CN110405208A - A kind of primary-secondary type substrate suitable for selective laser fusing - Google Patents
A kind of primary-secondary type substrate suitable for selective laser fusing Download PDFInfo
- Publication number
- CN110405208A CN110405208A CN201910768955.4A CN201910768955A CN110405208A CN 110405208 A CN110405208 A CN 110405208A CN 201910768955 A CN201910768955 A CN 201910768955A CN 110405208 A CN110405208 A CN 110405208A
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- China
- Prior art keywords
- submount
- selective laser
- primary
- secondary type
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/10—Auxiliary heating means
- B22F12/17—Auxiliary heating means to heat the build chamber or platform
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/38—Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a kind of primary-secondary type substrates suitable for selective laser fusing, including one piece of mother substrate and one piece of submount, the mother substrate to be mounted on the melting unit of selective laser and level, and the submount are mounted on the top of mother substrate, and level with mother substrate；It is directly printed on submount when the fusing forming of selective laser, after the completion of printing, part by submount and thereon is removed from mother substrate together.The present invention can reduce submount heat loss in SLM forming process, improve subbase plate temperature, reduce the temperature gradient between submount and drip molding, reduce SLM and shape the forming defects such as warpage, crackle, hole during above-mentioned metal parts；In addition, the present invention can also realize the temperature isolation of mother substrate and submount, to avoid the electronic component that mother substrate temperature is excessively high, damage is connected.
Description
Technical field
The invention belongs to 3D printing technique fields, are related to selective laser melting unit, and in particular to one kind is suitable for swashing
The primary-secondary type substrate of light selective melting.
Background technique
Selective laser fusing (SLM) is a kind of important 3D printing technique, in recent years by the wide of academia and industrial circle
General concern.SLM technology can not only shape various parts with complex structures, to greatly improve the design spirit of product in industrial production
Activity, and the parts size precision shaped is high, and performance is good.With the development of laser technology and galvanometer control technology, SLM at present
The technique of the common metals such as direct forming Fe base, Ti base, Ni base and its alloy is very mature, passes through SLM equipment preparation
Related components are widely used to the related fieldss such as aerospace, automobile manufacture, biologic medical.
However, for Cu, Al, Ag, Au etc. have high laser reflectivity and high heat conductance common metal and W, Ta, Mo,
Nb etc. has dystectic refractory metal, and when SLM direct forming, laser heat accumulation is insufficient for being completely melt metal.This
Outside, since there are higher temperature gradients between substrate and part, leading to SLM inside parts, there are higher residual stress.Compared with
The metal inside that high residual stress can cause W etc. to have black brittleness generates a large amount of micro-cracks and relaxed stress.
Summary of the invention
For the above-mentioned problems in the prior art and defect, it is suitable for selective laser the present invention provides one kind and melts
Primary-secondary type substrate, encountered when its object is to overcome current SLM equipment direct forming high-melting-point and high heat conductivity metal
It is difficult.The primary-secondary type substrate can reduce submount heat loss in SLM forming process, improve subbase plate temperature, reduce son
Temperature gradient between substrate and drip molding, reduce SLM shape warpage, crackle, hole during above-mentioned metal parts etc. at
Shape defect；In addition, the primary-secondary type substrate can also realize the temperature isolation of mother substrate and submount, to avoid mother substrate temperature
Electronic component excessively high, damage is connected.
For this purpose, the invention adopts the following technical scheme:
A kind of primary-secondary type substrate suitable for selective laser fusing, including one piece of mother substrate and one piece of submount, the mother
Substrate is mounted on the melting unit of selective laser and levels, and the submount are mounted on the top of mother substrate, and with mother substrate tune
It is flat；It is directly printed on submount when the fusing forming of selective laser, after the completion of printing, part one by submount and thereon
It is removed with from mother substrate.
Preferably, the top of the submount is cuboid, and lower part is cylindrical body, and the two is an integral structure, cylindrical body
Diameter of section be less than cuboid sectional dimension.
Preferably, it is provided with groove on the inside of the mother substrate, groove is provided with induction coil, by induction heating to subbase
The temperature of plate is regulated and controled.
Preferably, the power density range of the induction coil is 0.6-2.0KW/cm2。
Preferably, the contact area of the mother substrate surface and submount is equipped with heat insulation layer, for avoiding submount heat
It scatters and disappears；There are certain intervals between other region mother substrates and submount, are realized by the air in gap heat-insulated.
Preferably, the heat-insulating material of the heat insulation layer be include microporous calcium silicate products, it is aluminium silicate products, rock wool, ultra-fine
One of which including mineral wool；The width in the gap is 2mm-5mm.
Preferably, the material of the mother substrate is 45# steel or other tool steel；The material of the submount is according to laser
The ingredient of selective melting forming sample is selected, for guaranteeing between submount and drip molding there is good wetting to combine effect
Fruit avoids drip molding warpage.
Preferably, the overall dimensions size of the primary-secondary type substrate is true according to the forming cavity size of selective laser melting unit
It is fixed.
Preferably, the flatness of the upper and lower surface of the mother substrate and submount is respectively less than or is equal to 0.01mm, and up and down
The depth of parallelism on surface is less than or equal to 0.01mm.
Preferably, four angles of the submount are opened there are four countersunk head threaded hole, are fixed submount by mounting screw
On mother substrate.
Compared with prior art, the beneficial effects of the present invention are:
(1) primary-secondary type substrate of the invention, is thermally shielded between mother substrate and submount by thermal insulation layer and air, can
To reduce scattering and disappearing for heat in SLM forming process, and then the temperature of submount in SLM forming process is improved, on the one hand can subtracted
Laser power required for small forming, to improve the cladding effect and consistency of drip molding；On the other hand subbase can be reduced
Temperature gradient between plate and drip molding reduces the forming defects such as sample warpage and micro-crack.
(2) primary-secondary type substrate of the invention can still pass through intermediate thermal insulating layer when submount keep higher temperature
So that mother substrate keeps lower temperature to mention so as to avoid the various electronic components being connected with mother substrate by high-temperature damage
The high stability and durability of equipment.
(3) primary-secondary type substrate of the invention, after completing forming, submount, which unload, to be taken conveniently, passes through wire cutting separating sample
And substrate, it is subsequent only to need to carry out grinding process to sub- substrate surface to improve SLM substrate so that workload be greatly decreased
Utilization efficiency.
(4) structure is simple, easy to use, improves economic benefit.
Detailed description of the invention
Fig. 1 is a kind of top view of primary-secondary type substrate suitable for selective laser fusing provided by the present invention.
Fig. 2 is a kind of side structure section of primary-secondary type substrate suitable for selective laser fusing provided by the present invention
Figure.
Description of symbols: 1, submount；2, heat insulation layer；3, mother substrate；4, induction coil；5, threaded hole.
Specific embodiment
With reference to the accompanying drawing and specific embodiment come the present invention will be described in detail, specific embodiment therein and explanation only
For explaining the present invention, but it is not as a limitation of the invention.
As depicted in figs. 1 and 2, the invention discloses a kind of primary-secondary type substrates suitable for selective laser fusing, including one
Block mother substrate 3 and one piece of submount 1, the mother substrate 3 are mounted on the melting unit of selective laser and level, the submount 1
It is mounted on the top of mother substrate 3, and is leveled with mother substrate 3；It is directly beaten on submount 1 when the fusing forming of selective laser
Print, after the completion of printing, part by submount 1 and thereon is removed from mother substrate 3 together.
Specifically, the top of the submount 1 is cuboid, and lower part is cylindrical body, and the two is an integral structure, cylindrical body
Diameter of section be less than cuboid sectional dimension.
Specifically, the inside of the mother substrate 3 is provided with groove, and groove is provided with induction coil 4, passes through induction heating antithetical phrase
The temperature of substrate 1 is regulated and controled.
Specifically, the power density range of the induction coil 4 is 0.6-2.0KW/cm2。
Specifically, the contact area of 3 surface of mother substrate and submount 1 is equipped with heat insulation layer 2, for avoiding submount 1
Heat loss；There are certain intervals between other region mother substrates 3 and submount 1, are realized by the air in gap heat-insulated.
Specifically, the heat-insulating material of the heat insulation layer 2 be include microporous calcium silicate products, it is aluminium silicate products, rock wool, ultra-fine
One of which including mineral wool；The width in the gap is 2mm-5mm.
Specifically, the material of the mother substrate 3 is 45# steel or other tool steel；The material of the submount 1 is according to sharp
The ingredient of light selective melting forming sample is selected, for guaranteeing there is good wetting knot between submount 1 and drip molding
Effect is closed, drip molding warpage is avoided.
Specifically, the overall dimensions size of the primary-secondary type substrate is true according to the forming cavity size of selective laser melting unit
Fixed, it is highly 30-60mm that the length and width of primary-secondary type substrate entirety, which is 100mm-1000mm,
Specifically, the flatness of the upper and lower surface of the mother substrate 3 and submount 1 is respectively less than or equal to 0.01mm, and on
The depth of parallelism of lower surface is less than or equal to 0.01mm.
Specifically, four angles of the submount 1 are opened there are four countersunk head threaded hole 5, are consolidated submount 1 by mounting screw
It is scheduled on mother substrate 3.
Embodiment
A kind of primary-secondary type substrate suitable for selective laser fusing can be used to substitute conventional substrate, shape for SLM pure
Copper.The size of mother substrate 3 is 200mm*200mm*50mm, and material selection 45# steel is directly installed on the melting unit of selective laser
And it levels.The top half of submount 1 is the cuboid of 123mm*123mm*10mm, and lower half portion is the cylinder of diameter 100mm
Body, material use fine copper, guarantee its good wetability between drip molding, and submount 1 are mounted on 3 top of mother substrate, and
It is leveled with mother substrate 3.
It is provided with groove on the inside of mother substrate 3, induction coil 4, heating power density 2.0KW/cm are housed2, can pass through
Induction heating regulates and controls 1 temperature of submount.
The high-temperature heat insulation layer 2 of 1 contact area of 3 surface of mother substrate and submount selects mineral wool as heat-barrier material, every
Thermosphere is with a thickness of 2mm.
The upper and lower surface flatness of mother substrate 3 and submount 1 is respectively less than or is equal to 0.01mm, and the depth of parallelism of upper and lower surface
Less than or equal to 0.01mm.
Mother substrate 3 and submount 1 are attached by bolt.Countersunk head threaded hole there are four being opened at four angles of submount 1
5, the diameter of threaded hole 5 is 9mm, and submount 1 are fixed on mother substrate 3 by mounting screw.
SLM is directly printed on submount 1 when shaping, and after the completion of printing, part by submount 1 and thereon is together
It is removed from mother substrate 3.Separate part and submount 1 by wire cutting, it is subsequent only need to be to the surface of submount 1 when reusing
Carry out grinding process.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to restrict the invention, it is all in spirit of the invention and
Made any modification, equivalent replacement and improvement etc., should all be included in the protection scope of the present invention within spirit.
Claims (10)
1. a kind of primary-secondary type substrate suitable for selective laser fusing, including one piece of mother substrate (3) and one piece of submount (1),
Be characterized in that: the mother substrate (3) is mounted on the melting unit of selective laser and levels, and the submount (1) are mounted on female base
The top of plate (3), and leveled with mother substrate (3)；It is directly printed, is beaten on submount (1) when the fusing forming of selective laser
After the completion of print, part by submount (1) and thereon is removed from mother substrate (3) together.
2. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 1, it is characterised in that: the son
The top of substrate (1) is cuboid, and lower part is cylindrical body, and the two is an integral structure, and the diameter of section of cylindrical body is less than rectangular
The sectional dimension of body.
3. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 1, it is characterised in that: the mother
Groove is provided on the inside of substrate (3), groove is provided with induction coil (4), carries out by temperature of the induction heating to submount (1)
Regulation.
4. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 3, it is characterised in that: the sense
The power density range for answering coil (4) is 0.6-2.0KW/cm2。
5. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 1, it is characterised in that: the mother
The contact area of substrate (3) surface and submount (1) is equipped with heat insulation layer (2), for avoiding submount (1) heat loss；Other
There are certain intervals between region mother substrate (3) and submount (1), are realized by the air in gap heat-insulated.
6. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 5, it is characterised in that: described exhausted
The heat-insulating material of thermosphere (2) is wherein one including microporous calcium silicate products, aluminium silicate products, rock wool, super glass wool
Kind；The width in the gap is 2mm-5mm.
7. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 1, it is characterised in that: the mother
The material of substrate (3) is 45# steel or other tool steel；The material of the submount (1) melts forming examination according to selective laser
The ingredient of sample is selected, and for guaranteeing that there is good wetting to combine effect between submount (1) and drip molding, avoids shaping
Part warpage.
8. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 1, it is characterised in that: the son
The overall dimensions size of matrix substrate is determined according to the forming cavity size of selective laser melting unit.
9. a kind of primary-secondary type substrate suitable for selective laser fusing according to claim 1, it is characterised in that: the mother
The flatness of the upper and lower surface of substrate (3) and submount (1) is respectively less than or is equal to 0.01mm, and the depth of parallelism of upper and lower surface is less than
Or it is equal to 0.01mm.
10. a kind of primary-secondary type substrate suitable for selective laser fusing according to any one of claim 1 to 9, special
Sign is: four angles of the submount (1) are opened there are four countersunk head threaded hole (5), by mounting screw that submount (1) is fixed
On mother substrate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768955.4A CN110405208A (en) | 2019-08-20 | 2019-08-20 | A kind of primary-secondary type substrate suitable for selective laser fusing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768955.4A CN110405208A (en) | 2019-08-20 | 2019-08-20 | A kind of primary-secondary type substrate suitable for selective laser fusing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110405208A true CN110405208A (en) | 2019-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910768955.4A Pending CN110405208A (en) | 2019-08-20 | 2019-08-20 | A kind of primary-secondary type substrate suitable for selective laser fusing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110773737A (en) * | 2019-11-14 | 2020-02-11 | 杭州琼网计算机网络有限公司 | Selective laser melting prevents warp deformation's 3D printer |
| WO2024141281A1 (en) * | 2022-12-29 | 2024-07-04 | Seco Tools Ab | Detachable build plate |
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| WO2002060635A1 (en) * | 2001-02-02 | 2002-08-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for the selective laser sintering of metallic substances |
| CN106111986A (en) * | 2016-06-25 | 2016-11-16 | 湖南惟晟信息科技有限公司 | A kind of laser 3D printing device |
| CN106312066A (en) * | 2016-09-29 | 2017-01-11 | 首都航天机械公司 | Combined base plate for selective laser melting additive manufacturing |
| CN206047079U (en) * | 2016-08-25 | 2017-03-29 | 甘肃顺域新材料科技有限公司 | A kind of reusable 3D metallic prints substrate |
| CN107803500A (en) * | 2017-10-31 | 2018-03-16 | 西安铂力特增材技术股份有限公司 | A kind of powder bed increasing material manufacturing electromagnetic induction slows down the device and method of part stress |
| CN207692082U (en) * | 2017-10-24 | 2018-08-03 | 陕西恒通智能机器有限公司 | A kind of substrate heating system for SLM 3D printers |
| CN208143509U (en) * | 2018-04-18 | 2018-11-23 | 中国工程物理研究院机械制造工艺研究所 | A kind of electrothermal closed-loop heating device |
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2019
- 2019-08-20 CN CN201910768955.4A patent/CN110405208A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002060635A1 (en) * | 2001-02-02 | 2002-08-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for the selective laser sintering of metallic substances |
| CN106111986A (en) * | 2016-06-25 | 2016-11-16 | 湖南惟晟信息科技有限公司 | A kind of laser 3D printing device |
| CN206047079U (en) * | 2016-08-25 | 2017-03-29 | 甘肃顺域新材料科技有限公司 | A kind of reusable 3D metallic prints substrate |
| CN106312066A (en) * | 2016-09-29 | 2017-01-11 | 首都航天机械公司 | Combined base plate for selective laser melting additive manufacturing |
| CN207692082U (en) * | 2017-10-24 | 2018-08-03 | 陕西恒通智能机器有限公司 | A kind of substrate heating system for SLM 3D printers |
| CN107803500A (en) * | 2017-10-31 | 2018-03-16 | 西安铂力特增材技术股份有限公司 | A kind of powder bed increasing material manufacturing electromagnetic induction slows down the device and method of part stress |
| CN208143509U (en) * | 2018-04-18 | 2018-11-23 | 中国工程物理研究院机械制造工艺研究所 | A kind of electrothermal closed-loop heating device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110773737A (en) * | 2019-11-14 | 2020-02-11 | 杭州琼网计算机网络有限公司 | Selective laser melting prevents warp deformation's 3D printer |
| CN110773737B (en) * | 2019-11-14 | 2021-11-23 | 安徽汇正电子科技有限公司 | Selective laser melting prevents warp deformation's 3D printer |
| WO2024141281A1 (en) * | 2022-12-29 | 2024-07-04 | Seco Tools Ab | Detachable build plate |
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Application publication date: 20191105 |