CN106257697A - 一种量子点膜及其制备方法 - Google Patents
一种量子点膜及其制备方法 Download PDFInfo
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- CN106257697A CN106257697A CN201610793864.2A CN201610793864A CN106257697A CN 106257697 A CN106257697 A CN 106257697A CN 201610793864 A CN201610793864 A CN 201610793864A CN 106257697 A CN106257697 A CN 106257697A
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- quantum dot
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- 239000002096 quantum dot Substances 0.000 title claims abstract description 130
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 189
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 84
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 84
- 239000001301 oxygen Substances 0.000 claims abstract description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 82
- 230000004888 barrier function Effects 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000011241 protective layer Substances 0.000 claims abstract description 47
- 239000010408 film Substances 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 239000010409 thin film Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 22
- 239000002861 polymer material Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 12
- 238000007865 diluting Methods 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000009970 fire resistant effect Effects 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 11
- 239000012528 membrane Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920005570 flexible polymer Polymers 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 230000032683 aging Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
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- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
Description
灰度变化 | 100h | 200h | 300h | 400h | 500h |
实施例4 | -3.3% | -5.5% | -7.9% | -10.2% | -13% |
实施例5 | -5.3% | -9.2% | -13.7% | -18.1% | -23.3% |
实施例6 | -2.1% | -3.5% | -5.7% | -7.2% | -9.3% |
Claims (10)
Priority Applications (1)
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CN201610793864.2A CN106257697A (zh) | 2016-08-31 | 2016-08-31 | 一种量子点膜及其制备方法 |
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CN201610793864.2A CN106257697A (zh) | 2016-08-31 | 2016-08-31 | 一种量子点膜及其制备方法 |
Publications (1)
Publication Number | Publication Date |
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CN106257697A true CN106257697A (zh) | 2016-12-28 |
Family
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Family Applications (1)
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CN201610793864.2A Pending CN106257697A (zh) | 2016-08-31 | 2016-08-31 | 一种量子点膜及其制备方法 |
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CN (1) | CN106257697A (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653985A (zh) * | 2017-02-20 | 2017-05-10 | 天津市中环量子科技有限公司 | 一种多层封装的量子点led结构 |
CN106855199A (zh) * | 2017-02-04 | 2017-06-16 | 苏州星烁纳米科技有限公司 | 一种量子点膜及背光模组 |
CN108400223A (zh) * | 2018-05-07 | 2018-08-14 | 深圳技术大学(筹) | 发光二极管封装结构、量子点密封单元及其制备方法 |
CN108957844A (zh) * | 2017-05-25 | 2018-12-07 | 张家港康得新光电材料有限公司 | 量子点膜、背光模组及液晶显示装置 |
CN109616577A (zh) * | 2018-10-26 | 2019-04-12 | 纳晶科技股份有限公司 | 一种量子点膜及其制备方法 |
CN111952426A (zh) * | 2020-07-21 | 2020-11-17 | 广东广腾达科技有限公司 | 一种量子点发光二极管及其封装方法 |
WO2021225017A1 (ja) * | 2020-05-08 | 2021-11-11 | 東レエンジニアリング株式会社 | 量子ドット構造体および量子ドット構造体の製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200629974A (en) * | 2005-02-02 | 2006-08-16 | Au Optronics Corp | Encapsulation structure of organic electroluminescence device |
JP2013033833A (ja) * | 2011-08-01 | 2013-02-14 | Panasonic Corp | 波長変換膜及びそれを用いた発光装置並びに照明装置 |
CN103852817A (zh) * | 2014-03-14 | 2014-06-11 | 宁波激智科技股份有限公司 | 一种应用于背光模组的量子点膜 |
CN104777669A (zh) * | 2015-04-24 | 2015-07-15 | 张家港康得新光电材料有限公司 | 量子点膜及背光模组 |
CN105058909A (zh) * | 2015-08-14 | 2015-11-18 | 纳晶科技股份有限公司 | 荧光膜结构、其制作方法及显示器件 |
CN105098002A (zh) * | 2015-06-16 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种光刻胶、量子点层图案化的方法及qled、量子点彩膜和显示装置 |
CN105182610A (zh) * | 2015-10-19 | 2015-12-23 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
JP2016141024A (ja) * | 2015-02-02 | 2016-08-08 | 三菱樹脂株式会社 | 電子部材用封止フィルム |
-
2016
- 2016-08-31 CN CN201610793864.2A patent/CN106257697A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200629974A (en) * | 2005-02-02 | 2006-08-16 | Au Optronics Corp | Encapsulation structure of organic electroluminescence device |
JP2013033833A (ja) * | 2011-08-01 | 2013-02-14 | Panasonic Corp | 波長変換膜及びそれを用いた発光装置並びに照明装置 |
CN103852817A (zh) * | 2014-03-14 | 2014-06-11 | 宁波激智科技股份有限公司 | 一种应用于背光模组的量子点膜 |
JP2016141024A (ja) * | 2015-02-02 | 2016-08-08 | 三菱樹脂株式会社 | 電子部材用封止フィルム |
CN104777669A (zh) * | 2015-04-24 | 2015-07-15 | 张家港康得新光电材料有限公司 | 量子点膜及背光模组 |
CN105098002A (zh) * | 2015-06-16 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种光刻胶、量子点层图案化的方法及qled、量子点彩膜和显示装置 |
CN105058909A (zh) * | 2015-08-14 | 2015-11-18 | 纳晶科技股份有限公司 | 荧光膜结构、其制作方法及显示器件 |
CN105182610A (zh) * | 2015-10-19 | 2015-12-23 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106855199A (zh) * | 2017-02-04 | 2017-06-16 | 苏州星烁纳米科技有限公司 | 一种量子点膜及背光模组 |
CN106855199B (zh) * | 2017-02-04 | 2019-12-17 | 苏州星烁纳米科技有限公司 | 一种量子点膜及背光模组 |
CN106653985A (zh) * | 2017-02-20 | 2017-05-10 | 天津市中环量子科技有限公司 | 一种多层封装的量子点led结构 |
CN108957844A (zh) * | 2017-05-25 | 2018-12-07 | 张家港康得新光电材料有限公司 | 量子点膜、背光模组及液晶显示装置 |
CN108400223A (zh) * | 2018-05-07 | 2018-08-14 | 深圳技术大学(筹) | 发光二极管封装结构、量子点密封单元及其制备方法 |
CN109616577A (zh) * | 2018-10-26 | 2019-04-12 | 纳晶科技股份有限公司 | 一种量子点膜及其制备方法 |
WO2021225017A1 (ja) * | 2020-05-08 | 2021-11-11 | 東レエンジニアリング株式会社 | 量子ドット構造体および量子ドット構造体の製造方法 |
CN111952426A (zh) * | 2020-07-21 | 2020-11-17 | 广东广腾达科技有限公司 | 一种量子点发光二极管及其封装方法 |
CN111952426B (zh) * | 2020-07-21 | 2022-03-25 | 广东广腾达科技有限公司 | 一种量子点发光二极管及其封装方法 |
TWI762316B (zh) * | 2020-07-21 | 2022-04-21 | 台灣奈晶股份有限公司 | 一種量子點發光二極體及其封裝方法 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Yu Zhen Inventor after: Li Shuo Inventor after: Peng Juan Inventor after: Ding Qinghua Inventor after: Cao Yingjie Inventor after: Cheng Wu Inventor after: Lv Yonghe Inventor before: Yu Zhen Inventor before: Li Shuo Inventor before: Peng Juan Inventor before: Ding Qinghua Inventor before: Cao Yingjie Inventor before: Cheng Wu Inventor before: Chen Chen |
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RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161228 |