CN111775072A - Diamond roller machining process for special-shaped grinding surface - Google Patents
Diamond roller machining process for special-shaped grinding surface Download PDFInfo
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- CN111775072A CN111775072A CN202010515807.4A CN202010515807A CN111775072A CN 111775072 A CN111775072 A CN 111775072A CN 202010515807 A CN202010515807 A CN 202010515807A CN 111775072 A CN111775072 A CN 111775072A
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- diamond
- female die
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
Abstract
The invention relates to the field of diamond roller machining, and discloses a diamond roller machining process for a special-shaped grinding surface. The method comprises the following processing steps: step one; turning the inner cavity of the female die to obtain a female die cavity surface; step two; diamond particles are adhered to the cavity surface of the negative model; step three; a conversion process of the diamond particles; step four; trimming the diamond roller; step five; and (5) detecting the precision of the diamond particles. The invention can be suitable for processing and manufacturing diamond rollers with various grinding surfaces of different shapes, mask plates with array holes of different patterns can be flexibly selected according to actual processing requirements, and the mask plates are matched with the solid photosensitive film, so that the implantation efficiency of diamond particles is improved, the position precision is also improved, the application range is widened, the arrangement precision and the arrangement efficiency of the diamond particles are enhanced, the processing quality of the diamond rollers is improved, and the service life of the diamond rollers is prolonged.
Description
Technical Field
The invention relates to the field of diamond roller machining, in particular to a diamond roller machining process for a special-shaped grinding surface.
Background
Grinding is a main machining method for achieving machining requirements of mechanical parts with complex surfaces on high precision, high efficiency and low cost in the industries of aerospace, automobiles, precision equipment and the like at present. In order to enable the grinding wheel to have a correct working surface during grinding, the dressing of the grinding wheel is an indispensable link, and meanwhile, the quality of the dressing effect of the grinding wheel is also the key for ensuring the processing quality of parts. Diamond rollers, which are precision dressing tools containing a high technological content, are commonly used for dressing them, the level of which represents the highest technical level in the abrasive industry. The existing diamond roller machining usually adopts an electroplating mode to consolidate diamond particles on a female die, the diamond particles are randomly and irregularly distributed, the effective diamond particles only account for a small part of the total diamond particles, a large number of redundant particles not only increase the manufacturing cost, but also seriously interfere the normal work of the effective diamond particles, and the diamond rollers with different grinding surfaces are machined and manufactured according to the requirements, so that the machining efficiency of the diamond rollers is reduced.
Disclosure of Invention
In order to solve the technical problems, the invention provides a diamond roller processing technology of a special-shaped grinding surface, which aims to effectively arrange diamond particles on diamond rollers with grinding surfaces of different shapes, improve the processing efficiency and the processing quality of the diamond rollers, and the distribution of the diamond particles has various arrangement modes according to the processing and manufacturing requirements, has simple processing process and low cost, and improves the precision requirement of the diamond particles.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a diamond roller processing technique of a special-shaped grinding surface comprises the following processing steps;
the method comprises the following steps: turning the inner cavity of the female die to obtain a female die cavity surface;
step two: adhering a mask plate with display holes arranged in a preset direction to the cavity surface of the female die; the aperture of the display hole is larger than the particle size of a single diamond particle and smaller than two times of the particle size of the diamond particle, the diamond particles are solidified in the display hole in an electroplating mode to form an electroplating processing layer, and the first processing body is obtained after the mask plate is removed;
step three: placing the first processing body and the mandrel to be processed into a casting mold, filling a low-melting-point alloy into a gap between the first processing body and the mandrel to be processed so as to enable the electroplated processing layer and the diamond particles to be attached to the mandrel to be processed, and removing the female mold to obtain a second processing body;
step four: grinding an inner hole of the mandrel to be machined to be consistent with the axis of the outer peripheral surface by taking the outer peripheral surface of the diamond particles on the surface of the second machining body as a reference, and finishing the diamond particles on the surface of the second machining body to obtain a finished diamond roller;
step five: and (3) adopting laser power spectrum detection, irradiating laser to the surface of the diamond roller finished product to present a laser power spectrum image reflecting the linear characteristics of diamond particles, and obtaining the surface precision condition of the diamond roller through multiple measurements.
As a preferred scheme of the present invention, in the second step, the mask plate is made of a photoresist material, the solid photosensitive film is adhered to the cavity surface of the negative mold, the negative mold adhered with the mask plate is placed on a workbench of a lithography machine, and development is performed to obtain the array holes.
In a preferred embodiment of the present invention, in the second step, the female mold is vibrated at an amplitude of 2 to 3mm and a vibration frequency of 9 to 10HZ during electroplating to drop diamond particles into the array holes; the thickness of the mask plate is 70-90 μm, so that the diamond particles effectively fall into the array holes when vibrating, and the implantation efficiency of the diamond particles is improved.
As a preferable mode of the present invention, in the second step, after the electroplating is completed, the electroplating treatment is repeatedly performed on the cavity surface of the female die for 2 to 5 times to thicken the electroplated layer to 2 to 3mm, so that the diamond particles are prevented from falling off, and the electroplated layer with high strength and rigidity is obtained.
In a preferable embodiment of the present invention, in the third step, the low melting point alloy is selected as a solder material having a melting point of 198 ℃, so as to reduce an influence on the precision of the diamond roller.
In a preferred embodiment of the present invention, in the third step, when the female die is removed, the shell of the turning female die is slowly fed at a low speed on a lathe with a distance of 0.4 to 0.5mm left, and then ground to expose the tooth tip by using a cylindrical grinder, a groove is turned on the lathe by using a forming cutter, and finally the remaining female die material is ground by using a forming grinding wheel to expose the diamond particle surface.
As a preferable scheme of the invention, in the fourth step, when the inner hole of the mandrel to be processed is processed, the second processing body is placed on an inner circle grinding machine and aligned, then the inner hole is ground with a grinding amount of 0.04-0.06mm, the taper of the ground inner hole is within 0.002mm, and the fit clearance with the mandrel to be processed is 0.001-0.002 mm.
In a preferred embodiment of the present invention, in the fourth step, diamond particles are dressed by an electric discharge dressing method, the second workpiece is mounted on a lathe which is operated at a high speed, the second workpiece is connected to a positive electrode, a tool electrode of an electric discharge machine is connected to a negative electrode, a coolant is sprayed between the second workpiece and the tool electrode, and a voltage is applied to remove the electroplated layer, thereby developing the diamond particles.
In a preferred embodiment of the present invention, in the second step, natural diamond with a particle size of 48 μm to 120 μm is used as the diamond particles, and the natural diamond has the characteristics of high melting point, high thermal conductivity, small specific heat, small thermal expansion coefficient, good chemical stability and high electrical resistivity.
In conclusion, the invention has the following beneficial effects: the invention can be suitable for processing and manufacturing diamond rollers with various grinding surfaces of different shapes, mask plates with array holes of different patterns can be flexibly selected according to actual processing requirements, and the mask plates are matched with the solid photosensitive film, so that the implantation efficiency of diamond particles is improved, the position precision is also improved, the application range is widened, the arrangement precision and the arrangement efficiency of the diamond particles are enhanced, the processing quality of the diamond rollers is improved, and the service life of the diamond rollers is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart of the processing technique of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in figure 1, the invention provides a diamond roller processing technology of a special-shaped grinding surface, which comprises the following processing steps:
the method comprises the following steps: and turning the inner cavity of the female die to obtain the cavity surface of the female die.
In the first step, the female mold should be made of a material having the advantages of high mechanical strength, high deformation resistance, easy processing, good economy and the like, such as graphite, 46# steel or aluminum alloy. The graphite has good conductivity, high density, large mechanical strength, good plasticity, good comprehensive performance and no damage when the temperature is changed violently; the 45# steel has high mechanical strength after heat treatment, but has poor workability; the aluminum alloy has low density, good conductivity and easy processing and forming, but has poor deformation resistance under heating stress and poor stability; high purity graphite is preferred for use in the present invention. When the inner cavity of the female die is machined, the forming sample plate cutter is adopted for turning, so that the cavity surface of the female die has higher profile precision, and the machining requirement of a diamond roller for machining a complex grinding surface can be met.
Step two: the mask plate with the display holes arranged in the preset direction is adhered to the surface of the cavity of the female die, wherein the aperture of the display holes is larger than the particle size of a single diamond particle and smaller than twice the particle size of the diamond particle, so that only one diamond particle is ensured to enter the array hole, the diamond particle is solidified in the display holes in an electroplating mode to form an electroplating processing layer, and a first processing body is obtained after the mask plate is removed.
In the second step, the manufacturing process of the mask specifically comprises the following steps: a mask plate with diamond particles regularly arranged is designed through three-dimensional software, when the mask plate is adhered, according to the performance, the process and other conditions of comprehensive materials, a solid photosensitive film is selected, the solid photosensitive film is lightly adhered to the cavity surface of a dry and preheated female mold, fingers are tightly pressed to be tightly attached to the cavity surface of the female mold, after the mask plate and the mask plate are cooled for a period of time, the female mold with the adhered film, the mask plate and matched transparent glass are sequentially placed on a workbench of a photoetching machine, the solid photosensitive film is exposed through ultraviolet rays, after the exposure is finished, the solid photosensitive film is immediately developed, holes in the mask plate are exposed through a developer of 1% of anhydrous and sodium carbonate solution at the temperature of 20-30 ℃, array holes are obtained after photoetching, and after the development is finished, the solid photosensitive film is trimmed through scissors.
During the electroplating process, the female die is vibrated at the vibration frequency of 9-10HZ and the amplitude of 2-3mm, so that diamond particles fall into the array holes, and one diamond particle is embedded into each array hole. The thickness of the mask plate is 70-90 μm, so that the diamond particles effectively fall into the array holes when vibrating, and the implantation efficiency of the diamond particles is improved.
After the electroplating is finished, the electroplating treatment is repeatedly carried out for 2-5 times on the cavity surface of the female die so as to thicken the electroplating processing layer to 2-3mm, thereby preventing the diamond particles from falling off and obtaining the electroplating processing layer with high strength and rigidity.
The mask plate is made of photoresist materials, and the photoresist is high in precision, large in thickness, good in adhesion capacity, easy to remove, simple to operate and low in cost. The diamond particles are natural diamond with the particle size of 48-120 mu m, and have the characteristics of high melting point, high thermal conductivity, small specific heat, small thermal property of expansion coefficient, good chemical stability and high resistivity.
Step three: and placing the first processed body and the mandrel to be processed into a casting mold, filling low-melting-point alloy into a gap between the first processed body and the mandrel to be processed so as to enable the electroplated processing layer and the diamond particles to be attached to the mandrel to be processed, and removing the female mold to obtain a second processed body.
In the third step, when the female die is removed, the shell of the female die is turned on a lathe by low-speed slow feeding and is left with a distance of 0.4-0.5mm, then the shell is ground to expose the tooth end by a cylindrical grinder, a groove is turned on the lathe by a forming cutter, the cutter is not in contact with the electroplating processing layer, and finally the rest female die material is ground by the forming grinding wheel to expose the diamond particle surface.
Wherein, the low melting point alloy is selected as a soldering tin material with a melting point of 198 ℃, thereby reducing the influence on the precision of the diamond roller.
Step four: and grinding the inner hole of the mandrel to be processed to be consistent with the axis of the outer peripheral surface by taking the outer peripheral surface of the diamond particles on the surface of the second processing body as a reference, and finishing the diamond particles on the surface of the second processing body to obtain a finished diamond roller.
In the fourth step, when the inner hole of the mandrel to be processed is processed, the second processing body is placed on an inner circle grinding machine for alignment, then the inner hole is ground with the grinding amount of 0.04-0.06mm, the taper of the ground inner hole is within 0.002mm, and the fit clearance with the mandrel to be processed is 0.001-0.002 mm.
And trimming the diamond particles by an electric spark trimming method, mounting a second processing body on a lathe which runs at a high speed, connecting the second processing body with a positive electrode, connecting a tool electrode of an electric spark machine with a negative electrode, spraying cooling liquid between the second processing body and the tool electrode, pressurizing the cooling liquid, removing an electroplating processing layer, and displaying the diamond particles.
Step five: and (3) adopting laser power spectrum detection, irradiating laser to the surface of the diamond roller finished product to present a laser power spectrum image reflecting the linear characteristics of diamond particles, and obtaining the surface precision condition of the diamond roller through multiple measurements.
Through the specific embodiment, the beneficial effects of the invention are as follows: the invention can be suitable for processing and manufacturing diamond rollers with various grinding surfaces of different shapes, mask plates with array holes of different patterns can be flexibly selected according to actual processing requirements, and the mask plates are matched with the solid photosensitive film, so that the implantation efficiency of diamond particles is improved, the position precision is also improved, the application range is widened, the arrangement precision and the arrangement efficiency of the diamond particles are enhanced, the processing quality of the diamond rollers is improved, and the service life of the diamond rollers is prolonged.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A diamond roller processing technology of a special-shaped grinding surface is characterized by comprising the following processing steps;
the method comprises the following steps: turning the inner cavity of the female die to obtain a female die cavity surface;
step two: adhering a mask plate with display holes arranged in a preset direction to the cavity surface of the female die; the aperture of the display hole is larger than the particle size of a single diamond particle and smaller than two times of the particle size of the diamond particle, the diamond particles are solidified in the display hole in an electroplating mode to form an electroplating processing layer, and the first processing body is obtained after the mask plate is removed;
step three: placing the first processing body and the mandrel to be processed into a casting mold, filling a low-melting-point alloy into a gap between the first processing body and the mandrel to be processed so as to enable the electroplated processing layer and the diamond particles to be attached to the mandrel to be processed, and removing the female mold to obtain a second processing body;
step four: grinding an inner hole of the mandrel to be machined to be consistent with the axis of the outer peripheral surface by taking the outer peripheral surface of the diamond particles on the surface of the second machining body as a reference, and finishing the diamond particles on the surface of the second machining body to obtain a finished diamond roller;
step five: and (3) adopting laser power spectrum detection, irradiating laser to the surface of the diamond roller finished product to present a laser power spectrum image reflecting the linear characteristics of diamond particles, and obtaining the surface precision condition of the diamond roller through multiple measurements.
2. The diamond roller machining process for the special-shaped grinding surface according to claim 1, wherein in the second step, the mask plate is made of photoresist materials, the mask plate is adhered to the cavity surface of the female die through a solid photosensitive film, the female die adhered with the mask plate is placed on a workbench of a photoetching machine for development, and the array holes are obtained.
3. The diamond roller machining process of the special-shaped grinding surface according to claim 1, wherein in the second step, the female die is vibrated with the amplitude of 2-3mm and the vibration frequency of 9-10Hz during electroplating, so that diamond particles fall into the array holes; the thickness of the mask plate is 70-90 μm.
4. The diamond roller machining process of the special-shaped grinding surface according to claim 1, wherein in the second step, after electroplating is completed, electroplating treatment is repeatedly carried out on the cavity surface of the female die for 2-5 times so as to thicken the electroplating machining layer to 2-3 mm.
5. The diamond roller machining process of the special-shaped grinding surface as claimed in claim 1, wherein in the third step, the low-melting-point alloy is selected from a soldering tin material with a melting point of 198 ℃.
6. A diamond roller machining process for a special-shaped grinding surface according to claim 1, wherein in the third step, when the female die is removed, the shell of the female die is turned on a lathe at a low speed and slowly feeding speed, 0.4-0.5mm is left, then the shell is ground to expose the tooth end by a cylindrical grinding machine, a groove is turned on the lathe by a forming cutter, and finally the residual female die material is ground by a forming grinding wheel to expose the diamond particle surface.
7. The diamond roller machining process of the special-shaped grinding surface according to claim 1, wherein in the fourth step, when the inner hole of the mandrel to be machined is machined, the second machining body is placed on an internal grinding machine and aligned, then the inner hole is ground with a grinding amount of 0.04-0.06mm, the taper of the ground inner hole is within 0.002mm, and the fit clearance between the second machining body and the mandrel to be machined is 0.001-0.002 mm.
8. The diamond roller machining process of a special-shaped grinding surface according to claim 1, wherein in the fourth step, diamond particles are dressed by an electric spark dressing method, the second machined body is mounted on a lathe which runs at a high speed, the second machined body is connected with a positive electrode, a tool electrode of an electric spark machine is connected with a negative electrode, cooling liquid is sprayed between the second machined body and the tool electrode, voltage is applied, the electroplated layer is removed, and the diamond particles are revealed.
9. The diamond roller processing technology of the special-shaped grinding surface as claimed in claim 1, wherein in the second step, the diamond particles adopt natural diamond with the particle size of 48-120 μm.
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| CN202010515807.4A CN111775072B (en) | 2020-06-09 | 2020-06-09 | Diamond roller machining process for special-shaped grinding surface |
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| CN202010515807.4A CN111775072B (en) | 2020-06-09 | 2020-06-09 | Diamond roller machining process for special-shaped grinding surface |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112677045A (en) * | 2020-12-10 | 2021-04-20 | 郑州磨料磨具磨削研究所有限公司 | Diamond roller, preparation device and preparation method |
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
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| JP2018086690A (en) * | 2016-11-28 | 2018-06-07 | 株式会社荏原製作所 | Polishing film, polishing method, and method of manufacturing polishing film |
| CN108527182A (en) * | 2018-05-10 | 2018-09-14 | 上海交通大学 | The method that the diamond abrasive tool of abrasive grain ordered arrangement is prepared using mask plate |
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| CN101653928A (en) * | 2008-08-19 | 2010-02-24 | 苏新页 | Stickiness transfer method for diamond order distribution and stickiness transfer tape |
| CN102458771A (en) * | 2009-04-17 | 2012-05-16 | 3M创新有限公司 | Planar abrasive articles made using transfer articles and method of making the same |
| JP2018086690A (en) * | 2016-11-28 | 2018-06-07 | 株式会社荏原製作所 | Polishing film, polishing method, and method of manufacturing polishing film |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112677045A (en) * | 2020-12-10 | 2021-04-20 | 郑州磨料磨具磨削研究所有限公司 | Diamond roller, preparation device and preparation method |
| CN112677045B (en) * | 2020-12-10 | 2022-02-22 | 郑州磨料磨具磨削研究所有限公司 | Diamond roller, preparation device and preparation method |
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115026730B (en) * | 2022-07-11 | 2024-03-01 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
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