JP2003168855A - Electrical appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrical appliance capable of preventing corrosion and solder cracks of an electrolytic capacitor due to moistures even at the time of using it outdoors. <P>SOLUTION: A printed board 2 for which an electronic component 1 including an aluminum electrolytic capacitor 1a is mounted on a mounting surface 2a is attached inside a case 3 in a rectangular parallelepiped shape whose one end face is opened. For the aluminum electrolytic capacitor 1a arranged mutually closely on the mounting surface 2a, a lead and a part of a main body continued to the lead are coated with resin 4 and the resin whose structure viscosity ratio is 1.5 or higher and viscosity is 10,000 mPas or higher is used for the resin 4. Thus, when the resin 4 is injected in the vicinity of the lead of the aluminum electrolytic capacitor 1a, the lead of the aluminum electrolytic capacitor 1a and a part of the main body continued to the lead are filled with the resin without spreading it to the other electronic component 1. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric device in which a container for housing a circuit board on which electronic parts are mounted is filled with resin.

[0002]

2. Description of the Related Art Moisture resistance is required for electric equipment used in an outdoor environment. For example, in the case of a lighting fixture, a discharge lamp lighting device, which is an electric device, has a configuration in which a circuit board (printed circuit board) on which electronic components are mounted is housed in a container (case), and the case is housed in the lighting equipment body. However, the main body of the lighting fixture does not have a completely closed structure because it requires a drainage hole, etc., and there is a risk of dew condensation on the electrical equipment in an outdoor environment where the temperature changes greatly.

There is a method of dealing with the dew condensation by setting a certain distance between the charging parts, but the more reliable one is the first.
Japanese Patent Application Laid-Open No. 6-53681 discloses a conventional example of the above, and its processing procedure is shown in FIGS. 7 (a) and 7 (b). In the first conventional example, the printed circuit board 2 on which the electronic component 1 is mounted is mounted in a rectangular parallelepiped metal case 3 ′ having an open end. Then, the second resin 21 is injected mainly so as to bury the printed circuit board 2, and then the second resin 21 is applied so as to cover the portion of the electronic component 1 near the upper portion with a predetermined layer thickness. Pour onto resin 21.

That is, as shown in FIGS. 8 and 9, after the printed circuit board 2 is housed in the case 3 ', resin between the printed circuit board 2 and the inner bottom surface of the case 3'is prevented from being affected by the ambient temperature. The second resin 21 having a low viscosity and a low hardness is filled for the purpose of reducing the stress caused by the volume change and relaxing the stress.

Further, in order to secure a predetermined layer thickness in the electronic component 1 portion above the printed circuit board 2, low hardness (however,
The first resin 20 having a higher hardness than the second resin 21) and high thixotropy is coated, and the electronic parts 1 and the connecting portion between the printed circuit board 2 and the case 3 ′ are also sufficiently coated with the resin. In addition to being possible, it is not necessary to fill the inside of the case 3'with resin, so that the amount of material used can be reduced. For example, for heat dissipation, an electronic component 1h that is attached in a state in which a part thereof is in close contact with the inner surface 3a 'of the case 3'
In this case, the surface of the component except the contact surface with the case 3 ′ is covered with the first resin 20.

Regarding the electrical connection between the printed circuit board 2 and the case 3 ', as shown in FIG. 8, the ground pattern 23 of the printed circuit board 2 is formed so as to be continuous up to the periphery of the mounting hole. After inserting the screw N into this mounting hole, the screw N may be screwed into the screw hole of the boss M provided upright on the bottom surface of the case 3 ′ (in the drawing, the vicinity of the head of the screw N is partially (Notched), or using lead wire L as shown in FIG.

However, in the first conventional example, as shown in FIG. 10, the first resin 20 squeezed between the electronic component 1 and the printed circuit board 2 expands and contracts due to the temperature change. There is a risk that a force will be applied to the solder portion 8 through the lead 9 and a solder crack will occur, and rather, consideration of the relaxation of the stress F1 on the first resin 20 becomes more important. In particular, as shown in FIG. 11, for a printed circuit board direct mounting component in which the main body of the electronic component 1 and the printed circuit board 2 are mounted so as to be extremely close to each other, expansion and contraction F2 of the printed circuit board 2 itself is performed via resin Direct electronic components 1
Since it will also be transmitted to the main body of the, the stress on the solder portion 8 becomes even greater, so that when using a printed circuit board of paper phenol with a large linear expansion coefficient, or a component with a small lead diameter that reduces the amount of solder, etc. Especially, the influence becomes remarkable.

Therefore, as a second conventional example, an electric device which solves the above-mentioned problem is a Japanese Patent Application No. 2000-331 shown in FIG.
No. 379 is proposed. According to the second conventional example, the electronic component 1 ′ having a large heat generation amount is surface-mounted on the solder surface 2b of the printed board 2 and the other electronic component 1 is mounted on the mounting surface 2a.
Since the resin 22 is filled only between the solder surface 2b of the printed circuit board 2 and the inner bottom surface of the case 3 ', the heat radiation by the resin 22 can be efficiently performed, and the first conventional method can be used. The example problem can be solved. Further, by adopting this configuration, if the control circuit section in which small parts are densely packed is surface-mounted on the solder surface 2b,
Since the resin 22 can protect it from dew condensation, it may be used in an outdoor environment.

[0009]

However, the electronic component 1
Aluminum electrolytic capacitors commonly used in
a has a sectional structure as shown in FIG. A substantially cylindrical aluminum case 11 having one end opened is mounted in a substantially cylindrical outer sleeve 10 having both ends opened, and an internal element 12 wound with an aluminum foil is housed inside the aluminum case 11. The aluminum lead wire 13 pulled out from the bottom surface of the internal element 12 is welded to the lead wire terminal 14 of the tin-plated CP wire (tin-plated copper-coated steel wire), which is the lead portion,
It constitutes an electrode terminal. A sealing member 15 made of a rubber bushing is provided around the aluminum lead wire 13 on one end side of the aluminum case 11, and a pressure valve 16 for releasing the internal pressure to the outside at the time of overheating or overvoltage is provided on the other end side. .

The lead portion of the lead wire terminal 14 of the aluminum electrolytic capacitor 1a is provided outside the sealing material 15 (rubber bushing) because of its structure. Due to the standard electrode potential of, there is a possibility that battery corrosion will occur due to the inclusion of ions contained in water and the like. In particular, when used in a salt-damaged area such as along the coast even in an outdoor environment, there is a possibility that the lead may be cut due to corrosion in a short period of time, leading to a failure of electric equipment.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an electric device capable of preventing corrosion of an electrolytic capacitor due to moisture and solder cracks even when used outdoors.

[0012]

According to a first aspect of the present invention, there is provided a circuit board on which an electronic component including at least an electrolytic capacitor is mounted, and a container accommodating the circuit substrate, and at least the electrolytic capacitor among the electronic components. The lead portion and a part of the body of the capacitor following the lead portion are coated with a resin having a structural viscosity ratio of 1.5 or more and a viscosity of 10,000 mPa · s or more.

According to a second aspect of the present invention, in the first aspect, the electronic component having a large heat generation amount among the electronic components is surface-mounted on one surface of the circuit board and fixed with solder, and And the inner bottom surface of the container are arranged to face each other, and a structural viscosity ratio of 1.5 or more in the lead portion of the electrolytic capacitor and a part of the body of the capacitor following the lead portion, Viscosity is 10,000 mPa
· Covering a first resin of s or more, filling the second resin between one surface of the circuit board and the inner bottom surface of the container, the first resin being more than the second resin. It is characterized by low hardness and elastic modulus.

According to a third aspect of the present invention, in the first or second aspect, the resin is a urethane resin.

A fourth aspect of the present invention is characterized in that, in any one of the first to third aspects, the resin with which the electrolytic capacitor is coated has an elastic modulus of 20 MPa or less at the lower limit temperature of the operating temperature range.

According to a fifth aspect of the present invention, in any one of the second to fourth aspects, the first resin does not contain a filler, and the second resin contains a filler.

According to a sixth aspect of the present invention, in any one of the second to fifth aspects, an electron which is surface-mounted between one surface of the circuit board and an inner bottom surface of the container and which is surface-mounted on the one surface of the circuit board. A cavity that is not filled with the second resin is provided in a portion that does not affect the heat dissipation path of the component, and the circuit board communicates with the cavity and has a through hole that is not covered or filled with the first resin. It is formed.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the circuit board is made of paper phenol.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the circuit board and the electronic component form a lighting circuit for lighting a discharge lamp.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) The structure of an electric device according to this embodiment is shown in a cutaway perspective view of FIG. In this embodiment, a printed circuit board 2 on which an electronic component 1 including an aluminum electrolytic capacitor 1a is mounted on a mounting surface 2a is mounted in a rectangular parallelepiped case 3 whose one end surface is open.

On the mounting surface 2a, the aluminum electrolytic capacitors 1a are arranged in close proximity to each other, and the bottom surface of the main body on which the lead wire terminals project is mounted so as to face the mounting surface 2a, or the lead wire terminals are mounted. Is mounted so that the side surface of the main body faces the mounting surface 2a.

The lead portion of the aluminum electrolytic capacitor 1a and a part of the main body following the lead portion are covered with a resin 4, and the resin 4 has a structural viscosity ratio of 1.5 or more and a viscosity of 100.
Since the resin of 00 mPa · s or more is used, if the resin 4 is injected mainly in the vicinity of the lead portion of the aluminum electrolytic capacitor 1a, the lead portion and the lead of the aluminum electrolytic capacitor 1a do not spread to other electronic components 1. The part and the part of the body following the part can be resin-filled.

That is, since the lead portion of the aluminum electrolytic capacitor 1a is covered with the resin 4, it is possible to prevent the battery from being corroded by moisture, and the resin 4 does not wrap around to other electronic parts 1. There is no risk of solder cracks due to expansion and contraction of the resin 4. Further, since the lead portion of the aluminum electrolytic capacitor 1a is a clinch lead having a curved portion, stress on the solder portion of the aluminum electrolytic capacitor 1a is considerably reduced, and no solder crack occurs.

There is also an effect that the main body of the aluminum electrolytic capacitor 1a can be fixed to the printed board 2 by the resin 4.

(Embodiment 2) The structure of an electric device according to this embodiment is shown in a cutaway perspective view of FIG. 2. The same components as those in Embodiment 1 are designated by the same reference numerals and their description is omitted. In this embodiment, resin filling is performed when the aluminum electrolytic capacitors 1a are arranged apart from each other, and the three aluminum electrolytic capacitors 1a are mounted separately from each other on one end side on the mounting surface 2a of the printed circuit board 2. There is. The FET 1b, the capacitor 1c, and the diode 1g are mounted substantially on the same straight line as the end portion of the aluminum electrolytic capacitor 1a 'mounted in the most central position and so as to surround the other aluminum electrolytic capacitor 1a. Terminal 1d which is a component directly attached to the printed circuit board
Is mounted on the other end of the mounting surface 2a, and is a current fuse 1e and a choke coil 1 which are also components directly attached to the printed circuit board.
The f (drum type) is mounted on the other end side of the mounting surface 2a with the FET 1b, the capacitor 1c, and the diode 1g sandwiched between the aluminum electrolytic capacitor 1a.

The resin 4 used here has a structural viscosity ratio of 1.
It is a urethane resin having a viscosity of 5 or more and a viscosity of 10,000 mPa · s or more. The hardness and elastic modulus increase as the temperature of the urethane resin decreases, but the elastic modulus is 20 MPa at the lower limit of the operating temperature range of about -20 ° C. The following resins have extremely low stress.

In the present embodiment, the aluminum electrolytic capacitors 1a are coated with the resin 4 to cover the lead parts of all the aluminum electrolytic capacitors 1a and a part of the main body following the lead parts.
The resin 4 is injected from one end side of the mounting surface 2a on which is arranged. At this time, depending on the case, the injection is performed while moving the injection position.

Also in this embodiment, the structural viscosity ratio is 1.5 or more and the viscosity is 10,000 mPa · s as in the first embodiment.
Since the resin 4 described above is used, the flow of the resin 4 is small, and the FET 1b, the capacitor 1c, the diode 1 are used.
Since g serves to prevent the resin 4 from flowing to the other end of the mounting surface 2a, the resin 4 is applied to the terminals 1d, the current fuse 1e, and the choke coil 1f, which are electronic components extremely disadvantageous to solder cracks. It doesn't go around.

That is, the aluminum electrolytic capacitor 1a is arranged at one end side on the mounting surface 2a of the printed circuit board 2, and the terminal 1
d, the current fuse 1e, the choke coil 1f, and other electronic components such as the FET 1b, the capacitor 1c, and the diode 1g are arranged on the other end side of the mounting surface 2a, which are disadvantageous to solder cracks. Since the parts are arranged so as to form a boundary between them, the position of resin filling is fixed around the aluminum electrolytic capacitor 1a, and the occurrence of solder cracks in the parts directly attached to the printed circuit board due to expansion and contraction of the resin 4 is prevented. In addition, since the lead portion of the aluminum electrolytic capacitor 1a is covered with the resin 4, it is possible to prevent the occurrence of battery corrosion due to water.

Further, the aluminum electrolytic capacitor 1a is capable of relieving stress by the rubber-type sealing material provided on the bottom surface, and the diameter of the lead terminal is large and the amount of solder is large. Also, since the resin 4 which is advantageous for solder cracks and has extremely small stress is used, no solder cracks occur in the aluminum electrolytic capacitor 1a.

(Embodiment 3) The processing procedure of the electrical equipment of this embodiment is shown in the side sectional views of FIGS. 3 (a), 3 (b) and 3 (c). The same reference numerals are given and the description is omitted. In the present embodiment, the electronic component 1 ′ having a large heat generation amount is surface-mounted on the solder surface 2b of the printed board 2. Further, electronic components 1 such as an aluminum electrolytic capacitor 1a, a capacitor 1c, a terminal 1d, a choke coil 1f are mounted on the mounting surface 2a, and the aluminum electrolytic capacitors 1a are arranged close to each other as in the first embodiment.

Next, the processing procedure of this embodiment will be described. First, as shown in FIG. 3A, a resin 5 (second resin) is formed at a central portion of an inner bottom surface of a case 3 of a rectangular parallelepiped-shaped synthetic resin molded product having one end surface opened so as to be higher than a peripheral portion. 3) is arranged in a raised manner, and then, as shown in FIG. 3B, the solder surface 2b of the printed circuit board 2 on which the electronic components 1 and 1 ′ are mounted and the inner bottom surface of the case 3 are opposed to each other.
It is stored inside and while spreading the resin 5 on the solder surface 2b,
The resin 5 is spread evenly and filled between the solder surface 2b of the printed circuit board 2 and the inner bottom surface of the case 3 to bring the resin 5 into close contact with the electronic component 1 '. Recesses A are provided on both end surfaces in the case 3 substantially parallel to the bottom surface, and both end portions of the printed circuit board 2 are fitted into the recessed parts A, whereby the printed circuit board 2
Are mounted in the case 3. Then, as shown in FIG. 3C, if the resin 4 (first resin) is injected around the lead portion of the aluminum electrolytic capacitor 1a, it spreads to other electronic components 1 as in the first embodiment. It is possible to cover the lead portion of the aluminum electrolytic capacitor 1a and a part of the main body following the lead portion with the resin 4 without the need.

As the resin 4 which is the first resin, a resin having low fluidity is used as in the first embodiment, and the resin 5 which is the second resin has low fluidity (for example, structural viscosity ratio,
A material having a viscosity similar to that of the resin 4) and a relatively high thermal conductivity is used to radiate heat from the electronic component 1 '.

In this embodiment as well, since the resin 4 does not wrap around the electronic components 1 other than the aluminum electrolytic capacitor 1a like the first embodiment, there is no risk of solder cracks due to expansion or contraction of the resin 4, and the aluminum electrolytic capacitor 1a
Since the lead portion is covered with the resin 4, the occurrence of battery corrosion due to water can be prevented. Further, since the lead portion of the aluminum electrolytic capacitor 1a is a clinch lead having a curved portion, stress on the solder portion of the aluminum electrolytic capacitor 1a is considerably reduced, and there is no risk of solder cracks.

If a slight clearance is provided in the mounting portion between the printed circuit board 2 and the case 3, the expansion and contraction of the resin 5 can be absorbed, and the electronic component 1'mounted on the solder surface 2b can be absorbed. You can avoid stress.

By adopting such a structure, the stress on the solder portion of the electronic component 1 can be reduced, so that a paper phenol substrate having a large linear expansion coefficient can be used for the printed circuit board 2 and the cost can be reduced. be able to.

Further, although the case 3 is made of a synthetic resin molded article in this embodiment, it may be made of metal in order to further enhance the heat radiation efficiency of the electronic component 1 '.

(Embodiment 4) The structure of the electric equipment of the present embodiment is shown in the side sectional view of FIG. 4. The same components as those in Embodiments 2 and 3 are designated by the same reference numerals and the description thereof will be omitted. In the present embodiment, similarly to the second embodiment, the aluminum electrolytic capacitor 1a is arranged at one end side on the mounting surface 2a of the printed circuit board 2 to directly connect the printed circuit board which is disadvantageous to solder cracks such as the terminals 1d and the choke coil 1f. Since the mounting component is disposed on the other end side of the mounting surface 2a and the component is disposed so as to form a boundary between other electronic components such as the FET 1b and the diode 1g, the resin 4 (first resin) is used. Is fixed around the aluminum electrolytic capacitor 1a so that the resin 4 does not wrap around the terminals 1d, the choke coil 1f, etc., which are extremely disadvantageous to solder cracks, and the resin 4 expands. It is possible to prevent the generation of solder cracks in the parts directly attached to the printed circuit board due to the contraction, and the lead portion of the aluminum electrolytic capacitor 1a is covered with the resin 4, so that moisture is prevented. The occurrence of cell corrosion from can prevent.

Further, similarly to the third embodiment, the electronic component 1'having a large amount of heat generation is surface-mounted on the solder surface 2b of the printed circuit board 2, and the heat conduction between the solder surface 2b and the inner bottom surface of the case 3 is performed. The resin 5 (second resin) having a relatively high rate is filled to radiate heat from the electronic component 1'which generates a large amount of heat.

Then, in FIG. 4, the resin 5 protrudes to the mounting surface 2a of the printed circuit board and is in contact with the resin 4,
In this case, since the compatibility between the resin 4 and the resin 5 becomes a problem,
In this embodiment, urethane resin is used for both resin 4 and resin 5. This is because the addition reaction type silicone resin of the platinum catalyst generally used for the resin 4 is used and the urethane resin is used for the resin 5, the curing inhibition occurs at the interface.

The urethane resin of the resin 4 has a low fluidity as in the other examples, and is a resin having an extremely low hardness and a low elastic modulus containing no filler, and the urethane resin of the resin 5 has a low fluidity (for example, A material having a structural viscosity ratio and a viscosity similar to that of the resin 4) and a high thermal conductivity containing a filler is used. This is because when the filler is not included, the hardness and elastic modulus tend to be relatively low (the heat dissipation coefficient cannot be so high). When the filler is included, the hardness and elastic modulus are high, but the heat dissipation coefficient can also be high. Therefore, it is possible to efficiently dissipate heat from the electronic component 1'which generates a large amount of heat.

The arrangement of components on the component surface 2a and the filling / covering method of the resin 4 in this embodiment are the same as those in the second embodiment, and the heat dissipation coefficient of the resin 4 is not so high (heat transfer is also low), so that the temperature The heat transfer from the electronic component 1'which generates a large amount of heat to the aluminum electrolytic capacitor 1a, which is a component whose rise is desired to be suppressed, is suppressed to prevent a decrease in reliability.

The method of filling the resin 4 and the resin 5 is substantially the same as that of the third embodiment, but the resin 5 is cured in the state of FIG. 3B so that the resin 4 and the resin 5 are not mixed. After that (for example, the urethane bond is generated by a chemical reaction between polyisocyanate and a polyol, and the heating can shorten the curing time), the resin 4 is filled.

At this time, since the resin 4 is a resin having a low fluidity, when the gap between the printed board 2 and the electronic component 1 is small to some extent, an air layer is formed during filling.
For example, the aluminum electrolytic capacitor 1a is covered with the resin 4 up to the lower part of the body, but as can be seen from FIG. 13, the outer shape is generally uneven, and an air layer is formed in this portion without the resin 4 wrapping around. It is.

Although this air layer may be advantageous in terms of stress relaxation, when the resin 4 is filled and then cured by heating, air bubbles expand from the surface of the resin due to expansion of the air layer, etc. The crater-like holes are formed by removing the lead wires to expose the lead portions of the printed circuit board 2 and the aluminum electrolytic capacitor 1a. Therefore, in this embodiment,
The resin 4 is cured at room temperature to avoid such a problem.

(Embodiment 5) The structure of the electric equipment of the present embodiment is shown in the side sectional view of FIG. 5, and is arranged on the solder surface 2b of the printed circuit board 2 between the solder surface 2b and the inner bottom surface of the case 3. A cavity 6 that is not filled with the resin 5 is provided near the lower portion of the terminal 1d that does not affect the heat dissipation path of the surface-mounted electronic component 1'having a large amount of heat generation, and a cavity is provided at a location corresponding to the cavity 6 of the printed circuit board 2. This embodiment is different from the fourth embodiment in that a through hole 7 that connects the portion 6 and the mounting surface side 2a is formed. The same components as those in the fourth embodiment are designated by the same reference numerals and description thereof will be omitted. To do.

As the resin 5, when a urethane resin which forms a urethane bond by a chemical reaction between a polyisocyanate and a polyol and cures is used, since the polyisocyanate before curing is a highly reactive material, the moisture content before curing is high. If present, water reacts with polyisocyanate to generate carbon dioxide gas (CO ₂ ). Further, since the printed circuit board 2 contains a small amount of water, carbon dioxide gas is generated at the contact surface between the printed circuit board 2 and the resin 5 due to the water contained in the printed circuit board 2 and bubbles are generated, resulting in Electronic component 1'which is surface-mounted on the printed circuit board 2 or the solder surface 2b
And the resin 5 do not come into close contact with each other, and the heat dissipation is reduced.

Therefore, as shown in FIG. 6, the carbon dioxide gas G generated is allowed to escape in the direction of arrow C, that is, to the cavity portion 6 and to the outside through the through hole 7, thereby allowing the printed circuit board 2 and the electronic component 1'and the resin. The degree of adhesion with 5 is prevented.

The procedure for filling the resin 4 and the resin 5 is substantially the same as that of the fourth embodiment, but if the resin 5 is cured while being heated as a condition for curing, the printed board 2 can be dried together. Therefore, the water content contained in the printed circuit board can be reduced as much as possible.

That is, the resin 4 is cured at room temperature to give the resin 5
By performing high temperature curing, it is possible to provide more reliable electric equipment.

When the electric device of this embodiment is used in a discharge lamp lighting device, it is generally used indoors in a dry place, and therefore it is normally provided without being filled with resin 4 or covered. However, if the configuration of this embodiment is adopted for outdoor use, even if the number of outdoor use is small, it suffices to add a few steps in manufacturing, which leads to a reduction in manufacturing cost. There is also the effect.

[0053]

According to the invention of claim 1, there is provided a circuit board on which an electronic component including at least an electrolytic capacitor is mounted, and a container accommodating the circuit substrate, and at least a lead portion of the electrolytic capacitor of the electronic component. A structural viscosity ratio of 1.5 is provided in a part of the body of the capacitor following the lead part.
As described above, since the resin having a viscosity of 10000 mPa · s or more is coated, if the resin is injected mainly in the vicinity of the lead portion of the electrolytic capacitor, the lead portion and the lead portion of the electrolytic capacitor do not spread to other electronic parts. A part of the main body following the can be resin-filled. Therefore, since the lead part of the electrolytic capacitor is covered with resin to prevent the occurrence of battery corrosion due to moisture, and because the resin does not wrap around to other electronic parts, there is no risk of solder cracks due to resin expansion or contraction. There is an effect that there is no. Further, there is an effect that the electrolytic capacitor can be fixed to the circuit board by the resin.

According to a second aspect of the present invention, in the first aspect, an electronic component having a large heat generation amount among the electronic components is surface-mounted on one surface of the circuit board and fixed with solder, and And the inner bottom surface of the container are arranged to face each other, and a structural viscosity ratio of 1.5 or more in the lead portion of the electrolytic capacitor and a part of the body of the capacitor following the lead portion, Viscosity is 10,000 mPa
· Covering a first resin of s or more, filling the second resin between one surface of the circuit board and the inner bottom surface of the container, the first resin being more than the second resin. Since the hardness and elastic modulus are small, it is possible to suppress heat transfer from an electronic component having a large amount of heat generation to an electrolytic capacitor, which is a component whose temperature rise is desired to be suppressed, and prevent deterioration of reliability, and an electronic component having a large amount of heat generation. Has an effect that heat can be released by the second resin.

According to the invention of claim 3, in claim 1 or 2, since the resin is a urethane resin, it is possible to prevent the occurrence of curing inhibition at the interface when a plurality of resins are mixed with each other. is there.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the resin coated on the electrolytic capacitor has an elastic modulus of 20 Mpa or less at the lower limit temperature of the operating temperature range. Elastic modulus is 20 MPa
If it is the following, the resin has extremely small stress, and there is an effect that the stress on the electrolytic capacitor can be reduced.

According to a fifth aspect of the present invention, in any one of the second to fourth aspects, the first resin does not contain a filler and the second resin contains a filler. Therefore, the first resin not containing a filler is The hardness and elastic modulus can be reduced, and the second resin containing the filler has high hardness and elastic modulus, but can also have a high heat dissipation coefficient and can efficiently dissipate heat from an electronic component that generates a large amount of heat. There is an effect.

According to a sixth aspect of the present invention, in any one of the second to fifth aspects, an electron which is surface-mounted between one surface of the circuit board and an inner bottom surface of the container and which is surface-mounted on the one surface of the circuit board. A cavity that is not filled with the second resin is provided in a portion that does not affect the heat dissipation path of the component, and the circuit board communicates with the cavity and has a through hole that is not covered or filled with the first resin. Since it is formed, air bubbles generated at the time of curing the second resin are released to the cavity and also to the outside through the through holes, thereby preventing a decrease in the degree of adhesion between the circuit board or electronic component and the second resin. Therefore, there is an effect that the heat dissipation can be maintained.

According to the invention of claim 7, in any one of claims 1 to 6, since the circuit board is made of paper phenol, there is an effect that the cost can be reduced.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the circuit board and the electronic component form a lighting circuit for lighting a discharge lamp.
The discharge lamp lighting device having any of the configurations can be used outdoors, and the same effects as those of claims 1 to 7 can be obtained.

[Brief description of drawings]

FIG. 1 is a cutaway perspective view showing a first embodiment of the present invention.

FIG. 2 is a cutaway perspective view showing a second embodiment of the present invention.

3 (a), (b), (c) are side sectional views showing a processing procedure of a third embodiment of the present invention.

FIG. 4 is a side sectional view showing a fourth embodiment of the present invention.

FIG. 5 is a side sectional view showing a fifth embodiment of the present invention.

FIG. 6 is a partial cross-sectional view showing a fifth embodiment of the present invention.

7A and 7B are side cross-sectional views showing a processing procedure of a conventional example.

FIG. 8 is a cutaway perspective view showing a first conventional example.

FIG. 9 is another broken perspective view showing the first conventional example.

FIG. 10 is a partial cross-sectional view showing a first conventional example.

FIG. 11 is an enlarged partial sectional view showing a first conventional example.

FIG. 12 is a side sectional view showing a second conventional example.

FIG. 13 is a sectional structural view of an aluminum electrolytic capacitor.

[Explanation of symbols]

1 electronic components 1a Aluminum electrolytic capacitor 2 printed circuit boards 3 cases 4 resin

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toshikazu Hongo             Ikeda Electric Co., Ltd. No. 404-1, Nishinosue, Himeji City, Hyogo Prefecture             Within the corporation F term (reference) 5E314 AA24 BB06 CC17 FF21 GG01                       GG11 GG24 GG26                 5E336 AA02 BB01 CC01 CC53 CC55                       CC57 CC60 EE01 GG03 GG30

Claims (8)

[Claims] 1. A circuit board on which an electronic component including at least an electrolytic capacitor is mounted, and a container accommodating the circuit board, wherein at least a lead portion of the electrolytic capacitor of the electronic component and the capacitor following the lead portion. Part of the main body of the structure has a structural viscosity ratio of 1.5 or more and a viscosity of 10
An electric device coated with a resin of 000 mPa · s or more. 2. An electronic component having a large heat generation amount among the electronic components is surface-mounted on one surface of the circuit board and fixed by solder, and the one surface of the circuit board and the inner bottom surface of the container are separated from each other. They are arranged so as to face each other, and have a structural viscosity ratio of 1.5 or more and a viscosity of 1 in the lead portion of the electrolytic capacitor and a part of the body of the capacitor following the lead portion.
A first resin of 0000 mPa · s or more is coated, and a second resin is provided between one surface of the circuit board and the inner bottom surface of the container.
2. The electric device according to claim 1, wherein the first resin has a hardness and an elastic modulus smaller than that of the second resin. 3. The electric device according to claim 1, wherein the resin is a urethane resin. 4. The resin coated on the electrolytic capacitor is
The electric device according to any one of claims 1 to 3, wherein the elastic modulus is 20 Mpa or less at the lower limit temperature of the operating temperature range. 5. The electric device according to claim 2, wherein the first resin does not contain a filler, and the second resin contains a filler. 6. The second portion is provided between the one surface of the circuit board and the inner bottom surface of the container, and at a portion which does not affect the heat radiation path of the electronic component surface-mounted on the one surface of the circuit board.
6. A hollow portion which is not filled with the resin is provided, and the circuit board is formed with a through hole which communicates with the hollow portion and is not covered or filled with the first resin. Or listed electrical equipment. 7. The electric device according to claim 1, wherein the circuit board is made of paper phenol. 8. The electric device according to claim 1, wherein the circuit board and the electronic component constitute a lighting circuit for lighting a discharge lamp.