KR101748828B1

KR101748828B1 - Method and Apparatus for Manufacturing Multi Array Panel

Info

Publication number: KR101748828B1
Application number: KR1020150118905A
Authority: KR
Inventors: 이민수
Original assignee: 이민수
Priority date: 2015-08-24
Filing date: 2015-08-24
Publication date: 2017-07-03
Also published as: KR20170023578A

Abstract

A manufacturing method of a multi-array substrate and an apparatus for manufacturing the multi-array substrate are disclosed. The multi-array substrate manufacturing apparatus of the present invention can manufacture a multi-array substrate in which a plurality of individually reinforced cell substrates are adhered to one carrier substrate. When a multi-array substrate is used, reinforcement processing can be individually performed for each cell substrate, and a touch panel manufacturing process can be simultaneously performed on a plurality of cell substrates on a multi-array substrate in a touch panel manufacturing process, Therefore, not only the completeness of the reinforcing treatment of the individual cell substrate can be enhanced, but also the productivity is high and the manufacturing cost can be reduced.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a multi-array substrate,

In order to enable the reinforcement process individually for each of the cell substrates and to simultaneously perform the touch panel fabrication process for a plurality of cell substrates in the touch panel manufacturing process, To a single carrier substrate, and a multi-array substrate manufacturing apparatus.

Among the touch panels, capacitive touch panels are widely applied to portable electronic devices such as mobile phones because they have excellent durability and multi-touch functions. In recent years, there is an increasing demand for a thin and durable touch panel for a touch panel .

The capacitance type touch panel is a method of coating a transparent electrode layer (ITO) on one side of a transparent film or glass to allow a certain amount of current to flow, and sensing a change in fine capacitance caused by touching to recognize the touch position. (OGS: One Glass Solution), which forms an ITO pattern on a cover glass instead of using an inner glass or a film formed with an ITO pattern, has been actively developed.

There are various ways to divide, but the integrated touch panel is largely classified into hybrid cover glass integral type (G1F) and cover glass integral type (G2) type. The GIF-type touch panel generates a transparent electrode pattern for Tx in a cover glass, creates a transparent electrode pattern for Rx on a separate PET (polyethylene terephthalate) film, and then bonds the glass and the film with an adhesive (OCA). On the other hand, the G2 type touch panel generates a pattern of one of Tx or Rx transparent electrodes in a cover glass, creates an insulator layer on the pattern, and then generates the remaining transparent electrode patterns.

However, if the cover glass is damaged by the G2 or G1F type touch panel, the transparent electrode formed on the cover glass is damaged and the touch operation becomes impossible. Therefore, a separate tempered glass is applied on the cover glass to protect the electrode layer A glass-glass (GG) method has been proposed.

A manufacturing method of a cover glass integrated touch panel is divided into a sheet process and a cell process.

In the sheet system, (1) a reinforcing process is performed on a large-area circular substrate (usually glass), (2) a plurality of cell regions which are actually used as a touch panel on the circular substrate are divided The touch panel manufacturing process is performed later. (3) When a plurality of cells are formed on an original substrate, the cell substrate is finally cut into cell-unit substrates (hereinafter referred to as "cell substrates").

Such a sheet method is advantageous in that productivity is high and manufacturing cost is low by performing a substrate processing process such as printing or a thin film process on a large disk basis, but it is difficult to cut a surface-enhanced disk into a cell substrate, There is a problem in that the strength of the substrate at the edge is lowered due to heat generated and the durability is weakened. There is also a problem that after the substrate processing step, the high temperature chemical strengthening treatment on the side of the cell substrate is substantially impossible.

Due to the problems of the sheet type, most cover glass integrated type touch panels are manufactured in accordance with the cell type.

The cell method is as follows: (1) First, a large-sized original plate is cut into a plurality of cell substrates, (2) a touch panel is manufactured such as placing a transparent electrode after performing chemical strengthening treatment on each cut cell substrate And the process is performed. Since the cell method performs the cutting process prior to the surface strengthening treatment, the cutting process is easy, and since the surface strengthening treatment process is performed before the substrate treatment process after the cutting, effective strengthening treatment is also performed on the side surface including the cell substrate So that the durability of the product can be improved.

However, the cell type has a disadvantage in that the manufacturing process is long, the productivity is low, and the manufacturing cost is high, compared with the sheet type, because the touch panel manufacturing process is performed on a cell substrate basis.

It is an object of the present invention to provide a method of manufacturing a multi-array substrate in which a plurality of individually reinforced cell substrates are bonded to a single carrier substrate and a multi-array substrate manufacturing apparatus thereof, So that the touch panel manufacturing process can be simultaneously performed on the plurality of cell substrates in the touch panel manufacturing process.

According to another aspect of the present invention, there is provided a method of manufacturing a multi-array substrate, the method comprising: forming a plurality of cell substrates on a single carrier substrate so as to simultaneously form layers for a touch panel on a plurality of cell substrates; Preparing a plurality of cell substrates reinforced with a plurality of cell substrates; A carrier substrate preparation step of partitioning a cell position for the plurality of cell substrates on a carrier substrate and printing a process pattern for each of the plurality of cell positions; Arranging the plurality of cell substrates at the plurality of cell locations so that the center of the cell substrate is aligned with the center of the process pattern; And bonding and bonding the plurality of cell substrates to the carrier substrate, thereby producing a multi-array substrate.

Here, it is preferable that the process pattern uses the pattern of the layer to be generated simultaneously on the plurality of cell substrates. For example, in the preparing of the carrier substrate, The process pattern can be printed at one time.

According to another embodiment, the cell substrate disposing step may include: a resin disposing step of applying a bonding resin to each of the cell substrates; Aligning the center of the cell substrate coated with the bonding resin so as to coincide with the center of the process pattern, and arranging the cell substrate at the cell position; And a cell substrate adhering step of adhering the cell substrate to the carrier substrate by curing the resin by irradiating ultraviolet rays or applying heat to the carrier substrate on which the cell substrate is disposed.

Wherein the cell substrate transfer step comprises: measuring a first distance between a first edge of the cell substrate and an edge of the process pattern opposite the first edge; Measuring a second distance between a second edge located diagonally to the first edge and an edge of the process pattern opposite the second edge; And adjusting the posture of the cell substrate such that the first distance and the second distance are equal.

The cell substrate transferring step may include a step of transferring the first and second faces forming the first corner of the cell substrate with reference to the first corner and the second corner facing each other in the diagonal direction of the cell substrate, (A1, b1) between two surfaces of the process pattern opposite to the first and second surfaces with a first camera; Measuring a distance (a2, b2) between the third and fourth faces forming the second edge and the two faces of the process pattern facing the third and fourth faces simultaneously with a second camera; And adjusting the posture of the cell substrate such that a1 = a2 and b1 = b2.

A multi-array substrate manufacturing apparatus according to another embodiment of the present invention includes a substrate stage, a resin application module, a cell placement module, and a bonding module. The substrate stage supports a carrier substrate on which a process pattern is formed for each cell position at which the plurality of cell substrates are to be arranged. The resin application module applies a bonding resin to one side of the plurality of chemically reinforced cell substrates. The cell placement module places the plurality of cell substrates coated on one side of the bonding resin with the resin application module on the carrier substrate loaded on the substrate stage. The bonding module cures the bonding resin by irradiating heat or ultraviolet rays to the carrier substrate on which the plurality of cell substrates are disposed, thereby bonding the plurality of cell substrates to the carrier substrate to complete the multi-array substrate.

In the case of using the multi-array substrate of the present invention, since the touch panel manufacturing process can be simultaneously performed on a plurality of cell substrates, each of the cell substrates is strengthened individually, Lt; / RTI >

A multi-array substrate manufacturing apparatus of the present invention generates a process pattern on a carrier substrate using a mask to be used in a touch panel manufacturing process and aligns the position of the cell substrate using the process pattern generated on the carrier substrate , The error with respect to the position of the cell substrate is remarkably reduced, thereby making it possible to manufacture the sheet type by the multi-array substrate.

Further, in the multi-array substrate manufacturing apparatus of the present invention, since the bonding resin for bonding the individual cell substrate to the carrier substrate is applied to the cell substrate using the resin transfer roller, the application process is very easily performed, It is possible to prevent the resin from being applied to other regions of the carrier substrate.

In addition, in the multi-array substrate manufacturing apparatus of the present invention, all four cell substrates can be arranged at the same time in the step of arranging the cell substrates on the carrier substrate. In this arrangement process, It is possible to simplify the structure of the conveying means by using the conveying means integrated with the conveying means.

Further, in the multi-array substrate manufacturing apparatus of the present invention, the process pattern printed on the carrier substrate may be disposed at the center of the cell substrate using only two cameras in the process of positioning the cell substrate on the carrier substrate.

1 is a perspective view of a multi-array substrate manufacturing apparatus according to an embodiment of the present invention,
FIG. 2 is a perspective view of an example of the cell placement module of FIG. 1;
Figure 3 is a top view of the cell placement module of Figure 2,
4 is a view showing a pickup unit of the cell placement module of FIG. 2,
5 is a view showing an example of a carrier substrate in which process patterns are shown,
6 is a view provided to explain a process of correcting the posture of the cell substrate on the carrier substrate, and
7 is a cross-sectional view of a resin application module according to an embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail with reference to the drawings.

The present invention utilizes the advantages of a cell type by using (1) a cell substrate that is individually chemically reinforced (i.e., tempered glass), (2) a plurality of cell substrates, A bonded multi-array substrate is manufactured, and a touch panel manufacturing process is performed on a multi-array substrate unit at a time, so that a touch panel manufacturing process is simultaneously applied to a plurality of cell substrates.

1, the apparatus 100 for manufacturing a multi-array substrate includes a substrate stage 101 on which a carrier substrate 10 is loaded, a substrate stage 101 disposed on one side of the substrate stage 101, A cell placement module 130 for placing a plurality of cell substrates 30 on a carrier substrate 10 loaded on a substrate stage 101 and a bonding module (not shown) The multi-array substrate 50 having a plurality of cell substrates 30 attached to one carrier substrate 10 can be manufactured.

The multi-array substrate 50 is inserted into a plurality of cell substrates 30 that are placed on the carrier substrate 10 and then put in a sheet-type touch panel manufacturing process (for example, bezel area printing or transparent electrode layer formation) At the same time, the touch panel manufacturing process is performed.

The substrate stage 101 is provided under the cell placement module 130 to support the carrier substrate 10 and the cell substrate 30 transported by the cell placement module 130 is supported by the carrier substrate 10 on the substrate stage 101 10 to form a single multi-array substrate 50.

Here, the carrier substrate 10 is bonded to a plurality of cell substrates 30 as a base substrate of the multi-array substrate 50 in an aligned state, and a plurality of cell substrates 30, . The material of the carrier substrate 10 is not particularly limited, but may be suitably selected from metal, glass, hard resin, and the like having resistance to deformation due to external force or heat.

On the carrier substrate 10, the process pattern 10-a and the reference mark 10-b are displayed as shown in Fig. Here, the process pattern 10-a is a reference for aligning the cell position, which is the position of each cell substrate 30, when positioning the plurality of cell substrates 30 on the carrier substrate 10. [

A plurality of cell substrates 30 on the multi-array substrate 50 may be subjected to a process to be used in performing a touch panel manufacturing process (for example, bezel printing or transparent electrode layer formation) It is preferable to use the same pattern as that of the mask. In other words, when it is assumed that the bezel is screen printed on the plurality of cell substrates 30 after completing the multi-array substrate 50 according to the present invention, when the bezel is screen-printed on the plurality of cell substrates 30 The bezel is previously printed on the carrier substrate 10 by using the mask (hereinafter, process mask) to be used as it is. Then, the process pattern of the plurality of cell substrates 30 on the carrier substrate 10 becomes a reference of the cell position. The process pattern 10-a in FIG. 5 exemplarily shows a process pattern to be printed on the cell substrate 30. FIG. As another example, in the case of forming a transparent electrode layer (sensing line or driving line) after the completion of the multi-array substrate 50, a process mask for the transparent electrode layer is used to sputter or generate a process pattern on the carrier substrate 10 .

The reference mark 10-b is a reference coordinate of the process pattern 10-a displayed on the carrier substrate 10, and is displayed on one side of the carrier substrate 10. Since the reference mark 10-b is already displayed in the process mask (for example, a mask for bezel printing) as described above, it is displayed together with the process mask 10-a when displaying the process pattern 10-a.

In the present invention, the four cell substrates 30 are simultaneously aligned on the carrier substrate 10 in the process of disposing the cell substrate 30 on the carrier substrate 10. To this end, the cell placement module 130 has a configuration for transferring four cell substrates 30, and four resin application modules 110 are also provided.

7, each of the resin application modules 110 includes a resin storage container 111 for housing the bonding resin, a resin transfer roller 111 disposed in the resin storage container 111 so that the lower portion of the resin storage container 111 is submerged in the resin 113). The resin is applied to the rotating surface of the resin transfer roller 113 as the resin transfer roller 113 rotates and the resin is applied to the cell substrate 30 while the lower surface of the cell substrate 30 contacts the resin transfer roller 113 do. The cell substrate 30 is transferred to the resin application module 110 by the cell placement module 130.

The cell placement module 130 performs the resin application process in the resin application module 110 by (1) holding the cell substrate 30 individually reinforced, (2) applying the resin-coated cell substrate 30 And transferred to the substrate stage 101 to be arranged on the carrier substrate 10.

2 to 4, the cell placement module 130 includes first to fourth pick-up units 201, 203, 205, and 207 for respectively holding the cell substrate 30 by vacuum suction, Up unit (201, 203, 205, 207). The transfer unit linearly moves the first to fourth pick-up units 201, 203, 205, and 207 in the x, y, and z axes, respectively, and rotates at a desired angle. Thereby, the cell placement module 130 can simultaneously arrange four cell substrates at a time.

It is preferable that the first to fourth pick-up units 201, 203, 205, 207 hold the cell substrate 30 by a vacuum adsorption method so that the cell substrate 30 is not damaged.

The transfer unit is provided with a first transfer unit 131-1 for transferring the first pick-up unit 201 on the x axis and a first transfer unit 131 for transferring the second pick- A first-third transfer unit 131-3 for transferring the third pick-up unit 205 on the x-axis, and a fourth transfer unit 131-3 for transferring the fourth pick-up unit 207 on the x- A second-1 transfer unit 133-1 for transferring the first-first transfer unit 131-1 and the first-second transfer unit 131-2 on the y-axis, A second transferring unit 133-3 for transferring the third transferring unit 131-3 and the first transferring unit 131-4 on the y axis, -2 transporting unit 133-3 on the x-axis, and a third transporting unit 135 for transporting the first to fourth pick-up units 201, 203, 205, 207 on the z- 1 to 4-4 transfer units 137-1, 137-2, 137-3 and 137-4 and first to fourth pick-up units 201, 203, 205 and 207, respectively, 5-1 to 5-4 transfer units 139-1, 139-2, 139-3, 139 -4).

When the transfer of the cell substrate 30 is started, the second-1 transfer unit 133-1 and the second-2 transfer unit 133-3 fix the position on the x-axis by the third transfer unit 135, The x-axis coordinates of the first pick-up unit 201 and the second pick-up unit 203 are fixed. Therefore, the first-first transfer unit 131-1 and the first-second transfer unit 131-2 for transferring on the x-axis on the x-axis for individual adjustment of the first pick-up unit 201 and the second pick- Respectively. Similarly, since the x-axis coordinates of the third pick-up unit 205 and the fourth pick-up unit 207 are also fixed by the third transfer unit 135, the third pick-up unit 205 and the fourth pick- The first to third transfer units 131-3 and the first to fourth transfer units 131-4 are provided. Thus, even if four transfer units for transferring on the x-, y-, and z-axes for four first to fourth pick-up units 201, 203, 205, and 207 are not separately arranged, the first to fourth pick- 201, 203, 205, and 207 can be individually adjusted.

4, the first pick-up unit 201 is provided with a first camera unit 401 including two cameras for measuring relative positions and distances between the cell substrate 30 and the corresponding process pattern 10-a, And a first ultraviolet lamp 403 for irradiating ultraviolet spot light for primary bonding between the cell substrate 30 and the carrier substrate 10 are integrally provided, Unit 201 as shown in Fig. Likewise, the second to fourth pick-up units 203, 205 and 207 are also provided integrally with second to fourth camera units (not shown) and second to fourth ultraviolet lamps (not shown).

Hereinafter, the operation of the bonding apparatus 100 of the present invention will be described, focusing on the operation of the cell placement module 130. FIG. A process of placing the cell substrate 30 on the carrier substrate 10 by using the first pick-up unit 201 and the process of placing the cell substrate 30 by using the second to fourth pick-up units 203, 205, 30 will be described below with reference to the operation of the first pick-up unit 201. If necessary, the remaining second to fourth pick-up units 203, 205, 207 Will also be described. Further, the detailed process in which the first pick-up unit 201 is transported by the transport unit in the x, y, and z axes is based on a general understanding, and will not be described separately.

&Lt; Pretreatment step: Preparing the carrier substrate and the cell substrate >

A carrier substrate 10 having a process pattern and a reference mark is prepared and a plurality of reinforced cell substrates 30 are prepared and then the carrier substrate 10 is loaded onto the substrate stage 101 by a preprocessing process.

After the carrier substrate 10 is loaded on the substrate stage 101, the first pick-up unit 201 picks up the cell substrate 30 and then moves to the first resin application module 110, So that the resin is applied to the lower surface of the substrate. At the same time, the second to fourth pick-up units 203, 205, and 207 also pick up the cell substrate 30 and perform the resin coating process in the second to fourth resin application modules 110, respectively.

Coordinates of cell positions on which the respective cell substrates 30 are to be arranged on the carrier substrate 10 are already held by a control device (not shown). Since the cell positions of the plurality of cell substrates on the carrier substrate 10 are the coordinates of the process pattern and the process pattern 10-a is displayed using the process mask to be used in the subsequent manufacturing process, The coordinates of which are known.

Therefore, the transfer unit transfers the first pick-up unit 201 in the x and y-axis directions while the first pick-up unit 201 holds the cell substrate 30 as it is after the resin coating process is performed, The first pick-up unit 201 is transported in the z-axis again to the coordinates of the cell position of the corresponding cell substrate 30 determined by the first pick-up unit 10-b, To the corresponding cell location. As a result, the cell substrate 30 contacts the carrier substrate 10.

After the transfer of the cell substrate 30 by the transfer unit, the control unit (not shown) further controls the transfer unit based on the image information provided by the first camera unit 401 to correct the posture of the cell substrate 30 do. The process of 'posture correction of the cell substrate' will be described below again.

The first ultraviolet lamp 403 emits ultraviolet rays to at least two points on the cell substrate 30 to perform primary bonding of the cell substrate 30 to the carrier substrate 10 do.

On the other hand, the transfer of the cell substrate 30 of each of the second to fourth pick-up units 203, 205 and 207 is performed simultaneously with the transfer of the first pick-up unit 201. For example, when the second pick-up unit 203 is transferred in the z, y, and z axes by the transfer unit to transfer the cell substrate 30 to the corresponding cell position on the carrier substrate 10, , And the second ultraviolet lamp (not shown) firstly bonds the cell substrate 30. As described above, the first to fourth pick-up units 201, 203, 205, and 207 are simultaneously transported by the transport unit, and attitude correction and primary bonding are simultaneously performed, thereby improving the overall process speed.

&Lt; Repeat of cell substrate transfer step >

The cell placement module 130 arranges all of the plurality of cell substrates 30 on the carrier substrate 10 by repeating the above resin application step and the cell substrate transfer step with respect to the new cell substrate 30. [

&Lt; Cell glass bonding step &

When all of the cell substrates 30 are disposed on the carrier substrate 10, the carrier substrate 10 is unloaded from the substrate stage 101 and bonding by a bonding module (not shown) is performed. The bonding module (not shown) adheres the entire cell substrate 30 to the carrier substrate 10 by irradiating ultraviolet rays or applying heat to the entire carrier substrate 10 to cure the bonding resin of the cell substrate 30.

Through the above method, the multi-array substrate 50 of the present invention is manufactured.

After the cell substrate 30 is initially placed in its seat by the transfer unit, the control unit (not shown) further controls the transfer unit based on the image information provided by the first camera unit 401, 30) is corrected. The first camera unit 401 includes two cameras.

At this time, the posture correction of the cell substrate is performed in such a manner that the process pattern 10-a is positioned at the center of the cell substrate 30. Two corners disposed in the mutually diagonal direction among the four corners of the cell substrate 30 are referred to as a first corner 30-a and a second corner 30-b, respectively.

The method illustrated by way of example in FIG. 6 (a) is the first distance between the first edge 30-a and the edge of the process pattern 10-a opposite the first edge 30-a (b) between the edges of the process pattern 10-a opposed to the second edge 30-b and the second edge 30-b are coincident with each other. To this end, the first camera of the first camera unit 401 is used for measurement of the first distance a, and the second camera of the first camera unit 401 is used for the measurement of the second distance b.

The first distance a and the second distance b coincide with each other because the respective pick-up modules 201, 203, 205 and 207 still hold the cell substrate 30 The transfer means is controlled to precisely adjust the posture of the cell substrate 30 so that the process pattern 10-a is positioned at the center of the cell substrate 30. [

In the method of FIG. 6B, the first camera of the first camera unit 401 includes first and second surfaces forming the first corner 30-a and a process of opposing the first and second surfaces Is used to simultaneously measure distances a1 and b1 between two surfaces of the pattern 10-a. In addition, the second camera of the first camera unit 401 has the third and fourth faces forming the second corner 30-b, and two of the process patterns 10-a opposed to the third and fourth faces Is used to simultaneously measure the distances a2 and b2 between the two surfaces. The distances a1, b1, a2 and b2 of the four points to be measured should be measured close to the first edge 30-a and the second edge 30-b, Can be adjusted.

A process pattern 10-a is formed at the center of the cell substrate 30 by precisely adjusting the posture of the cell substrate 30 by controlling the conveying means so that a1 = a2 and b1 = b2 .

Thus, when the process pattern 10-a is aligned at the center of each cell substrate 30 and then used for display of the process pattern 10-a in the manufacturing process using the multi-array substrate 50 The desired layer can be formed on the cell substrate 30 without any error by using the mask as it is. Since the pattern of the layer formed on the cell substrate 30 by the mask is the same as the process pattern 10-a, if the posture correction of the cell substrate 30 is correct, As shown in FIG.

Accordingly, the method of using the multi-array substrate 50 of the present invention is as follows: (1) the cell substrate 30 is individually reinforced, and (2) A plurality of cell substrates can be operated in a single process as in the manufacturing process of the present invention.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

Claims

A method of manufacturing a multi-array substrate in which a plurality of cell substrates are disposed on a single carrier substrate so that a plurality of cell substrates can be simultaneously formed with layers for a touch panel,
Preparing a plurality of chemically reinforced cell substrates;
A carrier substrate preparation step of partitioning a cell position for the plurality of cell substrates on a carrier substrate and printing a process pattern for each of the plurality of cell positions;
Arranging the plurality of cell substrates at the plurality of cell locations so that the center of the cell substrate is aligned with the center of the process pattern; And
Forming a multi-array substrate by bonding and bonding the plurality of cell substrates to a carrier substrate,
The process pattern uses the pattern of the layer to be simultaneously generated on the plurality of cell substrates, and the carrier substrate preparation step prints the process pattern of the plurality of cell positions at one time using a mask to be used for the layer formation Wherein the multi-array substrate is manufactured by the method.

delete

The method according to claim 1,
The cell substrate disposing step may include:
A resin applying step of applying a bonding resin to each of the cell substrates;
A cell substrate transfer step of aligning the center of the cell substrate coated with the bonding resin so as to coincide with the center of the process pattern, and arranging the cell substrate at the cell position; And
And a cell substrate adhering step of adhering the cell substrate to the carrier substrate by curing the resin by irradiating ultraviolet rays or applying heat to the carrier substrate on which the cell substrate is disposed.

5. The method of claim 4,
In the cell substrate transfer step,
Measuring a first distance between a first edge of the cell substrate and an edge of the process pattern opposite the first edge;
Measuring a second distance between a second edge located diagonally to the first edge and an edge of the process pattern opposite the second edge; And
And adjusting a posture of the cell substrate so that the first distance and the second distance are equal to each other.

5. The method of claim 4,
In the cell substrate transfer step,
The first and second surfaces forming a first corner of the cell substrate and the first and second surfaces opposing the first and second surfaces with respect to a first corner and a second corner facing each other in the diagonal direction of the cell substrate, Measuring a distance (a1, b1) between two faces of the pattern to the first camera at the same time;
Simultaneously measuring a distance (a2, b2) between the third and fourth faces forming the second edge and the two faces of the process pattern opposite to the third and fourth faces with a second camera; And
And adjusting the posture of the cell substrate so that a1 = a2 and b1 = b2.

There is provided a multi-array substrate manufacturing apparatus for producing a multi-array substrate in which a plurality of cell substrates are disposed on one carrier substrate so as to be able to simultaneously generate layers for a touch panel on a plurality of cell substrates,
A substrate stage for supporting a carrier substrate on which a process pattern is formed for each cell position at which the plurality of cell substrates are to be arranged;
A resin application module for applying a bonding resin to one surface of the plurality of chemically reinforced cell substrates;
A cell placement module for placing the plurality of cell substrates coated on one side of the bonding resin with the resin application module on a carrier substrate loaded on the substrate stage; And
And a bonding module for bonding the plurality of cell substrates to the carrier substrate by curing the bonding resin by irradiating heat or ultraviolet rays to the carrier substrate on which the plurality of cell substrates are disposed,
Wherein the process pattern uses the pattern of the layer to be simultaneously generated on the plurality of cell substrates, and the carrier substrate prints the process pattern of the plurality of cell positions at once using a mask to be used for forming the layer Wherein the substrate is a substrate.

delete

8. The method of claim 7,
The cell placement module includes:
First to fourth pick-up units for vacuum holding and holding the cell substrates, respectively;
And a transfer unit for linearly moving the first to fourth pickup units in the x, y, and z axes or rotating the first to fourth pickup units at a desired angle (?), Respectively, Substrate manufacturing apparatus.

11. The method of claim 10,
The transfer unit
A first transfer unit 131-1 for transferring the first pick-up unit on the x-axis, a first transfer unit 131-2 for transferring the second pick-up unit on the x-axis, A first to third transfer unit 131-3 for transferring the third pick-up unit on the x-axis, a first to fourth transfer unit 131-4 for transferring the fourth pick-up unit on the x-axis, A second transferring unit 133-1 for transferring the first transferring unit 131-1 and the first transferring unit 131-2 on the y axis, A second-2 transferring unit 133-3 for transferring the first to fourth transferring units 131-4 to 131-3 on the y-axis, a second-1 transferring unit 133-3 for transferring the second- A fourth transfer unit 135 for transferring the first to fourth pick-up units on the x-axis, and fourth to fourth transfer units 137-1, 137-2, 137- 5-1 to 5-4 transfer units 139-1, 139-2, 139-3, and 139-4 for rotating the first to fourth pickup units about the z-axis, respectively, ) Wherein the substrate is a substrate.

12. The method of claim 11,
Wherein the cell array module is arranged at the cell position by aligning the center of the cell substrate coated with the bonding resin so as to match the center of the process pattern.

13. The method of claim 12,
And first to fourth camera units to be transported together with the first to fourth pick-up units by the transport unit,
Wherein each of the first to fourth camera units comprises:
A first camera used to measure a first distance between a first edge of the cell substrate and an edge of the process pattern opposite the first edge; And
A second camera used to measure a second distance between a second corner located diagonally to the first corner and an edge of the process pattern opposite the second corner,
Wherein the transfer unit adjusts the posture of the cell substrate so that the first distance and the second distance are the same.

13. The method of claim 12,
And first to fourth camera units to be transported together with the first to fourth pick-up units by the transport unit,
Wherein each of the first to fourth camera units comprises:
The first and second surfaces forming a first corner of the cell substrate and the first and second surfaces opposing the first and second surfaces with respect to a first corner and a second corner facing each other in the diagonal direction of the cell substrate, A first camera used to simultaneously measure distances (a1, b1) between two faces of the pattern; And
(A2, b2) between two faces of the process pattern facing the third and fourth faces forming the second edge and the third and fourth faces, and,
Wherein the transfer unit adjusts the posture of the cell substrate so that a1 = a2 and b1 = b2.