CN106415768A - Insulated thermal cut-off device - Google Patents
Insulated thermal cut-off device Download PDFInfo
- Publication number
- CN106415768A CN106415768A CN201580016574.0A CN201580016574A CN106415768A CN 106415768 A CN106415768 A CN 106415768A CN 201580016574 A CN201580016574 A CN 201580016574A CN 106415768 A CN106415768 A CN 106415768A
- Authority
- CN
- China
- Prior art keywords
- electrode
- temperature sensor
- thermal cut
- out device
- sealing coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
- H01H37/5427—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting encapsulated in sealed miniaturised housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H2037/528—Thermally-sensitive members actuated due to deflection of bimetallic element the bimetallic element being composed of more than two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/02—Bases, casings, or covers
- H01H9/04—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings
Abstract
A thermal cut-off device (100) includes a plastic base (102), two electrodes (104,114), a temperature sensing element (108), and a plastic cover (122) that fits over the base. The temperature sensing element is curved downward, and may be a bimetal or a trimetal. When the device is subject to an over-temperature condition, the orientation of the curve flips such that the temperature sensing element is then curved upward. When the temperature sensing element is curved upward, it lifts an arm of one of the electrodes, which severs the electrical connection between the electrodes. In this manner the device shuts off during an over-temperature condition in order to protect the circuit in which the device is installed. To prevent corrosion of the temperature sensing element, a first moisture insulation layer is applied to the outer surface of the thermal cut-off device. The moisture insulation layer may be an epoxy adhesive or a UV/visible light-cured adhesive or light/heat cured adhesive. In some embodiments, a second moisture insulation layer (138) is formed on the surface of the temperature sensing element.
Description
Technical field
The invention mainly relates to electronic protection circuit.More particularly it relates to a kind of isolation thermal cut-out device.
Background technology
In electronic circuit, faulty circuit is isolated by commonly used protection circuit with other circuit.For example, protection circuit can use
In prevent in electric circuit, in such as Li-ion batteries piles electrically or hot stall state.Protection circuit can be additionally used in preventing more
Serious problem, the fire for example being caused by power circuit fault.
Some circuit protection devices use temperature sensor.Temperature sensor under high-temperature and moist environment,
Can be corroded under wet environment particular with acetate ion and/or containing acid ingredient.The temperature sensor being corroded
Possibly cannot normal work, lead to circuit protection device lost efficacy.Acetate ion and/or acid ingredient are typically found in thermal cut-out
In the applied environment of device.Generally adopt electrical insulating tape to isolate thermal cut-out device, and prevent thermal cut-out and printed circuit board (PCB) or its
The contact of any metal to metal of the other assemblies on its substrate. the binding agent of electric unsulating tape may contain can in high temperature and
The acetate ion being released under high humidity environment and/or acid ingredient. additionally, being had by acid and other corrosive compound
The deformation of the temperature sensor that the material of preferably corrosion resistance is constituted is limited, and its thermal expansion character may be not enough to manufacture institute
Desired mini-plant.Undersized thermal cut-out device is desired；But in order to prevent being corroded, designer is for miniaturization
The reliability of equipment must be sacrificed.
Content of the invention
A kind of thermal cut-out device, including plastic feet, two electrodes, temperature sensor and be assemblied on base
Vinyl cover.Temperature sensor is bent downwardly, and can be bimetallic or three metals. when device bears over-temperature condition, bending section
Towards overturning, temperature sensor is then made to be bent upwards.When temperature sensor is bent upwards, it makes to be used for
The arm of the one of electrode being electrically connected in-between the electrodes lifts.By this way, cut off described dress under over-temperature conditions
Put, thus protecting the circuit installing described device. for preventing temperature sensor to be corroded, apply in the outer surface of thermal cut-out device
Add moist sealing coat.Described humidity sealing coat can be epobond epoxyn or UV/ visible curable adhesive or light heat can
Solidification binding agent.
Brief description
Fig. 1 shows the element of an example of the thermal cut-out device 100 for circuit protection.
Fig. 2 shows the thermal cut-out device as shown in Figure 1 after assembling.
Fig. 3 shows the moist sealing coat being applied on outside of deivce face as shown in Figure 1.
Fig. 4 shows that described humidity sealing coat may be applied to the side of thermal cut-out device.
Fig. 5 and 6 shows that moist sealing coat is applied to the end of thermal cut-out device.
Fig. 7 a-7c shows the outer surface that moist sealing coat is applied to thermal cut-out device, then with brush by binding agent
It is uniformly coated to a process on described device surface.
Specific embodiment
Fig. 1 shows the element of an example of the thermal cut-out device 100 for circuit protection.Described device includes plastics
Base 102, first electrode 104, positive temperature coefficient (PTC) chip 106, can be bimetallic plates temperature sensor 108.First
Electrode 104 includes the part 110 contacting with PTC chip 106 and the end extending laterally beyond plastic feet 102 edge
112. described devices further include the second electrode 114 positioned at temperature sensor 108 top.Second electrode 114 includes directly
Connect positioned at the Spring arm portions 116 of temperature sensor 108 top and extend outwardly away from from the other edge of plastic feet 102
End 118. described device include the metallic plate 120 above the Spring arm portions 116 of second electrode 114 and be sleeved on
The vinyl cover 122 assembling on substructure and with plastic feet 102.Vinyl cover 122 includes cover frame 124 and is assembled to cover frame
Interior cover die 126 in the opening 128 being formed on 124.Described device further includes to be clamped to the end of first electrode 104
The metal contact element 130 in opening 132 on 112, and it is clamped to opening on the Spring arm portions 116 of second electrode 114
Another metal contact element 134 in mouth 136.Described metal contact element 130 and 134 contacts with each other when being installed in circuit,
Thus forming the power path of the end 118 from the end 112 of first electrode 104 to second electrode 114.
Temperature sensor 108 has the shape of bending. and in FIG, temperature sensor 108 is bent downwardly, or changes
Yan Zhi, temperature sensor 108 have downwardly PTC chip 106 concave surface.Temperature sensor 108 can be such as Cu-
The bimetallic of Ni-Mn/Ni-Fe or Ni-Cr-Fe/Ni-Fe, three metals of such as Ni-Cu/Cu-Ni-Mn/Ni-Fe.Bimetallic or
Multiple layers of three metals may include highly expanded layer as wherein one layer, such as Cu-Ni-Mn or Ni-Cr-Fe, and is located at high swollen
Low bulk layer under swollen layer, such as Ni-Fe.Temperature sensor 108 can be coated with the second moist sealing coat 138, for example, connects
Touching anti-corrosion lubricant or contact coating. the anticorrosive lubricant of described contact can provide thin hydrophobicity cerul coating.Described contact
Coating can be hydrophobic fluoropolymer. the second moist sealing coat provides the shallow layer that can electric penetrate, i.e. electric current is permeable
And pass through described coating.PTC chip 106 can be polymer positive-temperature-coefficient (PPTC) chip or ceramic positive temperature coefficient (CPTC)
Chip.
Fig. 2 shows the thermal cut-out device 100 after assembling, including the vinyl cover 122 being assemblied on plastic feet 102, its
The end 118 of the end 112 of first electrode 104 and second electrode 114 stretches out from base 102.Device 100 passes through end
112 and 118 are connected with claimed circuit.
The height of device 100 is about 0.88mm, or about between 0.83mm to 0.93mm.The end of electrode 104 and 114
The height in portion 112 and 118 is about 0.10mm, or about between 0.09mm to 0.11mm.Device 100 is from the end of end 112
The width holding the end extending to end 118 along first axle is about 11.2mm, or about between 10.9mm to 11.5mm.Mould
Material shell (including base 102 and lid 122) is about 4.6mm along the width of described first axle, or about in 4.5mm extremely
Between 4.7mm. end 112 and 118 can extend about 33mm along described first axle from described shell, or about in 3.2mm extremely
3.4mm between.Depth along the cabinet of second axis vertical with first axle is about 2.8mm, or about in 2.7mm extremely
Between 2.9mm. end 112 and 118 is about 2.0mm along the depth of described second axis, or about between 1.9mm to 2.1mm.
At work, when the too high situation of temperature occurs, PTC chip 106 by heating, because it is above low bulk layer
It is provided with highly expanded layer, temperature sensor 108 reverses direction will be led to.In other words, when mounted, temperature sensor 108
Concave surface (in the face of PTC chip 106 basal surface) down, but produced by excess temperature condition, heat can lead to temperature sensor
108 are bent upwards, and make the top surface of temperature sensor 108 then become concave surface.When temperature sensor 108 " upset ", before
The edge of the angled temperature sensor 108 downwards and being at an angle of now upwards, applies to the spring arm 116 of second electrode 114
Plus power upwards.This power upwards makes spring arm 116 and contacts with the metal in the hole being clamped into spring arm and being formed on 116
Part 134 is lifted, and so that metal contact element 130 is no longer contacted with 134, thus cutting off electrical connection between end part 112 and 118 simultaneously
And shutoff device 100.
By this way, device 100 can prevent circuit from excess temperature situation, and Fig. 3 also show and is applied to the outer of device 100
On surface first moist sealing coat 302.Moist sealing coat 302 can prevent temperature sensor 108 high temperature and wet environment,
It is corroded in the wet environment particularly containing the corrosive element including acetate ion and/or acid ingredient.Specifically,
Fig. 3 shows the moist sealing coat 302 of the top surface being applied to described device.Moist sealing coat 302 can be for comprising epoxy resin
The epoxy adhesive of the firming agent of such as polyetheramine, or there is the bonding of the UV/ visible-light curing of urethane acrylate
Agent.Layer 302 has moisture resistance, to be reduced as far as the tide with the caustic such as such as acetate ion and/or acid ingredient
Wet penetrate in thermal cut-out device, thus preventing corrosion temperature sensing element.Fig. 4 shows that moist sealing coat 302 is also applied in
Side to device 100.Fig. 5 and 6 shows that moist sealing coat 302 is applied to the end of the device that end 112 and 118 is projected
Portion.
Fig. 7 a-7c shows the process for being applied to moist sealing coat 302 on the outer surface of thermal cut-out device 100.
Wherein, moist sealing coat 302 is epoxy resin.Device 100 can be loaded onto in fixture or holding meanss. in figure 7 a, adopts
Point plastic pin apply adhesive to electrode 112 or 118 and plastic frame 124 corner. binding agent is filled into the gap in corner
In, dampness access path is sealed.
As shown in Figure 7b, epoxy resin line 702 and 704 is applied to the edge of the top surface of device 100. as Fig. 7 c institute
Show, the center along device 100 top surface applies another epoxy resin line 706.Then, by uniform for described epoxy resin scrubbing brush in dress
Put on 100 top surface and side surface.
It is possible with identical process applying such as UV/ visible-light curing and light heat curable materials etc. other viscous
Mixture.
Although describing circuit protection device with reference to specific embodiment, it is understood by those skilled in the art that can be
On the premise of scope without departing from the application claim, various changes can be made or carries out equivalent.Additionally, can be according to teaching
Many modifications may be made to adapt to specific situation or material, without deviating from its scope.Therefore, it is intended to described thermal cut-out device simultaneously
It is not limited to disclosed specific embodiment, but be related to any any embodiment falling within the range of the claims.
Claims (13)
1. a kind of thermal cut-out device, including：
Base；
First electrode, is arranged on described base and includes end；
Temperature sensor, is arranged on above a part for described first electrode；
Second electrode, is arranged on above described temperature sensor and includes end；
Lid, described lid is assemblied on described base to form the part surrounding heat sensing element and first electrode and second electrode
Structure, wherein, the end of described first electrode and second electrode is prominent from the structure being formed by described lid and bottom seat；And
First moist sealing coat, at least a portion of the outer surface being formed at the structure being formed by described lid and bottom seat.
2. thermal cut-out device as claimed in claim 1, wherein, the described first moist sealing coat includes epoxy adhesive.
3. thermal cut-out device as claimed in claim 1, wherein, the described first moist sealing coat includes the epoxy containing firming agent
Resin is it is preferable that wherein said firming agent comprises polyetheramine.
4. thermal cut-out device as claimed in claim 1, wherein, described first moist sealing coat include Photocurable pressure-sensitive adhesive or
Light and heat curing adhesive.
5. thermal cut-out device as claimed in claim 1, wherein, described temperature sensor includes two or more expansions
Layer.
6. thermal cut-out device as claimed in claim 1, wherein, described temperature sensor includes bimetallic or three metals.
7. thermal cut-out device as claimed in claim 1, wherein, described temperature sensor is bending so that described temperature
The basal surface of sensing element is concave surface.
8. thermal cut-out device as claimed in claim 7, wherein, described temperature sensor is configured to the temperature when described device
Degree exceed during preset temperature upset curved surface towards so that when described device reaches described preset temperature, temperature sensor
Top surface be changed into concave surface it is preferable that wherein said temperature sensor is configured to the direction of the curved surface when temperature sensor
When being flipped up, lift a part for second electrode, thus cutting off the electrical connection between first electrode and second electrode.
9. thermal cut-out device as claimed in claim 1, further includes to be arranged on the positive temperature below described temperature sensor
Degree coefficient (PTC) chip.
10. thermal cut-out device as claimed in claim 1, further include be formed at temperature sensor on surface second
Moist sealing coat.
A kind of 11. thermal cut-out device, including：
Base；
First electrode, is arranged on described base and includes end；
Temperature sensor, is arranged on above a part for described first electrode；
Second moist sealing coat, is formed on the surface of described temperature sensor；
Second electrode, is arranged on above described temperature sensor and includes end；
It is assemblied in the lid on described base, described cap-shaped becomes to surround the part of heat sensing element and first electrode and second electrode
Structure, wherein, the end of described first electrode and second electrode is prominent from the structure being formed by described lid and bottom seat.
12. thermal cut-out device as claimed in claim 11, wherein, the described second moist sealing coat includes contacting lubricant or connects
Tactile coating is it is preferable that wherein said contact coating includes hydrophobic fluoropolymer.
13. thermal cut-out device as claimed in claim 11, wherein, the described second moist sealing coat provides hydrophobicity cerul and applies
Layer or electricity can penetrate shallow layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/228,196 US9831054B2 (en) | 2014-03-27 | 2014-03-27 | Insulated thermal cut-off device |
| US14/228,196 | 2014-03-27 | ||
| PCT/US2015/022918 WO2015148885A1 (en) | 2014-03-27 | 2015-03-27 | Insulated thermal cut-off device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106415768A true CN106415768A (en) | 2017-02-15 |
Family
ID=52997542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580016574.0A Pending CN106415768A (en) | 2014-03-27 | 2015-03-27 | Insulated thermal cut-off device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9831054B2 (en) |
| JP (1) | JP2017510039A (en) |
| KR (1) | KR20160136423A (en) |
| CN (1) | CN106415768A (en) |
| WO (1) | WO2015148885A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018120007A1 (en) * | 2016-12-30 | 2018-07-05 | Littelfuse Electronics (Shanghai) Co., Ltd. | Polymeric positive temperature coefficient device for battery cell protection |
| USD823266S1 (en) * | 2017-02-28 | 2018-07-17 | Digital Pulse Systems Pty Ltd | Sliding switch |
| JP7017874B2 (en) * | 2017-07-19 | 2022-02-09 | ボーンズ株式会社 | A breaker and a safety circuit equipped with it. |
| JP7017922B2 (en) | 2017-12-21 | 2022-02-09 | ボーンズ株式会社 | Breaker and safety circuit with it |
| JP7064350B2 (en) * | 2018-02-27 | 2022-05-10 | ボーンズ株式会社 | Breaker and safety circuit with it |
| JP6997685B2 (en) * | 2018-07-31 | 2022-01-18 | ボーンズ株式会社 | Current breaker, safety circuit and rechargeable battery pack |
| CN211377096U (en) * | 2020-03-24 | 2020-08-28 | 江门市昶顺机电有限公司 | Plug power line |
| IT202100018770A1 (en) * | 2021-07-15 | 2023-01-15 | Miotti S R L | TEMPERATURE LIMITER DEVICE |
| WO2024069853A1 (en) * | 2022-09-29 | 2024-04-04 | ボーンズ株式会社 | Breaker and secondary battery pack including same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102005332A (en) * | 2009-08-27 | 2011-04-06 | 马赛尔·P·霍夫萨埃斯 | Temperature-dependent switch |
| WO2012169442A1 (en) * | 2011-06-08 | 2012-12-13 | 株式会社小松ライト製作所 | Breaker, safety circuit including same, and secondary battery pack |
| DE102012112207B3 (en) * | 2012-12-13 | 2014-02-13 | Marcel P. HOFSAESS | Temperature-dependent switch |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1852333A (en) * | 1928-04-28 | 1932-04-05 | Honeywell Regulator Co | Actuator for controlling devices |
| US2347014A (en) * | 1937-09-24 | 1944-04-18 | Westinghouse Electric & Mfg Co | Thermal switching device |
| US2821836A (en) * | 1953-11-20 | 1958-02-04 | D H Mccorkle Company | Two-way fast acting bimetal control elements |
| US2800555A (en) * | 1954-08-18 | 1957-07-23 | Sundt Engineering Company | Low amperage circuit interrupter |
| DE1291538B (en) * | 1964-04-30 | 1969-03-27 | Danfoss As | Bimetal link for wet conditions and process for its manufacture |
| US3295081A (en) * | 1964-07-21 | 1966-12-27 | American Radiator & Standard | Thermo-magnetically operated switches |
| US3474372A (en) * | 1967-02-16 | 1969-10-21 | Crowell Designs Inc | Temperature-responsive switch having self-contained heater |
| US3665360A (en) * | 1970-03-11 | 1972-05-23 | Norden Alexander | Thermostat |
| US3767370A (en) * | 1971-11-22 | 1973-10-23 | Texas Instruments Inc | Composite thermostat material |
| US3842382A (en) * | 1973-07-19 | 1974-10-15 | Technar Inc | Electro-thermal relay actuator |
| US4121184A (en) * | 1975-10-20 | 1978-10-17 | General Electric Company | Electromagnetically controlled, temperature-sensitive (ECTS) reed switch with substantially hystersis free operation |
| US4016523A (en) * | 1975-12-22 | 1977-04-05 | Illinois Tool Works Inc. | Thermal switch device |
| US4115624A (en) * | 1977-03-29 | 1978-09-19 | Hood & Co., Inc. | Thermostat metal compositions |
| JPS5842752U (en) | 1981-09-16 | 1983-03-22 | 星家畜薬株式会社 | Cow blood measurement color chart |
| JPS5843752U (en) * | 1981-09-17 | 1983-03-24 | 東芝熱器具株式会社 | bimetal |
| JP2512887B2 (en) * | 1991-09-17 | 1996-07-03 | 三菱マテリアル株式会社 | Serge absorber |
| EP0659548B1 (en) * | 1993-12-27 | 2001-07-18 | Sumitomo Special Metals Company Limited | Bimetal |
| JP3522821B2 (en) | 1993-12-27 | 2004-04-26 | 住友特殊金属株式会社 | bimetal |
| DE19623570C2 (en) * | 1996-06-13 | 1998-05-28 | Marcel Hofsaes | Temperature monitor with a Kapton film |
| JPH10281457A (en) * | 1997-04-10 | 1998-10-23 | Tdk Corp | Bimetal type sensor for preventing over-heating of tempura-oil |
| US6949825B1 (en) * | 1999-07-09 | 2005-09-27 | Osram Opto Semiconductor Gmbh & Co. Ohg | Laminates for encapsulating devices |
| JP3756700B2 (en) * | 1999-07-22 | 2006-03-15 | ウチヤ・サーモスタット株式会社 | Thermal protector |
| US6633222B2 (en) * | 2000-08-08 | 2003-10-14 | Furukawa Precision Engineering Co., Ltd. | Battery breaker |
| JP2004014434A (en) * | 2002-06-11 | 2004-01-15 | Uchiya Thermostat Kk | Dc current shut-0ff switch |
| JP4121993B2 (en) | 2004-11-29 | 2008-07-23 | 株式会社小松ライト製作所 | Safety device built-in battery |
| KR100899282B1 (en) * | 2006-07-18 | 2009-05-27 | 주식회사 엘지화학 | Safety Switch Using Heat Shrinkage Tube and Secondary Battery Including the Same |
| US7800477B1 (en) * | 2007-03-20 | 2010-09-21 | Thermtrol Corporation | Thermal protector |
| JP4755134B2 (en) * | 2007-04-25 | 2011-08-24 | 三洋化成工業株式会社 | Curing agent for epoxy resin |
| DE102008048554B3 (en) * | 2008-09-16 | 2010-02-04 | Hofsaess, Marcel P. | Temperature-dependent switch |
| JP2012077243A (en) * | 2010-10-05 | 2012-04-19 | Gun Ei Chem Ind Co Ltd | Polybenzoxazine resin for compounding epoxy resin, and epoxy resin composition containing the same |
| US9159985B2 (en) * | 2011-05-27 | 2015-10-13 | Ostuka Techno Corporation | Circuit breaker and battery pack including the same |
| JP6267479B2 (en) * | 2013-10-15 | 2018-01-24 | ボーンズ株式会社 | Breaker, safety circuit including the same, and secondary battery circuit |
-
2014
- 2014-03-27 US US14/228,196 patent/US9831054B2/en active Active
-
2015
- 2015-03-27 KR KR1020167029552A patent/KR20160136423A/en unknown
- 2015-03-27 CN CN201580016574.0A patent/CN106415768A/en active Pending
- 2015-03-27 JP JP2016559185A patent/JP2017510039A/en active Pending
- 2015-03-27 WO PCT/US2015/022918 patent/WO2015148885A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102005332A (en) * | 2009-08-27 | 2011-04-06 | 马赛尔·P·霍夫萨埃斯 | Temperature-dependent switch |
| WO2012169442A1 (en) * | 2011-06-08 | 2012-12-13 | 株式会社小松ライト製作所 | Breaker, safety circuit including same, and secondary battery pack |
| DE102012112207B3 (en) * | 2012-12-13 | 2014-02-13 | Marcel P. HOFSAESS | Temperature-dependent switch |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160136423A (en) | 2016-11-29 |
| US9831054B2 (en) | 2017-11-28 |
| US20150279596A1 (en) | 2015-10-01 |
| JP2017510039A (en) | 2017-04-06 |
| WO2015148885A1 (en) | 2015-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106415768A (en) | Insulated thermal cut-off device | |
| TW200735135A (en) | PTC device | |
| US8599539B2 (en) | Ceramic chip assembly | |
| CN103903046B (en) | Transponder and its manufacture method for object identification | |
| CN102792442A (en) | Heat insulation/heat dissipation sheet and intra-device structure | |
| CN110268501A (en) | Fuse-wire device | |
| KR20100130147A (en) | Temperature sensor | |
| TWI244667B (en) | Connecting structure and connecting method of circuit | |
| US9834686B2 (en) | Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module | |
| JP2013516068A5 (en) | ||
| WO2003015108A3 (en) | Circuit protection device | |
| JP2013516068A (en) | Surface mount resistor with high power heat dissipation terminal and manufacturing method thereof | |
| KR100668108B1 (en) | Structure for assembly of heating plate and heater of hair iron | |
| TWI493576B (en) | Over-current protection device and protective curcuit board containing the same | |
| CN1963646A (en) | A method for preventing erosion of electrode and LCD made by the same method | |
| CN201130575Y (en) | PTC polymer thermal resistor | |
| JP2011525683A (en) | Battery cover structure having battery terminals | |
| JP2003168855A (en) | Electrical appliance | |
| CN207320003U (en) | A kind of disposable thermal protector | |
| JP2010147227A (en) | Electronic device package | |
| CN103106989B (en) | Over-current protecting element and battery protection circuit device | |
| CN216311678U (en) | Temperature control material sheet | |
| CN213341555U (en) | Protection device applied to power supply lead-out wire of electric heating glass in autoclave manufacturing process | |
| CN207800364U (en) | Capacitor with overheat protector function | |
| JP5348422B2 (en) | Temperature sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170215 |
|
| WD01 | Invention patent application deemed withdrawn after publication |