CN106445251B - 内嵌式触控面板及其阵列基板 - Google Patents

内嵌式触控面板及其阵列基板 Download PDF

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CN106445251B
CN106445251B CN201611229627.XA CN201611229627A CN106445251B CN 106445251 B CN106445251 B CN 106445251B CN 201611229627 A CN201611229627 A CN 201611229627A CN 106445251 B CN106445251 B CN 106445251B
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touch
metal contact
contact wires
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data line
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CN106445251A (zh
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张启沛
张春倩
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract

本发明提供了一种内嵌式触控面板的阵列基板,所述阵列基板包括:触控电极,以阵列的形式设置在触控面板的有效区中;触控感测芯片,设置在触控面板的有效区外;金属连接线,与触控电极异层设置且通过过孔连接到触控电极,并且与触控面板的数据线相互绝缘地叠置,其中,触控电极通过金属连接线连接到触控感测芯片,在金属连接线与数据线之间设置有开关电路,开关电路在触控阶段使金属连接线与数据线接通,而在显示阶段使金属连接线与数据线断开。触控面板在有效区内走线的电阻电容性负载减小,使得触控面板的工作精度提高。

Description

内嵌式触控面板及其阵列基板
技术领域
本发明涉及一种触控面板,尤其涉及一种内嵌式触控面板及其阵列基板。
背景技术
液晶显示器(Liquid Crystal Display,LCD)是目前使用最广泛的一种平板显示器,已经逐渐成为诸如移动电话、个人数字助理(PDA)、数码相机、桌上型计算机或膝上型计算机等的各种电子设备所使用的具有高分辨率彩色屏幕的显示器。
随着液晶显示技术的发展进步,人们对LCD的显示品质、外观设计、人机界面等提出了更高的要求,触控技术(Touch Technology)因具有操作方便、高度集成等特点而成为技术发展的热点。
触控技术近些年发展迅猛,目前已有多种触控面板投入量产。对于现有的触控面板,根据触控传感器(Touch Sensor)设置位置的不同,可分为触控传感器覆盖于液晶盒上式(On Cell)、触控传感器内嵌在液晶盒内式(In Cell)、以及触控传感器外挂于显示面板式(Out Cell)。其中,In-Cell型触控面板是指将触控功能嵌入到液晶像素中的方法,不仅进一步降低了整机厚度,而且可以和LCD一同制作,没有额外的制作工序,也不影响其在室外等明亮的环境下的可视性。因此,对In-Cell型触控面板的研究日渐盛行。
现有的内嵌式触控面板的一种设计结构是利用一金属连接层来传递触控信号,该金属连接层包括多条彼此平行的金属连接线,用以电连接不同的触控传感器的焊盘电极。为了不影响像素开口率,所述金属连接线一般设置在触控面板的数据线的上方,如此,在金属连接线与数据线之间会存在电阻电容性负载(RC Loading),该负载会影响金属连接线所传递的触控信号的准确性,导致触控精度下降。
发明内容
本发明的目的在于提供一种能够降低在触控面板的有效区内走线的电阻电容性负载,提高触控面板的触控精度的内嵌式触控面板的阵列基板。
本发明提供了一种内嵌式触控面板的阵列基板,所述阵列基板包括:触控电极,以阵列的形式设置在触控面板的有效区中;触控感测芯片,设置在触控面板的有效区外;金属连接线,与触控电极异层设置且通过过孔连接到触控电极,并且与触控面板的数据线相互绝缘地叠置,其中,触控电极通过金属连接线连接到触控感测芯片,在金属连接线与数据线之间设置有开关电路,开关电路在触控阶段使金属连接线与数据线接通,而在显示阶段使金属连接线与数据线断开。
开关电路可包括薄膜晶体管和公共导电线。
薄膜晶体管的栅极可连接到公共导电线,薄膜晶体管的源极和漏极中的一个可连接到金属连接线,薄膜晶体管的源极和漏极中的另一个可连接到数据线。
公共导电线可由触控感测芯片接出。
薄膜晶体管可以是NMOS、PMOS、CMOS或传输门等。
开关电路可设置在触控面板的有效区的上侧或下侧。
根据本发明的内嵌式触控面板的阵列基板在触控面板的触控阶段通过触控感测芯片提供信号至公共导电线以使薄膜晶体管导通,从而使数据线与金属连接线电连接,由此触控面板在有效区内走线的电阻值和电容值都大幅下降,电阻电容性负载减小,从而可增加触控面板的工作准确度。
附图说明
通过以下结合附图对示例性实施例的描述,本发明的各方面将变得更加容易理解,在附图中:
图1是示出根据现有技术的In-Cell触控阵列基板的示意性剖视图。
图2是示出根据现有技术的自电容In-Cell触控阵列基板的架构示意图。
图3是示出根据本发明的示例性实施例的In-Cell触控阵列基板的架构示意图。
具体实施方式
在下文中,将通过参考附图对示例性实施例进行解释来详细描述本发明构思。然而,本发明构思可以按照多种不同形式具体实施,而不应当解释为限制为本文所阐述的各实施例;相反,提供这些实施例是为了使得本公开是清楚且完整的,并且将向本领域普通技术人员充分地传达本发明构思。在附图中,相同的附图标记表示相同的元件。此外,各个元件和区域是示意性示出的。因而,本发明构思不限于图中所示出的相对尺寸或距离。将要理解的是,尽管在这里会使用术语第一、第二等来描述各个元件和/或部件,但这些元件和/或部件不应当被这些术语限制。这些术语仅仅用于将一个元件和/或部件与另一个元件和/或部件区分开。因此,下面讨论的第一元件或第一部件可以被称为第二元件或第二部件,而没有背离本发明构思的教导。
图1是示出根据现有技术的In-Cell触控阵列基板的示意性剖视图。
参照图1,触控阵列基板100可包括基底110、遮光层115、缓冲层120、半导体元件SE、平坦化层140、公共电极层145、第二层间绝缘层150、金属连接层M3、钝化层155和像素电极层160。
基底110可包括透明基板,优选为玻璃基板。
遮光层115可设置在基底110上以及半导体元件SE下方,用于防止光线进入半导体元件SE可包括的薄膜晶体管的沟道区,从而可以起到降低漏电流、提高薄膜晶体管器件电学性能的作用。遮光层115可为钼(Mo)、钛(Ti)、铝(Al)、铜(Cu)中的一种或多种的堆栈组合。
缓冲层120可设置在基底110上并且覆盖基底110上的遮光层115。缓冲层120可减少或有效地防止金属原子和/或杂质从基底110向触控阵列基板的在基底110上的其他层的扩散并且可改善基底110的不规则表面的平整度。缓冲层120可为氧化硅(SiOx)层、氮化硅(SiNx)层或者由氧化硅层与氮化硅层叠加构成的复合层。
半导体元件SE可设置在缓冲层120上。半导体元件SE可包括薄膜晶体管。薄膜晶体管可包括多晶硅层125、源极S、漏极D、栅极G以及设置在它们之间的栅极绝缘层130和第一层间绝缘层135。
多晶硅层125可设置在缓冲层120上,并且包括位于两端的N型重掺杂区N+、位于中间的沟道区CH以及位于N型重掺杂区N+与沟道区CH之间的N型轻掺杂区N-。
栅极绝缘层130可设置在缓冲层120上并且覆盖在缓冲层120上的多晶硅层125。栅极绝缘层130可为氧化硅(SiOx)层、氮化硅(SiNx)层或者由氧化硅层与氮化硅层叠加构成的复合层。
栅极G可设置在栅极绝缘层130上。栅极G可与多晶硅层125的沟道区CH叠置。栅极G可包括金属、合金、导电金属氧化物、透明导电材料等。
第一层间绝缘层135可设置在栅极绝缘层130上并且覆盖在栅极绝缘层130上的栅极G。第一层间绝缘层135可使用无机材料或有机材料来形成。
源极S和漏极D可设置在第一层间绝缘层135上。源极S和漏极D可分别通过第一过孔H1与N型重掺杂区N+相接触。第一过孔H1形成在两端的N型重掺杂区N+上并且穿过第一层间绝缘层135和栅极绝缘层130。源极S和漏极D中的每个可包括金属膜、合金膜、金属氮化物膜、导电金属氧化物膜和/或透明导电膜。
平坦化层140可设置在第一层间绝缘层135上。平坦化层140可完全覆盖源极S和漏极D,并且可具有基本上水平的表面而没有围绕源极S和漏极D的台阶。平坦化层140可包括有机材料或无机材料。
公共电极层145可设置在平坦化层140上。公共电极层145的材料可为透明金属氧化物,所述透明金属氧化物可为铟锡氧化物、铟锌氧化物、铝锡氧化物、铝锌氧化物、铟锗锌氧化物中的一种或多种。
第二层间绝缘层150可设置在平坦化层140上并且覆盖在平坦化层140上的公共电极层145。第二层间绝缘层150可为氧化硅(SiOx)层、氮化硅(SiNx)层或者由氧化硅层与氮化硅层叠加构成的复合层。
金属连接层M3可设置在第二层间绝缘层150上并且与半导体元件SE的源极S叠置。金属连接层M3通过第二过孔H2与位于其下方的公共电极层145相接触,第二过孔H2形成在公共电极145上并且穿过第二层间绝缘层150。金属连接层M3可由任何合适的导电材料构成。
钝化层155可设置在第二层间绝缘层150上并且可覆盖在第二层间绝缘层150上的金属连接层M3。钝化层155的材料可为氮化硅或氧化硅。
像素电极层160可设置在钝化层155上。像素电极层160可通过第三过孔H3与半导体元件SE的漏极D相接触。第三过孔H3在半导体元件SE的漏极D上并且穿过平坦化层140、第二层间绝缘层150和钝化层155。像素电极层160的材料可为透明金属氧化物,所述透明金属氧化物可为铟锡氧化物、铟锌氧化物、铝锡氧化物、铝锌氧化物、铟锗锌氧化物中的一种或多种。
半导体元件SE的源极S连接到数据线,半导体元件SE的栅极G连接到栅极线。显示面板通过栅极线提供的栅极信号和数据线提供的数据电压来驱动。
由于触控面板的金属连接层M3与数据线叠置,因此在金属连接层M3与数据线之间会存在电阻电容性负载(RC Loading),该负载会影响金属连接层所传递的触控信号的准确性,导致面板的触控精度下降。
上述的内嵌式触控阵列基板是以公共电极层145与金属连接层M3的排布来实现触控功能,触控技术属于自电容式,其中,公共电极层145用作触控面板的自电容电极。
图2是示出根据现有技术的自电容In-Cell触控阵列基板的架构示意图。
如图2所示,自电容In-Cell触控阵列基板包括触控感测芯片IC、连接到触控感测芯片IC的多条平行的金属连接线ML以及多个自电容电极200。其中,触控感测芯片IC设置在触控面板的有效区(Active Area)外。多个自电容电极200以阵列的形式形成在触控面板的有效区中,多条金属连接线ML中的每条用于电连接触控感测芯片IC和多个自电容电极200中的相应的一个。
自电容电极200可对应于图1中所示的公共电极层145,金属连接线ML可对应于如图1中所示的金属连接层M3。自电容电极200和金属连接线ML为异层设置,且自电容电极200与相应的金属连接线ML通过过孔H电性连接,其中,过孔H可对应于图1中所示的用于电连接金属连接层M3和公共电极层145的第二过孔H2。
可对如图1中所示的位于金属连接层M3下方的用作自电容电极的公共电极层145采取挖空设计,以使得多个自电容电极200如图2所示地被彼此间隔开,从而改善多个自电容电极200之间的串扰。
当人体未触碰屏幕时,各个自电容电极所承受的电容为一固定值。当人体触碰屏幕时,对应的自电容电极所承受的电容为固定值叠加人体电容,触控感测芯片在触控阶段通过检测各自电容电极的电容值变化可以判断出触控位置。
为了降低显示信号和触控信号之间的相互干扰,提高画面品质和触控准确性,一般需要将触控和显示阶段进行分时驱动。在触控阶段,触控面板产生驱动信号并接收感测信号,以确定触控位置。而在显示阶段,触控面板产生公共电压,并通过过孔连接位于下方的公共电极层,以实现液晶显示器的正常显示。
图3是示出根据本发明的示例性实施例的In-Cell触控阵列基板的架构示意图。
为了克服上述缺点,可在触控面板的有效区AA周边增加包括一组薄膜晶体管TFT和一条公共导电线TP-SW的开关电路,该开关电路用于实现金属连接线ML与数据线的接通与断开。
薄膜晶体管TFT的数量可与金属连接线ML的数量相同。作为示例,参照图3,示例性地示出了开关电路包括三个薄膜晶体管TFT的情况。其中,每个薄膜晶体管TFT的源极和漏极中的一个连接到相应的金属连接线ML,每个薄膜晶体管的源极和漏极中的另一个连接到相应的一条数据线。具体地,第一薄膜晶体管TFT1的源极和漏极中的一个电连接到第一金属连接线ML(n+1),第一薄膜晶体管TFT1的源极和漏极中的另一个电连接到第一数据线DL(n+1)。第二薄膜晶体管TFT2的源极和漏极中的一个电连接到第二金属连接线ML(n+2),第二薄膜晶体管TFT2的源极和漏极中的另一个电连接到第二数据线DL(n+2)。第三薄膜晶体管TFT3的源极和漏极中的一个电连接到第三金属连接线ML(n+3)。第三薄膜晶体管TFT3的源极和漏极中的另一个电连接到第三数据线DL(n+3)。另外,第一薄膜晶体管TFT1、第二薄膜晶体管TFT2和第三薄膜晶体管TFT3的栅极可电连接到公共导电线TP-SW。
开关电路可设置在有效区AA的上侧或下侧。
薄膜晶体管TFT可以是NMOS、PMOS、CMOS或传输门等。
公共导电线TP-SW可由触控感测芯片IC接出。
在显示阶段,触控感测芯片IC可提供信号使薄膜晶体管TFT截止,由此数据线与金属连接线ML断开。在触控阶段,触控感测芯片IC可提供信号使薄膜晶体管TFT导通,由此数据线与金属连接线ML连接,从而触控面板在有效区AA内走线的电阻值和电容值都大幅降低,电阻电容性负载减小,触控面板的工作精度提高。
根据本发明的示例性实施例,在触控面板的有效区周边增加包括一组薄膜晶体管和一条公共导电线的开关电路(例如,由一组薄膜晶体管和一条公共导电线构成的开关电路)。在触控面板的触控阶段,触控感测芯片提供信号至公共导电线以使薄膜晶体管导通,从而使数据线与金属连接线电连接,由此触控面板在有效区内走线的电阻值和电容值都大幅下降,电阻电容性负载减小,从而可增加触控面板的工作准确度。
虽然参照本发明的示例性实施例具体示出并描述了本发明,但是本领域技术人员应该理解,在不脱离本发明的精神和范围的情况下,可做出形式上和细节上的各种改变。结合一个实施例描述的特征或方面可以适用于其他实施例。

Claims (5)

1.一种内嵌式触控面板的阵列基板,其特征在于,所述阵列基板包括:
触控电极,以阵列的形式设置在触控面板的有效区中;
触控感测芯片,设置在触控面板的有效区外;
金属连接线,与触控电极异层设置且通过过孔连接到触控电极,并且与触控面板的数据线相互绝缘地叠置,
其中,触控电极通过金属连接线连接到触控感测芯片,
其中,在金属连接线与数据线之间设置有开关电路,开关电路包括薄膜晶体管和公共导电线,薄膜晶体管的栅极连接到公共导电线,薄膜晶体管的源极和漏极中的一个连接到金属连接线,薄膜晶体管的源极和漏极中的另一个连接到数据线,其中,开关电路在触控阶段使金属连接线与数据线接通,而在显示阶段使金属连接线与数据线断开。
2.如权利要求1所述的内嵌式触控面板的阵列基板,其特征在于,公共导电线由触控感测芯片接出。
3.如权利要求1所述的内嵌式触控面板的阵列基板,其特征在于,薄膜晶体管是NMOS、PMOS、CMOS或传输门。
4.如权利要求1所述的内嵌式触控面板的阵列基板,其特征在于,开关电路设置在触控面板的有效区的上侧或下侧。
5.一种内嵌式触控面板,其特征在于,包括权利要求1至4任一项所述的阵列基板。
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