CN106414546A - 快速固化的环氧粘合剂组合物 - Google Patents

快速固化的环氧粘合剂组合物 Download PDF

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Publication number
CN106414546A
CN106414546A CN201580031090.3A CN201580031090A CN106414546A CN 106414546 A CN106414546 A CN 106414546A CN 201580031090 A CN201580031090 A CN 201580031090A CN 106414546 A CN106414546 A CN 106414546A
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CN
China
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weight
curable compositions
curable composition
less
present disclosure
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Pending
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CN201580031090.3A
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English (en)
Chinese (zh)
Inventor
苏海勃·埃尔吉姆阿维
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN106414546A publication Critical patent/CN106414546A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201580031090.3A 2014-06-17 2015-06-17 快速固化的环氧粘合剂组合物 Pending CN106414546A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14172755.2 2014-06-17
EP14172755.2A EP2957584B1 (en) 2014-06-17 2014-06-17 Rapid curing epoxy adhesive compositions
PCT/US2015/036189 WO2015195775A1 (en) 2014-06-17 2015-06-17 Rapid curing epoxy adhesive compositions

Publications (1)

Publication Number Publication Date
CN106414546A true CN106414546A (zh) 2017-02-15

Family

ID=50942204

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580031090.3A Pending CN106414546A (zh) 2014-06-17 2015-06-17 快速固化的环氧粘合剂组合物

Country Status (10)

Country Link
US (1) US10882947B2 (https=)
EP (1) EP2957584B1 (https=)
JP (1) JP6626012B2 (https=)
KR (1) KR20170018912A (https=)
CN (1) CN106414546A (https=)
BR (1) BR112016029780A2 (https=)
CA (1) CA2952248A1 (https=)
ES (1) ES2625552T3 (https=)
PL (1) PL2957584T3 (https=)
WO (1) WO2015195775A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110461901A (zh) * 2017-04-04 2019-11-15 3M创新有限公司 用于航空航天应用的具有低收缩和较低后固化特性与耐化学品性的环氧-有机硅混合密封剂组合物
CN111748079A (zh) * 2020-07-14 2020-10-09 道生天合材料科技(上海)股份有限公司 一种可快速固化的固化剂及使用该固化剂的环氧树脂系统
CN113631624A (zh) * 2019-04-30 2021-11-09 喜利得股份公司 用于环氧树脂化合物的固化剂组合物、具有改进的低温固化的环氧树脂化合物和多组分环氧树脂体系
CN114207017A (zh) * 2019-08-06 2022-03-18 株式会社钟化 固化性组合物
CN114316137A (zh) * 2020-10-09 2022-04-12 罗门哈斯电子材料有限责任公司 高折射率材料
TWI900487B (zh) * 2019-07-31 2025-10-11 日商力森諾科股份有限公司 接著劑套組及接著體

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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EP3275915B1 (en) * 2016-07-29 2022-11-30 3M Innovative Properties Company Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties
EP3275914B1 (en) * 2016-07-29 2022-05-11 3M Innovative Properties Company Flame retardant adhesive composition
CN108929518B (zh) * 2017-05-26 2022-11-25 洛阳尖端技术研究院 一种环氧树脂吸波复合材料及其制备方法
US10792884B2 (en) * 2017-06-15 2020-10-06 The Boeing Company Composite panel sandwich structures with integrated joints
US11286335B2 (en) 2018-05-17 2022-03-29 Evonik Operations Gmbh Fast-curing epoxy systems
US11359048B2 (en) * 2018-05-17 2022-06-14 Evonik Operations Gmbh Fast-curing epoxy systems
EP3569629B1 (de) 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
EP3569630B1 (de) 2018-05-17 2022-08-03 Evonik Operations GmbH Schnell härtende epoxysysteme
WO2020033037A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033036A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
EP3626757A1 (de) * 2018-09-19 2020-03-25 Hilti Aktiengesellschaft Verwendung von salzen als beschleuniger in einer epoxidharzmasse zur chemischen befestigung
EP3660069B1 (de) 2018-11-29 2024-01-03 Evonik Operations GmbH Schnell härtende epoxysysteme
CN110530924A (zh) * 2019-08-08 2019-12-03 西安交通大学 一种可施加电场的dsc电极系统
US11453744B2 (en) 2019-10-15 2022-09-27 Evonik Operations Gmbh Compositions consisting of BrØnsted acids and monoamines
WO2021206471A1 (ko) * 2020-04-09 2021-10-14 코오롱인더스트리 주식회사 접착제 조성물 및 고무 보강재
EP3981817B1 (de) 2020-10-12 2025-09-10 Evonik Operations GmbH Zusammensetzungen umfassend brönstedtsäuren und monoamine
EP4194516A1 (en) 2021-12-09 2023-06-14 Jotun A/S Coatings
WO2025116899A1 (en) * 2023-11-29 2025-06-05 Uniseal, Inc. Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4101459A (en) * 1975-10-23 1978-07-18 Ciba-Geigy Corporation Compositions for curing epoxide resins
EP2223966A1 (en) * 2009-02-25 2010-09-01 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
CN102307925A (zh) * 2009-02-06 2012-01-04 3M创新有限公司 室温固化环氧树脂粘合剂
CN103068946A (zh) * 2010-08-10 2013-04-24 3M创新有限公司 环氧树脂结构粘合剂

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US3282015A (en) 1962-04-20 1966-11-01 Frederick W Rohe Moldable insert fastener with dual potting ports in head
US3271498A (en) 1964-01-27 1966-09-06 Rohe Method of installation of moldable insert in sandwich panel
US4668736A (en) * 1984-07-18 1987-05-26 Minnesota Mining And Manufacturing Company Fast curing epoxy resin compositions
CA1249691A (en) * 1984-07-18 1989-01-31 Janis Robins Fast curing epoxy resin compositions
JPS62501299A (ja) 1985-06-26 1987-05-21 ザ　ダウ　ケミカル　カンパニ− ゴム改質エポキシ化合物
US4941785A (en) 1989-09-13 1990-07-17 Witten Donald W Potted insert for honeycomb panels
JP5604771B2 (ja) * 2006-04-24 2014-10-15 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料およびその製造方法
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
JP5281901B2 (ja) * 2007-02-13 2013-09-04 株式会社カネカ 硬化性組成物
JP5547641B2 (ja) * 2008-09-29 2014-07-16 株式会社カネカ 硬化性組成物およびその硬化物
GB0905362D0 (en) * 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
US9139699B2 (en) * 2012-10-04 2015-09-22 Dow Corning Corporation Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts
DE102012203794A1 (de) * 2012-03-12 2013-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch lösbarer Polyamid-Klebstoff
JP2014139293A (ja) * 2012-12-20 2014-07-31 Dow Global Technologies Llc エポキシ樹脂組成物、それを製造する方法、およびその物品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4101459A (en) * 1975-10-23 1978-07-18 Ciba-Geigy Corporation Compositions for curing epoxide resins
CN102307925A (zh) * 2009-02-06 2012-01-04 3M创新有限公司 室温固化环氧树脂粘合剂
EP2223966A1 (en) * 2009-02-25 2010-09-01 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
CN102333819A (zh) * 2009-02-25 2012-01-25 3M创新有限公司 在宽温度范围内具有高机械强度的环氧树脂粘合剂组合物
CN103068946A (zh) * 2010-08-10 2013-04-24 3M创新有限公司 环氧树脂结构粘合剂

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110461901A (zh) * 2017-04-04 2019-11-15 3M创新有限公司 用于航空航天应用的具有低收缩和较低后固化特性与耐化学品性的环氧-有机硅混合密封剂组合物
CN113631624A (zh) * 2019-04-30 2021-11-09 喜利得股份公司 用于环氧树脂化合物的固化剂组合物、具有改进的低温固化的环氧树脂化合物和多组分环氧树脂体系
CN113631624B (zh) * 2019-04-30 2023-10-20 喜利得股份公司 用于环氧树脂化合物的固化剂组合物、具有改进的低温固化的环氧树脂化合物和多组分环氧树脂体系
TWI900487B (zh) * 2019-07-31 2025-10-11 日商力森諾科股份有限公司 接著劑套組及接著體
CN114207017A (zh) * 2019-08-06 2022-03-18 株式会社钟化 固化性组合物
CN111748079A (zh) * 2020-07-14 2020-10-09 道生天合材料科技(上海)股份有限公司 一种可快速固化的固化剂及使用该固化剂的环氧树脂系统
CN114316137A (zh) * 2020-10-09 2022-04-12 罗门哈斯电子材料有限责任公司 高折射率材料

Also Published As

Publication number Publication date
PL2957584T3 (pl) 2017-08-31
US20170088664A1 (en) 2017-03-30
ES2625552T3 (es) 2017-07-19
WO2015195775A1 (en) 2015-12-23
EP2957584B1 (en) 2017-03-01
US10882947B2 (en) 2021-01-05
EP2957584A1 (en) 2015-12-23
CA2952248A1 (en) 2015-12-23
BR112016029780A2 (pt) 2017-08-22
JP6626012B2 (ja) 2019-12-25
JP2017519869A (ja) 2017-07-20
KR20170018912A (ko) 2017-02-20

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Application publication date: 20170215

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