CN106281100A - Conductive glue slice - Google Patents
Conductive glue slice Download PDFInfo
- Publication number
- CN106281100A CN106281100A CN201610719193.5A CN201610719193A CN106281100A CN 106281100 A CN106281100 A CN 106281100A CN 201610719193 A CN201610719193 A CN 201610719193A CN 106281100 A CN106281100 A CN 106281100A
- Authority
- CN
- China
- Prior art keywords
- parts
- conductive
- conductive glue
- glue slice
- powder body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a kind of conductive glue slice, raw material consists of: ethylene-vinyl acetate copolymer 100 parts, conductive powder body 30 50 parts, coumarone indeneresin 20 30 parts, synthesizes paraffin resin 10 20 parts, Pulvis Talci 10 15 parts, 5 10 parts of firming agent, toughener 5 10 parts, styrene 15 parts, number is mass fraction.In the conductive glue slice that the present invention provides, use polyimide resin as major ingredient, by design special composition stabilizer and conductive powder body, nitrile rubber and conductive powder body can strengthen the toughness of product and have excellent electric conductivity simultaneously so that product has the performance of high-quality.
Description
Technical field
The present invention relates to a kind of conductive glue slice, belong to LED silica gel technical field.
Background technology
Glue is the intermediate connecting bi-material, how occurs with water preparation, belongs to fine chemistry industry class, of a great variety, mainly with
Sizing, physical aspect, method for curing and the sorting technique of adherend material.(-1203 common winks do to common are instant glue
Glue-cyanacrylate strength instant adhesive is a kind of), epoxy bond class, anaerobism glue, UV glue (ultraviolet
Photocuring class), PUR, pressure sensitive adhesive, latex class etc..
Conductive glue slice is a kind of adhesive solidifying or having after drying certain electric conductivity, it generally with matrix resin and
Conductive filler i.e. conducting particles, for mainly comprising composition, is combined conducting particles by the bonding effect of matrix resin,
Form conductive path, it is achieved by being conductively connected of viscous material.Owing to the matrix resin of conductive glue slice is a kind of adhesive, permissible
Suitable solidification temperature is selected to carry out bonding, simultaneously as the height of the miniaturization of electronic component, miniaturization and printed circuit board (PCB)
Developing rapidly of densification and Highgrade integration, and conductive glue slice can make slurry, it is achieved the highest linear resolution.And
Conductive glue slice technique is simple, it is easy to operation, can improve production efficiency, so conductive glue slice is to substitute slicker solder welding, it is achieved lead
The ideal chose of electrical connection.
Summary of the invention
Purpose: for solving the deficiencies in the prior art, the present invention provides a kind of conductive glue slice.
Technical scheme: for solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of conductive glue slice, its raw material consists of: ethylene-vinyl acetate copolymer 100 parts, conductive powder body 30-50 part, tonkabean
Ketone-indene resin 20-30 part, synthesis paraffin resin 10-20 part, Pulvis Talci 10-15 part, firming agent 5-10 part, toughener 5-10 part,
Styrene 1-5 part, number is mass fraction.
Preferably, described conductive glue slice, it is characterised in that its raw material consists of: ethene-vinyl acetate copolymerization
Body 100 parts, conductive powder body 40 parts, coumarone-indene resin 25 parts, synthesis paraffin resin 15 parts, Pulvis Talci 12 parts, 8 parts of firming agent,
Toughener 8 parts, styrene 3 parts, number is mass fraction.
Preferably, described conductive glue slice, it is characterised in that: described conductive powder body be gold, silver, copper, aluminum, zinc,
The mixture of one or more in ferrum, the powder of nickel, graphite powder.
Preferably, described conductive glue slice, it is characterised in that: described firming agent is the crosslinking of difunctional aziridine
Agent.
Preferably, described conductive glue slice, it is characterised in that: described firming agent is N, and N'-1,6-dihexyl is double
(1-aziridine) amide.
Preferably, described conductive glue slice, it is characterised in that: nitrile rubber selected by described toughener.
Beneficial effect: in the conductive glue slice that the present invention provides, employing polyimide resin is as major ingredient, special by design
Stable components agent and conductive powder body, nitrile rubber and conductive powder body can strengthen the toughness of product and have excellent conduction simultaneously
Property so that product has the performance of high-quality.Formed conductive path, make conductive glue slice have electric conductivity, in glue-line interparticle surely
Determine to contact to solidify due to conductive glue slice or be dried and cause.Before curing, conducting particles is point in adhesive conductive glue slice
From exist, contact the most continuously, be therefore at state of insulation.Conductive glue slice solidification or dried, due to solvent
Volatilization and the solidification of adhesive and cause the contraction of adhesive volume, make conducting particles each other in stable continuous state, because of
And show electric conductivity.
Detailed description of the invention
Below in conjunction with example, the present invention is illustrated:
Embodiment 1: a kind of conductive glue slice, forms as follows:
Ethylene-vinyl acetate copolymer 100 parts, conductive powder body 30 parts, coumarone-indene resin 20 parts, synthesize paraffin resin 10 parts,
Pulvis Talci 10 parts, 5 parts of firming agent, toughener 5 parts, styrene 1 part, number is mass fraction.
Embodiment 2: a kind of conductive glue slice, forms as follows:
Ethylene-vinyl acetate copolymer 100 parts, conductive powder body 40 parts, coumarone-indene resin 25 parts, synthesize paraffin resin 15 parts,
Pulvis Talci 12 parts, 8 parts of firming agent, toughener 8 parts, styrene 3 parts, number is mass fraction.
Embodiment 3: a kind of conductive glue slice, forms as follows:
Ethylene-vinyl acetate copolymer 100 parts, conductive powder body 50 parts, coumarone-indene resin 30 parts, synthesize paraffin resin 20 parts,
Pulvis Talci 15 parts, 10 parts of firming agent, toughener 10 parts, styrene 1-5 part, number is mass fraction.
The product that above example obtains, through experiment test: in the conductive glue slice that the present invention provides, uses polyimides
Resin is as major ingredient, and by design special composition stabilizer and conductive powder body, nitrile rubber and conductive powder body can strengthen simultaneously
The toughness of product also has excellent electric conductivity so that product has the performance of high-quality, forms conductive path, makes conductive glue slice have
Conductive, in glue-line, interparticle stable contact causes due to conductive glue slice solidification or be dried.Conductive glue slice is in solidification
Before, conducting particles is to separate to exist in adhesive, contacts the most continuously, is therefore at state of insulation.Conducting resinl
Sheet solidification or dried, causes the contraction of adhesive volume due to the volatilization of solvent and the solidification of adhesive, makes conducting particles
Each other in stable continuous state, thus show electric conductivity.
Below disclosing the present invention with preferred embodiment, so it is not intended to limiting the invention, all employing equivalents
Or the technical scheme that equivalent transformation mode is obtained, within all falling within protection scope of the present invention.
Claims (6)
1. a conductive glue slice, its raw material consists of: ethylene-vinyl acetate copolymer 100 parts, conductive powder body 30-50 part, tonkabean
Ketone-indene resin 20-30 part, synthesis paraffin resin 10-20 part, Pulvis Talci 10-15 part, firming agent 5-10 part, toughener 5-10 part,
Styrene 1-5 part, number is mass fraction.
Conductive glue slice the most according to claim 1, it is characterised in that its raw material consists of: ethylene-vinyl acetate copolymer
100 parts, conductive powder body 40 parts, coumarone-indene resin 25 parts, synthesize paraffin resin 15 parts, Pulvis Talci 12 parts, 8 parts of firming agent, increase
Tough dose 8 parts, styrene 3 parts, number is mass fraction.
Conductive glue slice the most according to claim 1, it is characterised in that: described conductive powder body be gold, silver, copper, aluminum, zinc, ferrum,
The mixture of one or more in the powder of nickel, graphite powder.
Conductive glue slice the most according to claim 1, it is characterised in that: described firming agent is the crosslinking of difunctional aziridine
Agent.
Conductive glue slice the most according to claim 4, it is characterised in that: described firming agent is N, the double (1-of N'-1,6-dihexyl
Aziridine) amide.
Conductive glue slice the most according to claim 1, it is characterised in that: nitrile rubber selected by described toughener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719193.5A CN106281100A (en) | 2016-08-25 | 2016-08-25 | Conductive glue slice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719193.5A CN106281100A (en) | 2016-08-25 | 2016-08-25 | Conductive glue slice |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106281100A true CN106281100A (en) | 2017-01-04 |
Family
ID=57615130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610719193.5A Pending CN106281100A (en) | 2016-08-25 | 2016-08-25 | Conductive glue slice |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106281100A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416505A (en) * | 2021-06-05 | 2021-09-21 | 昆山纳诺新材料科技有限公司 | EVA conductive hot melt adhesive and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101778894A (en) * | 2007-08-08 | 2010-07-14 | 第一毛织株式会社 | electro-conductive thermoplastic resin compositions and articles manufactured therefrom |
| CN102746808A (en) * | 2012-07-27 | 2012-10-24 | 清华大学深圳研究生院 | High-conductivity graphene conducting resin and preparation method thereof |
| CN102947893A (en) * | 2010-06-21 | 2013-02-27 | 迪睿合电子材料有限公司 | Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof |
| CN104059568A (en) * | 2013-03-20 | 2014-09-24 | 长春中科应化特种材料有限公司 | Hot melt adhesive capable of evacuating electric stress and production method thereof |
-
2016
- 2016-08-25 CN CN201610719193.5A patent/CN106281100A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101778894A (en) * | 2007-08-08 | 2010-07-14 | 第一毛织株式会社 | electro-conductive thermoplastic resin compositions and articles manufactured therefrom |
| CN102947893A (en) * | 2010-06-21 | 2013-02-27 | 迪睿合电子材料有限公司 | Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof |
| CN102746808A (en) * | 2012-07-27 | 2012-10-24 | 清华大学深圳研究生院 | High-conductivity graphene conducting resin and preparation method thereof |
| CN104059568A (en) * | 2013-03-20 | 2014-09-24 | 长春中科应化特种材料有限公司 | Hot melt adhesive capable of evacuating electric stress and production method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 陈孟楣: "《实用化工产品配方工艺手册 续一》", 30 June 1993 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416505A (en) * | 2021-06-05 | 2021-09-21 | 昆山纳诺新材料科技有限公司 | EVA conductive hot melt adhesive and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101812280B (en) | Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method | |
| WO2010073885A1 (en) | Film adhesive and anisotropic conductive adhesive | |
| JP2007091959A (en) | Anisotropically conductive adhesive | |
| JP4998732B2 (en) | Anisotropic conductive adhesive | |
| CN105390219A (en) | Component with over-voltage over-current protective effect and manufacturing process of the same | |
| JP2013163747A (en) | Liquid resin composition for sealing semiconductor, and semiconductor device | |
| CN107735477A (en) | Conductive adhesive, conductive structure and electronic unit | |
| JP2007056209A (en) | Adhesive for circuit connection | |
| CN106281100A (en) | Conductive glue slice | |
| CN110922939A (en) | Organosilicon gel with conductivity | |
| CN104017511B (en) | The preparation method of epoxide resin conductive adhesive film | |
| WO2015099049A1 (en) | Conductive paste and conductive film | |
| CN106281101A (en) | Conductive glue | |
| CN101440266B (en) | Surface mount adhesive for surface mount technology and preparation method thereof | |
| CN101735558A (en) | Glue solution for copper-clad plate | |
| CN105969296A (en) | Conductive adhesive | |
| JP2010024416A (en) | Adhesive for connecting electrodes | |
| CN106147631A (en) | A kind of conductive glue | |
| CN106281102A (en) | Conducting resinl | |
| CN104371616A (en) | Preparation method of phenolic resin conductive adhesive | |
| JP4867805B2 (en) | Adhesive for electrode connection | |
| CN106047229A (en) | Preparation method of conductive adhesive | |
| JP2680412B2 (en) | Anisotropic conductive film | |
| CN101805576B (en) | Epoxy-resin single-component soft adhesive | |
| CN105860882A (en) | Conductive adhesive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |