CN106312066B - A kind of assembled substrate for selective laser fusing increasing material manufacturing - Google Patents
A kind of assembled substrate for selective laser fusing increasing material manufacturing Download PDFInfo
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- CN106312066B CN106312066B CN201610867711.8A CN201610867711A CN106312066B CN 106312066 B CN106312066 B CN 106312066B CN 201610867711 A CN201610867711 A CN 201610867711A CN 106312066 B CN106312066 B CN 106312066B
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- main substrate
- substrate
- forming board
- product
- selective laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/40—Structures for supporting workpieces or articles during manufacture and removed afterwards
- B22F10/47—Structures for supporting workpieces or articles during manufacture and removed afterwards characterised by structural features
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/64—Treatment of workpieces or articles after build-up by thermal means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of assembled substrates melting increasing material manufacturing for selective laser, the assembled substrate includes main substrate and forming board, wherein, main substrate is mounted on as support plate on former, and the forming board for being used for product shaping manufacture is removably mounted in main substrate, this assembled substrate is convenient for removing forming board and product from main substrate.In the fabrication process, real-time finishing processing can be carried out to special constructions such as closing inner flow passages, and without carrying out substrate leveling again, greatly reduces the Operational preparation time, improve production efficiency and reduce processing cost；After the completion of product shaping manufactures, it can will be disassembled from main substrate on each forming board, realize the separation between each product, then according to heat treatment and detection demand, independent process is carried out to each product, therefore the product of different demands can be produced in same stove, improves utilization rate of equipment and installations.
Description
Technical field
It is the present invention relates to selective laser fusing increases material manufacturing technology field, more particularly to a kind of to increase for selective laser fusing
The assembled substrate of material manufacture.
Background technology
Increases material manufacturing technology is melted in selective laser, is based on substrate successively figuration manufacture complex component, is closed in titanium alloy, high temperature
The difficult-to-machine metals such as gold complex-shaped surface mould, type face, thin-walled, non-uniform member entirety manufacture view have unique advantage.
Currently, selective laser fusing increasing material manufacturing is based on monolith substrate successively figuration manufacture component.Using monolith substrate
The complicated metal component of forming cannot achieve the heat treatment of different systems, can not be carried out to different component when single stove produces product
Distinctive tissue and performance detection can not carry out the same stove production of different batches of product, reduce equipment service efficiency.This
Outside, it is both needed to carry out wire cutting and milling/grinding to block of metal substrate after every stove product shaping, processing capacity is big, is processed into
It needs to carry out leveling again, Operational preparation to substrate before this height, substrate utilization is relatively low, and selective laser is melt-processed every time
Time increases, and production efficiency declines.In addition, such as closing inner flow passage special construction product makes part exist due to the constraint of structure
Part is difficult to carry out finishing processing after processing is completed.
Invention content
It is an object of the invention to overcome the prior art, provide a kind of for selective laser fusing increasing material manufacturing
Assembled substrate, which may be implemented that the batch heat of same stove selective laser fusing product, structure property is examined in batches
It surveys, improves the utilization rate of substrate, and the disassembly efficiency of substrate can be effectively improved, reduce process time and cost, and can be
Real-time finishing processing is carried out to special constructions such as closing inner flow passages in manufacturing process.
The above-mentioned purpose of the present invention is realized by following scheme：
A kind of assembled substrate for selective laser fusing increasing material manufacturing, including main substrate and N block forming boards, wherein：
Main substrate is mounted on the melting unit of selective laser and carries out leveling processing, and N block forming boards are mounted on the main base later
Product shaping manufacture is carried out on plate；In the fabrication process, if being checked product or being handled, by corresponding forming board
It dismantles and takes out from main substrate, and after completing product examination or processing, then the forming board is enterprising mounted on main substrate
Row post forming manufactures；After completing product shaping manufacture, N block forming boards are dismantled into taking-up from main substrate；Wherein, N is
Positive integer.
The above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, after the completion of product shaping manufacture, by each forming
Substrate dismantles taking-up from main substrate, then according to the heat treatment of each product setting and structure property detection demand, to corresponding
Forming board and formed product carry out heat treatment and structure property detection.
The above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, when carrying out product separation, using wire cutting
Technique detaches product and forming board, then carries out independent smooth processing to each forming board；It is smooth that treated
Forming board is mounted on main substrate, carries out the figuration manufacture of subsequent product.
The above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, according to the forming cavity of selective laser melting unit
Size determines the book size of main substrate, and the machining tolerance of the main substrate book size is -0.5mm~0mm.
The thickness of the above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, main substrate is 20mm~40mm.
The upper and lower surface of the above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, forming board and main substrate is flat
Face degree is respectively less than or is equal to 0.01mm, and the depth of parallelism between the upper and lower surface of forming board is less than or equal to 0.01mm, main substrate
Upper and lower surface between the depth of parallelism again smaller than or be equal to 0.01mm.
The above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, the uniformly distributed threaded hole on main substrate are used
In installation N block forming boards.
The above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, lays 6 row, 6 row mounting hole on main substrate,
Amount to 36 mounting holes；Wherein：In every row mounting hole, the center separation delta l=L/6 of adjacent mounting hole；It is installed in each column
Kong Zhong, the center separation delta b=B/6 of adjacent mounting hole；L is the length of main substrate, and B is the width of main substrate；Utilize described 36
A mounting hole can install the forming board of three kinds of specifications on main substrate, wherein the forming of three kinds of specifications
The length L ' and width B ' of substrate meet following condition：
The first forming board：L/2<L '≤L, B/2<B’≤B；
Second of forming board：L/3<L '≤L/2, B/3<B’≤B/2；
The third forming board：Δl+d<L '≤L/3, Δ b+d<B’≤B/3；D is that forming board upper surface mounting hole is straight
Diameter.
The above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, countersunk head through-hole is opened up on forming board, is led to
It crosses mounting screw forming board is fixed on main substrate；Wherein, the countersunk head depth of the countersunk head through-hole is 15mm~25mm.
The material of the above-mentioned assembled substrate for selective laser fusing increasing material manufacturing, main substrate is 45 steel or carbon, C
Steel.
Compared with prior art, the present invention haing the following advantages：
(1), assembled substrate of the invention includes main substrate and forming board, wherein main substrate is mounted on as support plate
On former, and the forming board for being used for product shaping manufacture is removably mounted in main substrate, this combination base
Plate is convenient for removing forming board and product from main substrate, therefore can be in the fabrication process to special knots such as closing inner flow passages
Structure carries out real-time finishing processing, and without carrying out substrate leveling again, greatly reduces the Operational preparation time, improve production effect
Rate simultaneously reduces processing cost；
(2), the present invention on forming board carry out product shaping manufacture, after the completion of manufacture can by each forming board from
It disassembles on main substrate, to realize the separation between each product, and according to heat treatment and detection demand, each product is carried out
Independent process, therefore being heat-treated of different systems, distinctive tissue and performance detection may be implemented in the assembled substrate of the present invention,
Realize the same stove production of different batches of product.
(3), the present invention carries out product shaping manufacture on each forming board, and cutting on line detaches product and forming board
Afterwards, it only carries out that milling is gentle polishes processing to the corresponding forming board of each product, avoids the smooth processing of large format of monolith substrate,
Smooth processing capacity and processing cost is greatly decreased, while selecting the book size of forming board according to product largest cross-sectional sized
So that the effective rate of utilization of substrate is largely increased.
Description of the drawings
Fig. 1 a are the assembled substrate mounting structure schematic diagram that the present invention melts increasing material manufacturing for selective laser；
Fig. 1 b are the assembled substrate mounting structure side view that the present invention melts increasing material manufacturing for selective laser.
Specific implementation mode
The present invention is described in further detail with specific example below in conjunction with the accompanying drawings：
The present invention provides a kind of assembled substrates melting increasing material manufacturing for selective laser, for substituting traditional entirety
Substrate convenient for carrying out independent processing to product during figuration manufacture, and can after forming detach each product.
As seen in figure la and lb, the assembled substrate for selective laser fusing increasing material manufacturing of the invention include main substrate and
N block forming boards, the length of main substrate, width, thickness are respectively designated as L, B, H, length, width, the thickness of forming board in figure
Degree is respectively designated as L ', B ', h.Wherein：Main substrate is mounted on the melting unit of selective laser and carries out leveling processing, later by N
Block forming board, which is mounted on the main substrate, carries out product shaping manufacture；In the fabrication process, if necessary to be carried out to product
It checks or handles, then corresponding forming board is dismantled to taking-up from main substrate, and after completing product examination or processing, then will
The forming board, which is mounted on main substrate, carries out post forming manufacture；After completing product shaping manufacture, by N block forming boards
It dismantles and takes out from main substrate；Wherein, N is positive integer.
Traditional monolith substrate is in special constructions such as shaped closure inner flow passages, in order to carry out finishing to structures such as inner flow passages
Processing, needs to remove monolith substrate from former, and will be installed back on former after completing finishing processing, and
It needs to re-start leveling processing to substrate, is thus added significantly to the Operational preparation time.And since all products all exist
Manufacture is formed in same substrate, and therefore, one of product needs individually processing, then needs to remove entire substrate, to
Reduce production efficiency.And the assembled substrate of the present invention is product shaping to be carried out on each forming board, and each forming board can
To dismantle and install from main substrate according to demand, it is suitable for the independent processing of each product, and since main substrate was generating
Journey is not dismantled, therefore need not carry out leveling processing again, is thus greatly reduced the Operational preparation time, is improved life
Produce efficiency.
In addition, traditional monolith substrate cannot carry out product the problem of distinctiveness heat treatment and structure property detection, do not prop up
Hold the product of the figuration manufacture different demands in single stove.And the present invention assembled substrate, can after the completion of product shaping manufactures,
Each forming board is dismantled to taking-up from main substrate, to realize the separation between product, then according to the heat of each product setting
Processing and structure property detection demand carry out heat treatment to corresponding forming board and formed product and structure property detect.Cause
This assembled substrate using the present invention can produce the product of different demands in single stove, to be effectively utilized former
Formingspace, improve the service efficiency of equipment.
Further, since conventional method shapes single product or multiple products on monolith substrate, cutting on line separation production
After product and substrate, in order to ensure the flatness of substrate, need to carry out the entire breadth of monolith substrate that milling is gentle to polish processing.And
The present invention carries out product shaping manufacture on each forming board, in separation process, only to the corresponding forming board of each product into
The smooth processing of row, therefore smooth processing capacity can be greatly reduced, save production time and cost.
In the assembled substrate process of the present invention, it can be determined according to the forming chamber size of selective laser melting unit
The book size of main substrate, machining tolerance are -0.5mm~0mm.Also to ensure that the rigidity and intensity of main substrate, the main base
The thickness of plate is designed as 20mm~40mm.In order to ensure being installed without leveling between forming board and main substrate, need to each base
Plate is limited as follows：The upper and lower surface flatness of forming board and main substrate is respectively less than or is equal to 0.01mm, forming board
The depth of parallelism between upper and lower surface is less than or equal to 0.01mm, the depth of parallelism between the upper and lower surface of main substrate again smaller than or be equal to
0.01mm。
Screw may be used between main substrate and forming board to be fixedly connected and dismantle.In order to enterprising in main substrate
The alternative installation of the multiple forming boards of row, can on main substrate uniformly distributed threaded hole, as multiple forming boards
Preparation mounting hole.The present invention gives the mount schemes of one kind 6 × 6, can support the more of the forming board of three kinds of dimensions
Kind installation requirements, concrete scheme are as follows：
6 row, 6 row mounting hole is laid on main substrate, that is, amounts to 36 mounting holes；Wherein：It is adjacent in every row mounting hole
The center separation delta l=L/6 of mounting hole；In each column mounting hole, the center separation delta b=B/6 of adjacent mounting hole；L is main base
The length of plate, B are the width of main substrate；The forming of three kinds of specifications can be installed using this 36 mounting holes on main substrate
Substrate, wherein the length L ' and width B ' of the forming board of three kinds of specifications meet following condition：
The first forming board：L/2<L’≤ L, B/2<B’≤B；
Second of forming board：L/3<L '≤L/2, B/3<B’≤B/2；
The third forming board：Δl+d<L '≤L/3, Δ b+d<B’≤B/3；D is that forming board upper surface mounting hole is straight
Diameter.
When installing forming board on main substrate, for the ease of the reuse of forming board, opened up on forming board
Forming board is fixed on main substrate by countersunk head through-hole by mounting screw；Wherein, the countersunk head depth of the countersunk head through-hole is 15mm
~25mm can increase its access times as far as possible under conditions of ensureing forming board intensity.
The present invention is defined below to the material and technical conditions of main substrate and forming board：Main substrate uses 45 steel or carbon
Tool steel, designs that its upper and lower surface roughness is Ra0.8~Ra1.6, remaining surface roughness is Ra1.6~Ra3.2；Shape base
Plate uses the material close or consistent with formation of parts, and it is Ra0.8~Ra1.6, remaining surface to design its upper and lower surface roughness
Roughness is Ra1.6~Ra3.2；Modifier treatment is carried out before main substrate and forming board machining, before grinding answer
Power makes annealing treatment.
The above, a specific implementation mode only of the invention, but scope of protection of the present invention is not limited thereto, appoints
What those familiar with the art in the technical scope disclosed by the present invention, the change or replacement that can be readily occurred in, all
It is covered by the protection scope of the present invention.
The content that description in the present invention is not described in detail belongs to the known technology of professional and technical personnel in the field.
Claims (9)
1. a kind of assembled substrate for selective laser fusing increasing material manufacturing, it is characterised in that：Base is shaped including main substrate and N blocks
Plate, wherein：Main substrate is mounted on the melting unit of selective laser and carries out leveling processing, is later mounted on N block forming boards
Product shaping manufacture is carried out on the main substrate；It in the fabrication process, will be corresponding if being checked product or being handled
Forming board dismantles taking-up from main substrate, and after completing product examination or processing, then the forming board is mounted on master
Post forming manufacture is carried out on substrate；After completing product shaping manufacture, N block forming boards are dismantled into taking-up from main substrate；
Wherein, N is positive integer；Wherein, 6 row, 6 row mounting hole is laid on main substrate, that is, amounts to 36 mounting holes；Wherein：Pacify in every row
It fills in hole, the center separation delta l=L/6 of adjacent mounting hole；In each column mounting hole, the center separation delta b=of adjacent mounting hole
B/6；L is the length of main substrate, and B is the width of main substrate；Three kinds can be installed on main substrate using 36 mounting holes
The forming board of specification, wherein the length L ' and width B ' of the forming board of three kinds of specifications meet following item
Part：
The first forming board：L/2<L '≤L, B/2<B’≤B；
Second of forming board：L/3<L '≤L/2, B/3<B’≤B/2；
The third forming board：Δl+d<L '≤L/3, Δ b+d<B’≤B/3；D is that bore dia is installed in forming board upper surface.
2. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to claim 1, it is characterised in that：Production
After the completion of product figuration manufacture, each forming board is dismantled to taking-up from main substrate, then according to each product setting heat treatment and
Structure property detection demand carries out heat treatment to corresponding forming board and formed product and structure property detects.
3. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to claim 1, it is characterised in that：
When carrying out product separation, product and forming board are detached using wire cutting technology, then each forming board is carried out only
Vertical smooth processing；Smooth treated forming board is mounted on main substrate, carries out the figuration manufacture of subsequent product.
4. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to one of claims 1 to 3, feature
It is：The book size of main substrate, and the main substrate breadth ruler are determined according to the forming chamber size of selective laser melting unit
Very little machining tolerance is -0.5mm~0mm.
5. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to one of claims 1 to 3, feature
It is：The thickness of main substrate is 20mm~40mm.
6. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to one of claims 1 to 3, feature
It is：The upper and lower surface flatness of forming board and main substrate is respectively less than or is equal to 0.01mm, and the upper and lower surface of forming board
Between the depth of parallelism be less than or equal to 0.01mm, the depth of parallelism between the upper and lower surface of main substrate again smaller than or be equal to 0.01mm.
7. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to one of claims 1 to 3, feature
It is：The uniformly distributed threaded hole on main substrate, for installing N block forming boards.
8. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to claim 7, it is characterised in that：
Countersunk head through-hole is opened up on forming board, and by mounting screw, forming board is fixed on main substrate；Wherein, the countersunk head is logical
The countersunk head depth in hole is 15mm~25mm.
9. a kind of assembled substrate for selective laser fusing increasing material manufacturing according to one of claims 1 to 3, feature
It is：The material of main substrate is 45 steel or carbon tool steel.
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| CN201610867711.8A CN106312066B (en) | 2016-09-29 | 2016-09-29 | A kind of assembled substrate for selective laser fusing increasing material manufacturing |
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| CN201610867711.8A CN106312066B (en) | 2016-09-29 | 2016-09-29 | A kind of assembled substrate for selective laser fusing increasing material manufacturing |
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| CN106312066B true CN106312066B (en) | 2018-08-31 |
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Cited By (1)
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| CN108161001B (en) * | 2017-12-05 | 2019-11-12 | 北京星航机电装备有限公司 | Melt combined shaping method in selective laser |
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| CN108380876A (en) * | 2018-03-22 | 2018-08-10 | 昆明理工大学 | A kind of combined laser selective melting metal 3D printing substrate |
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| DE102008031925B4 (en) * | 2008-07-08 | 2018-01-18 | Bego Medical Gmbh | Dual manufacturing process for small series products |
| EP3040136B1 (en) * | 2013-08-30 | 2021-04-07 | Asahi Yukizai Corporation | Molding method for laminated mold |
| CN104289712B (en) * | 2014-09-16 | 2016-08-24 | 北京工业大学 | A kind of SLM manufactures heat sink shaping arrangement method and supports adding method |
| CN104552679B (en) * | 2015-01-12 | 2017-01-11 | 北京同方生物芯片技术有限公司 | Preparation method of mold core of mold, mold core of mold and biochip |
| CN205439279U (en) * | 2016-03-15 | 2016-08-10 | 湘潭大学 | Easily peel off device of formed part on vibration material disk stamp pad |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109822093A (en) * | 2018-12-26 | 2019-05-31 | 西安铂力特增材技术股份有限公司 | A kind of device for grafting and engrafting method of SLM device molding die |
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