CN109079138B - Material-adding manufacturing reusable substrate and reusing method - Google Patents
Material-adding manufacturing reusable substrate and reusing method Download PDFInfo
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- CN109079138B CN109079138B CN201811163167.4A CN201811163167A CN109079138B CN 109079138 B CN109079138 B CN 109079138B CN 201811163167 A CN201811163167 A CN 201811163167A CN 109079138 B CN109079138 B CN 109079138B
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- 239000000758 substrate Substances 0.000 title claims abstract description 164
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 28
- 239000000843 powder Substances 0.000 claims abstract description 51
- 238000010146 3D printing Methods 0.000 claims abstract description 42
- 239000000654 additive Substances 0.000 claims abstract description 19
- 230000000996 additive effect Effects 0.000 claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims description 52
- 238000003801 milling Methods 0.000 claims description 21
- 238000000227 grinding Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 8
- 238000004064 recycling Methods 0.000 claims description 5
- 238000003892 spreading Methods 0.000 abstract description 6
- 230000007480 spreading Effects 0.000 abstract description 6
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000005056 compaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004093 laser heating Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000110 selective laser sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
Abstract
The invention discloses a reusable substrate for additive manufacturing, which comprises a substrate powder paved surface and a workbench bonding surface which are parallel to each other, and is characterized in that the workbench bonding surface is provided with at least three bosses, the bosses are provided with countersunk holes, and the countersunk holes are used for fixedly mounting the substrate and a 3D printing workbench. The invention is easier to ensure the form and position tolerance of the substrate, is easier to realize even and compact powder spreading during 3D printing, reduces the processing difficulty coefficient of the substrate and accelerates the use efficiency of the substrate.
Description
Technical Field
The invention relates to the technical field of additive manufacturing, in particular to a reusable substrate for additive manufacturing and a reusable method.
Background
Additive manufacturing techniques (also known as "3D printing") are methods for directly manufacturing three-dimensional physical entities in a layer-by-layer build-up manner based on a computer three-dimensional CAD model. In view of the inherent superiority of additive manufacturing, various types of targeted 3D printing techniques have emerged at present, such as: the three-dimensional printing method comprises the steps of selective laser melting, direct metal melting deposition, selective solidification of photosensitive resin, selective laser sintering, 3D jet printing and the like, wherein a substrate is adopted as a base plate for attaching a 3D printing workpiece. The flatness of the substrate surface and the parallelism of the upper surface and the lower surface of the substrate have a direct influence on the quality of the 3D printing workpiece.
The effect of the geometric tolerance of the substrate on the printed workpiece is described below by taking the current 3D printing technology of selective laser melting, which is widely used in industry.
In the selective laser melting processing process, a layer of metal powder material is paved on the surface of a substrate by a scraper. The laser beam is controlled by a control system to scan the powder in accordance with the profile of the cross section of the workpiece at the layer. The temperature of the powder is raised to the melting point and sintered to form the initial cross-section of the workpiece. Then the 3D printing workbench and the substrate are lowered by the thickness of a powder layer, powder is paved on the upper surface of the section of the formed workpiece through a scraper again, the powder is heated to a certain temperature just lower than the fusion point of the powder, a laser beam is controlled through a control system, scanning is carried out on the powder according to the section outline of the layer, the temperature of the powder is raised to the fusion point for fusion again, and bonding is achieved with the formed part below. After the sintering of the section of the layer is completed, the thickness of the powder paving layer is reduced by the 3D printing workbench together with the substrate, the powder material is paved on the powder material again through the scraper, and sintering of a new section of the layer is performed until the whole workpiece is completed. And after the printing of the workpiece is finished, lifting the whole 3D printing workbench, cleaning off excessive powder, taking the workpiece fused on the substrate off the 3D printing workbench together, and separating the workpiece from the substrate by wire cutting or other process means. The working process can show that the surface leveling condition of the substrate and the 3D printing workbench at the beginning of printing is directly related to the compaction and uniformity condition of the powder spreading layer of the scraper on the surface of the substrate. The flatness of the 3D printing workbench is determined by equipment, equipment manufacturers can adjust the equipment at one time during installation, but the base plates are different, the base plates can be machined at the later stage or manufactured by a workpiece printer, and the base plates are installed on the 3D printing workbench through screws. Therefore, the flatness of the powder spreading surface of the substrate, and the parallelism of the two surfaces between the powder spreading surface of the substrate and the joint surface of the 3D printing workbench have the most direct influence on the compaction and uniformity of the powder spreading layer. And because the substrate is influenced by the high temperature in the preheating and laser sintering processes in the additive manufacturing process, a certain deformation amount is generated on the surface of the substrate after each printing, a workpiece separated from the substrate by line cutting after printing can remain on a workpiece base or support on the powder paving surface of the substrate, and the substrate can be ground again to ensure the surface planeness and the upper surface parallelism of the substrate for achieving the purpose of recycling the substrate.
In the prior art, as shown in fig. 1, after additive manufacturing is completed, the surface of a substrate is milled and ground to enable the flatness of the surface to meet the requirement; and then turning over the paved surface of the substrate to serve as a reference surface, and milling and grinding the joint surface of the 3D printing workbench to achieve the required surface planeness and the required two-surface parallelism. Because the areas of the paved powder surface of the substrate and the two surfaces of the bonding surface of the substrate and the 3D printing workbench are larger (as shown in figure 1), a larger milling cutter or grinding wheel is needed during milling, so that cooling liquid is difficult to be completely sprayed to the cutter point of the milling cutter or the cutting contact position of the grinding wheel and a workpiece during processing, the cutter is cooled insufficiently during cutting, and the processing efficiency is reduced; the abrasion of the cutter during the cutting process of the milling cutter or the grinding wheel also causes the difference of the height of two adjacent position surfaces which are ground back and forth; the larger processing area also causes the increase of the round-trip cutting times of the milling cutter or the grinding wheel, so that the heat of the processed surface of the workpiece is accumulated and deformed; the larger processing area causes the difficult adjustment consistency of the round-trip milling direction, and the difference of the removed material quantity at adjacent positions can be caused.
Therefore, the required plane flatness and the required parallelism of the two sides of the substrate are difficult to achieve in the existing substrate processing mode, and the problem of difficulty in guaranteeing the parallelism of the two sides of the substrate is particularly outstanding. The flatness of the substrate surface and the parallelism of the two surfaces directly influence the uniform compaction condition of powder paving during 3D printing every time. In addition, the processing difficulty of the existing substrate causes overlong processing time and higher economic cost each time, and the service efficiency of the substrate is reduced.
Secondly, in the prior art, after 3D printing is finished, the substrate is directly and manually and freely placed on the wire cutting bench to separate the wire cutting from the substrate. Because the substrate is manually and freely placed on the wire cutting rack, the perpendicularity and parallelism of the substrate and the wire cutting rack are difficult to ensure, and therefore, a workpiece and the substrate are separated by wire cutting each time, a residual workpiece base and a support are artificially left on the paved surface of the substrate, and secondary milling processing of the paved surface of the substrate is caused. Thus, the preparation time from the substrate to the reuse is too long, the working efficiency is reduced, and the processing cost is further increased.
The thickness of the existing substrate is 15mm (shown in figure 1), and the substrate is too thin, so that large deformation is easy to generate under the action of external force such as repeated sand blasting or laser heating.
Disclosure of Invention
The invention provides a reusable substrate for additive manufacturing, which comprises a substrate powder paving surface and a workbench bonding surface which are parallel to each other, and is characterized in that the workbench bonding surface is provided with at least three bosses, the substrate is provided with countersunk holes, and the countersunk holes are used for fixedly mounting the substrate and a 3D printing workbench.
Further, the counter bore is located on the boss.
Preferably, the number of the bosses is four, and the bosses are respectively arranged at four right angles of the joint surface of the workbench.
Further, the thickness of the substrate is increased by 50% to 100% relative to a conventional substrate.
Preferably, the thickness of the substrate is increased by 60% to 80% relative to a conventional substrate.
Preferably, the thickness of the conventional substrate is generally 10-20mm, and the thickness of the substrate (including the boss) of the present invention is 15-40mm, and more preferably 16-36mm.
A reuse method based on additive manufacturing reuse substrate, characterized by comprising the steps of:
step 1, after additive manufacturing is completed, a substrate and a workpiece are separated through cutting to obtain a paved powder surface, so that the planeness of the surface meets the requirement;
Step 2, turning over the paved powder surface of the substrate to serve as a reference surface, and flattening the surface of a boss attached to the 3D printing workbench to achieve the required surface flatness and the parallelism of the two surfaces;
Step 3, attaching the surface of the boss after processing to the surface of a 3D printing workbench of 3D printing equipment, and fastening the substrate on the 3D printing workbench by using a fastener;
and 4, paving the material powder on the powder paving surface of the substrate, so that the powder paving is even and compact during 3D printing, and the quality of a 3D printing workpiece is better ensured.
Further, the cutting mode in the step 1 may be a conventional cutting mode such as laser cutting and wire cutting.
Further, it is preferable to wire-cut using a fixed substrate wire-cutting tool.
Specifically, the fixed substrate wire cutting tool in the step 1 comprises a substrate bonding fixing surface and a fixing mechanism, wherein the substrate bonding fixing surface is bonded with a substrate, and the fixing mechanism is used for bonding the substrate bonding fixing surface with the surface of a substrate boss.
Specifically, the fixing mechanism comprises a fixing screw hole, a fixing spoke and a locking bolt, and the fixing spoke and the wire cutting bench are connected into a whole through the locking bolt.
Further, the planarization treatment in the step 2 may be performed by milling and/or grinding.
Specifically, the specific method for separating the substrate and the workpiece by wire cutting in the step 1 to obtain the paved powder surface so that the surface flatness meets the requirement comprises the following steps: the boss surface of the substrate is fixed on the attaching and fixing surface of the substrate, the flatness and perpendicularity of the substrate and the wire cutting bench are controlled to be within a tolerance range of 0.05 mm by using a dial indicator correction straightening plane method, so that the powder-paved surface of the wire cutting wire attached substrate directly cuts and separates a workpiece and the substrate, and the plane tolerance of the powder paved on the obtained substrate is within 0.05 mm.
As the boss (shown in figure 4) with a certain height is manufactured on the substrate, compared with the bonding surface (shown in figure 1) of the prior substrate, the area is greatly reduced, so that the whole surface of the boss is easier to realize the surface flatness. Because the reduction of the whole surface of the boss (shown in figure 4) compared with the prior substrate joint surface (shown in figure 1) is also the reduction of the whole processing area, a milling cutter or a grinding wheel which is smaller than the prior art can be adopted in processing, and the cooling liquid can be easily sprayed to the cutting contact position of the milling cutter tip or the grinding wheel and the workpiece, so that the loss of the cutter in cutting is greatly reduced, and the processing efficiency is improved. The cutter abrasion of the milling cutter or the grinding wheel is reduced in the cutting process, and the consistency of the height of two adjacent position surfaces of the back and forth milling is also facilitated. The reduction of the whole processing area is also beneficial to the reduction of the times of back and forth milling of the milling cutter or the grinding wheel, and can effectively reduce the accumulated heat deformation of the processed surface of the workpiece. The whole processing area is reduced, the round-trip milling direction is easier to adjust, the consistency of the material removing direction of the surface of the workpiece is ensured, and the material removing amount of round-trip adjacent positions is kept the same.
The boss of the present invention (as in fig. 4) is easier to achieve surface planarity.
According to the substrate wire cutting fixture (shown in fig. 6), the flatness and the perpendicularity of the substrate and the wire cutting bench can be controlled within a tolerance range through the surface marking by fixing the boss surface of the substrate on the bonding and fixing surface of the substrate. Therefore, the wire cutting wire can be directly cut and separated from the workpiece and the substrate by being attached to the paved surface of the substrate, and the planar tolerance of the paved surface of the obtained substrate is within the required range. Compared with the existing method without using tools to directly cut the wire, the method can directly ensure the accuracy of the wire cutting plane. By using the substrate wire cutting fixture, the substrate powder surface subjected to wire cutting can not be artificially remained on the workpiece base and supported, so that the substrate powder surface subjected to wire cutting directly meets the reuse standard. Compared with the prior art, the method reduces the residual base and supporting links of the paved powder surface milling and grinding workpiece, shortens the preparation time for reusing the substrate, improves the working efficiency and reduces the processing and manufacturing cost.
After the substrate powder-paved surface of the invention is wire-cut by the invention fixed substrate wire-cutting tool (as shown in figure 6), four small areas of the surface of the boss are machined by taking the substrate powder-paved surface as a reference surface. Due to the fact that the flatness of the boss (shown in fig. 4) is easy to achieve, the parallelism between the paved surface of the substrate and the boss surface is easy to achieve, and the milling and grinding amount is very small, and the processing time is very short.
The parallelism between the powder-covered surface and the boss surface of the substrate is easier to realize than that of the substrate used in the prior art, such as the parallelism between the powder-covered surface and the bonding surface of the substrate shown in fig. 1.
The invention is easier to ensure the form and position tolerance of the substrate, is easier to realize uniform compaction of powder spreading during 3D printing, reduces the processing difficulty coefficient of the substrate, and accelerates the use efficiency of the substrate. The overall thickness h2 (shown in fig. 5) of the substrate is larger than the overall thickness h1 (shown in fig. 2) of the substrate used at present, so that the deformation of the substrate used at present under the conditions of repeated sand blasting external force action and laser heating is smaller, the material removal required during wire cutting, milling and grinding is less, the use times of the substrate used at present is more, and better economic benefit is realized.
Drawings
FIG. 1 is a schematic diagram of a prior art substrate structure;
FIG. 2 is a sectional view in the A-A direction of FIG. 1
FIG. 3 is a schematic illustration of an additive manufacturing reusable substrate structure in accordance with the present invention;
FIG. 4 is a view in the direction B of FIG. 3;
FIG. 5 is a cross-sectional view taken in the direction a-a of FIG. 3;
FIG. 6 is a practical state diagram of the wire cutting tool for the fixed substrate of the invention;
wherein: 1_prior art substrate; 1-01_ prior art substrate is powder faced; 1-02_working table bonding surface; 2-a substrate of the present invention; 2-01_the substrate is paved with powder; 2-02_counter bore; 2-03_boss; 3-fixing a substrate wire cutting tool; 3-01_is attached to the substrate; 3-02_fixing screw holes; 3-03_fixed spokes; 3-04_ locking bolt; 4-line cutting rack.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Embodiment one:
the utility model provides an increase material makes repeatedly usable base plate, includes the base plate that is parallel to each other by shop's face and workstation binding face, the workstation binding face sets up three boss, be provided with the counter bore on the boss.
The thickness of the substrate is increased by 50% -100%, and the thickness of the embodiment is increased by 100%.
Embodiment two:
Referring to fig. 2-5, compared with the first embodiment, the difference of the additive manufacturing reusable substrate is that the number of the bosses is four, and the bosses are respectively arranged at four right angles of the joint surface of the workbench; the thickness of the substrate was increased by 80%. The remainder is the same as in the first embodiment. Another embodiment provides a 60% increase in thickness of the substrate.
Embodiment III:
Compared with the first embodiment, the reusable substrate for additive manufacturing is different in that five bosses are respectively arranged at four right angles and the center of the joint surface of the workbench; the thickness of the substrate is increased by 50%. The remainder is the same as in the first embodiment.
Embodiment four:
referring to fig. 6, a recycling method of an additive manufacturing recycling substrate according to a second embodiment includes the steps of:
Step 1, after additive manufacturing is completed, separating a substrate and a workpiece by using a fixed substrate wire cutting tool to obtain a paved powder surface, so that the planeness of the surface meets the requirement; the fixed substrate wire cutting tool comprises a substrate bonding fixing surface and a fixing mechanism, wherein the substrate bonding fixing surface is bonded with a substrate, and the fixing mechanism is used for bonding the substrate bonding fixing surface with the surface of a substrate boss. The fixing mechanism comprises a fixing screw hole, a fixing spoke and a locking bolt, and the fixing spoke is connected with the wire cutting bench (shown in figure 6) into a whole through the locking bolt;
The specific method for separating the substrate and the workpiece by wire cutting to obtain the paved powder surface so that the surface flatness reaches the requirement comprises the following steps: the boss surface of the substrate is fixed on the attaching and fixing surface of the substrate, the flatness and perpendicularity of the substrate and the wire cutting table frame are controlled to be within the tolerance range by using a dial indicator correction straightening plane method, the embodiment is within the tolerance range of 0.05 mm, the paved powder surface of the wire cutting wire attached to the substrate is used for directly cutting and separating the workpiece and the substrate, and the obtained planar tolerance of the paved powder of the substrate is within the required tolerance range, and the embodiment is within 0.05 mm.
Step 2, turning over the paved powder surface of the substrate to serve as a reference surface, and only milling and grinding the surface of a boss attached to the 3D printing workbench to achieve the required surface planeness and the required two-surface parallelism;
and 3, attaching the surface of the boss after processing to the surface of a 3D printing workbench of 3D printing equipment, fastening the substrate on the 3D printing workbench by using a fastener, and locking the countersunk screw on the 3D printing workbench through a countersunk (screw) hole in the embodiment.
And 4, paving the material powder on the powder paving surface of the substrate, so that the powder paving is even and compact during 3D printing, and the quality of a 3D printing workpiece is better ensured.
Claims (5)
1. The repeated use method of the material adding manufacturing repeated use substrate comprises a substrate powder paving surface and a workbench bonding surface which are parallel to each other, and is characterized in that the workbench bonding surface is provided with at least three bosses, the substrate is provided with countersunk holes, and the countersunk holes are used for fixedly mounting the substrate and a 3D printing workbench, and the repeated use method is characterized by comprising the following steps:
step 1, after additive manufacturing is completed, a substrate and a workpiece are separated through cutting to obtain a paved powder surface, so that the planeness of the surface meets the requirement;
Step 2, turning over the paved powder surface of the substrate to serve as a reference surface, and flattening the surface of a boss attached to the 3D printing workbench to achieve the required surface flatness and the parallelism of the two surfaces;
Step 3, attaching the surface of the boss after processing to the surface of a 3D printing workbench of 3D printing equipment, and fastening the substrate on the 3D printing workbench by using a fastener;
and 4, paving the material powder on the powder paving surface of the substrate, so that the powder paving is even and compact during 3D printing, and the quality of a 3D printing workpiece is better ensured.
2. The method of claim 1, wherein the cutting in step 1 is wire cutting using a fixed substrate wire cutting tool .
3. The method for recycling the substrate for additive manufacturing according to claim 2, wherein the wire cutting fixture for fixing the substrate in the step 1 comprises a substrate attaching fixing surface attached to the substrate and a fixing mechanism, wherein the fixing mechanism is used for attaching the substrate attaching fixing surface to the surface of the substrate boss, and comprises fixing screw holes, fixing spokes and locking bolts, and the fixing spokes are integrally connected with the wire cutting bench through the locking bolts.
4. An additive manufacturing reusable substrate reuse method according to claim 1, characterized in that said planarization treatment in step2 is performed by milling and/or grinding.
5. The method for recycling the substrate for additive manufacturing according to claim 1, wherein the specific method for separating the substrate and the workpiece by wire cutting in the step 1 to obtain the paved powder surface so that the surface flatness meets the requirement comprises the following steps: the boss surface of the substrate is fixed on the attaching and fixing surface of the substrate, the flatness and perpendicularity of the substrate and the wire cutting bench are controlled to be within the tolerance range by using a dial indicator correction straightening plane method, so that the paved surface of the wire cutting wire attached to the substrate is directly cut and separated from the workpiece and the substrate, and the obtained planar tolerance of the paved surface of the substrate is within the tolerance range.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811163167.4A CN109079138B (en) | 2018-09-30 | 2018-09-30 | Material-adding manufacturing reusable substrate and reusing method |
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| CN201811163167.4A CN109079138B (en) | 2018-09-30 | 2018-09-30 | Material-adding manufacturing reusable substrate and reusing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109794837B (en) * | 2019-03-19 | 2023-07-21 | 陕西科技大学 | Polishing machine special for metal 3D printing substrate |
| CN110732669B (en) * | 2019-10-29 | 2022-01-14 | 长沙新材料产业研究院有限公司 | Supplementary lift platform that prints of vibration material disk |
| CN112475292A (en) * | 2020-10-25 | 2021-03-12 | 北京工业大学 | Universal linear cutting clamp for selective laser melting forming part |
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| GB2500412A (en) * | 2012-03-21 | 2013-09-25 | Eads Uk Ltd | Build Plate for an additive manufacturing process |
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| CN109079138A (en) | 2018-12-25 |
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