US20150279596A1 - Insulated Thermal Cut-Off Device - Google Patents
Insulated Thermal Cut-Off Device Download PDFInfo
- Publication number
- US20150279596A1 US20150279596A1 US14/228,196 US201414228196A US2015279596A1 US 20150279596 A1 US20150279596 A1 US 20150279596A1 US 201414228196 A US201414228196 A US 201414228196A US 2015279596 A1 US2015279596 A1 US 2015279596A1
- Authority
- US
- United States
- Prior art keywords
- sensing element
- temperature sensing
- thermal cut
- insulation layer
- moisture insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
- H01H37/5427—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting encapsulated in sealed miniaturised housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H2037/528—Thermally-sensitive members actuated due to deflection of bimetallic element the bimetallic element being composed of more than two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/02—Bases, casings, or covers
- H01H9/04—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings
Definitions
- the present invention relates generally to electronic protection circuitry. More, specifically, the present invention relates to an insulated thermal cut-off device.
- Protection circuits are often times utilized in electronic circuits to isolate failed circuits from other circuits.
- the protection circuit may be utilized to prevent damage from an electrical or thermal fault condition in an electrical circuit, such as in lithium-ion battery packs. Protection circuits may also be utilized to guard against more serious problems, such as a fire caused by a power supply circuit failure.
- Some circuit protection devices use a temperature sensing element. Temperature sensing elements can become corroded under high temperature and moisture environments, particularly from moisture with acetate ion and/or acid content. A corroded temperature sensing element may not work properly, causing the circuit protection device to fail. Acetate ions and/or acid content often exist in the thermal cut-off application environment.
- An electrical insulation tape is often used to isolate the thermal cut-off device and prevent any metal-to-metal contact of the thermal cut-off with other components on a printed circuit board or other substrate. The adhesive of the electrical insulation tape may contain acetate ions and/or acid content, which may be released under a high temperature and high humidity environment.
- temperature sensing elements comprising materials with better corrosion resistance to acids and other corrosive compounds may have a limited deflection and their thermal expansion characteristics may not be sufficient to allow the manufacture of the desired small devices.
- Small size thermal cut-off devices are desirable; but to guard against corrosion a designer must sacrifice reliability of the devices for miniaturization.
- a thermal cut-off device includes a plastic base, two electrodes, a temperature sensing element, and a plastic cover that fits over the base.
- the temperature sensing element is curved downward, and may be a bimetal or a trimetal.
- the orientation of the curve flips such that the temperature sensing element is then curved upward.
- the temperature sensing element is curved upward, it lifts an arm of one of the electrodes, which severs the electrical connection between the electrodes. In this manner the device shuts off during an over-temperature condition in order to protect the circuit in which the device is installed.
- a moisture insulation layer is applied to the outer surface of the thermal cut-off device.
- the moisture insulation layer may be an epoxy adhesive or a UV/visible light-cured adhesive or a light/heat curable adhesive.
- FIG. 1 shows elements of an example of a thermal cut-off device 100 for circuit protection.
- FIG. 2 shows an assembled thermal cut-off device as shown in FIG. 1 .
- FIG. 3 shows a moisture insulation layer applied to the outer surface of the device shown in FIG. 1 .
- FIG. 4 shows that the moisture insulation layer is also applied to the lateral sides of a thermal cut-off device.
- FIGS. 5 and 6 show that the moisture insulation layer is applied to the ends of a thermal cut-off device.
- FIGS. 7 a - 7 c demonstrate one of the processes for applying the moisture insulation layer to the outside surface of a thermal cut-off device, then using a brush to spread the adhesive on the device surface evenly.
- FIG. 1 shows elements of an example of a thermal cut-off device 100 for circuit protection.
- the device includes a plastic base 102 , a first electrode 104 , a positive temperature coefficient (PTC) chip 106 , and a bimetal plate 108 .
- the first electrode 104 includes a portion 110 in contact with the PTC chip 106 and a terminal portion 112 that extends laterally past the edge of the plastic base 102 .
- the device further includes a second electrode 114 positioned above the temperature sensing element 108 .
- the second electrode 114 includes a spring arm portion 116 that is directly above the temperature sensing element 108 and a terminal portion 118 that extends away from another edge of the plastic base 102 .
- the device includes a metal plate 120 above the spring arm portion 116 of the second electrode 114 and a plastic cover 122 that fits over the below structure and fits to the plastic base 102 .
- the plastic cover 122 includes a cover frame 124 and an over-mold 126 that fits into an opening 128 defined in the frame 124 .
- the device further includes a metal contact 130 that is clamped into an opening 132 in the terminal portion 112 of the first electrode 104 , and another metal contact 134 that is clamped into an opening 136 in the spring arm portion 116 of the second electrode 114 .
- the metal contacts 130 and 134 are in contact with each other, thus forming an electrical path from the terminal portion 112 of the first electrode 104 to the terminal portion 118 of the second electrode 114 .
- the temperature sensing element 108 has a curved shape. In FIG. 1 , the temperature sensing element 108 curves downward, or in other words, the temperature sensing element 108 has a concave surface facing downward toward the PTC chip 106 .
- the temperature sensing element 108 may be a bimetal such as Cu—Ni—Mn/Ni—Fe or Ni—Cr—Fe/Ni—Fe, trimetal such as Ni—Cu/Cu—Ni—Mn/Ni—Fe.
- the multiple layers of the bimetal or trimetal may include a high expansion layer as one of the layers, e.g. Cu—Ni—Mn or Ni—Cr—Fe, and a low expansion layer, e.g.
- the temperature sensing element 108 may be coated with a second moisture insulation layer 138 , such as a contact anti-corrosion lubricant or a contact coating.
- the contact anti-corrosion lubricant may provide a thin hydrophobic wax-based coating.
- the contact coating may be a hydrophobic fluorinated polymer.
- the second moisture insulation layer provides an electrically penetrable thin coating, i.e. electrical current can penetrate and pass through the coating.
- the PTC chip 106 may be a polymeric positive temperature coefficient (PPTC) chip or a ceramic positive temperature coefficient (CPTC) chip.
- FIG. 2 shows an assembled thermal cut-off device 100 , including the plastic cover 122 fitted over the plastic base 102 , with the terminal portion 112 of the first electrode 104 and terminal portion 118 of the second electrode 114 extending away from the base 102 .
- the device 100 is connected with the circuit-to-be-protected through the terminal portions 112 and 118 .
- a height of the device 100 may be about 0.88 mm, or between about 0.83 mm and about 0.93 mm.
- a height of the terminal portions 112 and 118 of the electrodes 104 and 114 may be about 0.10 mm, or between about 0.09 mm and about 0.11 mm.
- a width of the device 100 extending along a first axis from the end of the terminal portion 112 to the end of the terminal portion 118 is about 11.2 mm, or between about 10.9 mm and about 11.5 mm.
- a width of the plastic casing (including the base 102 and cover 122 ) along the first axis may be about 4.6 mm, or between about 4.5 mm and about 4.7 mm.
- the terminal portions 112 and 118 may extend past the casing along the first axis by about 3.3 mm, or between about 3.2 mm and 3.4 mm.
- a depth of the plastic casing along a second axis that is perpendicular to the first axis is about 2.8 mm, or between about 2.7 mm and about 2.9 mm.
- a depth of the terminal portions 112 and 118 along the second axis direction is about 2.0 mm, or between about 1.9 mm and 2.1 mm.
- the PTC chip 106 would heat up and cause the temperature sensing element 108 to flip its orientation due to its layering of high expansion layer above a low expansion layer.
- the concave surface (bottom surface facing the PTC chip 106 ) of the temperature sensing element 108 is facing downward, but the heating due to an over-temperature condition would cause temperature sensing element 108 to curve upwards, such that the top surface of the temperature sensing element 108 is then the concave surface.
- the temperature sensing element 108 “flips”, the edges of the temperature sensing element 108 , which were previously angled downwards and are now angled upwards, exert an upward force on the spring arm 116 of the second electrode 114 .
- FIG. 3 further shows a first moisture insulation layer 302 applied to the outer surface of the device 100 .
- the moisture insulation layer 302 prevents corrosion of the temperature sensing element 108 under high temperature and moist environments, particularly moisture containing corrosive elements, including acetate ion and/or acid content.
- FIG. 3 shows the moisture insulation layer 302 applied to a top surface of the device.
- the moisture insulation layer 302 may be an epoxy adhesive that contains epoxy resin and a curing agent such as polyoxypropylenediamine, or UV/visible light-curable adhesives which have acrylated urethane.
- the layer 302 provides moisture resistance to minimize the ingress of moisture with corrosive agents, e.g.
- FIG. 4 shows that the moisture insulation layer 302 is also applied to the lateral sides of the device 100 .
- FIGS. 5 and 6 show that the moisture insulation layer 302 is applied to the ends of the device from which the terminal portions 112 and 118 protrude.
- FIGS. 7 a - 7 c demonstrate the process for applying the moisture insulation layer 302 to the outside surface of the thermal cut-off device 100 , where the moisture insulation layer 302 is an epoxy.
- the device 100 may be loaded into a fixture or holding device.
- an adhesive is applied at the corner of the electrode 112 or 118 and plastic frame 124 using a dispensing needle. The adhesive fills into the gap in that corner and seals the moisture ingress path.
- epoxy lines 702 and 704 are applied on the edges of the top surface of the device 100 .
- another epoxy line 706 is applied along a center of the top surface of the device 100 . The epoxy is then brushed evenly over the top and side surfaces of the device 100 .
- UV/visible light-curable and light/heat curable material also can be applied by the same process method.
- circuit protection device has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the claims of the application. In addition, many modifications may be made to adapt a particular situation or material to the teachings without departing from its scope. Therefore, it is intended that the thermal cut-off device is not to be limited to the particular embodiments disclosed, but to any embodiments that fall within the scope of the claims.
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Thermally Actuated Switches (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
- I. Field
- The present invention relates generally to electronic protection circuitry. More, specifically, the present invention relates to an insulated thermal cut-off device.
- II. Background Details
- Protection circuits are often times utilized in electronic circuits to isolate failed circuits from other circuits. For example, the protection circuit may be utilized to prevent damage from an electrical or thermal fault condition in an electrical circuit, such as in lithium-ion battery packs. Protection circuits may also be utilized to guard against more serious problems, such as a fire caused by a power supply circuit failure.
- Some circuit protection devices use a temperature sensing element. Temperature sensing elements can become corroded under high temperature and moisture environments, particularly from moisture with acetate ion and/or acid content. A corroded temperature sensing element may not work properly, causing the circuit protection device to fail. Acetate ions and/or acid content often exist in the thermal cut-off application environment. An electrical insulation tape is often used to isolate the thermal cut-off device and prevent any metal-to-metal contact of the thermal cut-off with other components on a printed circuit board or other substrate. The adhesive of the electrical insulation tape may contain acetate ions and/or acid content, which may be released under a high temperature and high humidity environment. Further, temperature sensing elements comprising materials with better corrosion resistance to acids and other corrosive compounds may have a limited deflection and their thermal expansion characteristics may not be sufficient to allow the manufacture of the desired small devices. Small size thermal cut-off devices are desirable; but to guard against corrosion a designer must sacrifice reliability of the devices for miniaturization.
- A thermal cut-off device includes a plastic base, two electrodes, a temperature sensing element, and a plastic cover that fits over the base. The temperature sensing element is curved downward, and may be a bimetal or a trimetal. When the device is subject to an over-temperature condition, the orientation of the curve flips such that the temperature sensing element is then curved upward. When the temperature sensing element is curved upward, it lifts an arm of one of the electrodes, which severs the electrical connection between the electrodes. In this manner the device shuts off during an over-temperature condition in order to protect the circuit in which the device is installed. To prevent corrosion of the temperature sensing element, a moisture insulation layer is applied to the outer surface of the thermal cut-off device. The moisture insulation layer may be an epoxy adhesive or a UV/visible light-cured adhesive or a light/heat curable adhesive.
-
FIG. 1 shows elements of an example of a thermal cut-offdevice 100 for circuit protection. -
FIG. 2 shows an assembled thermal cut-off device as shown inFIG. 1 . -
FIG. 3 shows a moisture insulation layer applied to the outer surface of the device shown inFIG. 1 . -
FIG. 4 shows that the moisture insulation layer is also applied to the lateral sides of a thermal cut-off device. -
FIGS. 5 and 6 show that the moisture insulation layer is applied to the ends of a thermal cut-off device. -
FIGS. 7 a-7 c demonstrate one of the processes for applying the moisture insulation layer to the outside surface of a thermal cut-off device, then using a brush to spread the adhesive on the device surface evenly. -
FIG. 1 shows elements of an example of a thermal cut-offdevice 100 for circuit protection. The device includes aplastic base 102, afirst electrode 104, a positive temperature coefficient (PTC)chip 106, and abimetal plate 108. Thefirst electrode 104 includes aportion 110 in contact with thePTC chip 106 and aterminal portion 112 that extends laterally past the edge of theplastic base 102. The device further includes asecond electrode 114 positioned above thetemperature sensing element 108. Thesecond electrode 114 includes aspring arm portion 116 that is directly above thetemperature sensing element 108 and aterminal portion 118 that extends away from another edge of theplastic base 102. The device includes ametal plate 120 above thespring arm portion 116 of thesecond electrode 114 and aplastic cover 122 that fits over the below structure and fits to theplastic base 102. Theplastic cover 122 includes acover frame 124 and an over-mold 126 that fits into an opening 128 defined in theframe 124. The device further includes ametal contact 130 that is clamped into an opening 132 in theterminal portion 112 of thefirst electrode 104, and anothermetal contact 134 that is clamped into anopening 136 in thespring arm portion 116 of thesecond electrode 114. At installation into a circuit, themetal contacts terminal portion 112 of thefirst electrode 104 to theterminal portion 118 of thesecond electrode 114. - The
temperature sensing element 108 has a curved shape. InFIG. 1 , thetemperature sensing element 108 curves downward, or in other words, thetemperature sensing element 108 has a concave surface facing downward toward thePTC chip 106. Thetemperature sensing element 108 may be a bimetal such as Cu—Ni—Mn/Ni—Fe or Ni—Cr—Fe/Ni—Fe, trimetal such as Ni—Cu/Cu—Ni—Mn/Ni—Fe. The multiple layers of the bimetal or trimetal may include a high expansion layer as one of the layers, e.g. Cu—Ni—Mn or Ni—Cr—Fe, and a low expansion layer, e.g. Ni—Fe, below the high expansion layer. Thetemperature sensing element 108 may be coated with a secondmoisture insulation layer 138, such as a contact anti-corrosion lubricant or a contact coating. The contact anti-corrosion lubricant may provide a thin hydrophobic wax-based coating. The contact coating may be a hydrophobic fluorinated polymer. The second moisture insulation layer provides an electrically penetrable thin coating, i.e. electrical current can penetrate and pass through the coating. ThePTC chip 106 may be a polymeric positive temperature coefficient (PPTC) chip or a ceramic positive temperature coefficient (CPTC) chip. -
FIG. 2 shows an assembled thermal cut-offdevice 100, including theplastic cover 122 fitted over theplastic base 102, with theterminal portion 112 of thefirst electrode 104 andterminal portion 118 of thesecond electrode 114 extending away from thebase 102. Thedevice 100 is connected with the circuit-to-be-protected through theterminal portions - A height of the
device 100 may be about 0.88 mm, or between about 0.83 mm and about 0.93 mm. A height of theterminal portions electrodes device 100 extending along a first axis from the end of theterminal portion 112 to the end of theterminal portion 118 is about 11.2 mm, or between about 10.9 mm and about 11.5 mm. A width of the plastic casing (including thebase 102 and cover 122) along the first axis may be about 4.6 mm, or between about 4.5 mm and about 4.7 mm. Theterminal portions terminal portions - During operation, when an over-temperature condition occurs, the
PTC chip 106 would heat up and cause thetemperature sensing element 108 to flip its orientation due to its layering of high expansion layer above a low expansion layer. In other words, at installation the concave surface (bottom surface facing the PTC chip 106) of thetemperature sensing element 108 is facing downward, but the heating due to an over-temperature condition would causetemperature sensing element 108 to curve upwards, such that the top surface of thetemperature sensing element 108 is then the concave surface. When the temperature sensingelement 108 “flips”, the edges of thetemperature sensing element 108, which were previously angled downwards and are now angled upwards, exert an upward force on thespring arm 116 of thesecond electrode 114. This upward force lifts thespring arm 116 and themetal contact 134 which is clamped into the hole defined in thespring arm 116, such that themetal contacts terminal portions device 100. - In this manner the
device 100 protects a circuit from over-temperature conditions.FIG. 3 further shows a firstmoisture insulation layer 302 applied to the outer surface of thedevice 100. Themoisture insulation layer 302 prevents corrosion of thetemperature sensing element 108 under high temperature and moist environments, particularly moisture containing corrosive elements, including acetate ion and/or acid content. In particular,FIG. 3 shows themoisture insulation layer 302 applied to a top surface of the device. Themoisture insulation layer 302 may be an epoxy adhesive that contains epoxy resin and a curing agent such as polyoxypropylenediamine, or UV/visible light-curable adhesives which have acrylated urethane. Thelayer 302 provides moisture resistance to minimize the ingress of moisture with corrosive agents, e.g. acetate ion and/or acid content into thermal cut-off device, thus preventing corrosion of the temperature sensing element.FIG. 4 shows that themoisture insulation layer 302 is also applied to the lateral sides of thedevice 100.FIGS. 5 and 6 show that themoisture insulation layer 302 is applied to the ends of the device from which theterminal portions -
FIGS. 7 a-7 c demonstrate the process for applying themoisture insulation layer 302 to the outside surface of the thermal cut-offdevice 100, where themoisture insulation layer 302 is an epoxy. Thedevice 100 may be loaded into a fixture or holding device. InFIG. 7 a, an adhesive is applied at the corner of theelectrode plastic frame 124 using a dispensing needle. The adhesive fills into the gap in that corner and seals the moisture ingress path. - As shown in
FIG. 7 b,epoxy lines device 100. As shown inFIG. 7 c, anotherepoxy line 706 is applied along a center of the top surface of thedevice 100. The epoxy is then brushed evenly over the top and side surfaces of thedevice 100. - Other adhesives such as UV/visible light-curable and light/heat curable material also can be applied by the same process method.
- While the circuit protection device has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the claims of the application. In addition, many modifications may be made to adapt a particular situation or material to the teachings without departing from its scope. Therefore, it is intended that the thermal cut-off device is not to be limited to the particular embodiments disclosed, but to any embodiments that fall within the scope of the claims.
Claims (20)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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US14/228,196 US9831054B2 (en) | 2014-03-27 | 2014-03-27 | Insulated thermal cut-off device |
PCT/US2015/022918 WO2015148885A1 (en) | 2014-03-27 | 2015-03-27 | Insulated thermal cut-off device |
CN201580016574.0A CN106415768A (en) | 2014-03-27 | 2015-03-27 | Insulated thermal cut-off device |
JP2016559185A JP2017510039A (en) | 2014-03-27 | 2015-03-27 | Insulation heat shut-off device |
KR1020167029552A KR20160136423A (en) | 2014-03-27 | 2015-03-27 | Insulated thermal cut-off device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US14/228,196 US9831054B2 (en) | 2014-03-27 | 2014-03-27 | Insulated thermal cut-off device |
Publications (2)
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US20150279596A1 true US20150279596A1 (en) | 2015-10-01 |
US9831054B2 US9831054B2 (en) | 2017-11-28 |
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US14/228,196 Active 2034-10-25 US9831054B2 (en) | 2014-03-27 | 2014-03-27 | Insulated thermal cut-off device |
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US (1) | US9831054B2 (en) |
JP (1) | JP2017510039A (en) |
KR (1) | KR20160136423A (en) |
CN (1) | CN106415768A (en) |
WO (1) | WO2015148885A1 (en) |
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WO2018120007A1 (en) * | 2016-12-30 | 2018-07-05 | Littelfuse Electronics (Shanghai) Co., Ltd. | Polymeric positive temperature coefficient device for battery cell protection |
US11462866B2 (en) * | 2020-03-24 | 2022-10-04 | Jiangmen Changshun Mechanical & Electronical Co, Ltd. | Plug power cord |
IT202100018770A1 (en) * | 2021-07-15 | 2023-01-15 | Miotti S R L | TEMPERATURE LIMITER DEVICE |
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JP7017874B2 (en) * | 2017-07-19 | 2022-02-09 | ボーンズ株式会社 | A breaker and a safety circuit equipped with it. |
JP7017922B2 (en) * | 2017-12-21 | 2022-02-09 | ボーンズ株式会社 | Breaker and safety circuit with it |
JP7064350B2 (en) * | 2018-02-27 | 2022-05-10 | ボーンズ株式会社 | Breaker and safety circuit with it |
JP6997685B2 (en) * | 2018-07-31 | 2022-01-18 | ボーンズ株式会社 | Current breaker, safety circuit and rechargeable battery pack |
WO2024069853A1 (en) * | 2022-09-29 | 2024-04-04 | ボーンズ株式会社 | Breaker and secondary battery pack including same |
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JP6267479B2 (en) * | 2013-10-15 | 2018-01-24 | ボーンズ株式会社 | Breaker, safety circuit including the same, and secondary battery circuit |
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- 2015-03-27 KR KR1020167029552A patent/KR20160136423A/en unknown
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018120007A1 (en) * | 2016-12-30 | 2018-07-05 | Littelfuse Electronics (Shanghai) Co., Ltd. | Polymeric positive temperature coefficient device for battery cell protection |
US11462866B2 (en) * | 2020-03-24 | 2022-10-04 | Jiangmen Changshun Mechanical & Electronical Co, Ltd. | Plug power cord |
IT202100018770A1 (en) * | 2021-07-15 | 2023-01-15 | Miotti S R L | TEMPERATURE LIMITER DEVICE |
WO2023286102A1 (en) * | 2021-07-15 | 2023-01-19 | Miotti S.R.L. | Temperature limiting device |
Also Published As
Publication number | Publication date |
---|---|
US9831054B2 (en) | 2017-11-28 |
JP2017510039A (en) | 2017-04-06 |
WO2015148885A1 (en) | 2015-10-01 |
KR20160136423A (en) | 2016-11-29 |
CN106415768A (en) | 2017-02-15 |
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