CN106292082A - 液晶显示屏的像素结构及其制造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 25
- 230000004888 barrier function Effects 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 91
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910003978 SiClx Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
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- H01L27/1259—Multistep manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134318—Electrodes characterised by their geometrical arrangement having a patterned common electrode
-
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- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134372—Electrodes characterised by their geometrical arrangement for fringe field switching [FFS] where the common electrode is not patterned
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/12—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
- G02F2201/123—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode pixel
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
Abstract
本发明提供了一种液晶显示屏的像素结构,其特征在于包括:一衬底;一金属层,设置于所述衬底上;一第一绝缘层,设置于所述金属层上;一公用电极层,设置于所述第一绝缘层上,且所述公用电极层与所述第一绝缘层直接接触;一第二绝缘层,设置于所述公用电极层上;以及一第一像素电极及一第二像素电极层,设置于所述第二绝缘层上,其中所述第一及第二像素电极层位于同一像素结构内。本发明能够缩短生产时间、降低生产成本并提高生产良率。
Description
技术领域
本案涉及一种液晶显示屏的像素结构及其制造方法,尤其涉及一种具有高穿透率液晶显示屏的像素结构及其制造方法。
背景技术
随着液晶显示技术持续、广泛、深入和迅速的发展,目前液晶显示屏(LCD)已几乎压倒性地占据所有的主要显示屏市场,例如监视器、移动电话、电视机、笔记本电脑、平板个人电脑(Tablet PC)、全球卫星定位系统(GPS)装置、可携式影像播放器等。
在液晶显示屏中,液晶扮演着光阀的角色,在液晶显示屏的每一像素及/或次像素中,在即时显示时间内,控制光的穿透及光的阻绝。从液晶的控制机制的角度来看,液晶显示屏可分为垂直配相(vertical alignment,VA)和平面切换(plane switching)两种类型。由于显示屏的分辨率(resolution)规格日易提高,每个像素及/或次像素的面积随之愈来愈小,为了提高像素及/或次像素的开口率(aperture ratio),每个像素及/或次像素所需的线路在其有限的面积内的设计排列,仅能从衬底的垂直方向来争取线路配置的空间,所以采用了多片光掩膜的方式来逐层完成所需线路,但也因此增加了光掩膜的使用数量及生产程序的次数。
为了解决上述现有技术的缺点,发明人通过本发明提出完整且有效的解决方案。
发明内容
本发明提供一种液晶显示屏的像素结构及制造液晶显示屏像素的方法,可以缩短生产时间,有效降低成本并具有更高良率的生产程序,来生产符合市场所需的高穿透率的显示屏产品。
本发明一方面提供一种液晶显示屏的像素结构,所述像素结构包括:一衬底;一金属层,设置于所述衬底上;一第一绝缘层,设置于所述金属层上;一公用电极层,设置于所述第一绝缘层上,且所述公用电极层与所述第一绝缘层直接接触;一第二绝缘层,设置于所述公用电极层上;以及一第一像素电极层及一第二像素电极层,设置于所述第二绝缘层上,其中所述第一像素电极层与所述第二像素电极层位于同一像素结构内,以一即定间距排列。
本发明另一方面提供一种制造一液晶显示屏像素的方法,所述制造方法包括下列步骤:提供一衬底;以及形成一像素单元于所述衬底上,其中形成所述像素单元的步骤包括下列步骤:形成一图案化金属层于所述衬底上;形成一第一绝缘层于所述图案化金属层及所述衬底上;形成一公用电极层于所述第一绝缘层及所述图案金属层上;形成一第二绝缘层于所述公用电极层上;以及形成一第一像素电极层及一第二像素电极层于所述第二绝缘层上,其中所述第一像素电极层与所述第二像素电极层位于同一像素结构内,以一即定间距排列。
本领域技术人员在阅读以下详细实施方式的叙述及所附的附图之后,将对本发明的目的及优点有更清楚明白的了解。
附图说明
图1为本发明一实施例的FFS LCD中的一个像素结构的俯视图;
图2为根据图1的所述像素结构沿A-A’线的剖面图;
图3为制造本发明一实施例的FFS LCD中的像素结构的方法流程图;
图4为本发明一实施例的FFS LCD面板的结构图。
符号说明:
10:像素结构
12:金属层
13:第一绝缘层
15:第一电极层
16:第二绝缘层
17、17a、17b:第二电极层
18:狭缝
20、40:像素层
21、41、51:衬底
30:FFS LCD面板
31:薄膜晶体管阵列衬底
32:彩色滤光片衬底
34:框胶
35:液晶层
37:薄膜晶体管阵列层
38:彩色滤光片层
S1-S6:步骤
W:线宽
L:间距
具体实施方式
本发明将藉由下列实施例并配合附图,作进一步的详细说明。值得一提的是,本发明下列实施例的叙述仅用于说明和描述,并非用来限制本发明至任何所揭露的精确形式或数据。另外,本领域普通技术人员当可了解附图省略了部分的元件,以简要说明本发明实施例。
本发明提出一种像素结构,其中共用电极层设置于衬底与像素电极层之间,因此可兼顾像素电极的线宽及线距的合适尺寸,不需要将所述线宽或线距的尺寸设计成更小而造成容易发生短断路的情况。
请参考图1。图1为本发明一实施例的液晶显示屏,例如是边缘电场切换(FFSLCD)中的一个像素结构10的俯视图。所述像素结构10由俯视方向可见包括一第一电极层15以及位于所述第一电极层15上方的一第二电极层17,其中所述第一电极层15为一全面性的透明电极层,在此实施例中作为驱动液晶的一公用电极层之用;所述第二电极层17为具有图案的透明电极层,其图案的中间部位为狭长形的狭缝18,由于所述狭缝18不具有透明电极层,因此由俯视方向向所述狭缝18看去,可直视位于第二电极层17下方的所述第一电极层15,所述第二电极层17在此实施例作为作为驱动液晶的一像素电极层之用。所述第二电极层17的下方还有于图1中未示出的其他各层,如后说明。所述第一电极层15及所述第二电极层17可依实际产品需求而采用各种变化的形状及排列的设计,不仅限于此。
请参考图2。图2为根据图1的所述像素结构10沿A-A’线的剖面图;由图2可更清楚了解本发明一实施例的所述像素结构10的详细结构。
所述像素结构10包括一衬底21及在所述衬底21上形成的一像素层20,在一实施例中,所述衬底21可为玻璃或其它合适的硬质衬底。在另一实施例中,所述衬底21也可是塑质材料的软性衬底。所述像素层20包含具有线路(或称图案化)的所述金属层12;所述金属层12在此实施例作为导线之用,例如作为数据线。在一实施例中,所述金属层12的材料可为钼/铝/钼的层迭结构(未于图2中示出),其厚度依序可为例如约之后,其上为一第一绝缘层13。在一实施例中,所述第一绝缘层13的材料可为氮化硅、氧化硅或氮氧化硅。且,厚度较佳可为约至的范围,优选为约接着绝缘层13上形成透明导电层的线路,即一第一电极层15,其可作为驱动液晶的一公共电极层之用。在一实施例中,所述第一电极层15的材料可为铟锡氧化物、氧化铟或氧化锡,而其厚度较佳可为约且所述第一电极层15与所述第一绝缘层13直接接触。然后,再于所述第一电极层15上以沉积程序及微影刻蚀程序制作出具有线路的一第二绝缘层16(由于所述线路位于图2所示的范围外,故未于图2中示出)。在一实施例中,所述第二绝缘层16的材料可为氮化硅、氧化硅或氮氧化硅,且厚度可为约至的范围。其中,优选为约或最后,所述第二绝缘层16上为具有线路的透明导电层,即第二电极层17(包含17a及17b),可作为驱动液晶的像素电极层之用。在一实施例中,所述第二电极层17(包含17a及17b)的材料可为铟锡氧化物、氧化铟或氧化锡,其厚度可为约第二电极层17(包含17a及17b)可以一即定间距排列,且此间距L可以是介于1.46μm至2.0μm之间。而,第二电极层17(包含17a及17b)的线宽W可以是介于1.5μm至4μm之间,使其短断路发生机会能有效降低。
因为所述第一电极层15与所述第一绝缘层13直接接触,所以在所述第一电极层15与所述第一绝缘层13之间无需再配置一平坦层,因此不必使用用于保护层制作的光掩膜,更无需进行形成平坦层的子程序。
将所述像素结构10沿横行及纵列的方向分别复制而排列成一个像素阵列以形成一FFS LCD的显示区域时,其相邻的两个所述像素结构10以一固定间距排列,且在每一个所述像素结构10中的第二电极层17(包含17a及17b)之间的即定间距L(即狭缝18剖面的宽度)亦需如前所述可介于1.46μm至2.0μm之间。
图3为本发明一实施例的所述像素结构10的制造流程图。如图3所示,所述制造流程图说明如后。步骤S1:提供一衬底21;步骤S2:于所述衬底21上通过沉积程序(例如溅镀、蒸镀或涂布等方式)形成一层金属层12,并经过微影程序(包括清洗、光阻上膜、曝光、显影(形成图案化光阻)、刻蚀、去膜及烘烤等子程序)来形成具有线路的所述金属层12(或称图案化金属层);步骤S3:于所述衬底21及所述金属层12上再通过例如前述的沉积程序形成一第一绝缘层13;步骤S4:接着于所述第一绝缘层上通过例如前述的沉积程序及微影程序形成具有线路的一第一电极层15(或称图案化第一电极层15),使所述第一电极层15与所述第一绝缘层13直接接触;步骤S5:再于所述第一电极层15及所述第一电极层上通过例如前述的沉积程序形成所述第二绝缘层16;以及步骤S6:再于所述第二绝缘层1上通过例如前述的沉积程序及微影程序形成具有线路的透明导电层,即第二电极层17(包含17a及17b),便能得到如图2所示出的剖面图的像素结构10。
此外,根据实际FFS LCD的设计需要,于所述衬底21及所述金属层12之间还可配置薄膜晶体管阵列层37或彩色滤光片层38,如后说明,再进行包括搭配对向的衬底并于其间注入液晶等多道工序之后,便能形成完整的FFS LCD面板结构。
图4为本发明第一实施例的FFS LCD面板30的示意结构图。如图4所示,所述FFS LCD面板30包括位于下层的薄膜晶阵管列衬底31、位于所述薄膜晶体管阵列衬底31的相对侧的彩色滤光片衬底32、位于所述薄膜晶体管阵列衬底31及所述彩色滤光片衬底32之间的框胶34以及液晶层35。其中所述框胶34将所述薄膜晶体管阵列衬底31和所述彩色滤光片衬底32固定并定义出液晶层35的范围:所述薄膜晶体管阵列衬底31包括一衬底41、一像素结构40以及一薄膜晶体管阵列层37;所述彩色滤光片衬底32包含衬底51以及一彩色滤光片层38;其中各层的配置可以根据实际FFS LCD面板的设计而改变,不仅限于上述实施例。
综合上述,本发明至少具有优点:可有效降低生产成本、降低制作线路时短断路的发生机会、提高生产良率等。并且,本发明实施例的液晶显示屏具有高穿透率。所述优点并不用来局限本发明。
实施例:
A、一种液晶显示屏的像素结构,包括:一衬底;一金属层,设置于所述衬底上;一第一绝缘层,设置于所述金属层上;一公用电极层,设置于所述第一绝缘层上,且所述公用电极层与所述第一绝缘层直接接触;一第二绝缘层,设置于所述公用电极层上;以及一第一像素电极及一第二像素电极层,设置于所述第二绝缘层上,其中所述第一及第二像素电极层位于同一像素结构内。
B、如实施例A所述的像素结构,所述第一及第二像素电极层以一即定间距排列,且所述即定间距介于1.46μm至2.0μm之间。
C、如实施例A-B所述的像素结构,所述第一像素电极层及所述第二像素电极层具有一线宽,所述线宽介于1.5μm至4μm之间。
D、如实施例A-C所述的像素结构,所述第一绝缘层的厚度范围介于至之间。
E、如实施例A-D所述的像素结构,所述第二绝缘层的厚度范围介于至之间。
F、如实施例A-E所述的像素结构,所述第一绝缘层包括氮化硅、氧化硅或氮氧化硅。
G、如实施例A-F所述的像素结构,所述第二绝缘层包括氮化硅、氧化硅或氮氧化硅。
H、如实施例A-G所述的像素结构,所述第一像素电极层及第二像素电极层包括铟锡氧化物、氧化铟或氧化锡。
I、一种液晶显示屏像素结构的制造方法,包括下列步骤:提供一衬底;以及形成一像素单元于所述衬底上,其中形成所述像素单元的步骤,包括下列步骤:形成一图案化金属层于所述衬底上;形成一第一绝缘层于所述图案化金属层及所述衬底上;形成一公用电极层于所述第一绝缘层及所述图案化金属层上;形成一第二绝缘层于所述公用电极层上;以及形成一第一像素电极层及一第二像素电极层于所述第二绝缘层上,其中第一及第二像素电极层位于同一像素结构内。
J、还包括以下步骤:以一微影程序,形成所述第一像素电极层及所述第二像素电极层,并以一即定间距排列;其中,所述微影程序,至少包括以下步骤:沉积一透明导电层;形成一图案化光阻于所述透明导电层上;刻蚀所述透明导电层,以形成所述第一像素电极层及所述第二像素电极层;以及移除所述图案化光阻。
虽然本发明已将较佳实施例揭露如上,但其并非用以限定本发明,任何本领域的普通技术人员,在不脱离本发明的精神和范围内,可作更动与润饰。因此本发明的保护范围以权利要求保护的范围为准。本案由本领域的普通技术人员所作的各种修饰,皆不脱离所附的权利要求的保护范围。
Claims (10)
1.一种液晶显示屏的像素结构,其特征在于,所述像素结构包括:
一衬底;
一金属层,设置于所述衬底上;
一第一绝缘层,设置于所述金属层上;
一公用电极层,设置于所述第一绝缘层上,且所述公用电极层与所述第一绝缘层直接接触;
一第二绝缘层,设置于所述公用电极层上;以及
一第一像素电极层及一第二像素电极层,设置于所述第二绝缘层上,其中所述第一像素电极层及第二像素电极层位于同一像素结构内。
2.如权利要求1所述的像素结构,其特征在于:
所述第一及第二像素电极层以一预定间距排列,且所述预定间距介于1.46μm至2.0μm之间。
3.如权利要求1所述的像素结构,其特征在于:
所述第一像素电极层及所述第二像素电极层具有一线宽,所述线宽介于1.5μm至4μm之间。
4.如权利要求1所述的像素结构,其特征在于:
所述第一绝缘层的厚度范围介于至之间。
5.如权利要求1所述的像素结构,其特征在于:
所述第二绝缘层的厚度范围介于至之间。
6.如权利要求1所述的像素结构,其特征在于:
所述第一绝缘层包括氮化硅、氧化硅或氮氧化硅。
7.如权利要求1所述的像素结构,其特征在于:
所述第二绝缘层包括氮化硅、氧化硅或氮氧化硅。
8.如权利要求1所述的像素结构,其特征在于:
所述第一像素电极层及第二像素电极层包括铟锡氧化物、氧化铟或氧化锡。
9.一种液晶显示屏像素结构的制造方法,其特征在于,所述制造方法包括下列步骤:
提供一衬底;以及
形成一像素单元于所述衬底上,其中形成所述像素单元的步骤,包括下列步骤:
形成一图案化金属层于所述衬底上;
形成一第一绝缘层于所述图案化金属层及所述衬底上;
形成一公用电极层于所述第一绝缘层及所述图案化金属层上;
形成一第二绝缘层于所述公用电极层上;以及
形成一第一像素电极层及一第二像素电极层于所述第二绝缘层上,其中第一及第二像素电极层位于同一像素结构内。
10.如权利要求9所述的制造方法,其特征在于,所述制造方法还包括以下步骤:
以一微影程序,形成所述第一像素电极层及所述第二像素电极层,并以一预定间距排列;
其中,所述微影程序,至少包括以下步骤:
沉积一透明导电层;
形成一图案化光阻于所述透明导电层上;
刻蚀所述透明导电层,以形成所述第一像素电极层及所述第二像素电极层;以及
移除所述图案化光阻。
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Application publication date: 20170104 |