CN106445624A - Silicon-wafer-free measurement process compiling method - Google Patents
Silicon-wafer-free measurement process compiling method Download PDFInfo
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- CN106445624A CN106445624A CN201510481789.1A CN201510481789A CN106445624A CN 106445624 A CN106445624 A CN 106445624A CN 201510481789 A CN201510481789 A CN 201510481789A CN 106445624 A CN106445624 A CN 106445624A
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Abstract
The invention discloses a silicon-wafer-free measurement process compiling method, which comprises the following steps of: inputting a wafer data file; extracting at least one type of first parameter from the wafer data file; and according to the at least one type of first parameter, generating a measurement process compiling file. According to the silicon-wafer-free measurement process compiling method, artificial participation is not required, a specific wafer does not need to be waited to achieve a measurement machine, a corresponding measurement process can be prepared in advance offline, so that the production efficiency of the measurement machine used for processing the wafer can be greatly improved, and correspondingly, wafer processing cost is lowered.
Description
Technical field
Semiconductor manufacturing facility field of the present invention, the measurement procedure compiling of especially a kind of no silicon chip
Method.
Background technology
Ellipsometry is widely used in semiconductor production industry, with its lossless, high speed etc.
Feature, becomes the major technique of the measurement of silicon chip surface material characteristics and optical key size.
With the development of semiconductor technology, the key size of integrated component from 1 μm of progress to 22nm,
The corresponding accuracy to ellipsometry and repeatability require to have arrived atMagnitude.For
Pattern-free silicon chip, the inhomogeneities of the thickness of its surface film exceed well overMagnitude.Cause
This, even if measuring beam is equipped with minute differences in silicon chip surface sprocket bit, actual measured results are just
May be relativelyThere is the change of the order of magnitude.The repeatability ultimately resulting in measurement is very poor.
Content of the invention
In contrast, the measurement procedure compiling of no silicon chip will bring many advantages.Processing stream
Journey becomes more efficiently and is easier to manage, and arriving at and be used for giving birth to without waiting for silicon chip
Become the free time of the measurement board of flow process, the parameter for compiling needed for flow process can before this just
Instrument under input line, as long as then silicon chip arrives at the board for measurement, then measurement procedure
Can use.Compile measurement procedure under line and can reduce flow process compilation time and need not
Keep the operation of production line.Further, automatic flow process compiles for the quality of data, goes
Except the multiple uncertain of flow process compilation process and discordance are also advantageous.
Based on considerations above, if proposing a kind of measurement procedure Compilation Method of no silicon chip, will be
Very advantageously.The method includes：
- input wafer data file；
- extract at least one first parameter among described wafer data file；And
- measurement procedure compiling file is generated according to described at least one first parameter.
Measurement procedure Compilation Method according to the no silicon chip of the present invention need not manually participate in, and also need not
Specific wafer is waited to reach weigh-bridge, and being capable of the ground corresponding measurement stream that is prepared in advance under line
Journey, thus greatly improving the production efficiency of the weigh-bridge processing wafer, and correspondingly reduces
The processing cost of wafer.
Explanation by specific embodiment hereafter is become apparent from by various aspects of the invention.
Brief description
Read the following detailed description to non-limiting example by referring to accompanying drawing, this
The other features, objects and advantages of invention will become more apparent upon.
Fig. 1 shows flow process Figure 100 of the method according to one embodiment of the present of invention；
Fig. 2 shows flow process Figure 200 of the method according to an alternative embodiment of the invention；
Fig. 3 shows the flow chart 300 of the method for another embodiment according to the present invention；
Fig. 4 shows a kind of Ming Dynasty style diagram；And
Fig. 5 shows a kind of dark formula pattern.
In in figure, run through different diagrams, same or similar reference represents identical or phase
As device (module) or step.
Specific embodiment
In the specific descriptions of following preferred embodiment, by with reference to a composition present invention part
Appended accompanying drawing.Appended accompanying drawing has been illustrated by way of example the spy being capable of the present invention
Fixed embodiment.The embodiment of example is not intended as all embodiments according to the present invention for the limit.
It is appreciated that without departing from the scope of the present invention, it is possible to use other embodiment,
Structural or logicality modification can also be carried out.Therefore, specific descriptions below not limit
Property processed, and the scope of the present invention is defined by the claims appended hereto.
Measurement pattern-free silicon chip, is gone up after simple machinery positioning by doing to silicon chip recess at present
Piece starts to measure.And during produce silicon chip translation and rotation error be not considered, therefore must
When so can lead to measure every time, the measurement position deviation of light beam is excessive, and measurement reproducibility cannot ensure
Result.
Up to the present, measurement procedure compiling generally all completes in system.For measurement
For flow process, processing engine is needed to be instructed pattern identification image using system, collects small pieces letter
Breath and measurement position.And for model flow (such as film flow process), processing engine needs
Carry out scanning optical spectrum using system and judge whether energy overflows.If energy has overflowed, that
Filter and other equipment part will be changed.
This will lead to the consumption on substantial amounts of debug time and human resourcess.
The present invention proposes a kind of measurement procedure Compilation Method of no silicon chip, will be very favorable.
Fig. 1 shows flow process Figure 100 of the method according to one embodiment of the present of invention, the method bag
Include：
- first, wafer data file will be inputted in step 110；
- next in the step 120, extract at least one among described wafer data file
First parameter；And
- last, in step 130, measurement stream is generated according to described at least one first parameter
Journey compiling file.
Measurement procedure Compilation Method according to the no silicon chip of the present invention need not manually participate in, and also need not
Specific wafer is waited to reach weigh-bridge, and being capable of the ground corresponding measurement stream that is prepared in advance under line
Journey, thus greatly improving the production efficiency of the weigh-bridge processing wafer, and correspondingly reduces
The processing cost of wafer.
Among according to one embodiment of the present of invention, methods described also includes：
- preserve described measurement procedure compiling file, to indicate wafer handling system according to described survey
Measure flow process compiling file to run thus processing described wafer.
Just described measurement procedure compiling file can be stored by this way, to indicate
Wafer handling system to run thus processing described wafer according to described measurement procedure compiling file.
Among according to one embodiment of the present of invention, under described measurement procedure Compilation Method is online
Automatically carry out.Thus just can make the measurement procedure Compilation Method of the no silicon chip according to the present invention
Need not manually participate in, also reach weigh-bridge without waiting for specific wafer, and can be pre- under line
First get out corresponding measurement procedure, thus greatly improving the production of the weigh-bridge processing wafer
Efficiency, and correspondingly reduce the processing cost of wafer.
Among according to one embodiment of the present of invention, described measurement procedure compiling file includes：
- step measurement procedure compiling file；And/or
- model measurement flow process compiling file.
It is suitable to produce step measurement procedure compiling file according to the method for the present invention and/or model is surveyed
Amount flow process compiling file, its principle is all the same, is all the wafer data literary composition from user input
Extract corresponding supplemental characteristic in part so as to be formed corresponding step measurement procedure compiling file and/
Or model measurement flow process compiling file.
Fig. 2 shows flow process Figure 200 of the method according to an alternative embodiment of the invention, from
In figure can be seen that among according to one embodiment of the present of invention, in step 210 will be defeated
Enter wafer data file, then in a step 220,
- when described measurement procedure compiling file be step measurement procedure compiling file when, described extremely
A kind of few first parameter includes：
- wafer small pieces information；
- aligned position information；
- measurement position information；And/or
- positioning keyed file, or
Finally in step 230 will be according to information above generation step measurement procedure compiling file.
- when described measurement procedure compiling file be model measurement flow process compiling file when, described extremely
A kind of few first parameter includes：
- model data.
Generation step measurement procedure compiling file illustrated above and/or the compiling of model measurement flow process
Specifically required parameter during file.It will be understood by those of skill in the art that shown here go out
Parameter be merely exemplary, and nonrestrictive.Other suitable parameters are also possible.
Fig. 3 shows the flow chart 300 of the method for another embodiment according to the present invention, from
In figure can be seen that among according to one embodiment of the present of invention, in the step 310 will be defeated
Enter wafer data file, then in step 320, extract among described wafer data file
At least one first parameter, in a step 330, when described measurement procedure compiling file is finally
During model measurement flow process compiling file, measurement procedure is generated according to described at least one first parameter
The step of compiling file includes：
- select optical measurement weigh-bridge；
- chosen wavelength range；And/or
- select wave filter.
Illustrated above produce specifically required parameter during model measurement flow process compiling file.This
Field it will be appreciated by the skilled person that shown here go out parameter be merely exemplary, rather than
Restricted.Other suitable parameters are also possible.
Among according to one embodiment of the present of invention, described wave filter includes 25% filtering
The wave filter of device, 50% wave filter and/or 100%.
The concrete percentages of wave filter mentioned herein are also merely exemplary, rather than
Restricted, other suitable wave filter are also feasible, as long as meeting corresponding parameter mark
Accurate.
Among according to one embodiment of the present of invention, described step measurement procedure compiling file bag
Include small pieces mapping, measurement group, image file and/or calibration flow process, wherein, described image file
It is configured to be converted to image pattern, described image pattern is Ming Dynasty style diagram or dark formula pattern.
Here it is shown that specifically required ginseng when producing described step measurement procedure compiling file
Number information.
Among according to one embodiment of the present of invention, it is big that described wafer small pieces information includes small pieces
Little and original die location.
Among according to one embodiment of the present of invention, when described measurement procedure compiling file is step
During rapid measurement procedure compiling file, measurement procedure is generated according to described at least one first parameter and compiles
The step of translation part includes：
- small pieces mapping is produced according to described wafer small pieces information；
- measurement group is produced according to described measurement position information；
- positioning keyed file is converted to image file；And/or
- calibration flow process is produced according to aligned position information, described image file is configured to change
For image pattern, described image pattern is Ming Dynasty style diagram or dark formula pattern.
Measurement procedure Compilation Method according to the no silicon chip of the present invention need not manually participate in, and also need not
Specific wafer is waited to reach weigh-bridge, and being capable of the ground corresponding measurement stream that is prepared in advance under line
Journey, thus greatly improving the production efficiency of the weigh-bridge processing wafer, and correspondingly reduces
The processing cost of wafer.
Fig. 4 shows a kind of Ming Dynasty style diagram, it can be seen that this pattern is bright,
That is, can be clearly seen that the color of line portion is deeper than other parts, additionally, this figure
Case also has a kind of other form, as shown in figure 5, Fig. 5 shows a kind of dark formula pattern.From
The color that in figure can be seen that line portion is more shallow than other parts.
Measurement procedure Compilation Method according to the no silicon chip of the present invention need not manually participate in, and also need not
Specific wafer is waited to reach weigh-bridge, and being capable of the ground corresponding measurement stream that is prepared in advance under line
Journey, thus greatly improving the production efficiency of the weigh-bridge processing wafer, and correspondingly reduces
The processing cost of wafer.
It is obvious to a person skilled in the art that the invention is not restricted to above-mentioned one exemplary embodiment
Details, and without departing from the spirit or essential characteristics of the present invention, can be with it
His concrete form realizes the present invention.Therefore, from the point of view of anyway, embodiment all should be regarded as
It is exemplary, and be nonrestrictive.Additionally, it will be evident that " inclusion " one word is not arranged
Except other elements and step, and wording " one " is not excluded for plural number.In device claim
The multiple element of statement can also be realized by an element.The first, the second grade word is used for table
Show title, and be not offered as any specific order.
Claims (10)
1. a kind of measurement procedure Compilation Method of no silicon chip, it includes：
- input wafer data file；
- extract at least one first parameter among described wafer data file；And
- measurement procedure compiling file is generated according to described at least one first parameter.
2. measurement procedure Compilation Method according to claim 1, wherein, methods described is also
Including：
- preserve described measurement procedure compiling file, to indicate wafer handling system according to described measurement
Flow process compiling file is running thus processing described wafer.
3. measurement procedure Compilation Method according to claim 1, wherein, described measurement stream
Automatically carry out under journey Compilation Method is online.
4. measurement procedure Compilation Method according to claim 1, wherein, described measurement stream
Journey compiling file includes：
- step measurement procedure compiling file；And/or
- model measurement flow process compiling file.
5. measurement procedure Compilation Method according to claim 4, wherein,
- when described measurement procedure compiling file be step measurement procedure compiling file when, described at least
A kind of first parameter includes：
- wafer small pieces information；
- aligned position information；
- measurement position information；And/or
- positioning keyed file, or
- when described measurement procedure compiling file be model measurement flow process compiling file when, described at least
A kind of first parameter includes：
- model data.
6. measurement procedure Compilation Method according to claim 5, wherein, when described measurement
When flow process compiling file is model measurement flow process compiling file, according to described at least one first ginseng
The step that number generates measurement procedure compiling file includes：
- select optical measurement weigh-bridge；
- chosen wavelength range；And/or
- select wave filter.
7. measurement procedure Compilation Method according to claim 6, wherein, described wave filter
Wave filter including 25% wave filter, 50% wave filter and/or 100%.
8. measurement procedure Compilation Method according to claim 4, wherein, described step is surveyed
Amount flow process compiling file includes small pieces mapping, measurement group, image file and/or calibration flow process, its
In, described image file is configured to be converted to image pattern, and described image pattern is Ming Dynasty style figure
Show or dark formula pattern.
9. measurement procedure Compilation Method according to claim 5, wherein, described wafer is little
Piece information includes small pieces size and original die location.
10. measurement procedure Compilation Method according to claim 5, wherein, when described measurement
When flow process compiling file is step measurement procedure compiling file, according to described at least one first ginseng
The step that number generates measurement procedure compiling file includes：
- small pieces mapping is produced according to described wafer small pieces information；
- measurement group is produced according to described measurement position information；
- positioning keyed file is converted to image file；And/or
- calibration flow process is produced according to aligned position information.
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| CN102478842A (en) * | 2010-11-23 | 2012-05-30 | 中芯国际集成电路制造(上海)有限公司 | Measurement process optimization method and device |
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| CN1275795A (en) * | 1999-05-19 | 2000-12-06 | 西门子公司 | Equipment for processing chip |
| CN1961407A (en) * | 2004-04-23 | 2007-05-09 | 尼康股份有限公司 | Exposing equipment, exposing method, and manufacturing method for element |
| CN101040367A (en) * | 2005-03-25 | 2007-09-19 | 尼康股份有限公司 | Shot shape measuring method, mask |
| US7861195B2 (en) * | 2008-01-30 | 2010-12-28 | Advanced Mirco Devices, Inc. | Process for design of semiconductor circuits |
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Application publication date: 20170222 |