CN106435504A - 在铝合金表面镀抗指纹膜的方法 - Google Patents

在铝合金表面镀抗指纹膜的方法 Download PDF

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CN106435504A
CN106435504A CN201611094362.7A CN201611094362A CN106435504A CN 106435504 A CN106435504 A CN 106435504A CN 201611094362 A CN201611094362 A CN 201611094362A CN 106435504 A CN106435504 A CN 106435504A
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fingerprint film
aluminum alloy
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王旭
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HARTEC TECHNOLOGY (KUNSHAN) Co Ltd
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Abstract

本发明公开了一种在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,先用无水乙醇清洁,之后采用等离子体清洗,去除附着在表面,结构疏松的无机物以及低表面能的有机物杂质,露出阳极氧化后具有不饱和化学键的表面;然后在基体表面采用磁控溅射技术,镀金属氧化物与非金属氧化物混合缓冲层,该缓冲层为无色透明薄膜;最后在缓冲层上采用真空蒸镀技术,镀抗指纹薄膜。主要应用与电子产品保护外壳上,用以提升触感及防止指纹残留;可在不改变铝合金基体颜色的基础上,提升抗指纹薄膜与铝合金基体的附着力;产品表面触感光滑,不易沾染指纹。

Description

在铝合金表面镀抗指纹膜的方法
技术领域
本发明涉及一种在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,主要应用在电子产品铝合金外壳,用以提升手感以及解决易沾染指纹的问题。
背景技术
铝合金具有导热率高(100-200W/m℃)、强度高(200-500MPa)、耐腐蚀等独特优点,是理想的结构材料,在航空航天、船舶制造以及电子产品保护外壳等领域获得了广泛应用。
作为电子产品保护外壳材质,一般要求对铝合金做阳极氧化处理,并在封孔前对其染色,以得到风格各异的色彩。经阳极氧化处理后的铝合金表面硬度得到提升,常伴有独特的亚光效果,得到消费者的喜爱。
但经阳极氧化处理后的铝合金表面具有微观孔道结构,造成摩擦系数较大(0.6-0.7)影响使用手感。同时,其表面易沾染指纹,且不易擦掉,严重影响使用体验。优选的解决方案是在阳极氧化后的铝合金表面镀抗指纹薄膜,该薄膜材料一般为含氟的有机物,其链段碳原子被氟原子包围。成膜后,链段位于薄膜外侧,使得薄膜表层具有极低的表面能(最低可达6.7mJ/m2),手指上的油污不易浸润膜层表面,达到抗指纹、易清除的效果。
不过,正由于抗指纹材料表面能较低,致使其无法对基材有效浸润,造成膜层附着力弱、易脱落、寿命短的现象。
发明内容
目的:为了克服现有技术中存在的不足,解决抗指纹薄膜与阳极氧化后铝合金表面附着力差的问题,经分析得出其根本原因是:抗指纹材料分子链段极性弱,与铝合金基体间范德华力小,无法形成强的物理键合。并且,材料本身化学性质稳定,不与基材发生化学反应,不存在化学键合,因此无法浸润阳极氧化后铝合金表面。
本发明提供一种在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,该方法在提升抗指纹薄膜附着力的同时,不会对基材颜色产生影响。
技术方案:为解决上述技术问题,本发明采用的技术方案为:
一种在铝合金表面镀抗指纹膜的方法,包括以下步骤:
(1)铝合金基体先用无水乙醇清洁,之后采用等离子体清洗,去除附着在表面、结构疏松的无机物以及低表面能的有机物杂质,露出阳极氧化后具有不饱和化学键的表面:等离子体清洗可使有机物的化学键断裂,进而生成小分子物质被真空抽气系统带离铝合金基体表面,其次,荷能粒子对铝合金基体表面的轰击可提升铝合金基体温度,有助于水分等极性分子脱离铝合金基体表面,使得氧化铝分子暴露在真空中,铝合金基体表面具有大量的不饱和化学键;
(2)采用磁控溅射镀膜技术,在铝合金基体表面沉积缓冲层;所述缓冲层的材质为金属氧化物与非金属氧化物的混合物;缓冲层中的金属氧化物可与铝合金基体表面的氧化铝以共价键的形式形成稳定的化学键合;
(3)在缓冲层镀完后,采用真空蒸镀方式在缓冲层表面镀抗指纹薄膜;所述抗指纹薄膜的材质为含氟有机物;抗指纹薄膜的材料与缓冲层中的非金属氧化物经脱水缩合后形成稳定的化学键合,使得抗指纹薄膜与缓冲层结合牢固。
具体的,所述缓冲层中,金属氧化物中的金属为Ti、Cr、Al、Sb中的一种或几种。例如,金属氧化物选自二氧化钛、三氧化二铬、三氧化二铝、三氧化二锑、五氧化二锑;
非金属氧化物中的非金属为Si、C、B中的一种或几种。例如:非金属氧化物选自二氧化硅,一氧化碳,二氧化碳,三氧化二硼。
步骤(2)具体是指,清洗完毕后提升真空到10-5torr,通入Ar与反应气体,维持真空度在10-4torr,采用磁控溅射镀膜技术,在铝合金基体表面沉积厚度15-25nm的缓冲层。
步骤(3)具体是指,采用真空蒸镀方式在缓冲层表面镀抗指纹薄膜,工作真空度维持在10-5torr,指纹薄膜厚度在10-15nm。
作为更优选,所述抗指纹薄膜的材质与缓冲层所采用的金属氧化物、非金属氧化物在可见光波段均呈透明特性;因此不会影响基体颜色。
有益效果:本发明提供的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,抗指纹薄膜与阳极氧化后铝合金表面附着力差的问题所采用的原理是:某些非金属氧化物表面会聚集大量羟基,而抗指纹材料可以与羟基发生脱水缩合反应,形成较强的化学键合。因抗指纹材料与缓冲层中非金属氧化物表面羟基可发生脱水缩合作用,二者间具有较强的化学键,因此抗指纹薄膜与缓冲层附着牢固。缓冲层中的金属氧化物与铝合金基体表面的氧化铝可形成共价化学键合。因此,采用该技术镀制的抗指纹薄膜具有优秀的附着力,同时,抗指纹薄膜与缓冲层所采用的金属氧化物、非金属氧化物在可见光波段均呈透明特性,因此不会影响铝合金基体颜色;本发明方法可在不改变铝合金基体颜色的基础上,提升抗指纹薄膜与铝合金基体的附着力;产品表面触感光滑,不易沾染指纹。
附图说明
图1是本发明阳极氧化铝合金表面镀抗指纹膜后的示意图;
图中:11为表面经阳极氧化后的铝合金基体,12为缓冲层,13为抗指纹薄膜。
具体实施方式
下面结合附图对本发明作更进一步的说明。
如图1所示,为一种在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,包括以下步骤:
(1)铝合金基体11先用无水乙醇清洁,之后采用等离子体清洗,去除附着在表面、结构疏松的无机物以及低表面能的有机物杂质,露出阳极氧化后具有不饱和化学键的表面:等离子体清洗可使有机物的化学键断裂,进而生成小分子物质被真空抽气系统带离铝合金基体表面,其次,荷能粒子对铝合金基体表面的轰击可提升铝合金基体温度,有助于水分等极性分子脱离铝合金基体表面,使得氧化铝分子暴露在真空中,铝合金基体表面具有大量的不饱和化学键;
(2)清洗完毕后继续提升真空到10-5torr(mm Hg),通入Ar与反应气体,维持真空度在10-4torr,采用磁控溅射镀膜技术,在铝合金基体表面沉积厚度约20nm的缓冲层12;所述缓冲层的材质为金属氧化物与非金属氧化物的混合物;缓冲层中的金属氧化物可与铝合金基体表面的氧化铝以共价键的形式形成稳定的化学键合;
(3)在缓冲层镀完后,采用真空蒸镀方式在缓冲层表面镀抗指纹薄膜13,工作真空度维持在10-5torr,指纹薄膜厚度在10-15nm;所述抗指纹薄膜的材质为含氟有机物;抗指纹薄膜的材料与缓冲层中的非金属氧化物经脱水缩合后形成稳定的化学键合,使得抗指纹薄膜与缓冲层结合牢固。
实例1
测试标准确立:
依据抗指纹及附着力性能要求,确立测试标准如下:
抗指纹性能测试标准:镀膜后水接触角大于110°;
附着力测试标准:采用耐磨擦测试仪,压头直径11mm,负重500g,划痕范围60mm,速度1cyc/sec,钢丝绒#0000。摩擦后水接触角大于100°。
样品为0.8mm厚,经阳极氧化后的黑色铝合金基体,膜层结构为铝合金基体/非金属氧化物缓冲层/抗指纹薄膜;
测试结果:镀抗指纹薄膜前水接触角为57°,镀膜后水接触角113°,经摩擦测试后,水接触角75°。
实例2
样品为0.8mm厚,经阳极氧化后的黑色铝合金基体,膜层结构为铝合金基体/混合物缓冲层/抗指纹薄膜;
测试结果:镀抗指纹薄膜前水接触角为56°,镀膜后水接触角118°,经摩擦测试后,水接触角107°
以上所述仅是本发明的优选实施方式,应当指出:对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。

Claims (7)

1.一种在铝合金表面镀抗指纹膜的方法,包括以下步骤:
(1)铝合金基体先用无水乙醇清洁,之后采用等离子体清洗,去除附着在表面无机物以及有机物杂质,露出阳极氧化后具有不饱和化学键的表面:
(2)采用磁控溅射镀膜技术,在铝合金基体表面沉积缓冲层;所述缓冲层的材质为金属氧化物与非金属氧化物的混合物;缓冲层中的金属氧化物可与铝合金基体表面的氧化铝以共价键的形式形成稳定的化学键合;
(3)在缓冲层镀完后,采用真空蒸镀方式在缓冲层表面镀抗指纹薄膜;所述抗指纹薄膜的材质为含氟有机物;抗指纹薄膜的材料与缓冲层中的非金属氧化物经脱水缩合后形成稳定的化学键合,使得抗指纹薄膜与缓冲层结合牢固。
2.根据权利要求1所述的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,其特征在于:所述缓冲层中,金属氧化物中的金属为Ti、Cr、Al、Sb中的一种或几种。
3.根据权利要求1所述的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,其特征在于:所述缓冲层中,非金属氧化物中的非金属为Si、C、B中的一种或几种。
4.根据权利要求1所述的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,其特征在于:步骤(2)具体是指,清洗完毕后提升真空到10-5torr,通入Ar与反应气体,维持真空度在10-4torr,采用磁控溅射镀膜技术,在铝合金基体表面沉积厚度15-25nm的缓冲层。
5.根据权利要求1所述的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,其特征在于:步骤(3)具体是指,采用真空蒸镀方式在缓冲层表面镀抗指纹薄膜,工作真空度维持在10-5torr,指纹薄膜厚度在10-15nm。
6.根据权利要求1所述的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,其特征在于:所述抗指纹薄膜的材质在可见光波段均呈透明特性。
7.根据权利要求1所述的在阳极氧化处理后的铝合金表面镀抗指纹膜的方法,其特征在于:所述缓冲层所采用的金属氧化物、非金属氧化物在可见光波段均呈透明特性。
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