CN106449426B - A kind of flexible base board and preparation method thereof - Google Patents
A kind of flexible base board and preparation method thereof Download PDFInfo
- Publication number
- CN106449426B CN106449426B CN201610864070.0A CN201610864070A CN106449426B CN 106449426 B CN106449426 B CN 106449426B CN 201610864070 A CN201610864070 A CN 201610864070A CN 106449426 B CN106449426 B CN 106449426B
- Authority
- CN
- China
- Prior art keywords
- shape
- layer
- changing material
- flexible base
- base board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The invention discloses a kind of flexible base boards and preparation method thereof, solve in flexible base board preparation process, the metal fault rupture caused by thermally expanding different and generation stress between each film layer or the problem that falls off.Wherein, the preparation method of the flexible base board, before preparing metal layer, including：Prepare lattice-shaped separation layer；Shape-changing material is filled in each cell in grid；Carrying out first time specially treated to the shape-changing material makes its expansion；Metal layer is prepared on the separation layer and the shape-changing material；Carrying out second of specially treated to the shape-changing material makes it restore original shape, and the original shape depends on the shape of the cell.
Description
Technical field
The present invention relates to flexible base board technical fields, and in particular to a kind of flexible base board and preparation method thereof.
Background technology
Important component of the flexible base board as flexible display device, generally include to be arranged buffer layer in substrate,
Multiple film layers such as insulating layer, metal layer, these film layers have different coefficient of thermal expansion due to the difference of material,
Stress can be generated between each film layer due to thermally expanding different in the preparation process of flexible base board, which easilys lead to metal
The fracture of layer falls off.
Invention content
In view of this, an embodiment of the present invention provides a kind of preparation method of flexible base board, solve between each film layer by
Harmful effect of the stress to metal layer caused by coefficient of thermal expansion difference.The present invention also provides a kind of flexible base board, solutions
Metal fault rupture or the problem of fall off in flexible base board preparation process of having determined.
One embodiment of the invention provides a kind of preparation method of flexible base board, before preparing metal layer, including：It prepares
Lattice-shaped separation layer；Shape-changing material is filled in each cell in grid；Special place for the first time is carried out to shape-changing material
Reason makes its expansion；Metal layer is prepared on separation layer and shape-changing material；Carrying out second of specially treated to shape-changing material makes it
Restore original shape, the original shape depends on the shape of cell.
One embodiment of the invention additionally provides a kind of flexible base board, including：Metal layer, the underlying film layer packet of the metal layer
Include in lattice-shaped arrangement separation layer, and filling grid in each cell shape-changing material layer, the metal layer with
The separation layer contact, and be support and the shape-changing material layer separation with the separation layer.
A kind of flexible base board provided in an embodiment of the present invention and preparation method thereof, by the way that deformation material is arranged under metal layer
The bed of material and separation layer can make metal layer for support and shape-changing material layer separation, that is, realize metal layer and lower layer with separation layer
Film layer is partially separated, in this way, in the production preparation process of flexible base board, so that it may effectively to reduce due to being thermally expanded between film layer
The metal fault rupture or the risk that falls off that difference generates caused by stress.
Description of the drawings
Fig. 1 show the preparation method flow chart of the flexible base board of one embodiment of the invention offer.
Fig. 2 a- Fig. 2 f show the preparation process schematic diagram of the flexible base board of one embodiment of the invention offer.
It is respectively the state signal for the flexible base board preparation process that another embodiment of the present invention provides shown in Fig. 3 a and Fig. 3 b
Figure.
Fig. 4 a show the vertical view of the flexible base board of one embodiment of the invention offer.
Fig. 4 b show flexible base board shown in Fig. 4 a along the schematic cross-section of A1-A2 lines.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained without creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 show the preparation method flow chart of the flexible base board of one embodiment of the invention offer.It can be seen from the figure that
The preparation method of the flexible base board includes：
Step 101, lattice-shaped separation layer is prepared.Lattice-shaped separation layer 12 can be prepared by mask etch process.
Refering to Fig. 2 a and Fig. 2 b, the present embodiment is the separation layer 12 that lattice-shaped is prepared on buffer layer 11, this is just needed
Buffer layer 11 is first prepared on the substrate 10, and mask etching technique is then used to prepare the separation layer of lattice-shaped on buffer layer 11
12.The preparation of buffer layer 11 uses the prior art, is not construed as limiting to this, in addition, it will be understood by those skilled in the art that the preparation
The step of separation layer of lattice-shaped is that the film layer under existing metal layer carries out, and the film layer under the metal layer is not
It is limited to buffer layer 11.
In one embodiment, separation layer 12 may be used with the inorganic material compared with high adhesion force, for example, silica,
Silicon nitride etc. is conducive to being bonded for subsequent metal layer and separation layer 12 in this way.
In one embodiment, the section configuration of each cell is rectangle or trapezoidal, or semicircle.
Step 102, shape-changing material is filled in each cell in grid.In this way, shape-changing material 13 will replicate
The shape of cell, as original shape, as shown in Figure 2 c.The shape-changing material 13 uses the material with shape memory function,
This kind of material its internal structure after first time specially treated will produce variation, expand, special using second later
Different processing can restore original shape.Here first time and/or second of specially treated can be heating, cooling, pressurization etc.
Condition changes.
In one embodiment, shape-changing material 13 is organic polymer shape-memory material, such as polynorbornene or friendship
Join polyethylene.This is because high-molecular organic material and metal layer are easily separated in the preparation process of flexible base board.
Step 103, carrying out first time specially treated to shape-changing material makes its expansion.
In one embodiment, shape-changing material uses polynorbornene.At this point, first time specially treated refers to by temperature liter
To 250 degree, polynorbornene can expand height, and be surrounded since polynorbornene surrounding is isolated layer, meeting when expanded by heating
By the adhesion for coming from separation layer, this power is gradually successively decreased from the circumferential center of cell four, therefore shape shown in Fig. 2 d is presented
Shape.It will be appreciated by those skilled in the art that only preferred embodiment given here, when actual production, polynorbornene expansion
Its top surface edge part is possible to slightly above separation layer 12 afterwards.
In addition, the corresponding specially treated of different shape-changing materials is different, even if being all heating, different shape-changing materials corresponds to
The target temperature of heat treatment may also be different, when actual production, needs rationally to be arranged according to the characteristic of shape-changing material.
Step 104, metal layer is prepared on separation layer and shape-changing material.Plasma gas-phase deposit or sputtering may be used
Mode prepare metal layer 14, as shown in Figure 2 e.The preparation process of the metal layer 14 is the prior art, is not limited this.
Step 105, carrying out second of specially treated to shape-changing material makes it restore original shape, and original shape depends on single
The shape of first lattice.
Still by taking polynorbornene as an example, then second of specially treated by temperature specifically, be reduced to 40 degree, at this point, poly-
Norbornene can restore original shape, the i.e. shape of cell, so far form flexible base board as shown in figure 2f.
It is especially noted that when filling shape-changing material 13, should preferably be protected with the height of separation layer 12 as reference
It is concordant with 12 upper surface of separation layer to demonstrate,prove 13 upper surface of shape-changing material layer.The advantage of doing so is that the metal subsequently prepared can be made
Layer surface is smooth-out, reduces broken string risk.This is illustrated below in conjunction with the accompanying drawings.
When the upper surface grade height of shape-changing material layer 13 and separation layer 12, it can be ensured that shape occurs for subsequent deformation material layer 13
Upper surface after change is centainly higher than 12 upper surface of separation layer, as shown in Figure 2 d, in turn, when shape-changing material layer 13 restores shape,
When metal layer 14 is detached with shape-changing material layer 13, layer on surface of metal is smooth-out, as shown in figure 2f.It is of course also possible to rationally set
The height of shape-changing material layer 13 is counted, as long as the upper surface after shape-changing material layer 13 deforms upon can be ensured higher than on separation layer 12
Surface.
And if shape-changing material layer 13 is less than the upper surface of separation layer 12, so that after shape-changing material layer 13 deforms upon
Upper surface be still below 12 upper surface of separation layer, as shown in Figure 3a, then when shape-changing material layer restores shape, metal layer 14 and deformation
When material layer 13 detaches, layer on surface of metal is no longer smooth, as shown in Figure 3b, be easy to cause metal wire broken string.
Flexible base board according to the ... of the embodiment of the present invention, by preparing shape-changing material layer 13 and separation layer under metal layer 14
12, metal layer 14 can be made to be detached with shape-changing material layer 13 for support with separation layer 12, that is, realize metal layer and underlying film layer
(being shape-changing material layer 13 and separation layer 12 here) is partially separated, in this way, in the production preparation process of flexible base board, just
The risk that the metal fault rupture caused by the stress for thermally expanding different generations between film layer can effectively be reduced or fallen off, simultaneously
Certain stress buffer can also be played the role of in the bending process of flexible base board.
Fig. 4 a show the vertical view of the flexible base board of one embodiment of the invention offer.Fig. 4 b show flexible shown in Fig. 4 a
Schematic cross-section of the substrate along A1-A2 lines.Can be seen that the flexible base board in conjunction with Fig. 4 a and Fig. 4 b includes being arranged on the substrate 10
Buffer layer 11, on buffer layer 11 in lattice-shaped arrangement separation layer 12, fill grid in each cell deformation
Material layer 13, and it is set to the metal layer 14 (being not shown in Fig. 4 a) on separation layer 12 and shape-changing material layer 13, wherein gold
Belong to layer 14 to contact with separation layer 12, and is detached with shape-changing material layer 13 by the supporting role of separation layer 12.
Shape-changing material layer 13 using with shape memory function material, this kind of material after first time specially treated its
Internal structure will produce variation, expand, and can restore original shape using second of specially treated later.Here
Primary and/or second of specially treated can be the conditions variation such as heating, cooling, pressurization.In one embodiment, shape-changing material
13 be organic polymer shape-memory material, such as polynorbornene or crosslinked polyethylene.This is because in the system of flexible base board
High-molecular organic material and metal layer 14 are easily separated during standby.On the contrary, in order to conducive to the fitting with metal layer, separation layer is then adopted
Use inorganic material.
In the present embodiment, the section configuration of each cell is rectangle, but not limited to this, can also be trapezoidal, straight
Angle is trapezoidal, the other shapes such as semicircle.
In the present embodiment, the upper surface of shape-changing material layer 13 and the upper surface of separation layer 12 are contour.The benefit done so
It is that layer on surface of metal can be made smooth-out, reduces broken string risk.For the height of separation layer 12, quantity and two neighboring
The spacing needs of separation layer 12 are rationally arranged according to physical conditions such as substrate size, craft precisions, are not construed as limiting to this.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Within god and principle, made by any modification, equivalent replacement etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of preparation method of flexible base board, which is characterized in that before preparing metal layer, including：
Prepare lattice-shaped separation layer；
Shape-changing material is filled in each cell in grid；
Carrying out first time specially treated to the shape-changing material makes its expansion；
Metal layer is prepared on the separation layer and the shape-changing material；
Carrying out second of specially treated to the shape-changing material makes it restore original shape, and the original shape depends on the list
The shape of first lattice.
2. according to the method described in claim 1, it is characterized in that, filling deformation in described each cell in grid
Material is specially：
Shape-changing material is filled in each cell in grid to the upper surface of the shape-changing material and the separation layer
Upper surface is concordant.
3. according to the method described in claim 1, it is characterized in that, the first time specially treated or second of specially treated are
Heating, or it is cooling, or pressurization, or decompression.
4. method according to any one of claim 1-3, which is characterized in that when the shape-changing material is polynorbornene
When, the first time specially treated is：It is heated to 250 degree；Second of specially treated be：It is cooled to 40 degree.
5. a kind of flexible base board, including metal layer, which is characterized in that the underlying film layer of the metal layer includes being arranged in lattice-shaped
Separation layer, and each cell in filling grid shape-changing material layer, the metal layer contacts with the separation layer,
And with the separation layer be support with the shape-changing material layer separation.
6. flexible base board according to claim 5, which is characterized in that the shape-changing material layer is remembered for organic polymer shape
Recall material.
7. flexible base board according to claim 5, which is characterized in that the separation layer is inorganic material.
8. flexible base board according to claim 5, which is characterized in that the upper surface of the shape-changing material layer is isolated with described
The upper surface of layer is contour.
9. according to the flexible base board described in any one of claim 5-8, which is characterized in that the section configuration of the cell is
Rectangle is trapezoidal, or semicircle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864070.0A CN106449426B (en) | 2016-09-29 | 2016-09-29 | A kind of flexible base board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864070.0A CN106449426B (en) | 2016-09-29 | 2016-09-29 | A kind of flexible base board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449426A CN106449426A (en) | 2017-02-22 |
| CN106449426B true CN106449426B (en) | 2018-10-26 |
Family
ID=58169870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610864070.0A Active CN106449426B (en) | 2016-09-29 | 2016-09-29 | A kind of flexible base board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449426B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473775A (en) * | 2019-08-29 | 2019-11-19 | 上海华力集成电路制造有限公司 | Improve the method for film removing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548198A (en) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | Flexible circuit board suitable for packing |
| CN104465479A (en) * | 2014-12-19 | 2015-03-25 | 京东方科技集团股份有限公司 | Flexible display substrate mother board and manufacturing method of flexible display substrate |
| GB2521616A (en) * | 2013-12-23 | 2015-07-01 | Nokia Technologies Oy | A substrate scaffold structure and associated apparatus and methods |
| CN104751773A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI339087B (en) * | 2007-04-18 | 2011-03-11 | Ind Tech Res Inst | Stretchable flexible printed circuit (fpc) and fabricating method thereof |
-
2016
- 2016-09-29 CN CN201610864070.0A patent/CN106449426B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548198A (en) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | Flexible circuit board suitable for packing |
| GB2521616A (en) * | 2013-12-23 | 2015-07-01 | Nokia Technologies Oy | A substrate scaffold structure and associated apparatus and methods |
| CN104751773A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display and manufacturing method thereof |
| CN104465479A (en) * | 2014-12-19 | 2015-03-25 | 京东方科技集团股份有限公司 | Flexible display substrate mother board and manufacturing method of flexible display substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106449426A (en) | 2017-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5374006B2 (en) | Substrate manufacturing method and substrate obtained by the method | |
| CN105849891B (en) | Reduce the warpage in the structure with circuit | |
| US7256503B2 (en) | Chip underfill in flip-chip technologies | |
| TW201131717A (en) | Apparatus and method for controlling semiconductor die warpage | |
| TW533568B (en) | Ball grid array IC package and manufacturing method thereof | |
| JP5587041B2 (en) | Method for transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from its coefficient of thermal expansion | |
| JP5571999B2 (en) | Package interface plate for package isolation | |
| JP2009124077A (en) | Semiconductor chip and its production process | |
| CN102484097A (en) | Semiconductor-on-insulator with back side support layer | |
| JP2009111147A (en) | Semiconductor chip and method of manufacturing the same | |
| CN105140144A (en) | Medium pressurized thermal annealing mixed bonding method | |
| US8154099B2 (en) | Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate | |
| CN106449426B (en) | A kind of flexible base board and preparation method thereof | |
| CN101103454A (en) | Semiconductor chip and wafer production method | |
| US20180374818A1 (en) | Method for preparing a semiconductor apparatus | |
| WO2010062334A1 (en) | Method and apparatus for reducing semiconductor package tensile stress | |
| TWI553746B (en) | Low warpage wafer bonding through use of slotted substrates | |
| JP2020501376A5 (en) | ||
| JP2006062002A (en) | Method of segmenting substrate of semiconductor device | |
| CN100372056C (en) | Semiconductor device and producing method thereof | |
| CN1898572B (en) | Conductive contact holder, conductive contact unit and process for producing conductive contact holder | |
| US9673169B2 (en) | Method and apparatus for a wafer seal ring | |
| CN104081521B (en) | Support the method to produce restructuring chip for application chip during encapsulating | |
| CN101986429A (en) | Chip package and manufacturing method thereof | |
| TWI324382B (en) | Apparatus having reduced warpage in an over-molded ic package and method of reducing warpage in an over-molded ic package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201207 Address after: No.146 Tianying Road, high tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Suzhou, Jiangsu, Kunshan Patentee before: Kunshan New Flat Panel Display Technology Center Co.,Ltd. Patentee before: KunShan Go-Visionox Opto-Electronics Co.,Ltd. |