CN106312797B - Adjust the polishing assembly of optic periphery area pressure distribution - Google Patents
Adjust the polishing assembly of optic periphery area pressure distribution Download PDFInfo
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- CN106312797B CN106312797B CN201610836440.XA CN201610836440A CN106312797B CN 106312797 B CN106312797 B CN 106312797B CN 201610836440 A CN201610836440 A CN 201610836440A CN 106312797 B CN106312797 B CN 106312797B
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- polishing
- pressure
- dynamometer
- polishing disk
- distribution
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B39/00—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A kind of polishing assembly adjusting the distribution of optic periphery area pressure, it include: planet birotor pneumatic actuator, articulated type additional pressure applicator mechanism and polishing disk, it is characterized in that concentric grooves are carved at the back side of the polishing disk, the articulated type additional pressure applicator mechanism is made of fixed pedestal, turning joint and dynamometer.In the polishing process of optic periphery region, the distribution of optic periphery area pressure is adjusted by the polishing assembly, to change the distribution of fringe region material removal amount, achieve the effect that inhibit edge effect；In addition, Oscillation Amplitude can be effectively reduced by articulated type additional pressure applicator mechanism, to improve the confirmability of polishing process.
Description
Technical field
The present invention relates to optical processing technology fields, are related to computer control optical surface formation technology field, especially
A kind of polishing assembly adjusting the distribution of optic periphery area pressure.
Background technique
Computer controlled optical surfacing technology (Computer Controlled Optical Surfacing, CCOS) is
A kind of deterministic theory technology that eighties of last century the seventies grow up has become the master of aspherical optical element processing at present
Flow Technique.Under control of the computer, a diameter is much smaller than the polishing disk (being commonly called as small abrasive nose) of workpiece surface size according to meter
The motion profile and travel speed of calculation are scanned processing in workpiece surface.This technology has many conventional polishing techniques institutes not
The advantages of having, such as certainty is good, polishing efficiency is high and is capable of processing heavy caliber complex surface；However, it is asked there is also some
Topic or shortcoming, such as edge effect problem and intermediate frequency error problem.
Edge effect problem has larger impact and the important research in the field to the surface figure accuracy and processing efficiency of CCOS
Problem.The main reason for edge effect generates is: 1) polishing disk can not be fully removed workpiece surface；2) polishing disc portion vacantly makes
The pressure distribution of workpiece surface fringe region changes.Traditional solution route is to expand the edge of work by cushion block, with true
Workpiece surface can be fully removed by protecting polishing disk, to inhibit edge effect.This method to the shape and material property of cushion block all
It has higher requirements, thus is difficult to apply in CCOS.The case where polishing for CCOS or small tool, has scholar to propose side
Edge region removes the parameterized model of function, and some scholars propose the fringe region pressure distributed mode based on finite element analysis
Type, these models all in a certain range can accurately predicted edge region material removal amount distribution.By the side Preston
Journey is it is found that pressure and relative velocity are the principal elements for influencing material removing rate, although some researches show that optic periphery areas
The material removal in domain is there are non-linear, but the non-linear relation of the distribution of the pressure of fringe region and material removing rate is determining
, it can be obtained by many experiments.Thus, it carries out in small tool polishing process in workpiece surface fringe region, is pressed by adjusting
It is strong to be distributed changeable fringe region material removal amount distribution, and then can inhibit edge effect.
It is effectively adjusted however, traditional polishing tool can not be distributed the pressure of fringe region, therefore tune cannot be passed through
Pressure distribution is saved to inhibit edge effect.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of polishing groups of adjusting optic periphery area pressure distribution
Part is distributed optic periphery area pressure by the polishing assembly and carries out in the polishing process of optic periphery region
It adjusts, to change the distribution of fringe region material removal amount, achieve the effect that inhibit edge effect；In addition, auxiliary by articulated type
Help pressure exerting arrangement that can effectively reduce Oscillation Amplitude, to improve the confirmability of polishing process.
Technical solution of the invention is as follows:
A kind of polishing assembly adjusting the distribution of optic periphery area pressure, comprising: planet birotor Pneumatic Transmission dress
It sets, articulated type additional pressure applicator mechanism and polishing disk, it is characterized in that concentric grooves are carved at the back side of the polishing disk, it is described
Articulated type additional pressure applicator mechanism be made of fixed pedestal, turning joint and dynamometer, the fixed pedestal is fixed on described
Planet birotor pneumatic actuator side wall on, one end of the turning joint is connected with the fixed pedestal, institute
The fixed dynamometer of the fixture of the end for the turning joint stated, the probe of the dynamometer pass through the turning joint
It is located in any concentric grooves at the polishing disk back side, the ditch slot number from from inside to outside directly reads dynamometer probe
At a distance from the center of polishing disk, the dynamometer applies pressure to polishing disk in real time and shows the size of pressure applied.
The turning joint is the Joint Manipulator of the joint mechanism manually adjusted or computer control.
The effect of birotor pneumatic actuator is: driving polishing disk to carry out planetary rotation, when hollow shaft and the axis of rotation
When with one heart or being overlapped, polishing disk only has rotation；Constant pressure is applied to polishing disk, keeps polishing disk and optical surface to be processed close
Fitting, general surfacing removal rate are directly proportional to pressure applied.
Dynamometer is fixed by the fixture of turning joint end, it is mainly used for some position to polishing disk upper surface and applies
Add constant pressure, meanwhile, dynamometer exports or shows in real time the size of pressure applied.By the concentric grooves to survey
Power meter probe carries out limitation positioning and measurement, can directly read dynamometer probe from ditch slot number and polish disk center or edge
Distance, meanwhile, when polishing disk carries out the rotation polishing of planetary birotor, groove can limiting measuring force meter probe relative position.
The present invention mainly has the advantages that:
It (1), can be to edge area pressure point by articulated type pressure exerting arrangement in the polishing process of optic periphery region
Cloth is adjusted, to change the distribution of fringe region material removal amount, can reach the effect for inhibiting edge effect；
(2) since bottom friction discontinuity is easy to produce mechanical oscillation in polishing disk rotary course, by articulated type
Pressure exerting arrangement pressure can effectively reduce Oscillation Amplitude, thus the confirmability of polishing process can be improved.
Detailed description of the invention
Fig. 1 is the installation diagram for the polishing assembly that the present invention adjusts the distribution of optic periphery area pressure；
Fig. 2 is the schematic diagram of planet birotor pneumatic actuator；
Fig. 3 is the schematic diagram of articulated type additional pressure applicator mechanism；
Fig. 4 is the schematic diagram for the polishing disk that concentric grooves are carved at the back side；
Fig. 5 is dynamometer pressure operation schematic diagram；
Fig. 6 is Finite element analysis results, wherein Fig. 6 (a) indicates the case where dynamometer does not press；Fig. 6 (b), Fig. 6 (c),
Fig. 6 (d) respectively indicates the case where dynamometer is near the edge of work, inside, outside pressure.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in more detail.
Fig. 1 is polishing assembly assembling schematic diagram of the present invention.The polishing assembly specifically includes that planet birotor Pneumatic Transmission
Device 1, articulated type additional pressure applicator mechanism 2, the back side are carved with the polishing disk 3 of concentric grooves.
Fig. 2 is the appearance diagram of a planet birotor pneumatic actuator.The effect of this device is: 1) driving polishing
Disk carries out planetary rotation, and when hollow shaft and the axis of rotation are concentric or are overlapped, polishing disk only has rotation；2) polishing disk is applied permanent
Constant-pressure fits closely polishing disk with optical surface to be processed, and general surfacing removal rate is directly proportional to pressure applied.
This device belongs to conventional machinery component.
Fig. 3 is articulated type additional pressure applicator mechanism.Its main function is to apply certain pressure at the polishing disk back side, is changed
The pressure of polishing disk and optical surface contact area is distributed, to adjust the material removal amount in optic periphery region, inhibit
Edge effect.Articulated type additional pressure applicator mechanism is made of 23 3 fixed pedestal 21, turning joint 22, dynamometer parts.It is fixed
The effect of pedestal 21 is that entire articulated type additional pressure applicator mechanism 2 is fixed to planet birotor pneumatic actuator 1 by magnetic force
Side wall on, specific layout is as shown in Figure 1；The effect of turning joint 22 is the position for adjusting and fixing dynamometer 23, guarantees to survey
Power meter can press in 3 back side any position of polishing disk；Dynamometer 23 has both two functions of pressure and dynamometry, can by dial plate
Pressure size is read in real time.This mechanism is also conventional machinery component.
Fig. 4 is the schematic diagram for the polishing disk that concentric grooves are carved at the back side.This polishing disk is characterized in that, the back side just like
Concentric grooves 31 shown in Fig. 4.Limitation positioning and measurement can be carried out to dynamometer probe by the concentric grooves, from groove
Number can directly read dynamometer probe at a distance from polishing disk center or edge, meanwhile, planetary double turns are carried out in polishing disk
Son rotation polishing when, groove can limiting measuring force meter probe relative position.It should be noted that edge region is polished
When, it is currently preferred to use from rotary-die type, that is, the two-spool hollow shaft of planet and rotation overlapping of axles；If the two does not weigh
It closes, then dynamometer in polishing process is also needed to need to follow revolution motion.Note that being difficult clear in view of groove is closeer
It shows, concentric grooves is omitted in other attached drawings, there is concentric circles ditch at the polishing disk back side in actually all attached drawings
Slot.
Fig. 5 is the schematic diagram of dynamometer pressure.Dynamometer pressure position will have a direct impact on polishing disk and contact with workpiece surface
The pressure in region is distributed.
Fig. 6 is Finite element analysis results.Fig. 6 (a) indicates the case where dynamometer does not press, Fig. 6 (a), Fig. 6 (b) and Fig. 6
(c) dynamometer is respectively indicated the case where three kinds of different locations press.It can be seen that when dynamometer does not press (see Fig. 6
(a)), workpiece surface most fringe region pressure does not lean on workpiece inside region pressure big, will cause side in practical polishing process
Edge protrusion, i.e., common " alice " phenomenon；When dynamometer presses near the edge of work (see Fig. 6 (b)), workpiece surface most side
Edge area pressure with by workpiece inside region pressure very close to, meanwhile, dynamometer press near zone pressure it is larger；Work as dynamometry
(see Fig. 6 (c)) when meter presses on the inside of workpiece, nearby there is one piece of larger area of pressure in dynamometer pressure position on the inside of workpiece
Domain, and overall pressure distribution is relatively uniform；When dynamometer presses on the outside of workpiece (see Fig. 6 (d)), workpiece rim zone pressure
It is excessive, it will cause edge in practical polishing process and collapse down, i.e., common " turned-down edge " phenomenon.For different situations, adopt
It can prevent edge surface shape from deteriorating with different pressure conditions.For example, having alice if workpiece surface primary face shape, adopt
Alice can be inhibited with the pressure mode as shown in Fig. 6 (d)；If workpiece surface primary face shape is used there are turned-down edge phenomenon
Pressure mode shown in Fig. 6 (c) can prevent from continuing turned-down edge in polishing process.
So far, attached drawing is had been combined to the present invention have been described in detail.According to above description, those skilled in the art are answered
When having clear understanding to polishing assembly of the present invention.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in guarantor of the invention
Within the scope of shield.
Claims (2)
1. a kind of polishing assembly for adjusting the distribution of optic periphery area pressure, comprising: planet birotor pneumatic actuator
(1), articulated type additional pressure applicator mechanism (2) and polishing disk (3), it is characterised in that be carved with one heart at the back side of the polishing disk (3)
Circle groove (31), the articulated type additional pressure applicator mechanism (2) is by fixed pedestal (21), turning joint (22) and dynamometer (23)
Composition, the fixed pedestal (21) are fixed on the side wall of the planet birotor pneumatic actuator (1), the work
One end of movable joint (22) is connected with the fixed pedestal (21), and the fixture of the end of the turning joint is fixed described
Dynamometer (23), the probe of the dynamometer are located in any same of the polishing disk back side by the turning joint
In heart circle groove, dynamometer probe is directly read at a distance from the center of polishing disk from ditch slot number from inside to outside, the survey
Power meter applies pressure to polishing disk in real time and shows the size of pressure applied.
2. the polishing assembly according to claim 1 for adjusting the distribution of optic periphery area pressure, it is characterised in that institute
The turning joint (22) stated is the Joint Manipulator of the joint mechanism manually adjusted or computer control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610836440.XA CN106312797B (en) | 2016-09-21 | 2016-09-21 | Adjust the polishing assembly of optic periphery area pressure distribution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610836440.XA CN106312797B (en) | 2016-09-21 | 2016-09-21 | Adjust the polishing assembly of optic periphery area pressure distribution |
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| Publication Number | Publication Date |
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| CN106312797A CN106312797A (en) | 2017-01-11 |
| CN106312797B true CN106312797B (en) | 2019-05-17 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109129105B (en) * | 2018-08-22 | 2020-12-04 | 中国科学院上海光学精密机械研究所 | Floating polishing disk driving mechanism |
| CN112497022B (en) * | 2020-11-28 | 2022-05-17 | 厦门理工学院 | Polishing auxiliary supporting device for edge effect control |
| CN112605789B (en) * | 2020-11-29 | 2022-05-24 | 厦门理工学院 | Track control type polishing mechanism with adjustable gravity center and polishing method |
| CN112621458A (en) * | 2020-11-29 | 2021-04-09 | 厦门理工学院 | Spring type polishing disc mechanism with adjustable gravity center and polishing method |
| CN113043116B (en) * | 2021-04-13 | 2022-03-22 | 东莞市富饶光电有限公司 | Optical lens polishing device and polishing process |
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| CN1192710A (en) * | 1995-06-16 | 1998-09-09 | 普通光学有限公司 | Method and apparatus for optical polishing |
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| DE19651761A1 (en) * | 1996-12-12 | 1998-06-18 | Wacker Siltronic Halbleitermat | Method and device for polishing semiconductor wafers |
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| CN1192710A (en) * | 1995-06-16 | 1998-09-09 | 普通光学有限公司 | Method and apparatus for optical polishing |
| CN2666605Y (en) * | 2003-12-25 | 2004-12-29 | 中国科学院国家天文台南京天文光学技术研究所 | Pressure controller for active pressure polishing optical shell |
| CN201151073Y (en) * | 2007-12-14 | 2008-11-19 | 邱忠杰 | Quasi sphere centre circle swing fine grinding polisher |
| CN201760814U (en) * | 2010-04-21 | 2011-03-16 | 中国人民解放军国防科学技术大学 | Planetary-wheel numerically-controlled grinding and polishing removal-function generating device |
| CN102049716A (en) * | 2010-07-13 | 2011-05-11 | 厦门大学 | Adjustable pressure device used for polishing heavy-calibre plane optical element |
| CN103144004A (en) * | 2013-03-22 | 2013-06-12 | 哈尔滨工业大学 | Edge precision control method of large aperture optical element being processed through air bag polishing |
| CN105290918A (en) * | 2015-09-16 | 2016-02-03 | 西安交通大学 | Handheld multifunctional polishing device with horizontal calibration and pressure measurement and application method |
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| CN106312797A (en) | 2017-01-11 |
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