CN106449426A - Flexible substrate and preparation method thereof - Google Patents
Flexible substrate and preparation method thereof Download PDFInfo
- Publication number
- CN106449426A CN106449426A CN201610864070.0A CN201610864070A CN106449426A CN 106449426 A CN106449426 A CN 106449426A CN 201610864070 A CN201610864070 A CN 201610864070A CN 106449426 A CN106449426 A CN 106449426A
- Authority
- CN
- China
- Prior art keywords
- shape
- changing material
- sealing coat
- base board
- flexible base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 64
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 238000002955 isolation Methods 0.000 claims abstract 3
- 238000007789 sealing Methods 0.000 claims description 42
- 229920000636 poly(norbornene) polymer Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 230000036772 blood pressure Effects 0.000 claims 1
- 230000008859 change Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 230000006386 memory function Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000012781 shape memory material Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The invention discloses a flexible substrate and a preparation method thereof and aims at solving the problem that a metal layer breaks or falls off due to stress generated by the difference of thermal expansion between various film layers in the preparation process of the flexible substrate. Before the metal layer is prepared, the preparation method of the flexible substrate comprises the steps of preparing a grid-shaped isolation layer; filling each cell in a grid with a deforming material; carrying out first special treatment on the deforming material to expand the deforming material; preparing the metal layer on the isolation layer and the deforming material; and carrying out second special treatment on the deforming material to restore the initial shape, wherein the initial shape is determined by the shapes of the cells.
Description
Technical field
The present invention relates to flexible base board technical field is and in particular to a kind of flexible base board and preparation method thereof.
Background technology
Flexible base board as the important component part of flexible display device, generally include be arranged on suprabasil cushion,
Multiple film layer such as insulating barrier, metal level, these film layers have different thermal coefficient of expansions due to the difference of material, therefore,
Stress can be produced because thermal expansion is different between each film layer, this stress easilys lead to metal in the preparation process of flexible base board
Layer fracture or come off.
Content of the invention
In view of this, embodiments provide a kind of preparation method of flexible base board, solve between each film layer by
In the harmful effect to metal level for the stress produced by thermal coefficient of expansion difference.Present invention also offers a kind of flexible base board, solution
Metal fault rupture or the problem coming off in flexible base board preparation process of having determined.
One embodiment of the invention provides a kind of preparation method of flexible base board, before preparing metal level, including：Preparation
Lattice-shaped sealing coat；Shape-changing material is filled in each of grid cell；Shape-changing material is carried out with special place for the first time
Reason makes it expand；Prepare metal level on sealing coat and shape-changing material；Carrying out second special handling to shape-changing material makes it
Recover original shape, described original shape depends on the shape of cell.
One embodiment of the invention additionally provides a kind of flexible base board, including：Metal level, the underlying film layer bag of described metal level
Include in lattice-shaped the sealing coat of arrangement, and the shape-changing material layer of each of filling grid cell, described metal level with
Described sealing coat contact, and separated with described shape-changing material layer with described sealing coat for supporting.
A kind of flexible base board provided in an embodiment of the present invention and preparation method thereof, by arranging deformation material under metal level
The bed of material and sealing coat, can make metal level separate with shape-changing material layer for supporting with sealing coat, that is, achieve metal level and lower floor
Being partially separated of film layer, so, in the production preparation process of flexible base board it is possible to effective reduce due to film layer between thermal expansion
The different stress metal fault ruptures being led to producing or the risk coming off.
Brief description
Fig. 1 show the preparation method flow chart of the flexible base board of one embodiment of the invention offer.
Fig. 2 a- Fig. 2 f show the preparation process schematic diagram of the flexible base board of one embodiment of the invention offer.
The state being respectively the flexible base board preparation process that another embodiment of the present invention provides shown in Fig. 3 a and Fig. 3 b is illustrated
Figure.
Fig. 4 a show the top view of the flexible base board of one embodiment of the invention offer.
Fig. 4 b show flexible base board shown in Fig. 4 a along the schematic cross-section of A1-A2 line.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of not making creative work
Apply example, broadly fall into the scope of protection of the invention.
Fig. 1 show the preparation method flow chart of the flexible base board of one embodiment of the invention offer.It can be seen that
The preparation method of this flexible base board includes：
Step 101, prepares lattice-shaped sealing coat.Lattice-shaped sealing coat 12 can be prepared by mask etch process.
Refering to Fig. 2 a and Fig. 2 b, the present embodiment is the sealing coat 12 preparing lattice-shaped on cushion 11, and this is accomplished by
First prepare cushion 11 on the substrate 10, then the sealing coat of lattice-shaped is prepared using mask etching technique on cushion 11
12.The preparation of cushion 11 adopts prior art, and this is not construed as limiting, additionally, it will be understood by those skilled in the art that this preparation
The step of the sealing coat of lattice-shaped is that the film layer under existing metal level is carried out, and the film layer under this metal level is not
It is limited to cushion 11.
In one embodiment, sealing coat 12 can adopt the inorganic material having compared with high adhesion force, for example, silicon oxide,
Silicon nitride etc., is so conducive to fitting of subsequent metal layer and sealing coat 12.
In one embodiment, the section configuration of each cell is rectangle, or trapezoidal, or semicircle.
Step 102, fills shape-changing material in each of grid cell.So, shape-changing material 13 will replicate
The shape of cell, as original shape, as shown in Figure 2 c.This shape-changing material 13 using the material with shape memory function,
This kind of material its internal structure after first time special handling can produce change, expands, and passes through second spy afterwards again
Different process can recover original shape.Here first time and/or second special handling can be heating, cooling, pressurization etc.
Condition changes.
In one embodiment, shape-changing material 13 is organic polymer shape-memory material, such as polynorbornene or friendship
Connection polyethylene.This is because, in the preparation process of flexible base board, high-molecular organic material is easily separated with metal level.
Step 103, carrying out first time special handling to shape-changing material makes it expand.
In one embodiment, shape-changing material adopts polynorbornene.Now, first time special handling refers to temperature liter
High to 250 degree, polynorbornene can expand, and surrounds because polynorbornene surrounding is isolated layer, meeting during expanded by heating
It is subject to come from the adhesion of sealing coat, this power is gradually successively decreased from the circumferential center of cell four, therefore assumes shape shown in Fig. 2 d
Shape.It will be appreciated by those skilled in the art that simply preferred embodiment given here, during actual production, polynorbornene expands
Its top surface edge part is possible to slightly above sealing coat 12 afterwards.
Additionally, the corresponding special handling of different shape-changing materials is different, even if being all heating, different shape-changing materials corresponds to
The target temperature of heat treated be likely to difference, need during actual production rationally to be arranged according to the characteristic of shape-changing material.
Step 104, prepares metal level on sealing coat and shape-changing material.Plasma gas-phase deposit or sputtering can be adopted
Mode prepare metal level 14, as shown in Figure 2 e.The preparation process of this metal level 14 is prior art, and this is not limited.
Step 105, shape-changing material is carried out with second special handling makes it recover original shape, and original shape depends on single
The shape of first lattice.
Still, then this second special handling, specifically, temperature is reduced to 40 degree, now, gathers taking polynorbornene as a example
Norborene can recover original shape, i.e. the shape of cell, so far forms flexible base board as shown in figure 2f.
It is especially noted that when filling shape-changing material 13, preferably should protect using the height of sealing coat 12 as reference
Card shape-changing material layer 13 upper surface is concordant with sealing coat 12 upper surface.Advantage of this is that, the metal subsequently prepared can be made
Layer surface is smooth-out, reduces broken string risk.Below in conjunction with the accompanying drawings this is illustrated.
When shape-changing material layer 13 and the upper surface grade height of sealing coat 12 it can be ensured that subsequent deformation material layer 13 occurs shape
Upper surface after change is higher than necessarily sealing coat 12 upper surface, as shown in Figure 2 d, and then, when shape-changing material layer 13 recovers shape,
When metal level 14 is separated with shape-changing material layer 13, layer on surface of metal is smooth-out, as shown in figure 2f.It is of course also possible to rationally set
Meter shape-changing material layer 13 height, as long as ensure that shape-changing material layer 13 deform upon after upper surface be higher than sealing coat 12 on
Surface.
And if shape-changing material layer 13 is less than the upper surface of sealing coat 12, so that after shape-changing material layer 13 deforms upon
Upper surface be still below sealing coat 12 upper surface, as shown in Figure 3 a, then when shape-changing material layer recovers shape, metal level 14 and deformation
When material layer 13 separates, layer on surface of metal is no longer smooth, as shown in Figure 3 b, easily causes metal wire broken string.
Flexible base board according to embodiments of the present invention, by preparing shape-changing material layer 13 and sealing coat under metal level 14
12, metal level 14 can be made to separate with shape-changing material layer 13 for support with sealing coat 12, that is, achieve metal level and underlying film layer
(here be shape-changing material layer 13 and sealing coat 12) is partially separated, so, in the production preparation process of flexible base board, just
The different stress metal fault rupture being led to producing of thermal expansion or the risk coming off between can effectively reducing by film layer, simultaneously
Also certain stress buffer effect can be played during the bending of flexible base board.
Fig. 4 a show the top view of the flexible base board of one embodiment of the invention offer.Fig. 4 b show flexible shown in Fig. 4 a
Substrate is along the schematic cross-section of A1-A2 line.Can be seen that this flexible base board in conjunction with Fig. 4 a and Fig. 4 b and include setting on the substrate 10
Cushion 11, be in the sealing coat 12 of lattice-shaped arrangement on cushion 11, the deformation of filling each of grid cell
Material layer 13, and it is arranged at the metal level 14 (not shown in Fig. 4 a) on sealing coat 12 and shape-changing material layer 13, wherein, gold
Belong to layer 14 to contact with sealing coat 12, and separated with shape-changing material layer 13 by the supporting role of sealing coat 12.
Shape-changing material layer 13 using the material with shape memory function, this kind of material after first time special handling its
Internal structure can produce change, expands, and can recover original shape through second special handling more afterwards.Here
Once and/or second special handling can be heating, cooling, pressurization etc. condition change.In one embodiment, shape-changing material
13 is organic polymer shape-memory material, such as polynorbornene or crosslinked polyethylene.This is because, in the system of flexible base board
During standby, high-molecular organic material is easily separated with metal level 14.On the contrary, in order to beneficial to the laminating with metal level, sealing coat is then adopted
Use inorganic material.
In the present embodiment, the section configuration of each cell is rectangle, but not limited to this or trapezoidal, straight
The other shapes such as angle is trapezoidal, semicircle.
In the present embodiment, the upper surface of shape-changing material layer 13 is contour with the upper surface of sealing coat 12.The benefit of do so
It is to make layer on surface of metal smooth-out, reduce broken string risk.For the height of sealing coat 12, quantity and two neighboring
The spacing of sealing coat 12 needs rationally to be arranged according to physical conditions such as substrate size, craft precisions, and this is not construed as limiting.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Within god and principle, any modification of being made, equivalent etc., should be included within the scope of the present invention.
Claims (9)
1. a kind of preparation method of flexible base board is it is characterised in that before preparing metal level, including：
Prepare lattice-shaped sealing coat；
Shape-changing material is filled in each of grid cell；
Carrying out first time special handling to described shape-changing material makes it expand；
Prepare metal level on described sealing coat and described shape-changing material；
Carrying out second special handling to described shape-changing material makes it recover original shape, and described original shape depends on described list
The shape of first lattice.
2. method according to claim 1 it is characterised in that described in each cell filling shape-changing material concrete
For：
In each cell, filling shape-changing material is put down to the upper surface of described shape-changing material and the upper surface of described sealing coat
Together.
3. method according to claim 1 is it is characterised in that described first time special handling and/or second special place
Manage as heating, or cooling, or pressurization, or blood pressure lowering.
4. the method according to any one of claim 1-3 is it is characterised in that working as described shape-changing material is polynorbornene
When, described first time special handling is：It is heated to 250 degree；Described second special handling be：It is cooled to 40 degree.
5. a kind of flexible base board, including metal level it is characterised in that the underlying film layer of described metal level includes the arrangement in lattice-shaped
Sealing coat, and the shape-changing material layer of filling each of grid cell, described metal level is contacted with described sealing coat,
And separated with described shape-changing material layer with described sealing coat for supporting.
6. flexible base board according to claim 5 is it is characterised in that described shape-changing material layer is remembered for organic polymer shape
Recall material.
7. flexible base board according to claim 5 is it is characterised in that described sealing coat is inorganic material.
8. flexible base board according to claim 5 is it is characterised in that the upper surface of described shape-changing material layer and described isolation
The upper surface of layer is contour.
9. the flexible base board according to any one of claim 5-8 is it is characterised in that the section configuration of described cell is
Rectangle, or trapezoidal or semicircle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864070.0A CN106449426B (en) | 2016-09-29 | 2016-09-29 | A kind of flexible base board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864070.0A CN106449426B (en) | 2016-09-29 | 2016-09-29 | A kind of flexible base board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449426A true CN106449426A (en) | 2017-02-22 |
| CN106449426B CN106449426B (en) | 2018-10-26 |
Family
ID=58169870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610864070.0A Active CN106449426B (en) | 2016-09-29 | 2016-09-29 | A kind of flexible base board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449426B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473775A (en) * | 2019-08-29 | 2019-11-19 | 上海华力集成电路制造有限公司 | Improve the method for film removing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080257586A1 (en) * | 2007-04-18 | 2008-10-23 | Industrial Technology Research Institute | Flexible circuit structure with stretchability and method of manufacturing the same |
| CN102548198A (en) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | Flexible circuit board suitable for packing |
| CN104465479A (en) * | 2014-12-19 | 2015-03-25 | 京东方科技集团股份有限公司 | Flexible display substrate mother board and manufacturing method of flexible display substrate |
| CN104751773A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display and manufacturing method thereof |
| GB2521616A (en) * | 2013-12-23 | 2015-07-01 | Nokia Technologies Oy | A substrate scaffold structure and associated apparatus and methods |
-
2016
- 2016-09-29 CN CN201610864070.0A patent/CN106449426B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080257586A1 (en) * | 2007-04-18 | 2008-10-23 | Industrial Technology Research Institute | Flexible circuit structure with stretchability and method of manufacturing the same |
| CN102548198A (en) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | Flexible circuit board suitable for packing |
| GB2521616A (en) * | 2013-12-23 | 2015-07-01 | Nokia Technologies Oy | A substrate scaffold structure and associated apparatus and methods |
| CN104751773A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display and manufacturing method thereof |
| CN104465479A (en) * | 2014-12-19 | 2015-03-25 | 京东方科技集团股份有限公司 | Flexible display substrate mother board and manufacturing method of flexible display substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473775A (en) * | 2019-08-29 | 2019-11-19 | 上海华力集成电路制造有限公司 | Improve the method for film removing |
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| Publication number | Publication date |
|---|---|
| CN106449426B (en) | 2018-10-26 |
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Effective date of registration: 20201207 Address after: No.146 Tianying Road, high tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Suzhou, Jiangsu, Kunshan Patentee before: Kunshan New Flat Panel Display Technology Center Co.,Ltd. Patentee before: KunShan Go-Visionox Opto-Electronics Co.,Ltd. |
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