CN106319471A - Film coating carrying table and film coating device - Google Patents
Film coating carrying table and film coating device Download PDFInfo
- Publication number
- CN106319471A CN106319471A CN201510397687.1A CN201510397687A CN106319471A CN 106319471 A CN106319471 A CN 106319471A CN 201510397687 A CN201510397687 A CN 201510397687A CN 106319471 A CN106319471 A CN 106319471A
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- plated film
- catch
- compensating plate
- carrier
- baseplate carrier
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Abstract
The invention discloses a film coating carrying table and a film coating device. The film coating carrying table comprises a base plate carrying table and a compensation piece. The compensation piece is arranged on the action route of the base plate carrying table. The base plate carrying table is suitable for moving towards the compensation piece in a direction from the first position. The end, facing the first position in the above direction, of the compensation piece is provided with a shielding boundary, and the shielding boundary is suitable for moving in the above direction or suitable for shape changing.
Description
Technical field
The invention relates to a kind of processing microscope carrier and processing unit (plant), and in particular to a kind of plated film
Microscope carrier and coating apparatus.
Background technology
Along with development in science and technology, semiconductor element has been widely used in our life.Quasiconductor
Element such as includes each element layer such as electrode layer, semiconductor layer, the thickness of these element layers above-mentioned
It is directly related to quality and the usefulness of semiconductor element.Such as partly led what solar electrical energy generation applied
In body member layer, in order to reach good optical absorption, semiconductor element needs to carry out shape by plated film
Become there is suitable thickness and euphotic electrode layer in uniform thickness.
In existing coater, the plating mould of substrate is to utilize to be produced by the target of charged particle beam evaporation
Raw steam is attached on substrate form film plating layer.Because of substrate each position and plated film target during plated film
Distance and angle are different, so the thicknesses of layers of diverse location would also vary from after plated film,
The most identical for guaranteeing the thicknesses of layers of each position, amending plates need to be added in coater, by correction
The compensation substrate in coating process that blocks of plate produces because angles and positions are different in coating process
Raw thicknesses of layers deviation.
Existing amending plates manufacturing process is, first passes around a large amount of simulation calculating and calculates and show institute
Need shape and the position of amending plates, then correction sheet material is cut into calculated amending plates.Amending plates
After completing, plated film is the most also wanted to verify whether this amending plates meets the requirements, if once amending plates is not inconsistent
Close requirement, the most also to repeat to make, draw, cut the most again plated film checking, meet until amending plates
Requirement.On the other hand, when making the plating mould of different-thickness, size, operator is also required to again set
Count and change amending plates.
From the foregoing, the making of above-mentioned amending plates and change that not only operation is various, inefficiency, and
And to repeat cutting correction sheet material, the waste of material can be caused undoubtedly, cause production cost to improve.
Summary of the invention
The present invention provides a kind of plating mould microscope carrier, and it can meet different plating mould demands.
The present invention provides a kind of coating apparatus, and it can form various different plated film efficiently.
The plated film microscope carrier of embodiments of the invention includes a baseplate carrier and a compensating plate.Compensating plate is joined
Being placed on the path of motion of baseplate carrier, baseplate carrier is suitable to from a primary importance along a direction toward mending
Repay sheet to move.Compensating plate has an Ouluding boundary along above-mentioned direction towards one end of primary importance, hides
Move when border fits along above-mentioned direction or be suitable to change shape.
The coating apparatus of embodiments of the invention includes a coating source and above-mentioned plated film microscope carrier.Plated film
Source is in order to a coating film area plated film, and coating film area covering part compensating plate and part substrate microscope carrier
Path of motion.
In one embodiment of this invention, above-mentioned compensating plate includes that at least one catch, each catch are
Fit along above-mentioned direction to move, and each catch has along above-mentioned direction towards one end of primary importance
Having one to block end, these block end and interconnect and form Ouluding boundary.
In one embodiment of this invention, above-mentioned coating source includes a plasma emission source, a sky
Chamber, a plated film target and one fill gas.Plasma emission source is in order to send a charged particle beam
To cavity, and at least one magnetic field that charged particle beam is in sky is embedding arrives plated film target.Fill gas
Body is positioned in cavity, and fills gas between coating film area and plated film target.
In one embodiment of this invention, above-mentioned filling gas include but not limited to argon, oxygen,
The combination of hydrogen, aqueous vapor or above-mentioned gas.
In one embodiment of this invention, above-mentioned these catch close-packed arrays each other.
In one embodiment of this invention, these above-mentioned catch overlap each other.
In one embodiment of this invention, above-mentioned baseplate carrier is in order to carry a substrate, and substrate carries
A second position is further included on the path of motion of platform.When baseplate carrier is positioned at the second position, block limit
Boundary is in the aforementioned direction between substrate and primary importance.
In one embodiment of this invention, above-mentioned compensating plate further includes at least one driver element.Each
Driver element connects and moves one of them of these catch.
In one embodiment of this invention, above-mentioned plated film support plate further includes a processing unit and a control
Unit processed.Processing unit is electrically connected with these driver elements, and control unit is electrically connected to processing unit.
Control unit exports a signal, and processing unit exports multiple driving signals according to signal and drives to these single
Unit, these driver elements drive signal move these catch and form Ouluding boundary according to these.
Based on above-mentioned, the compensating plate of the plated film microscope carrier of embodiments of the invention can compensate a substrate in plating
The thicknesses of layers deviation produced because angles and positions are different in membrane process.Meanwhile, the plating of the present embodiment
The compensating plate of mould microscope carrier can adjust Ouluding boundary, therefore can meet various different plating mould demand.
The coating apparatus of embodiments of the invention, because having above-mentioned plated film microscope carrier, can complete efficiently
Various good plated films.
Accompanying drawing explanation
Fig. 1 is the side view of a kind of coating apparatus of the first embodiment that the present invention provides.
Fig. 2 A is the top view of a kind of coating apparatus of the first embodiment that the present invention provides.
Fig. 2 B is the partial enlarged drawing shown in the A of region according to Fig. 2 A.
Fig. 2 C is the top view of a kind of coating apparatus of the first embodiment that the present invention provides.
Fig. 3 is the top view of a kind of plated film microscope carrier of other embodiments of the offer of the present invention.
Fig. 4 is the top view of a kind of plated film microscope carrier of the second embodiment that the present invention provides.
Description of reference numerals
A, B: region
D1, d2: direction
L: path of motion
P1: primary importance
P2: the second position
S1: charged particle beam
50: substrate
100,100A, 100B: plated film microscope carrier
110,110A: baseplate carrier
120,120A, 320: compensating plate
121,121A, 321: Ouluding boundary
122,122A, 122B, 122C, 122D, 322: catch
123,123A, 123B, 123C, 123D, 323: block end
140: processing unit
150: control unit
200: coating source
210: plasma emission source
220: cavity
230: plated film target
300: coating apparatus
330: driver element
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with concrete real
Execute example, and referring to the drawings, the present invention is described in more detail.
Fig. 1 is the side view of a kind of coating apparatus of the first embodiment that the present invention provides.In the present invention
First embodiment in, coating apparatus 300 includes coating source 200 and plated film microscope carrier 100.Plated film carries
Platform 100 includes baseplate carrier 110 and a compensating plate 120.Compensating plate 120 is configured at substrate and carries
On the path of motion L of platform 110, and baseplate carrier 110 is suitable to from primary importance P1 along a side
Move toward compensating plate 120 to d1.Compensating plate has along direction d1 towards one end of primary importance P1
Having an Ouluding boundary 121, Ouluding boundary 121 fits along direction d1 and moves or be suitable to change shape.
In other words, baseplate carrier 110 can be close along path of motion L toward compensating plate 120, and compensates
Distance between Ouluding boundary 121 and primary importance P1 of sheet 120 can pass through motion compensation sheet 120
Adjust.Therefore, in the present embodiment, when above-mentioned coating source 200 is to compensating plate 120 and first
During region plated film between the P1 of position, the position of Ouluding boundary 121 can control baseplate carrier 110
A upper substrate is by the thickness of plated film, and the shape of Ouluding boundary 121 can control on baseplate carrier 110
One substrate is by the uniformity of plated film.
Fig. 2 A is the top view of a kind of coating apparatus of the first embodiment that the present invention provides.Refer to
The coating apparatus 300 of the e.g. Fig. 1 shown in Fig. 1 and Fig. 2 A, Fig. 2 A is observed from direction d2
Top view.Refer to Fig. 2 A, in the first embodiment of the present invention, compensating plate 120 is along direction
D1 towards primary importance P1 one end there is an Ouluding boundary 121.In other words, above-mentioned screening
Rib circle 121 is exactly the partial contour of compensating plate 120, and described partial contour relatively other parts were taken turns
Near baseplate carrier 110.
Fig. 2 B is the partial enlarged drawing shown in the A of region according to Fig. 2 A.Refer to Fig. 2 A and figure
2B, in the first embodiment of the present invention, compensating plate 120 includes multiple catch 122, and each gear
Sheet 122 has one along described direction d1 towards one end of primary importance P1 and blocks end 123, these
Block end 123 and interconnect and formed above-mentioned Ouluding boundary 121.Specifically, refer to Fig. 2 B,
In the present embodiment, catch 122A have block end 123A, catch 122B have block end 123B,
Catch 122C has and blocks end 123C, catch 122D and have and block end 123D, and these block end
Forming part Ouluding boundary 121 is carried out to connection mutually in the border of 123A, 123B, 123C, 123D, and
Each catch 122A, 122B, 122C, 122D fit along direction d1 and move, the most described portion
The shape of point Ouluding boundary 121 and position are as well as these catch 122A, 122B, 122C, 122D
Change in location and change.In other words, refer to Fig. 2 A, in the present embodiment, compensating plate 120
Ouluding boundary 121 can be allowed easily to change shape and position by these catch 122, therefore plated film carries
Platform 100 can provide a kind of good blocking and compensation effect.It is to say, in the present embodiment,
Compensating plate 120 e.g. a kind of plated film correction (compensation) array, but the invention is not restricted to
This.
Fig. 3 is the top view of a kind of plated film microscope carrier of other embodiments that the present invention provides.Refer to figure
2A and Fig. 3, the present invention is not limited to the above-mentioned compensating plate 120 being made up of multiple catch, in the present invention
Other embodiments in, the compensating plate 120A of plated film microscope carrier 100A can be more a piece of have block
The compensating plate 120A of border 121A, Ouluding boundary 121A can set according to the characteristic of a coating source
Count its shape, to provide good blocking and compensation effect to the substrate on baseplate carrier 110.Separately
On the one hand, the distance of compensating plate 120A and primary importance P1 can adjust, therefore when a coating source pair
During one coating film area B plated film, a substrate of baseplate carrier 110 carrying is exposed to the dynamic of coating film area B
Make path can adjust, and then aforesaid substrate can be controlled by the thickness of plated film, pass through compensating plate simultaneously
The Ouluding boundary 121A that can move along direction d1 in 120A provides good compensation effect.
Fig. 2 C is the top view of a kind of coating apparatus of the first embodiment that the present invention provides.Come in detail
Saying, depicted in Fig. 2 C is that in the embodiment depicted in Fig. 2 A, baseplate carrier 110 carries a substrate
Schematic diagram after moving a distance along path of motion L after 50.Refer to Fig. 1 and Fig. 2 C, work as base
Onboard 110 along path of motion L move to overlapping with compensating plate 120 time, due to Ouluding boundary 121
Primary importance P1 set out close to baseplate carrier 110, therefore the shape of Ouluding boundary 121 also determines
The sequencing that substrate 50 each region is blocked.Therefore, a plated film such as it is exposed to when substrate 50
During steam, the Ouluding boundary 121 of compensating plate 120 can compensate and produce it because angles and positions are different
The deviation of plated film degree.Specifically, compensating plate 120 such as can first block plated film vapor concentration relatively
The region that plated film vapor concentration is relatively low is blocked in high region again, and then is formed good on substrate 50
Film plating layer.On the other hand, by the movement of these catch 122 in compensating plate 120, Ouluding boundary 121
Shape can be corrected easily or change, simultaneously as these catch 122 close-packed arrays each other,
Good occlusion effect can be provided, and then improve the plated film efficiency of entirety.
Furthermore, it is understood that refer to Fig. 1 and 2A, in the present embodiment, coating source 200 is in order to right
One covering part path of motion L and the coating film area B plated film of compensating plate 120.When baseplate carrier 110
When being positioned at second position P2 of path of motion L, Ouluding boundary 121 is positioned at substrate in the direction dl
Between 50 and primary importance P1.It is to say, in the present embodiment, by baseplate carrier 110 certainly
Primary importance P1 moves to second position P2 to make the substrate 50 on baseplate carrier 110 to pass through
The covering of compensating plate 120 makes to be formed on substrate 50 good film plating layer.Therefore, when coating film area B
During the region height of the more upper and lower both sides of plated film vapor concentration in the region of middle adjacent paths L, by blocking limit
Boundary 121 preferentially blocks the higher plated film steam of concentration and can allow and be exposed to low concentration plated film steam
Substrate has the longer plated film time, therefore can form a uniform film plating layer.
On the other hand, these catch 122, in addition to can changing the shape of Ouluding boundary 121, also may be used
To move the Ouluding boundary 121 position on path of motion L.In other words, the plated film of the present embodiment
Microscope carrier 100 can change on the compensating plate 120 position on path of motion L, and then change easily
State the substrate 50 on baseplate carrier 110 and be exposed to the time of coating film area B.It is to say, this
The plated film microscope carrier 100 of bright embodiment is in addition to can forming uniform film plating layer, it is also possible to easily
Control the thickness of film plating layer.Therefore, a substrate is being made transparent leading by the coating apparatus 300 of the present embodiment
During the plated film of electroxidation thing (Transparent Conducting Oxide, TCO), compensating plate 120 can
Adjust with the thickness for different electrical requirements producing transparent conductive oxide thing film plating layers.
Refer to Fig. 1, in the present embodiment, above-mentioned coating source 200 includes a plasma emission
Source 210, one cavity 220, plated film target 230 and the filling gas being positioned in cavity 220
(sign).Plasma emission source 210 in order to send a charged particle beam S1 in cavity 220,
And at least one magnetic field that charged particle beam S1 is in cavity 220 arrives plated film target 230.Plasma
The charged particle beam S1 e.g. electron beam that body emission source 210 is sent, and electron beam S1 is via sky
The magnetic force that magnetic field in chamber 220 produces deflects and is transferred to plated film target 230, and plated film target 230 leads to
Cross and receive above-mentioned electron beam S1 and heat and be evaporated in cavity 220.
Refer to Fig. 1, in the present embodiment, fill gas and be positioned at coating film area B and plated film target 230
Between, and plasma emission source 210 sends the plasma of the most above-mentioned electron beam to cavity
Making filling gas dissociate in 220, the plated film steam therefore evaporated by plated film target 230 also can be with solution
The plated film steam of coating film area B it is transferred to from the filling gas reaction crossed formation.Specifically, originally
The coating apparatus 300 of embodiment e.g. utilizes ion-plating technique (Reaction Plasma
Deposition, RPD) substrate 50 on baseplate carrier 110 is made plated film.
Furthermore, it is understood that in the present embodiment, fill gas and include oxygen.Fill the oxygen in gas
Gas after the plasma dissociation sent through plasma emission source 210 can with from plated film target
The plated film steam of 230 forms the plated film steam with oxide material, therefore can be in coating film area B
The film plating layer that middle formation is good.In the present embodiment, the material of plated film target 230 such as includes oxidation
Indium (indium (III) oxide) or stannum oxide (Tin Oxide), but the invention is not restricted to this.At this
In other embodiments of invention, the filling gas in cavity can include argon, oxygen, aqueous vapor, hydrogen
Gas or include the mixed gas of combination of above-mentioned gas.On the other hand, in an embodiment of the present invention,
An above-mentioned plated film target 230 e.g. cylinder.In preferred embodiment of the present invention, above-mentioned circle
Cylinder such as has the bottom surface of a diameter of 40 millimeters, and cylindrical height is more than or equal to 30 millimeters little
In equal to 32 millimeters, but the invention is not restricted to this.
Fig. 4 is the top view of plated film microscope carrier in the second embodiment that the present invention provides.Refer to Fig. 4,
In the third embodiment of the present invention, the compensating plate 320 of plated film microscope carrier 100A further includes multiple driving
Unit 330.Each driver element 330 connects and moves one of them of these catch 322.The most just
Being to say, each driver element 330 is in order to promote a catch 322 to move along direction d1, to change
The shape of the Ouluding boundary 321 needed for the position blocking end 323 of these catch 322 formation.
Furthermore, it is understood that in the second embodiment of the present invention, plated film microscope carrier 100B also includes at one
Reason unit 140 and a control unit 150.Processing unit 140 is electrically connected with these driver elements 330,
Control unit 150 is electrically connected to processing unit 140.Specifically, control unit 150 is e.g.
One personal computer, desktop computer or other are in order to manipulate plated film microscope carrier 100B and the plating comprising it
The computer of film device, the invention is not restricted to this.Control unit 150 exports a signal, processing unit
140 export multiple driving signals to these driver elements 330, these driver elements 330 according to signal
Signal is driven to move these catch 322 and form Ouluding boundary 321 according to these.It is to say, this
The plated film microscope carrier 100B of embodiment can be according to the e.g. song of user's input to control unit 150
Line or equation export a signal to processing unit 140, and processing unit 140 is further according to above-mentioned letter
Number be converted to multiple driving signal to driver element 330 to move the position of these catch 322, make
The shape of Ouluding boundary 321 meets the shape representated by curve external form or equation that user inputted.
The above-mentioned function performed by processing unit 140 can be realized (as Programmed control realizes) by software
Or hardware realizes (as realized) by Digital Logical Circuits, the invention is not restricted to this.Therefore, originally
The plated film microscope carrier 100B of embodiment can shape to the Ouluding boundary 321 of compensating plate 320 easily
Adjust with position, when baseplate carrier 110A carries a substrate and moves along path of motion L,
Compensating plate 320 can provide good blocking and compensation effect at a coating process.
In sum, the compensating plate of the plated film microscope carrier of embodiments of the invention can compensate a substrate in plating
The thicknesses of layers deviation produced because angles and positions are different in membrane process.The plated film microscope carrier of the present embodiment
During for different plating mould demand, can directly adjust compensating plate and primary importance that baseplate carrier sets out
Between distance, be not required to extra time swap, overall plated film efficiency can be promoted.On the other hand,
Via the compensating plate that can adjust easily, the plated film microscope carrier of the present embodiment is before e.g. one coating process
Phase test phase is also not required to repeat to make catch, can avoid unnecessary waste.The enforcement of the present invention
The coating apparatus of example is because having above-mentioned plated film microscope carrier, needed for can adjusting various plated film efficiently
Parameter, simultaneously can avoid unnecessary waste.
Particular embodiments described above, is carried out the purpose of the present invention, technical scheme and beneficial effect
Further describe, be it should be understood that the foregoing is only the present invention specific embodiment and
, be not limited to the present invention, all within the spirit and principles in the present invention, that is done any repaiies
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (14)
1. a plated film microscope carrier, including:
One baseplate carrier；And
One compensating plate, is configured on the path of motion of this baseplate carrier, and this baseplate carrier is suitable to from one
One position is moved along a direction toward this compensating plate, and this compensating plate is along the direction towards this primary importance
One end there is an Ouluding boundary, this screening when border fit along the direction move or be suitable to change shape.
Plated film microscope carrier the most according to claim 1, wherein this compensating plate includes at least one catch,
This catch each fits along the direction and moves, and this catch each is along the direction towards this first
The one end put has one and blocks end, and these block end and interconnect and form this Ouluding boundary.
Plated film microscope carrier the most according to claim 2, wherein these catch close-packed arrays each other.
Plated film microscope carrier the most according to claim 2, wherein this compensating plate further includes at least one and drives
Moving cell, each driver element connects and moves one of them of these catch.
Plated film microscope carrier the most according to claim 4, also includes that a processing unit and controls single
Unit, this processing unit is electrically connected with these driver elements, and this control unit is electrically connected to this process list
Unit, wherein this control unit exports a signal, and this processing unit drives letter according to the output of this signal is multiple
Number give these driver elements, these driver elements according to these drive signals move these catch and formed
This Ouluding boundary.
Plated film microscope carrier the most according to claim 1, wherein this baseplate carrier is in order to carry a substrate,
And also include a second position on the path of motion of this baseplate carrier, when this baseplate carrier be positioned at this second
During position, this Ouluding boundary is in the direction between this substrate and this primary importance.
7. a coating apparatus, including:
One coating source, in order to a coating film area plated film；And
One plated film microscope carrier, including:
One baseplate carrier；And
One compensating plate, is configured on the path of motion of this baseplate carrier, and this coating film area covering part
This compensating plate and the path of motion of this baseplate carrier of part, this baseplate carrier is suitable to from a primary importance edge
A direction to move toward this compensating plate, this compensating plate has along the direction towards one end of this primary importance
Having an Ouluding boundary, this screening is moved when border fits along the direction or is suitable to change shape.
Coating apparatus the most according to claim 7, wherein this compensating plate includes at least one catch,
This catch each fits along the direction and moves, and this catch each is along the direction towards this first
The one end put has one and blocks end, and these block end and interconnect and form this Ouluding boundary.
Coating apparatus the most according to claim 8, wherein these catch close-packed arrays each other.
Coating apparatus the most according to claim 8, wherein this compensating plate further includes at least one and drives
Moving cell, each driver element connects and moves one of them of these catch.
11. coating apparatus according to claim 10, wherein this plated film microscope carrier also includes a process
Unit and a control unit, this processing unit is electrically connected with these driver elements, this control unit electricity
Property is connected to this processing unit, and wherein this control unit exports a signal, and this processing unit is according to this letter
Number export multiple driving signals give these driver elements, these driver elements according to these drive signals move
These catch dynamic also form this Ouluding boundary.
12. coating apparatus according to claim 7, wherein this coating source includes a plasma
Emission source, a cavity, a plated film target and one fill gas, and this filling gas is positioned in this cavity,
And this cavity has at least one magnetic field, this plasma emission source is in order to send a charged particle beam to being somebody's turn to do
In cavity, this charged particle beam this magnetic field in this cavity arrives this plated film target, this filling gas
Body is positioned between this coating film area and this plated film target.
13. coating apparatus according to claim 7, wherein this filling gas includes argon, oxygen
The combination of gas and water gas, hydrogen or above-mentioned gas.
14. coating apparatus according to claim 7, wherein this baseplate carrier is in order to carry a base
A second position is further included, when this baseplate carrier is positioned at this on plate, and the path of motion of this baseplate carrier
During the second position, this Ouluding boundary is in the direction between this substrate and this primary importance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510397687.1A CN106319471A (en) | 2015-07-08 | 2015-07-08 | Film coating carrying table and film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510397687.1A CN106319471A (en) | 2015-07-08 | 2015-07-08 | Film coating carrying table and film coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106319471A true CN106319471A (en) | 2017-01-11 |
Family
ID=57725309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510397687.1A Pending CN106319471A (en) | 2015-07-08 | 2015-07-08 | Film coating carrying table and film coating device |
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| CN (1) | CN106319471A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111270206A (en) * | 2018-12-05 | 2020-06-12 | 汉能移动能源控股集团有限公司 | Coating film correction device and coating machine for coating film on curved substrate |
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