CN106252319A - 一种铜基键合引线及其生产工艺 - Google Patents
一种铜基键合引线及其生产工艺 Download PDFInfo
- Publication number
- CN106252319A CN106252319A CN201610636350.6A CN201610636350A CN106252319A CN 106252319 A CN106252319 A CN 106252319A CN 201610636350 A CN201610636350 A CN 201610636350A CN 106252319 A CN106252319 A CN 106252319A
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- China
- Prior art keywords
- cuprio
- bonding wire
- wire
- production technology
- mold work
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Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 23
- 238000002844 melting Methods 0.000 claims abstract description 14
- 230000008018 melting Effects 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 238000002161 passivation Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011241 protective layer Substances 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 7
- 229910052738 indium Inorganic materials 0.000 claims abstract description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 239000011574 phosphorus Substances 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000002485 combustion reaction Methods 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 22
- 238000005266 casting Methods 0.000 claims description 21
- 238000000137 annealing Methods 0.000 claims description 19
- 206010037660 Pyrexia Diseases 0.000 claims description 18
- 239000000839 emulsion Substances 0.000 claims description 11
- 238000005491 wire drawing Methods 0.000 claims description 11
- 238000005461 lubrication Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- DYUQAZSOFZSPHD-UHFFFAOYSA-N Phenylpropyl alcohol Natural products CCC(O)C1=CC=CC=C1 DYUQAZSOFZSPHD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- -1 phenylpropyl alcohol triazole Chemical class 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 1
- 230000003026 anti-oxygenic effect Effects 0.000 abstract description 3
- 239000011573 trace mineral Substances 0.000 abstract description 2
- 235000013619 trace mineral Nutrition 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 13
- 229910052737 gold Inorganic materials 0.000 description 11
- 239000010931 gold Substances 0.000 description 11
- 241000218202 Coptis Species 0.000 description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000011161 development Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610636350.6A CN106252319B (zh) | 2016-08-05 | 2016-08-05 | 一种铜基键合引线及其生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610636350.6A CN106252319B (zh) | 2016-08-05 | 2016-08-05 | 一种铜基键合引线及其生产工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106252319A true CN106252319A (zh) | 2016-12-21 |
CN106252319B CN106252319B (zh) | 2018-08-28 |
Family
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Family Applications (1)
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CN201610636350.6A Expired - Fee Related CN106252319B (zh) | 2016-08-05 | 2016-08-05 | 一种铜基键合引线及其生产工艺 |
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CN (1) | CN106252319B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108118182A (zh) * | 2017-12-30 | 2018-06-05 | 安徽晋源铜业有限公司 | 一种集成电路封装用镀钯铜线的加工方法 |
CN108231243A (zh) * | 2017-12-30 | 2018-06-29 | 安徽晋源铜业有限公司 | 一种镀银超细铜丝及其制备方法 |
CN109047349A (zh) * | 2018-08-22 | 2018-12-21 | 湖州南浔钰盛博金属材料有限公司 | 铜丝生产防氧化加工工艺 |
CN109263130A (zh) * | 2018-09-19 | 2019-01-25 | 北京大学东莞光电研究院 | 一种石墨烯合金线材的制造方法 |
CN109411437A (zh) * | 2018-09-14 | 2019-03-01 | 汕头市骏码凯撒有限公司 | 一种具有表面复合膜的银合金线及其制作方法 |
CN111057900A (zh) * | 2020-01-09 | 2020-04-24 | 绍兴市力博科技有限公司 | 一种极细同轴电缆用铜合金线材的制备方法 |
CN111118334A (zh) * | 2020-01-09 | 2020-05-08 | 绍兴市力博科技有限公司 | 一种电缆用耐疲劳铜合金线材的制备方法 |
CN111167876A (zh) * | 2020-01-09 | 2020-05-19 | 绍兴市力博科技有限公司 | 一种电缆用耐疲劳无氧铜线材的制备方法 |
CN111519227A (zh) * | 2020-03-30 | 2020-08-11 | 安徽广宇电子材料有限公司 | 一种键合线制备用铜丝材料的抗氧化处理设备 |
CN115213076A (zh) * | 2022-05-27 | 2022-10-21 | 池州学院 | 一种新型镀钯键合无氧铜线的制备方法 |
CN117230415A (zh) * | 2023-01-17 | 2023-12-15 | 合肥中晶新材料有限公司 | 一种半导体封装用键合铜钯合金丝及其制作方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110011618A1 (en) * | 2006-08-31 | 2011-01-20 | Nippon Steel Materials Co., Ltd. | Copper alloy bonding wire for semiconductor device |
CN101707194B (zh) * | 2009-11-11 | 2011-11-23 | 宁波康强电子股份有限公司 | 一种镀钯键合铜丝的制造方法 |
CN102263038A (zh) * | 2011-08-19 | 2011-11-30 | 张若京 | 键合铜丝在生产过程中的表面处理技术 |
-
2016
- 2016-08-05 CN CN201610636350.6A patent/CN106252319B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110011618A1 (en) * | 2006-08-31 | 2011-01-20 | Nippon Steel Materials Co., Ltd. | Copper alloy bonding wire for semiconductor device |
CN101707194B (zh) * | 2009-11-11 | 2011-11-23 | 宁波康强电子股份有限公司 | 一种镀钯键合铜丝的制造方法 |
CN102263038A (zh) * | 2011-08-19 | 2011-11-30 | 张若京 | 键合铜丝在生产过程中的表面处理技术 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108118182A (zh) * | 2017-12-30 | 2018-06-05 | 安徽晋源铜业有限公司 | 一种集成电路封装用镀钯铜线的加工方法 |
CN108231243A (zh) * | 2017-12-30 | 2018-06-29 | 安徽晋源铜业有限公司 | 一种镀银超细铜丝及其制备方法 |
CN108231243B (zh) * | 2017-12-30 | 2019-11-19 | 安徽晋源铜业有限公司 | 一种镀银超细铜丝及其制备方法 |
CN109047349A (zh) * | 2018-08-22 | 2018-12-21 | 湖州南浔钰盛博金属材料有限公司 | 铜丝生产防氧化加工工艺 |
CN109411437A (zh) * | 2018-09-14 | 2019-03-01 | 汕头市骏码凯撒有限公司 | 一种具有表面复合膜的银合金线及其制作方法 |
CN109263130A (zh) * | 2018-09-19 | 2019-01-25 | 北京大学东莞光电研究院 | 一种石墨烯合金线材的制造方法 |
CN111057900A (zh) * | 2020-01-09 | 2020-04-24 | 绍兴市力博科技有限公司 | 一种极细同轴电缆用铜合金线材的制备方法 |
CN111118334A (zh) * | 2020-01-09 | 2020-05-08 | 绍兴市力博科技有限公司 | 一种电缆用耐疲劳铜合金线材的制备方法 |
CN111167876A (zh) * | 2020-01-09 | 2020-05-19 | 绍兴市力博科技有限公司 | 一种电缆用耐疲劳无氧铜线材的制备方法 |
CN111519227A (zh) * | 2020-03-30 | 2020-08-11 | 安徽广宇电子材料有限公司 | 一种键合线制备用铜丝材料的抗氧化处理设备 |
CN111519227B (zh) * | 2020-03-30 | 2021-02-23 | 安徽广宇电子材料有限公司 | 一种键合线制备用铜丝材料的抗氧化处理设备 |
CN115213076A (zh) * | 2022-05-27 | 2022-10-21 | 池州学院 | 一种新型镀钯键合无氧铜线的制备方法 |
CN117230415A (zh) * | 2023-01-17 | 2023-12-15 | 合肥中晶新材料有限公司 | 一种半导体封装用键合铜钯合金丝及其制作方法和应用 |
CN117230415B (zh) * | 2023-01-17 | 2024-03-19 | 合肥中晶新材料有限公司 | 一种半导体封装用键合铜钯合金丝及其制作方法和应用 |
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CN106252319B (zh) | 2018-08-28 |
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Effective date of registration: 20180718 Address after: 528200 Songgang South Pine Industrial Park, Shihshan Town, Nanhai District, Foshan, Guangdong Applicant after: FOSHAN NANHAI SONGGANG NEW ASIA-PACIFIC COPPER INDUSTRY Co.,Ltd. Address before: 510000 Guangdong science and Technology Industrial Development Zone, Guangzhou, 231 and 233 podium B1B2 Building 1, two, three, four Applicant before: BOAO ZONGHENG NETWORK TECHNOLOGY Co.,Ltd. Effective date of registration: 20180718 Address after: 510000 Guangdong science and Technology Industrial Development Zone, Guangzhou, 231 and 233 podium B1B2 Building 1, two, three, four Applicant after: BOAO ZONGHENG NETWORK TECHNOLOGY Co.,Ltd. Address before: 312000 East Street of Yucheng City, Shaoxing, Zhejiang Province, No. 153 Applicant before: Xu Gaolei |
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