CN106290983A - A kind of acceleration sensor chip based on amorphous carbon film - Google Patents

A kind of acceleration sensor chip based on amorphous carbon film Download PDF

Info

Publication number
CN106290983A
CN106290983A CN201610606289.0A CN201610606289A CN106290983A CN 106290983 A CN106290983 A CN 106290983A CN 201610606289 A CN201610606289 A CN 201610606289A CN 106290983 A CN106290983 A CN 106290983A
Authority
CN
China
Prior art keywords
amorphous carbon
siliceous
sensitive structure
resistance
membrane resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610606289.0A
Other languages
Chinese (zh)
Inventor
赵玉龙
马鑫
张琪
胡腾江
王鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Jiaotong University
Original Assignee
Xian Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Jiaotong University filed Critical Xian Jiaotong University
Priority to CN201610606289.0A priority Critical patent/CN106290983A/en
Publication of CN106290983A publication Critical patent/CN106290983A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance

Abstract

A kind of acceleration sensor chip based on amorphous carbon film, including siliceous sensitive structure, the back side of siliceous sensitive structure is bonded with boron glass, siliceous sensitive structure includes mass and the cantilever beam being connected with mass, siliceous sensitive structure use physical vapour deposition (PVD) or chemical gaseous phase depositing process are coated with four amorphous carbon-film resistance, wherein the first amorphous carbon membrane resistance is positioned on the cantilever beam of siliceous sensitive structure, and near frame one end;Second, third, the 4th amorphous carbon membrane resistance be positioned at the frame of siliceous sensitive structure, four amorphous carbon-film resistance connect into favour stone half-bridge testing circuit, and connected by plain conductor and pad, the amorphous carbon membrane resistance used due to the present invention has low-friction coefficient, corrosion-resistant, wear-resisting good characteristic such as grade, thoroughly solve traditional MEMS silicon micro-sensor and measure the restricting relation between sensitivity and natural frequency, make sensor have the feature such as high natural frequency and high measurement sensitivity concurrently.

Description

A kind of acceleration sensor chip based on amorphous carbon film
Technical field
The present invention relates to MEMS acceleration sensor chip technical field, based on amorphous carbon film add particularly to a kind of Velocity sensor chip.
Background technology
Demand along with the development of MEMS (MEMS) technology and the practical application area such as industry, military affairs Change, there is different performance and sensitivity principle acceleration transducer and progress into the visual field of people.Quick according to sense accelerations Sense mechanism is different, and acceleration transducer can be divided into condenser type, pressure resistance type, piezoelectric type, resonant mode and thermal conductivity etc..Owing to adopting With MEMS technology and IC integrated technique, there is volume acceleration transducer little, lightweight feature and can be placed in narrow and small In space, thus occur in the application scenario that some conventional sensors cannot use, such as machine tool chief axis vibration monitoring, intelligence Pen, virtual reality, 3D mouse and sports equipment etc..
Currently for the research of MEMS acceleration transducer, many carry out innovative design on its sensitive structure, in succession go out Show MEMS acceleration transducer based on sensitive structures such as cantilever beam-mass, rood beam, doube bridge and compound many beams.Though The most above-mentioned sensitive structure improves sensor performance to a certain extent, but there is problems in that 1. pass due to acceleration The sensitivity of sensor sensitive structure and natural frequency are a pair parameters of mutually constraint, and this contradictory relation cannot be by thoroughly Eliminate;The most traditional MEMS sensor all uses the mode of ion implanting to form varistor on a silicon substrate, is typically necessary 2-3 step just can complete the making of resistance, and processing technology is complex;3. the characteristics such as varistor does not possess wear-resisting, corrosion-resistant, limit Make its application under some adverse circumstances, reduce the life-span of sensor.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art, it is an object of the invention to provide a kind of based on amorphous carbon film add Velocity sensor chip, thoroughly solves traditional MEMS silicon micro-sensor and measures the restricting relation between sensitivity and natural frequency, Making sensor have the feature such as high natural frequency and high measurement sensitivity concurrently, the amorphous carbon membrane resistance of employing has low friction system Several, corrosion-resistant, the wear-resisting good characteristic that waits, the application under applicable adverse circumstances, there is the biggest market efficiency and economic worth.
To achieve these goals, the technical solution used in the present invention is:
A kind of acceleration sensor chip based on amorphous carbon film, including siliceous sensitive structure 1, siliceous sensitive structure 1 The back side be bonded with the front of boron glass 2, be provided with cavity 3, silicon between the back side and the front of boron glass 2 of siliceous sensitive structure 1 Matter sensitive structure 1 includes mass 5 and the cantilever beam 6 being connected with mass 5, uses physics gas on siliceous sensitive structure 1 Deposition or chemical gaseous phase depositing process are coated with four amorphous carbon-films resistance 4-1,4-2,4-3,4-4, wherein the first amorphous carbon mutually Membrane resistance 4-1 is positioned on the cantilever beam 6 of siliceous sensitive structure 1, and near frame one end;Second amorphous carbon membrane resistance 4-2, Three amorphous carbon membrane resistances 4-3 and the 4th amorphous carbon membrane resistance 4-4 are positioned at the frame of siliceous sensitive structure 1, and four non- Brilliant fixed carbon resister 4-1,4-2,4-3,4-4 connect into favour stone half-bridge testing circuit, and are connected by plain conductor 7 and pad 8, Siliceous sensitive structure 1, boron glass 2, amorphous carbon membrane resistance, plain conductor 7 and pad 8 constitute based on amorphous carbon film Acceleration sensor chip.
Described amorphous carbon membrane resistance uses magnetron sputtering and chemical gaseous phase depositing process to prepare, its bias point Wei-300V~300V and-150V~-750V.
The working clearance of 20-40 μm it is reserved with between mass 5 and the boron glass 2 of described siliceous sensitive structure 1.
Replace traditional pressure sensitive resistance as favour stone owing to present invention employs the amorphous carbon membrane resistance of high piezoresistance coefficient The bridge resistance of electric bridge.Sensor is made to have the following characteristics that 1. high measurement sensitivity, owing to amorphous carbon membrane resistance has pole High piezoresistance coefficient (120-1200) so that varistor is in the case of by identical ess-strain, it is possible to obtain bigger Resistance change.2 response frequencies are high, carry out cantilever beam structure dimensionally-optimised and select, can be not affect sensor sensitive The natural frequency of sensor is promoted in the case of degree.The most wear-resisting, corrosion-resistant.Owing to amorphous carbon film has low-friction coefficient, resistance to The features such as mill, are often used as the coating material of space shuttle, introduce this resistance and sensor can be made to have the longer life-span.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the present invention.
Fig. 2 is the Section A-A figure of Fig. 1.
Fig. 3 is the fundamental diagram of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in more detail.
See figures.1.and.2, a kind of acceleration sensor chip based on amorphous carbon film, including siliceous sensitive structure 1, The back side of siliceous sensitive structure 1 is bonded with the front of boron glass 2, and leaves bonding surplus, the back side of siliceous sensitive structure 1 and boron Being provided with cavity 3 between the front of glass 2, siliceous sensitive structure 1 includes mass 5 and the cantilever beam 6 being connected with mass 5, Siliceous sensitive structure 1 use physical vapour deposition (PVD) or chemical gaseous phase depositing process are coated with four amorphous carbon-films resistance 4-1,4- 2,4-3,4-4, wherein the first amorphous carbon membrane resistance 4-1 is positioned on the cantilever beam 6 of siliceous sensitive structure 1, and near frame one End;Second amorphous carbon membrane resistance 4-2, the 3rd amorphous carbon membrane resistance 4-3 and the 4th amorphous carbon membrane resistance 4-4 are positioned at silicon At the frame of matter sensitive structure 1, the amorphous carbon membrane resistance subjected to stress strain so arranged is big, and resistance variations is obvious, suitable Together in developing MEMS acceleration sensor chip based on amorphous carbon film, four amorphous carbon-films resistance 4-1,4-2,4-3,4-4 Connect into favour stone half-bridge testing circuit, and logical plain conductor 7 and pad 8 connect, siliceous sensitive structure 1, boron glass 2, amorphous State fixed carbon resister, plain conductor 7 and pad 8 constitute acceleration sensor chip based on amorphous carbon film.
Described amorphous carbon membrane resistance uses magnetron sputtering and chemical gaseous phase depositing process to prepare, its bias point Wei-300V~300V and-150V~-750V.
The working clearance of 20-40 μm it is reserved with, to protect between mass 5 and the boron glass 2 of described siliceous sensitive structure 1 Card mass 5 can be the most unsettled when normal operation of sensor, it is provided that suitably damping space and anti-overload ability.
The operation principle of the present invention is:
With reference to Fig. 3, utilize the piezoresistive effect of amorphous carbon film, when amorphous carbon membrane resistance 4-1,4-2,4-3,4-4 are in Time under certain stress effect, due to the change of carrier mobility, its resistivity changes, the change of its resistance with its suffered by Proportionate relationship between stress is:
Δ R R = K ϵ - - - ( 1 )
K therein is the equivalent piezoresistance coefficient of amorphous carbon film, and piezoresistance coefficient is used to characterize piezoresistive effect power, quilt It is defined as change relatively and the ratio of strain stress of amorphous carbon film resistivity under unit effect.
For the favour stone half-bridge testing circuit being made up of amorphous carbon film resistance, constant pressure source is used to power, when the external world adds When speed is applied on sensor chip, its output voltage can be expressed as:
V o = ( R 1 R 3 - R 2 R 4 ( R 1 + R 2 ) - ( R 3 + R 4 ) ) V i - - - ( 2 )
V in formula 2o、ViIt is respectively output voltage and input voltage, the R of electric bridge1It it is the first amorphous carbon membrane resistance 4-1 Resistance.R2、R3And R4For being arranged in the second amorphous carbon membrane resistance 4-2 at sensitive structure frame, the 3rd amorphous carbon film electricity Resistance 4-3 and the resistance of the 4th amorphous carbon membrane resistance 4-3.ΔR1It it is the change in resistance amount of the first amorphous carbon membrane resistance 4-1.Warp Cross substitution abbreviation, have an equation below:
V o = Δ R 4 R V i - - - ( 3 )
According to Newton's law, when unsettled mass 5 is by a direction acceleration effect, it will have one and accelerate Degree is directly proportional and inertia force in the same direction acts on mass 5, so that mass 5 produces certain displacement;Cantilever beam 6 with Mass 5 is connected, and cantilever beam 6 will occur bending and deformation under the drive of mass 5, thus produces stress on cantilever beam 6 and answer Become.The first amorphous carbon membrane resistance 4-1 in chip is arranged at the maximum stress of cantilever beam 6, according to piezoresistive effect formula, the The resistance of one amorphous carbon membrane resistance 4-1 can change, and then causes bridge balance to lose efficacy, thus exports a magnitude of voltage, Stress owing to producing on cantilever beam 6 is directly proportional to input acceleration, and the variable quantity of amorphous state fixed carbon resister and the stress of beam Being directly proportional, the accekeration that therefore output voltage is born to it is directly proportional, and finally achieves and acceleration is changed into the signal of telecommunication Function.In the present invention, owing to using amorphous carbon film as the varistor of sensor so that sensor has higher spirit Sensitivity and longer service life.

Claims (3)

1. an acceleration sensor chip based on amorphous carbon film, including siliceous sensitive structure (1), siliceous sensitive structure (1) the back side is bonded with the front of boron glass (2), is provided with between the back side and the front of boron glass (2) of siliceous sensitive structure (1) Cavity (3), siliceous sensitive structure (1) includes mass (5) and the cantilever beam 6 being connected with mass (5), it is characterised in that: It is coated with four amorphous carbon-film resistance (4-at siliceous sensitive structure (1) upper employing physical vapour deposition (PVD) or chemical gaseous phase depositing process 1,4-2,4-3,4-4), wherein the first amorphous carbon membrane resistance (4-1) is positioned on the cantilever beam (6) of siliceous sensitive structure (1), and Near frame one end;Second amorphous carbon membrane resistance (4-2), the 3rd amorphous carbon membrane resistance (4-3) and the 4th amorphous carbon Membrane resistance (4-4) is positioned at the frame of siliceous sensitive structure (1), and four amorphous carbon-film resistance (4-1,4-2,4-3,4-4) connect Become favour stone half-bridge testing circuit, and connected by plain conductor (7) and pad (8), siliceous sensitive structure (1), boron glass (2), amorphous carbon membrane resistance, plain conductor (7) and pad (8) constitute acceleration transducer core based on amorphous carbon film Sheet.
A kind of acceleration sensor chip based on amorphous carbon film the most according to claim 1, it is characterised in that: described Amorphous carbon membrane resistance use magnetron sputtering and chemical gaseous phase depositing process to prepare, its bias be respectively-300V~ 300V and-150V~-750V.
A kind of acceleration sensor chip based on amorphous carbon film the most according to claim 1, it is characterised in that: described Siliceous sensitive structure (1) mass (5) and boron glass (2) between be reserved with working clearance of 20-40 μm.
CN201610606289.0A 2016-07-28 2016-07-28 A kind of acceleration sensor chip based on amorphous carbon film Pending CN106290983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610606289.0A CN106290983A (en) 2016-07-28 2016-07-28 A kind of acceleration sensor chip based on amorphous carbon film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610606289.0A CN106290983A (en) 2016-07-28 2016-07-28 A kind of acceleration sensor chip based on amorphous carbon film

Publications (1)

Publication Number Publication Date
CN106290983A true CN106290983A (en) 2017-01-04

Family

ID=57662741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610606289.0A Pending CN106290983A (en) 2016-07-28 2016-07-28 A kind of acceleration sensor chip based on amorphous carbon film

Country Status (1)

Country Link
CN (1) CN106290983A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108709170A (en) * 2018-07-31 2018-10-26 江门黑氪光电科技有限公司 A kind of LED support from strip resistance
CN109507451A (en) * 2018-10-24 2019-03-22 西安交通大学 A kind of acceleration sensor chip and its processing method based on molybdenum disulfide film

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2570793Y (en) * 2002-08-30 2003-09-03 中国科学院上海微系统与信息技术研究所 Micro-mechanical acceleration transducer with measuring range up to 2million m/s power
CN101738494A (en) * 2009-12-11 2010-06-16 西安交通大学 Silicon micro-acceleration sensor chip
CN101768011A (en) * 2008-12-29 2010-07-07 中国科学院兰州化学物理研究所 Preparation method of corrosion resistant diamond film
CN102141576A (en) * 2010-12-28 2011-08-03 中北大学 High-gravity (g) acceleration sensor in plane of micro-electromechanical system (MEMS) based on resonance tunnelling structure (RTS)
CN102884437A (en) * 2010-05-10 2013-01-16 株式会社神户制钢所 Contact probe
CN103700576A (en) * 2013-12-17 2014-04-02 西安文理学院 Preparing method of self-assembly forming-dimension-controllable silicon nanocrystal films
CN104089570A (en) * 2014-07-16 2014-10-08 中国科学院宁波材料技术与工程研究所 Piezoresistive sensing element and manufacturing method thereof
CN104388902A (en) * 2014-12-03 2015-03-04 中国科学院宁波材料技术与工程研究所 Carbon-based coating having high electrical conductivity on surface of substrate and preparation method of coating
US9065358B2 (en) * 2011-07-11 2015-06-23 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS structure and method of forming same
CN105714274A (en) * 2016-03-31 2016-06-29 成都西沃克真空科技有限公司 Plasma enhanced chemical vapor deposition equipment and film manufacturing method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2570793Y (en) * 2002-08-30 2003-09-03 中国科学院上海微系统与信息技术研究所 Micro-mechanical acceleration transducer with measuring range up to 2million m/s power
CN101768011A (en) * 2008-12-29 2010-07-07 中国科学院兰州化学物理研究所 Preparation method of corrosion resistant diamond film
CN101738494A (en) * 2009-12-11 2010-06-16 西安交通大学 Silicon micro-acceleration sensor chip
CN102884437A (en) * 2010-05-10 2013-01-16 株式会社神户制钢所 Contact probe
CN102141576A (en) * 2010-12-28 2011-08-03 中北大学 High-gravity (g) acceleration sensor in plane of micro-electromechanical system (MEMS) based on resonance tunnelling structure (RTS)
US9065358B2 (en) * 2011-07-11 2015-06-23 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS structure and method of forming same
CN103700576A (en) * 2013-12-17 2014-04-02 西安文理学院 Preparing method of self-assembly forming-dimension-controllable silicon nanocrystal films
CN104089570A (en) * 2014-07-16 2014-10-08 中国科学院宁波材料技术与工程研究所 Piezoresistive sensing element and manufacturing method thereof
CN104388902A (en) * 2014-12-03 2015-03-04 中国科学院宁波材料技术与工程研究所 Carbon-based coating having high electrical conductivity on surface of substrate and preparation method of coating
CN105714274A (en) * 2016-03-31 2016-06-29 成都西沃克真空科技有限公司 Plasma enhanced chemical vapor deposition equipment and film manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108709170A (en) * 2018-07-31 2018-10-26 江门黑氪光电科技有限公司 A kind of LED support from strip resistance
CN109507451A (en) * 2018-10-24 2019-03-22 西安交通大学 A kind of acceleration sensor chip and its processing method based on molybdenum disulfide film

Similar Documents

Publication Publication Date Title
Niu et al. Design optimization of high pressure and high temperature piezoresistive pressure sensor for high sensitivity
Patranabi Sensors and Tranducers
CN101738494B (en) Silicon micro-acceleration sensor chip
CN103941041B (en) A kind of single mass three-shaft mems accelerometer of three-frame structure
Tian et al. The novel structural design for pressure sensors
Wang et al. A piezoresistive micro-accelerometer with high frequency response and low transverse effect
Ravi Sankar et al. Cross-axis sensitivity reduction of a silicon MEMS piezoresistive accelerometer
Liu et al. Analysis and design for piezoresistive accelerometer geometry considering sensitivity, resonant frequency and cross-axis sensitivity
Madhavi et al. Design of a piezoresistive micropressure sensor using finite element analysis
CN107643424B (en) Piezoresistive MEMS acceleration chip and manufacturing method thereof
CN105021846A (en) Six-axis integrated miniature acceleration sensor and manufacturing method therefor
CN106290983A (en) A kind of acceleration sensor chip based on amorphous carbon film
Kamble et al. Overview of load cells
Madhavi et al. Diaphragm design for MEMS pressure sensors using a data mining tool
CN102901520B (en) Method for improving temperature stability of capacitor type micromechanical sensor and micromechanical sensor
CN104950137A (en) Transverse sensitive acceleration sensor chip having stress isolation structure
Amarasinghe et al. Simulation, fabrication and characterization of a three-axis piezoresistive accelerometer
CN103995151B (en) Composite eight-beam high-frequency-response acceleration sensor chip
Zhao et al. Incorporation of the stress concentration slots into the flexures for a high-performance microaccelerometer
CN107271720B (en) Eight beam 3-axis acceleration sensors of low inter-axis coupling degree
Yan et al. Design and fabrication of thick-film PZT-metallic triple beam resonators
Paliwal et al. A differential Hall effect based pressure sensor
Song et al. A bionic micro-electromechanical system piezo-resistive vector hydrophone that suppresses vibration noise
Kim et al. Cross-shaped piezoelectric beam for torsion sensing
Rausch et al. Strain measurement on stiff structures: experimental evaluation of three integrated measurement principles

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170104

RJ01 Rejection of invention patent application after publication