CN106332531B - A kind of working medium cooling system by contact of server - Google Patents
A kind of working medium cooling system by contact of server Download PDFInfo
- Publication number
- CN106332531B CN106332531B CN201610933985.2A CN201610933985A CN106332531B CN 106332531 B CN106332531 B CN 106332531B CN 201610933985 A CN201610933985 A CN 201610933985A CN 106332531 B CN106332531 B CN 106332531B
- Authority
- CN
- China
- Prior art keywords
- spray
- spray chamber
- server
- cooling system
- workspace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Nozzles (AREA)
Abstract
The invention discloses a kind of working medium cooling system by contact of server, including spraying zone and the server workspace being arranged below spraying zone, liquid working substance after spraying zone with server workspace by first contacting, it is flowed back again by return port, spraying zone includes the second spray chamber that the first spray chamber and sprinkle density are more than the first spray chamber, first spray chamber is not connected to the second spray chamber, first spray chamber includes the first inlet opening and multiple first spray equipments, first spray equipment is corresponding with the room temperature region of server workspace, second spray chamber includes the second inlet opening and at least one second spray equipment, second spray equipment is corresponding with the high-temperature area of server workspace.The present invention system entirety Energy Efficiency Ratio be higher than existing computer room data center server cooling system, and it is reliability and durability, be conveniently replaceable repair.
Description
Technical field
The present invention relates to server cooling technology fields, and in particular to a kind of working medium cooling system by contact of server.
Background technology
Usually densely group is filled with the equipment such as server, interchanger, storage device in server cabinet, the consumption of these equipment
Electric power simultaneously generates heat.With the increase of business and the raising of server performance, the load and its calorific value of server also with
Increase, the thermic load concentrated very much can be formed in server cabinet, and if heat that these thermic loads generate disperses not in time,
Performance, safety and service life to equipment are all totally unfavorable.For the temperature and wet for maintaining needed for server reliably working
Degree, need to efficiently remove the heat that these servers shed, therefore, it is necessary to take an effective method to improve this height
Heating problem.
Invention content
In order to solve the problems in the existing technology, the present invention provides a kind of server liquid spray cooling system,
The big feature of specific heat capacity of the specific heat ratio air of liquid working substance is utilized in the spray cooling system, can increase substantially heat transfer
Performance can targetedly carry out local strengthening cooling, preferably reduce server work by being positioned to high-temperature regions such as CPU
Make temperature, improves server service life.
The specific technical solution of the present invention is as follows:
A kind of working medium cooling system by contact of server, including spraying zone and the service that is arranged below the spraying zone
Device workspace, liquid working substance is contacted by first after the spraying zone with the server workspace, then is flowed back by return port,
The spraying zone includes the second spray chamber that the first spray chamber and sprinkle density are more than first spray chamber, described
First spray chamber is not connected to second spray chamber,
First spray chamber include the first inlet opening and multiple first spray equipments, first spray equipment with it is described
The room temperature region of server workspace corresponds to,
Second spray chamber include the second inlet opening and at least one second spray equipment, second spray equipment with
The high-temperature area of the server workspace corresponds to.
Preferably, first spray chamber is arranged with the second spray chamber same layer.
Preferably, first spray chamber is arranged with the different layer of second spray chamber.
Preferably, first spray equipment is uniformly distributed in first spray chamber, and first spray equipment is
Drench fluid apertures.
Preferably, second spray equipment is leaching fluid apertures.
Preferably, second spray equipment is spray nozzle.
Preferably, the high-temperature area of the server workspace includes CPU section domain.
Preferably, the liquid working substance is heat transfer medium oil.
Implement the invention has the advantages that:
(1) present invention divides region on the basis of the high-temperature area to server workspace positions, targetedly
Carry out cool down, the big flow for realizing the uniform spray cooling of room temperature region large area and high-temperature area concentrates heat dissipation so that is
The whole Energy Efficiency Ratio of system is higher than existing computer room data center server cooling system;
(2) liquid working substance is in direct contact with the heat generating spot in server workspace in the present invention, and heat transfer resistance is almost
Zero, heat transfer efficiency is high;
(3) liquid working substance is combined using various ways in the present invention and alternating is sprayed or leaching, has both improved the profit of liquid working substance
With rate, cycle power consumption is also saved;
(4) component of the present invention is conventional criteria accessory, reliability and durability and be conveniently replaceable repair.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of the working medium cooling system by contact for server that embodiment one provides;
Fig. 2 is a kind of structure principle chart of the working medium cooling system by contact for server that embodiment one provides;
Fig. 3 is a kind of structural schematic diagram of the working medium cooling system by contact for server that embodiment two provides;
Fig. 4 is a kind of structure principle chart of the working medium cooling system by contact for server that embodiment two provides;
Fig. 5 is a kind of structural schematic diagram of the working medium cooling system by contact for server that embodiment three provides;
Fig. 6 is the structural schematic diagram for the second spray chamber that embodiment three provides;
Fig. 7 is the structural schematic diagram for the first spray chamber that embodiment three provides;
Fig. 8 is a kind of structure principle chart of the working medium cooling system by contact for server that embodiment three provides;
Fig. 9 is a kind of structural schematic diagram of the working medium cooling system by contact for server that example IV provides;
Figure 10 is the structural schematic diagram for the second spray chamber that example IV provides;
Figure 11 is the structural schematic diagram for the first spray chamber that example IV provides;
Figure 12 is a kind of structure principle chart of the working medium cooling system by contact for server that example IV provides.
Wherein, 1- servers workspace, 11- high-temperature areas, 2- return ports, the first spray chambers of 3-, the first inlet openings of 31-,
The first spray equipments of 32-, the second spray chambers of 4-, the second inlet openings of 41-, the second spray equipments of 42-.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of not making creative work it is all its
His embodiment, shall fall within the protection scope of the present invention.
Embodiment one
Referring to Fig. 1 and Fig. 2, the present invention provides a kind of working medium cooling system by contact of server, including spraying zone and
The server workspace 1 being arranged below the spraying zone, liquid working substance pass through the first and server work after the spraying zone
Make the contact of area 1, then flowed back by return port 2,
The spraying zone includes the second spray chamber 4 that the first spray chamber 3 and sprinkle density are more than first spray chamber 3,
First spray chamber 3 is not connected to second spray chamber 4,
First spray chamber 3 includes the first inlet opening 31 and multiple first spray equipments 32, first spray equipment
32 is corresponding with the room temperature region of the server workspace 1,
Second spray chamber 4 includes the second inlet opening 41 and at least one second spray equipment 42, second spray
Device 42 is corresponding with the high-temperature area 11 of the server workspace 1.
Preferably, first spray chamber 3 is arranged with 4 same layer of the second spray chamber.
Preferably, first spray equipment 32 is uniformly distributed in first spray chamber 3, first spray equipment
32 be leaching fluid apertures.
Preferably, second spray equipment 42 is leaching fluid apertures, the spray range energy of multiple second spray equipments 42
Enough cover the high-temperature area 11.
Preferably, the high-temperature area 11 of the server workspace 1 includes CPU section domain, is drawn in the server workspace 1
A high-temperature area 11 is separated, remaining region is room temperature region.
Preferably, the liquid working substance is heat transfer medium oil.
Implement the invention has the advantages that:
(1) present invention divides region on the basis of the high-temperature area to server workspace positions, targetedly
Carry out cool down, the big flow for realizing the uniform spray cooling of room temperature region large area and high-temperature area concentrates heat dissipation so that is
The whole Energy Efficiency Ratio of system is higher than existing computer room data center server cooling system;
(2) liquid working substance is in direct contact with heat generating spot, and heat transfer resistance is almost nil, and heat transfer efficiency is high;
(3) the oil cooled mode of leaching is taken, the utilization rate of oil is improved, saves cycle power consumption, system entirety Energy Efficiency Ratio is higher than
Existing computer room data center server cooling system.
Embodiment two
Referring to Fig. 3 and Fig. 4, the present invention provides a kind of working medium cooling system by contact of server, including spraying zone and
The server workspace 1 being arranged below the spraying zone, liquid working substance pass through the first and server work after the spraying zone
Make the contact of area 1, then flowed back by return port 2,
The spraying zone includes the second spray chamber 4 that the first spray chamber 3 and sprinkle density are more than first spray chamber 3,
First spray chamber 3 is not connected to second spray chamber 4,
First spray chamber 3 includes the first inlet opening 31 and multiple first spray equipments 32, first spray equipment
32 is corresponding with the room temperature region of the server workspace 1,
Second spray chamber 4 includes the second inlet opening 41 and at least one second spray equipment 42, second spray
Device 42 is corresponding with the high-temperature area 11 of the server workspace 1.
Preferably, first spray chamber 3 is arranged with 4 same layer of the second spray chamber.
Preferably, first spray equipment 32 is uniformly distributed in first spray chamber 3, first spray equipment
32 be leaching fluid apertures.
Preferably, second spray equipment 42 is spray nozzle, and the spray range of second spray equipment 42 can
Cover the high-temperature area 11.
Preferably, the high-temperature area 11 of the server workspace 1 includes CPU section domain, is drawn in the server workspace 1
A high-temperature area 11 is separated, remaining region is room temperature region.
Preferably, the liquid working substance is heat transfer medium oil.
Implement the invention has the advantages that:
(1) the first spray chamber is arranged with the second spray chamber same layer in the present invention, but individual segmentation, realizes room temperature
The big flow of the uniform spray cooling of region large area and high-temperature area concentrates heat dissipation so that system entirety Energy Efficiency Ratio is higher than existing machine
Room data center server cooling system;
(2) liquid working substance is in direct contact with heat generating spot, and heat transfer resistance is almost nil, and heat transfer efficiency is high;
(3) it takes leaching oil and oil spout to combine cooling mode, improves the utilization rate of oil, save cycle power consumption, system is whole
Energy Efficiency Ratio is higher than existing computer room data center server cooling system.
Embodiment three
Referring to Fig. 5, Fig. 6, Fig. 7 and Fig. 8, the present invention provides a kind of working medium cooling system by contact of server, including
Spraying zone and the server workspace 1 being arranged below the spraying zone, liquid working substance by after the spraying zone first with it is described
Server workspace 1 contacts, then is flowed back by return port 2,
The spraying zone includes the second spray chamber 4 that the first spray chamber 3 and sprinkle density are more than first spray chamber 3,
First spray chamber 3 is not connected to second spray chamber 4,
First spray chamber 3 includes the first inlet opening 31 and multiple first spray equipments 32, first spray equipment
32 is corresponding with the room temperature region of the server workspace 1,
Second spray chamber 4 includes the second inlet opening 41 and at least one second spray equipment 42, second spray
Device 42 is corresponding with the high-temperature area 11 of the server workspace 1.
Preferably, first spray chamber 3 is arranged with second spray chamber, 4 different layer.
Preferably, first spray equipment 32 is uniformly distributed in first spray chamber 3, first spray equipment
32 be leaching fluid apertures.
Preferably, second spray equipment 42 is leaching fluid apertures, the spray range energy of multiple second spray equipments 42
Enough cover the high-temperature area 11.
Preferably, the high-temperature area 11 of the server workspace 1 includes CPU section domain, is drawn in the server workspace 1
A high-temperature area 11 is separated, remaining region is room temperature region.
Preferably, the liquid working substance is heat transfer medium oil.
Implement the invention has the advantages that:
(1) first spray chamber is arranged with the different layer of the second spray chamber, and component is conventional criteria accessory, reliability and durability
And it is conveniently replaceable repair;
(2) the oil cooled mode of leaching is taken, the utilization rate of oil is improved, saves cycle power consumption;
(3) liquid working substance is in direct contact with heat generating spot, and heat transfer resistance is almost nil, and heat transfer efficiency is high, system entirety efficiency
Than being higher than existing computer room data center server cooling system.
Example IV
Referring to Fig. 9, Figure 10, Figure 11 and Figure 12, the present invention provides a kind of working medium cooling system by contact of server, packets
The server workspace 1 for including spraying zone and being arranged below the spraying zone, liquid working substance pass through elder generation after the spraying zone and institute
The contact of server workspace 1 is stated, then is flowed back by return port 2,
The spraying zone includes the second spray chamber 4 that the first spray chamber 3 and sprinkle density are more than first spray chamber 3,
First spray chamber 3 is not connected to second spray chamber 4,
First spray chamber 3 includes the first inlet opening 31 and multiple first spray equipments 32, first spray equipment
32 is corresponding with the room temperature region of the server workspace 1,
Second spray chamber 4 includes the second inlet opening 41 and at least one second spray equipment 42, second spray
Device 42 is corresponding with the high-temperature area 11 of the server workspace 1.
Preferably, first spray chamber 3 is arranged with second spray chamber, 4 different layer.
Preferably, first spray equipment 32 is uniformly distributed in first spray chamber 3, first spray equipment
32 be leaching fluid apertures.
Preferably, second spray equipment 42 is spray nozzle.
Preferably, the high-temperature area 11 of the server workspace 1 includes CPU section domain, is drawn in the server workspace 1
A high-temperature area 11 is separated, remaining region is room temperature region, and the quantity of the spray nozzle is a, corresponds to a height respectively
The spray range of temperature area 11, the spray nozzle can cover the high-temperature area 11.
Preferably, the liquid working substance is heat transfer medium oil.
Implement the invention has the advantages that:
(1) first spray chamber is arranged with the different layer of the second spray chamber, and component is conventional criteria accessory, reliability and durability
And it is conveniently replaceable repair;
(2) it takes oil spout and leaching oil to combine cooling mode, improves the utilization rate of oil, save cycle power consumption;
(3) liquid working substance is in direct contact with heat generating spot, and heat transfer resistance is almost nil, and heat transfer efficiency is high, system entirety efficiency
Than being higher than existing computer room data center server cooling system.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
1. a kind of working medium cooling system by contact of server, which is characterized in that including spraying zone and be arranged in the spraying zone
The server workspace of lower section marks off several high-temperature areas in the server workspace, remaining area in the horizontal direction
Domain is room temperature region, and liquid working substance is contacted by first after the spraying zone with the server workspace, then passes through return port
Reflux,
The spraying zone includes the second spray chamber that the first spray chamber and sprinkle density are more than first spray chamber, and described first
Spray chamber is not connected to second spray chamber,
First spray chamber includes the first inlet opening and multiple first spray equipments, first spray equipment and the service
The room temperature region of device workspace corresponds to,
Second spray chamber include the second inlet opening and at least one second spray equipment, second spray equipment with it is described
The high-temperature area of server workspace corresponds to;
First spray chamber is arranged but independently divided with the second spray chamber same layer, alternatively, first spray chamber and institute
The different layer setting of the second spray chamber is stated, component is conventional criteria part.
2. a kind of working medium cooling system by contact of server according to claim 1, which is characterized in that first spray
Shower device is uniformly distributed in first spray chamber, and first spray equipment is leaching fluid apertures.
3. a kind of working medium cooling system by contact of server according to claim 2, which is characterized in that second spray
Shower device is leaching fluid apertures.
4. a kind of working medium cooling system by contact of server according to claim 2, which is characterized in that second spray
Shower device is spray nozzle.
5. a kind of working medium cooling system by contact of server according to claim 1, which is characterized in that the server
The high-temperature area of workspace includes CPU section domain.
6. a kind of working medium cooling system by contact of server according to claim 1, which is characterized in that the liquid work
Matter is heat transfer medium oil.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610933985.2A CN106332531B (en) | 2016-10-31 | 2016-10-31 | A kind of working medium cooling system by contact of server |
PCT/CN2017/074520 WO2018076582A1 (en) | 2016-10-31 | 2017-02-23 | Working medium impingement cooling system for server |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610933985.2A CN106332531B (en) | 2016-10-31 | 2016-10-31 | A kind of working medium cooling system by contact of server |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106332531A CN106332531A (en) | 2017-01-11 |
CN106332531B true CN106332531B (en) | 2018-08-31 |
Family
ID=57819382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610933985.2A Active CN106332531B (en) | 2016-10-31 | 2016-10-31 | A kind of working medium cooling system by contact of server |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106332531B (en) |
WO (1) | WO2018076582A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106332531B (en) * | 2016-10-31 | 2018-08-31 | 广东合一新材料研究院有限公司 | A kind of working medium cooling system by contact of server |
CN106659092B (en) * | 2017-01-20 | 2019-12-31 | 广东合一新材料研究院有限公司 | Data center cabinet and pressure spraying system thereof |
CN106659093B (en) * | 2017-01-20 | 2019-12-31 | 广东合一新材料研究院有限公司 | Data center rack and gravity spraying system thereof |
CN106604619B (en) * | 2017-01-20 | 2023-05-30 | 广东西江数据科技有限公司 | Gravity-based oil leaching and separating method and oil separating device thereof |
CN109119873B (en) * | 2018-10-30 | 2024-02-09 | 中国工程物理研究院激光聚变研究中心 | Multi-working-medium combined spray cooling device |
CN110139542B (en) * | 2019-06-13 | 2024-05-14 | 北京丰联奥睿科技有限公司 | Funnel type liquid cooling server cabinet |
CN110099554B (en) * | 2019-06-13 | 2024-06-11 | 北京丰联奥睿科技有限公司 | Funnel type partition liquid cooling server cabinet |
CN110139543B (en) * | 2019-06-13 | 2024-06-11 | 北京丰联奥睿科技有限公司 | Funnel type liquid cooling server cabinet |
CN114097648B (en) * | 2020-12-23 | 2023-09-26 | 京东科技信息技术有限公司 | Spray control method, device, equipment and medium |
CN117908639A (en) * | 2022-10-11 | 2024-04-19 | 超聚变数字技术有限公司 | Computing equipment and computing node |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5831824A (en) * | 1996-01-31 | 1998-11-03 | Motorola, Inc. | Apparatus for spray-cooling multiple electronic modules |
JPH09293983A (en) * | 1996-04-24 | 1997-11-11 | Asia Electron Inc | Jet cooling device |
US6955062B2 (en) * | 2002-03-11 | 2005-10-18 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
CN102256477A (en) * | 2011-07-25 | 2011-11-23 | 李俊晖 | Parallel heat radiating system of computer-room equipment |
CN203279429U (en) * | 2013-01-09 | 2013-11-06 | 中国科学院电工研究所 | Spraying evaporative cooling circulatory system for a heating apparatus |
CN103869907A (en) * | 2014-02-27 | 2014-06-18 | 长沙星沙机床有限公司 | Seal box for large server |
CN105025691B (en) * | 2015-08-10 | 2018-03-06 | 苏州大景能源科技有限公司 | A kind of electronic installation, heat abstractor and its cooling means using liquid-cooling heat radiation |
CN105652993A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooled heat dissipation computer case |
CN105658037B (en) * | 2016-03-18 | 2018-04-20 | 苏州大景能源科技有限公司 | A kind of cold cooling cabinet of integrated liquid |
CN105934138B (en) * | 2016-06-16 | 2018-05-22 | 广东合一新材料研究院有限公司 | The working medium cooling system by contact and its method of work of high-power electromagnetic wave producer |
CN106332531B (en) * | 2016-10-31 | 2018-08-31 | 广东合一新材料研究院有限公司 | A kind of working medium cooling system by contact of server |
CN206136567U (en) * | 2016-10-31 | 2017-04-26 | 广东合一新材料研究院有限公司 | Working medium contact cooling system of server |
-
2016
- 2016-10-31 CN CN201610933985.2A patent/CN106332531B/en active Active
-
2017
- 2017-02-23 WO PCT/CN2017/074520 patent/WO2018076582A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN106332531A (en) | 2017-01-11 |
WO2018076582A1 (en) | 2018-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106332531B (en) | A kind of working medium cooling system by contact of server | |
US10966353B2 (en) | Centralized cooling system for data center | |
CN106413350B (en) | A kind of liquid cooling spray cabinet and its liquid cooling spray system | |
CN108966611A (en) | A kind of liquid-immersed cooled interchanger and group of switches | |
CN105960148A (en) | Intermittent working medium contact cooling system | |
CN206136567U (en) | Working medium contact cooling system of server | |
EP3457829B1 (en) | Cooling system of working medium contact type for heat dissipation of computer and data centre | |
CN113543588B (en) | Jet flow-transverse flow combined immersed heat dissipation device and method | |
CN103078518A (en) | Heat dissipation device | |
CN104503556A (en) | Redundancy backup server heat dissipation system based on combination of air cooling and liquid cooling | |
JP2021500755A (en) | Improved radiators and methods for power semiconductor devices | |
CN205912402U (en) | Be used for radiating working medium contact cooling system of computer and data center | |
CN205667078U (en) | But discontinuous working medium contact cooling system | |
CN211909505U (en) | OTN heat dissipation equipment | |
CN209882439U (en) | Double-sided heat dissipation high-performance water-cooling radiator and electrical equipment | |
WO2017215162A1 (en) | Cooling system of working medium contact type for high-power electrical device | |
CN105934140B (en) | A kind of working medium cooling system by contact of high-power electrical devices | |
CN209248443U (en) | A kind of heat radiation device for computer case with water cooling function | |
CN110778571A (en) | Cooling device for mechanical equipment | |
CN218274796U (en) | Liquid cooling plate, cooling system and battery | |
CN114980675A (en) | Electronic device layered micro-channel phase change cooling module and cooling system | |
CN114894020A (en) | Double-nozzle spray cooling circulation device and control method thereof | |
WO2017215160A1 (en) | Intermittent cooling system of working medium contact type | |
CN209594124U (en) | A kind of spray cooling rack and spray system applied to server | |
CN207602731U (en) | Cooled plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211117 Address after: 526000 room 142, workshop (Building B), Zhaoqing New District Investment Development Co., Ltd., north 8 District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xijiang Data Technology Co.,Ltd. Address before: Room 2006, building 2, No. 8, Fenghuang Third Road, Zhongxin Guangzhou Knowledge City, Guangzhou, Guangdong 510000 Patentee before: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |