CN105803404A - Thin film deposition assembly and thin film deposition device - Google Patents
Thin film deposition assembly and thin film deposition device Download PDFInfo
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- CN105803404A CN105803404A CN201610177201.8A CN201610177201A CN105803404A CN 105803404 A CN105803404 A CN 105803404A CN 201610177201 A CN201610177201 A CN 201610177201A CN 105803404 A CN105803404 A CN 105803404A
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- thin film
- film deposition
- target
- deposition
- laser illumination
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
Abstract
The invention discloses a thin film deposition assembly. The thin film deposition assembly comprises a deposition substrate (10), a target material bearing disk (20), a plurality of target materials (40) arranged on the surfaces, facing the deposition substrate (10), of the target material bearing disk (2) and arranged at intervals in the first direction, and a plurality of laser radiation source sets (3) arranged between the deposition substrate (10) and the target material bearing disk (20), wherein the deposition substrate (10) and the target material bearing disk (20) are oppositely arranged; the laser radiation source sets (30) correspond to the target materials (40) one to one; each laser radiation source set (30) comprises a plurality of laser radiations sources (31) arranged at intervals in the second direction; and the first direction intersects with the second direction. The invention further discloses a thin film deposition device. According to the thin film deposition assembly and the thin film deposition device, effective deposition areas are large, and therefore the large-batch production requirement of large-size substrates can be met, and by means of the design of point arrangement of the laser radiation sources and the movement manner of the target material bearing disk and/or the deposition substrate in the thin film deposition process, the thin film deposition evenness is improved.
Description
Technical field
The invention belongs to equipment for making film technical field, specifically, relate to a kind of thin film deposition assembly and film deposition apparatus.
Background technology
Organic light emission (OLED) Display Technique, than the lcd technology of current main-stream, has the outstanding advantages such as contrast height, colour gamut be wide, flexible, frivolous, energy-conservation.In recent years, OLED Display Technique is popularized in fields such as mobile the flexible wearable equipment such as equipment, intelligent watch, large scale curved surface TV, the white-light illuminatings such as smart mobile phone and panel computer gradually, and its growth momentum is powerful.
Current flexible OLED display has put into commercial operation.Can flexible OLED-device needs to use fexible film encapsulation technology (TFE, ThinFilmEncapsulation), effectively intercept water oxygen, be the key factor of constraint device life.Glass substrate splendid for water oxygen barrier performance and encapsulation cover plate are replaced by flexible material (such as PI, PET etc.) need to solve its water oxygen barrier performance problem.Accordingly, it would be desirable to make fexible film encapsulated layer on a flexible substrate.The encapsulation of current fexible film mainly adopts the plural layers encapsulation technology that inorganic barrier layer (Barrierlayer)/organic buffer layer (Bufferlayer) is alternately stacked.But, in film formation process, it is necessary to use the electrically conducting transparent Compound deposition technology that OLED damage is little.
Pulsed laser deposition (PLD, PulsedLaserDeposition) technology is a kind of inorganic compound deposition technique that deposition substrate is lossless, has started at present be applied to the production of industrial quarters and research and development field.Suitable in the thin film deposition from low temperature to high temperature of most of inorganic compound, such as ITO, Al2O3, IGZO etc..
But, when the existing thin film utilized in the flexible OLED display of pulsed laser deposition technique making, the effective deposition zone of existing pulsed laser deposition device is little, it is difficult to the demand that reply large-size substrate is produced in enormous quantities, and for the thin film deposition of large-size substrate, the uniformity of its deposition thin film is also affected by challenge.Additionally, existing pulsed laser deposition device is difficult to many targets codeposition thin film.
Summary of the invention
In order to solve above-mentioned prior art Problems existing, it is an object of the invention to provide a kind of thin film deposition assembly, comprising: the deposition substrate being oppositely arranged and target carrier；It is arranged at described target carrier on the surface of described deposition substrate and in the first direction spaced multiple target；Being arranged at the multiple laser illumination source groups between described deposition substrate and described target carrier, described laser illumination source group and described target one_to_one corresponding, each laser illumination source group includes spaced multiple laser illumination source in a second direction；Wherein, described first direction intersects with described second direction.
Further, described first direction and described second direction intersect vertically.
Further, described target is strip.
Further, the length direction of described target is along described second direction.
Further, described target includes along spaced many sub-targets of described second direction, wherein, and described sub-target and described laser illumination source one_to_one corresponding.
Further, forming the described target in strip along spaced many sub-targets of described second direction, wherein, the length direction of described target is along described second direction.
Further, described deposition substrate moves along predetermined direction.
Further, described target carrier moves along predetermined direction.
Further, described laser illumination source group is arranged between described deposition substrate and described target carrier, and described laser illumination source group is near described deposition substrate.
Another object of the present invention also resides in a kind of film deposition apparatus of offer, and it includes control system and above-mentioned thin film deposition assembly, and wherein, described control system controls described thin film deposition assembly and carries out thin film deposition.
Beneficial effects of the present invention: the thin film deposition assembly of the present invention and film deposition apparatus, its effective deposition zone is big, it is thus possible to reply large-size substrate production demand, and by designing the arrangement of laser illumination source point and target carrier and/or deposition substrate move mode in deposition of thin membrane process, improve the uniformity of deposition thin film.Additionally, the thin film deposition assembly of the present invention and film deposition apparatus achieve the purpose of many targets codeposition thin film.
Accompanying drawing explanation
What carry out in conjunction with the drawings is described below, and the above-mentioned and other side of embodiments of the invention, feature and advantage will become clearer from, in accompanying drawing:
Fig. 1 is the structure front view of thin film deposition assembly according to an embodiment of the invention；
Fig. 2 is the left view of Fig. 1；
Fig. 3 illustrates the left view of thin film deposition assembly according to another embodiment of the present invention；
Fig. 4 is the structural representation of film deposition apparatus according to an embodiment of the invention.
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings to embodiments of the invention are described in detail.However, it is possible to implement the present invention in many different forms, and the present invention should not be construed as limited to the specific embodiment set forth here.On the contrary, it is provided that these embodiments are to explain principles of the invention and practical application thereof, so that others skilled in the art are it will be appreciated that various embodiments of the present invention and be suitable for the various amendments of specific intended application.
In the accompanying drawings, in order to know components and parts, exaggerate the thickness in layer and region.Identical label represents identical element in the accompanying drawings all the time.
Fig. 1 is the structure front view of thin film deposition assembly according to an embodiment of the invention.Fig. 2 is the left view of Fig. 1.
Seeing figures.1.and.2, thin film deposition assembly includes according to an embodiment of the invention: deposition substrate 10,20, two laser illumination source groups 30 of target carrier and two targets 40.In the present embodiment, the quantity of laser illumination source group 30 and target 40 is two, but the present invention is not restricted to this, and their quantity arbitrarily can increase and decrease according to practical situation.
Further, a corresponding target 40 of laser illumination source group 30；It is to say, laser illumination source group 30 and target 40 one_to_one corresponding.
Deposition substrate 10 and target carrier 20 are oppositely arranged.Two targets 40 (the x direction in Fig. 1, the i.e. direction of parallel paper) in the first direction are spaced.In the present embodiment, target 40 is in strip.Further, the length direction of target 40 (the y direction in Fig. 1, the i.e. direction of vertical paper) in a second direction.So, it is known that first direction is vertical with second direction, but the present invention is not restricted to this, intersects as long as meeting first direction and second direction in practical application.
Two laser illumination source groups 30 are arranged between deposition substrate 10 and target carrier 20.Further, two laser illumination source groups 30 are near deposition substrate 10, but the present invention is not restricted to this.
Specifically, one of two laser illumination source groups 30 are arranged at the upper left side of target carrier 20, with the target 40 of corresponding target carrier 20 upper left side；Another of two laser illumination source groups 30 is arranged at the upper right side of target carrier 20, with the target 40 on right side on corresponding target carrier 20；But the present invention is not restricted to this.
Further, laser illumination source group 30 includes spaced four laser illumination sources 31 in a second direction.In the present embodiment, each laser illumination source group 30 includes four laser illumination sources 31, but the present invention is not restricted to this, and the quantity of the laser illumination source 31 that each laser illumination source group 30 includes arbitrarily can increase and decrease according to practical situation.
So, it is positioned at four laser illumination sources 31 that the upper left side laser illumination source group 30 of target carrier 20 includes and irradiates the four bundle laser, four positions to target 40 surface of target carrier 20 upper left side, on the surface of the target 40 of target carrier 20 upper left side, each point of irradiation forms plasma, the material of target 40 irradiates gasified at laser, material after gasification rises, thus form the thin film of certain deposition region on deposition substrate 10 surface.
Further, in the present embodiment, deposition substrate 10 or target carrier 20 can be mobile along predetermined direction (such as left and right directions or certain single direction).So, coordinate deposition substrate 10 or target carrier 20 along the movement of predetermined direction, it is possible to form the thin film of the component uniform film thickness consistent with the target 40 of target carrier 20 upper left side on deposition substrate 10 surface.
In like manner, be positioned at four laser illumination sources 31 that the upper right side laser illumination source group 30 of target carrier 20 includes irradiate four bundle laser to target carrier 20 four positions on target 40 surface on right side, on target carrier 20, on the surface of the target 40 on right side, each point of irradiation forms plasma, the material of target 40 irradiates gasified at laser, material after gasification rises, thus form the thin film of certain deposition region on deposition substrate 10 surface.
Further, in the present embodiment, deposition substrate 10 or target carrier 20 can be mobile along predetermined direction (such as left and right directions or certain single direction).So, coordinate deposition substrate 10 or target carrier 20 along the movement of predetermined direction, it is possible to deposition substrate 10 surface formed component with on target carrier 20 on the right side of the thin film of the consistent uniform film thickness of target 40.
In addition, can control to be positioned at four laser illumination sources 31 that the upper left side laser illumination source group 30 of target carrier 20 includes and four laser illumination source 31 intervals to schedule that the upper right side laser illumination source group 30 being positioned at target carrier 20 includes alternately open or close, as such, it is possible to be sequentially depositing bilayer or plural layers in deposition substrate 10.
As another embodiment of the present invention, refer to Fig. 3.Fig. 3 illustrates the left view of thin film deposition assembly according to another embodiment of the present invention.As it is shown on figure 3, target 40 is overall in strip, but with the target 40 shown in Fig. 1 or Fig. 2 the difference is that, the target 40 shown in Fig. 3 is made up of four sub-targets 41.Specifically, these four sub-targets 41 are spaced in a second direction, and every corresponding laser illumination source 31 of sub-target 41；It is to say, sub-target 41 and laser illumination source 31 one_to_one corresponding.
Fig. 4 is the structural representation of film deposition apparatus according to an embodiment of the invention.
With reference to Fig. 4, film deposition apparatus includes according to an embodiment of the invention: above-mentioned thin film deposition assembly and control system 100；Wherein, control system 100 controls above-mentioned thin film deposition assembly and carries out thin film deposition.
Specifically, control system 100 can control deposition substrate 10, target carrier 20, laser illumination source group 30 and target 40 and be operated according to default operation, thus forming predetermined thin film in deposition substrate 10.
In sum, thin film deposition assembly and film deposition apparatus according to an embodiment of the invention, its effective deposition zone is big, it is thus possible to reply large-size substrate production demand, and by designing the arrangement of laser illumination source point and target carrier and/or deposition substrate move mode in deposition of thin membrane process, improve the uniformity of deposition thin film.Additionally, thin film deposition assembly and film deposition apparatus achieve the purpose of many targets codeposition thin film according to an embodiment of the invention.
Although illustrate and describing the present invention with reference to specific embodiment, but it should be appreciated by those skilled in the art that: when without departing from the spirit and scope of the present invention limited by claim and equivalent thereof, the various changes in form and details can be carried out at this.
Claims (10)
1. a thin film deposition assembly, it is characterised in that including:
The deposition substrate (10) being oppositely arranged and target carrier (20)；
It is arranged at described target carrier (20) on the surface of described deposition substrate (10) and in the first direction spaced multiple target (40)；
It is arranged at the multiple laser illumination source groups (30) between described deposition substrate (10) and described target carrier (20), described laser illumination source group (30) and described target (40) one_to_one corresponding, each laser illumination source group (30) includes spaced multiple laser illumination source (31) in a second direction；Wherein, described first direction intersects with described second direction.
2. thin film deposition assembly according to claim 1, it is characterised in that described first direction and described second direction intersect vertically.
3. thin film deposition assembly according to claim 1 and 2, it is characterised in that described target (40) is in strip.
4. thin film deposition assembly according to claim 3, it is characterised in that the length direction of described target (40) is along described second direction.
5. thin film deposition assembly according to claim 1 and 2, it is characterized in that, described target (40) includes along spaced many sub-targets (41) of described second direction, wherein, described sub-target (41) and described laser illumination source (31) one_to_one corresponding.
6. thin film deposition assembly according to claim 5, it is characterized in that, forming the described target (40) in strip along spaced many sub-targets (41) of described second direction, wherein, the length direction of described target (40) is along described second direction.
7. thin film deposition assembly according to claim 1, it is characterised in that described deposition substrate (10) moves along predetermined direction.
8. thin film deposition assembly according to claim 1, it is characterised in that described target carrier (20) moves along predetermined direction.
9. thin film deposition assembly according to claim 1, it is characterized in that, described laser illumination source group (30) is arranged between described deposition substrate (10) and described target carrier (20), and described laser illumination source group (30) is near described deposition substrate (10).
10. a film deposition apparatus, it is characterised in that include the thin film deposition assembly described in control system and any one of claim 1 to 9, wherein, described control system controls described thin film deposition assembly and carries out thin film deposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177201.8A CN105803404A (en) | 2016-03-25 | 2016-03-25 | Thin film deposition assembly and thin film deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177201.8A CN105803404A (en) | 2016-03-25 | 2016-03-25 | Thin film deposition assembly and thin film deposition device |
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| Publication Number | Publication Date |
|---|---|
| CN105803404A true CN105803404A (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610177201.8A Pending CN105803404A (en) | 2016-03-25 | 2016-03-25 | Thin film deposition assembly and thin film deposition device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107099774A (en) * | 2017-04-26 | 2017-08-29 | 京东方科技集团股份有限公司 | Sputter equipment, sputtering method |
| CN107761058A (en) * | 2017-11-14 | 2018-03-06 | 中国科学院光电研究院 | Preparation facilities of complex alloy thin film and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107099774A (en) * | 2017-04-26 | 2017-08-29 | 京东方科技集团股份有限公司 | Sputter equipment, sputtering method |
| CN107099774B (en) * | 2017-04-26 | 2019-03-12 | 京东方科技集团股份有限公司 | Sputtering equipment, sputtering method |
| CN107761058A (en) * | 2017-11-14 | 2018-03-06 | 中国科学院光电研究院 | Preparation facilities of complex alloy thin film and preparation method thereof |
| CN107761058B (en) * | 2017-11-14 | 2018-11-13 | 中国科学院光电研究院 | Preparation facilities of complex alloy thin film and preparation method thereof |
| WO2019095486A1 (en) * | 2017-11-14 | 2019-05-23 | 中国科学院光电研究院 | Preparation device for multi-element alloy thin film, and preparation method therefor |
| US11149344B2 (en) * | 2017-11-14 | 2021-10-19 | The Academy Of Opto-Electronics, Chinese Academy Of Sciences | Apparatus and method for preparing multi-component alloy film |
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Application publication date: 20160727 |
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