CN106281101A - Conductive glue - Google Patents
Conductive glue Download PDFInfo
- Publication number
- CN106281101A CN106281101A CN201610719362.5A CN201610719362A CN106281101A CN 106281101 A CN106281101 A CN 106281101A CN 201610719362 A CN201610719362 A CN 201610719362A CN 106281101 A CN106281101 A CN 106281101A
- Authority
- CN
- China
- Prior art keywords
- parts
- conductive glue
- conductive
- glue
- powder body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a kind of conductive glue, raw material consists of: polyimide resin 20 40 parts, conductive powder body 10 20 parts, 68 parts of acetone, ethyl acetate 10 20 parts, styrene 10 15 parts, 5 10 parts of firming agent, toughener 10 20 parts, ethanol 15 parts, number is mass fraction.In the conductive glue that the present invention provides, use polyimide resin as major ingredient, by design special composition stabilizer and conductive powder body, nitrile rubber and conductive powder body can strengthen the toughness of product and have excellent electric conductivity simultaneously so that product has the performance of high-quality.
Description
Technical field
The present invention relates to a kind of conductive glue, belong to LED silica gel technical field.
Background technology
Glue is the intermediate connecting bi-material, how occurs with water preparation, belongs to fine chemistry industry class, of a great variety, mainly with
Sizing, physical aspect, method for curing and the sorting technique of adherend material.(-1203 common winks do to common are instant glue
Glue-cyanacrylate strength instant adhesive is a kind of), epoxy bond class, anaerobism glue, UV glue (ultraviolet
Photocuring class), PUR, pressure sensitive adhesive, latex class etc..
Conductive glue is a kind of adhesive solidifying or having after drying certain electric conductivity, it generally with matrix resin and
Conductive filler i.e. conducting particles, for mainly comprising composition, is combined conducting particles by the bonding effect of matrix resin,
Form conductive path, it is achieved by being conductively connected of viscous material.Owing to the matrix resin of conductive glue is a kind of adhesive, permissible
Suitable solidification temperature is selected to carry out bonding, simultaneously as the height of the miniaturization of electronic component, miniaturization and printed circuit board (PCB)
Developing rapidly of densification and Highgrade integration, and conductive glue can make slurry, it is achieved the highest linear resolution.And
Conductive glue technique is simple, it is easy to operation, can improve production efficiency, so conductive glue is to substitute slicker solder welding, it is achieved lead
The ideal chose of electrical connection.
Summary of the invention
Purpose: for solving the deficiencies in the prior art, the present invention provides a kind of conductive glue.
Technical scheme: for solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of conductive glue, its raw material consists of: polyimide resin 20-40 part, conductive powder body 10-20 part, acetone 6-8 part,
Ethyl acetate 10-20 part, styrene 10-15 part, firming agent 5-10 part, toughener 10-20 part, ethanol 1-5 part, number is matter
Amount number.
Preferably, described conductive glue, it is characterised in that its raw material consists of: polyimide resin 30 parts,
Conductive powder body 15 parts, 7 parts of acetone, ethyl acetate 15 parts, styrene 12 parts, 8 parts of firming agent, toughener 15 parts, ethanol 13 parts,
Number is mass fraction.
Preferably, described conductive glue, it is characterised in that: described firming agent is the crosslinking of difunctional aziridine
Agent.
Preferably, described conductive glue, it is characterised in that: described firming agent is N, and N'-1,6-dihexyl is double
(1-aziridine) amide.
Preferably, described conductive glue, it is characterised in that: nitrile rubber selected by described toughener.
Beneficial effect: in the conductive glue that the present invention provides, employing polyimide resin is as major ingredient, special by design
Stable components agent and conductive powder body, nitrile rubber and conductive powder body can strengthen the toughness of product and have excellent conduction simultaneously
Property so that product has the performance of high-quality.Formed conductive path, make conductive glue have electric conductivity, in glue-line interparticle surely
Determine to contact to solidify due to conductive glue or be dried and cause.Conductive glue is before solidification or being dried, and conducting particles is at adhesive
In be separate exist, contact the most continuously, be therefore at state of insulation.Conductive glue solidification or dried, due to
The volatilization of solvent and the solidification of adhesive and cause the contraction of adhesive volume, make conducting particles each other in stable sequential like
State, thus show electric conductivity.
Detailed description of the invention
Below in conjunction with example, the present invention is illustrated:
Embodiment 1: a kind of conductive glue, forms as follows:
Polyimide resin 20 parts, conductive powder body 10 parts, 6 parts of acetone, ethyl acetate 10 parts, styrene 10 parts, 5 parts of firming agent,
Toughener 10 parts, ethanol 1 part, number is mass fraction.
Embodiment 2: a kind of conductive glue, forms as follows:
Polyimide resin 30 parts, conductive powder body 15 parts, 7 parts of acetone, ethyl acetate 15 parts, styrene 12 parts, 8 parts of firming agent,
Toughener 15 parts, ethanol 13 parts, number is mass fraction.
Embodiment 3: a kind of conductive glue, forms as follows:
Polyimide resin 40 parts, conductive powder body 20 parts, 8 parts of acetone, ethyl acetate 20 parts, styrene 15 parts, firming agent 10
Part, toughener 20 parts, ethanol 5 parts, number is mass fraction.
The product that above example obtains, through experiment test: in the conductive glue that the present invention provides, uses polyimides
Resin is as major ingredient, and by design special composition stabilizer and conductive powder body, nitrile rubber and conductive powder body can strengthen simultaneously
The toughness of product also has excellent electric conductivity so that product has the performance of high-quality, forms conductive path, makes conductive glue have
Conductive, in glue-line, interparticle stable contact causes due to conductive glue solidification or be dried.Conductive glue is in solidification
Or before being dried, conducting particles is to separate to exist in adhesive, contacts the most continuously, is therefore at state of insulation.
Conductive glue solidification or dried, causes the contraction of adhesive volume due to the volatilization of solvent and the solidification of adhesive, makes to lead
Charged particle is each other in stable continuous state, thus shows electric conductivity.
Below disclosing the present invention with preferred embodiment, so it is not intended to limiting the invention, all employing equivalents
Or the technical scheme that equivalent transformation mode is obtained, within all falling within protection scope of the present invention.
Claims (6)
1. a conductive glue, its raw material consists of: polyimide resin 20-40 part, conductive powder body 10-20 part, acetone 6-8
Part, ethyl acetate 10-20 part, styrene 10-15 part, firming agent 5-10 part, toughener 10-20 part, ethanol 1-5 part, number is equal
For mass fraction.
Conductive glue the most according to claim 1, it is characterised in that its raw material consists of: polyimide resin 30 parts, leads
Electricity powder body 15 parts, 7 parts of acetone, ethyl acetate 15 parts, styrene 12 parts, 8 parts of firming agent, toughener 15 parts, ethanol 13 parts, part
Number is mass fraction.
Conductive glue the most according to claim 1, it is characterised in that: described conductive powder body be gold, silver, copper, aluminum, zinc, ferrum,
The mixture of one or more in the powder of nickel, graphite powder.
Conductive glue the most according to claim 1, it is characterised in that: described firming agent is the crosslinking of difunctional aziridine
Agent.
Conductive glue the most according to claim 4, it is characterised in that: described firming agent is N, the double (1-of N'-1,6-dihexyl
Aziridine) amide.
Conductive glue the most according to claim 1, it is characterised in that: nitrile rubber selected by described toughener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719362.5A CN106281101A (en) | 2016-08-25 | 2016-08-25 | Conductive glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719362.5A CN106281101A (en) | 2016-08-25 | 2016-08-25 | Conductive glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106281101A true CN106281101A (en) | 2017-01-04 |
Family
ID=57616313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610719362.5A Pending CN106281101A (en) | 2016-08-25 | 2016-08-25 | Conductive glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106281101A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568598A (en) * | 2006-12-22 | 2009-10-28 | 第一毛织株式会社 | Electroconductive thermoplastic resin composition and plastic article |
| CN101778894A (en) * | 2007-08-08 | 2010-07-14 | 第一毛织株式会社 | electro-conductive thermoplastic resin compositions and articles manufactured therefrom |
| CN102746808A (en) * | 2012-07-27 | 2012-10-24 | 清华大学深圳研究生院 | High-conductivity graphene conducting resin and preparation method thereof |
| CN104371587A (en) * | 2014-10-28 | 2015-02-25 | 哈尔滨工业大学 | Conductive ceramic powder-based polyimide conductive rubber and preparation method thereof |
-
2016
- 2016-08-25 CN CN201610719362.5A patent/CN106281101A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568598A (en) * | 2006-12-22 | 2009-10-28 | 第一毛织株式会社 | Electroconductive thermoplastic resin composition and plastic article |
| CN101778894A (en) * | 2007-08-08 | 2010-07-14 | 第一毛织株式会社 | electro-conductive thermoplastic resin compositions and articles manufactured therefrom |
| CN102746808A (en) * | 2012-07-27 | 2012-10-24 | 清华大学深圳研究生院 | High-conductivity graphene conducting resin and preparation method thereof |
| CN104371587A (en) * | 2014-10-28 | 2015-02-25 | 哈尔滨工业大学 | Conductive ceramic powder-based polyimide conductive rubber and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
|
| RJ01 | Rejection of invention patent application after publication |