CN106249007A - Probe module with feedback test function - Google Patents
Probe module with feedback test function Download PDFInfo
- Publication number
- CN106249007A CN106249007A CN201610390456.2A CN201610390456A CN106249007A CN 106249007 A CN106249007 A CN 106249007A CN 201610390456 A CN201610390456 A CN 201610390456A CN 106249007 A CN106249007 A CN 106249007A
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- cabling
- probe
- adaptor
- groove
- test function
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- 239000000523 sample Substances 0.000 title claims abstract description 130
- 238000012360 testing method Methods 0.000 title claims abstract description 85
- 230000001939 inductive effect Effects 0.000 claims abstract description 43
- 238000005452 bending Methods 0.000 claims description 12
- 238000010079 rubber tapping Methods 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 abstract description 13
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 description 23
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Abstract
The invention discloses a probe module with a feedback test function, which is arranged between a printed circuit board and an electronic device to be tested; it includes a connecting member, two inductive elements, two traces and two probes. The adapter is provided with two connecting lines; the two inductive elements are arranged on the adapter, each inductive element is provided with two ends, and one end of each inductive element is electrically connected with the connecting line; the two wires are arranged on the adapter and are respectively connected with the other end of each inductive element, wherein the two wires are close to each other but not in contact with each other and at least partially overlapped in a vertical projection direction; one end of each probe is electrically connected with one wire, and the other end of each probe is used for point contact with the electronic device to be tested. Therefore, the signal transmission path can be switched by the signal frequency difference, and the transmission path at high frequency is effectively shortened.
Description
Technical field
The present invention is relevant with probe module, particularly to a kind of probe module possessing feedback test function.
Background technology
Press, for detecting the method that the electric connection between each precision electronic element of electronic product is the most certain, be with one
Probe card is as the coffret of the test signal between a detection device and electronic devices under test with power supply signal.
And along with the progress of digital technology, the instruction cycle of electronic devices under test increases the most day by day with working transmission per second
Greatly, and make to detect the frequency of the processor produced test signal of device, and needed for electronic devices under test cannot being met
The working transmission demand of high frequency test signals.Therefore, for solving above-mentioned puzzlement, electronic devices under test itself is then utilized to produce
Required high frequency test signals, then send back electronic devices under test by probe card and detect, and then reach high-frequency test
Purpose.
But well known, resistance when signal line is the longest, when can make high frequency signal transmission, on signal path
Anti-value is relatively big, in turn results in line loss and promotes so that the test signal of high frequency cannot pass through, and then causes signal to be difficult to
By the identification of electronic devices under test institute, and the situation of test erroneous judgement is easily had to produce.
Summary of the invention
In view of this, it is an object of the invention to provide a kind of probe module possessing feedback test function, effectively to subtract
Signal path lengths during few high frequency signal transmission.
For reaching above-mentioned purpose, the probe module possessing feedback test function provided by the present invention, it is located at a printing electricity
Between road plate and an electronic devices under test；This probe module include an adaptor, two inductive elements, one first cabling,
One second cabling, one first probe and one second probe.This adaptor, is provided with two connection lines；This two inductive element
Being arranged at this adaptor, respectively this inductive element has two ends, and wherein one end is electrically connected with this connection line；This first cabling
It is arranged at this adaptor, and is connected with the other end of wherein this inductive element；This second cabling, is arranged at this adaptor,
And be connected with the other end of another this inductive element；This first probe one end is electrically connected with this first cabling, and the other end supplies
Tap the tested position of this electronic devices under test；This second probe one end is electrically connected with this second cabling, and the other end is for tapping
The tested position of this electronic devices under test；Wherein, this first cabling is close to each other with this second cabling but does not contacts, and hangs down one
Directly least partially overlapped on projecting direction.
The probe module of another offer one back coupling test function of the present invention, is located at a printed circuit board (PCB) and an electronics to be measured
Between device；This probe module includes an adaptor, one first cabling, one second cabling, a capacitive element, one first spy
Pin and one second probe.This adaptor is provided with two connection lines；This first cabling has one first bending segment, and this first is walked
Line one end connects wherein this connection line；This second cabling has one second bending segment, and this second cabling one end connects another
This connection line；This capacitive element has the other end of one first end and one second end, this first end and this first cabling
Connecting, this second end is connected with the other end of this second cabling；This first probe one end is electric with the first end of this capacitive element
Property connect, the other end is for tapping the tested position of this electronic devices under test；The of this second probe one end and this capacitive element
Two ends are electrically connected with, and the other end is for tapping the tested position of this electronic devices under test.
Accordingly, by above-mentioned design, when probe module carries out signal testing, whether low-frequency test or high-frequency test, all
Good signal detection effect and reliability can be obtained.
Accompanying drawing explanation
Fig. 1 is the probe card configuration figure of the probe module of first embodiment of the invention；
Fig. 2 is the top view of adaptor second, discloses the structure of circuit layout；
Fig. 3 is that the structure of Fig. 1 is in transmission direct current or the signal transmission path schematic diagram of low frequency signal；
Fig. 4 is that the structure of Fig. 1 is in the signal transmission path schematic diagram of transmission high-frequency signal；
Fig. 5 is the probe card configuration figure of the probe module of second embodiment of the invention；
Fig. 6 is the probe card configuration figure of the probe module of third embodiment of the invention；
Fig. 7 is the probe card configuration figure of the probe module of fourth embodiment of the invention；
Fig. 8 is the probe card configuration figure of the probe module of fifth embodiment of the invention；
Fig. 9 is the probe card configuration figure of the probe module of sixth embodiment of the invention；
Figure 10 is the probe card configuration figure of the probe module of seventh embodiment of the invention；
Figure 11 is the top view of Figure 10 adaptor second, discloses the first cabling and the structure of the second cabling；
Figure 12 is that the structure of Figure 10 is in transmission direct current or the signal transmission path schematic diagram of low frequency signal；
Figure 13 is that the structure of Figure 10 is in the signal transmission path schematic diagram of transmission high-frequency signal；
Figure 14 is the probe card configuration figure of the probe module of eighth embodiment of the invention；
Figure 15 is the probe card configuration figure of the probe module of ninth embodiment of the invention；
Figure 16 is the probe card configuration figure of the probe module of tenth embodiment of the invention；
Figure 17 is the probe card configuration figure of the probe module of eleventh embodiment of the invention；
Figure 18 is equivalent-circuit model figure.
[description of reference numerals]
1 detection device 1a detection terminal
2 electronic devices under test
10 printed circuit board (PCB)s
12,14 signal line
20 adaptors
First 20b of 20a second
20b1,20b2 groove 20c the 3rd
21～24 connection line 23a contact 24a contacts
25,26 circuit
30 needle stands
42 first probe 42a contacts
44 second probe 44a contacts
50 circuit layouts
52 first cabling 54 second cablings
60 adaptors
61 adaptors
First 61a1,61a2 groove of 61a
62 adaptors
The 3rd 62a1 groove of 62a
62b fourth face 62b1 groove
63 adaptors
First 63a1,63a2 groove of 63a
Second 63c of 63b the 3rd
64 adaptors
64a second 64c of first 64b the 3rd
64c1,64c2 groove
70 adaptors
70a second 70b1 groove of first 70b
70c the 3rd
71～74 connection lines
71a, 72a contact
82 first cabling 82a the first bending segments
84 second cabling 84a the second bending segments
90 adaptors
91 adaptors
First 91a1 groove of 91a
92 adaptors
92a second 92c of first 92b the 3rd
92c1 groove
93 adaptors
First 93a1 groove of 93a
Second 93c of 93b the 3rd
101,102 circuit
201,202 terminated line
C capacitive element
L1, L2 inductive element
P upright projection
Detailed description of the invention
For the present invention can be illustrated more clearly that, after hereby lifting preferred embodiment and coordinating diagram to describe in detail such as.Please join Fig. 1 institute
Showing, the probe card of first preferred embodiment of the invention is arranged between a detection device 1 and an electronic devices under test 2, and bag
Containing printed circuit board (PCB) 10 and a probe module.This printed circuit board (PCB) 10 is laid with several signal lines, and such letter
One end of number circuit is connected with for the detection terminal 1a with this detection device 1, and the other end is then in the end of this printed circuit board (PCB) 10
Face forms contact respectively, wherein, for purposes of illustration only, be hereby main with two bars circuits 12,14.This probe module then includes
One adaptor 20, needle stand 30,1 first probe 42,1 second probe 44, two inductive element L1, L2, a circuit layout 50.
Wherein:
This adaptor 20 is arranged between printed circuit board (PCB) 10 and needle stand 30, as the signal line of printed circuit board (PCB) 10
Between 12,14 and first, second probes 42,44, the switching of signal transmission is used.In the present embodiment, this adaptor 20 is more than one
Layer ceramic wafer, but be not limited, also can be an organic support plate of multilamellar.This adaptor 20 have back to one first 20a
With one second 20b, and one the 3rd 20c between this first 20a and this second 20b, this first 20a face
To this printed circuit board (PCB) 10, this second 20b in the face of this electronic devices under test 2, and this second 20b is recessed is formed with two grooves
20b1、20b2。
This adaptor 20 is provided with several connection lines, and for purposes of illustration only, hereby based on four connection lines 21～24.Should
One end of two connection lines 21,22 connects with respectively this signal line 12,14 of this printed circuit board (PCB) 10 respectively, and the other end is then at this
The groove face of two groove 20b1,20b2 forms a contact respectively；Other two connection line 23,24 one end in this two groove 20b1,
The groove face of 20b2 forms a contact respectively, and the other end is then formed with contact 23a the second of this adaptor 20 20b vicinity,
24a (Fig. 2 reference).
This needle stand 30 is a hollow shell, and is located at the top of this electronic devices under test 2, with for this first probe 42 with
This second probe 44 is arranged, and reaches to fix the effect of the spacing of those probes 42,44 according to this.And this first, second probe 42,44
Top and bottom protrude out the most respectively outside this needle stand 30, and the top of this first probe 42 connects this adaptor 20 second
The contact 42a of 20b, and it is electrically connected with this connection line 22 one end；The top of this second probe 44 connects this adaptor 20 second
The contact 44a of face 20b, and it is electrically connected with this connection line 24.And respectively the bottom of this probe 42,44 supplies to tap this electronics to be measured dress
Put the tested position of 2.
This two inductive element L1, L2 are respectively a choke coil (choke) in the present embodiment, but also can use coil
(coil), winding (Winding) or magnetic bead (Bead) etc. have the element replacement of inductance characteristic.This inductive element L1 is arranged
In this groove 20b1, and one end is connected in the contact of groove face with connection line 21, and the other end and connection line 23 are in groove face
Contact connects；Another inductive element L2 is arranged in another groove 20b2, and one end and connection line 22 are in the contact of groove face
Connecting, the other end is connected in the contact of groove face with connection line 24.Accordingly, this two inductive element L1, L2 passes through connection line
And it is electrically connected to this printed circuit board (PCB) 10.
This circuit layout 50 is arranged at second 20b of this adaptor 20.Refer to shown in Fig. 2, it includes one first
Cabling 52 and one second cabling 54.This first cabling 52 is the surface being printed on adaptor 20 with copper sheet with this second cabling 54
And formed, and in other embodiments, also can be by other modes, if other metal materials, tool conductive characteristic material are with transfer, pressure
Print or thin-film technique mode and formed.This first cabling 52 in flake, one end by circuit 25 with contact 23a and contact
42a is electrically connected with: this second cabling 54 one end is electrically connected with contact 24a and contact 44a by circuit 26.Wherein, should
First cabling 52 is close to each other with this second cabling 54 but does not contacts, and the partial portion of this second cabling 54 is positioned at this and first walks
In the range of upright projection P of line 52.
It is noted that in other application, this first cabling 52 and this second cabling 54 also can be not required to pass through line
Road 25,26 are just connected with contact, and directly can be electrically connected with connection line 23 respectively and be electrically connected with connection line 24.According to
This, can reduce the signal loss when transmitting via line.
Accordingly, when the detection terminal 1a of this detection device 1 exports direct current or low frequency test signal, this two inductive element
L1, L2 are in short circuit or the state of low resistance, and signal can directly pass through；And this first cabling 52 and this second cabling 54 be not because
It is electrically connected with, therefore to the signal section of being road or high impedance status.Therefore signal transmission path is as it is shown on figure 3, test signal is by examining
Survey the detection terminal 1a of device 1 through the signal line 12 of this printed circuit board (PCB) 10, the connection line 21 of this adaptor 20, inductance
Property element L1, connection line 23 to the first probe 42, flow through this electronic devices under test 2 again back through the second probe 44, connect
The signal line 14 of circuit 24, inductive element L2, connection line 22 and printed circuit board (PCB) 10 returns to the inspection of this detection device 1
Survey terminal 1a, make the formation loop, path of test signal reach the purpose of detection.
It addition, when this electronic devices under test 2 is intended to carry out oneself's detection and exports the test signal of high frequency, believe for high frequency
For number, this two inductive element L1, L2 can present the state of open circuit or high impedance.And due to first in this circuit layout 50
Cabling 52 is very close to each other with the second cabling 54 but does not contacts, and has overlap on the P of upright projection direction, therefore, at high frequency
Time, this first cabling 522 can produce the characteristic of similar electric capacity with this second cabling 54, for high-frequency signal, and this circuit cloth
Office 50 is in short-circuit or low-impedance state.Therefore signal transmission path is as shown in Figure 4, when test signal is filled by electronics to be measured
After putting 2 outputs, after the first probe 42 and circuit layout 50, then it is back to this electronic devices under test 2 by the second probe 44,
And make to test signal and can form test loop by extremely short path, and then reach the purpose of oneself's detection.
Fig. 5 show the probe card of second embodiment of the invention, and it has the knot being approximately identical to aforementioned first embodiment
Structure.Except for the difference that, its inductive element L1, L2 are embedded in the interior of this adaptor 60.Wherein, each inductive element L1, L2 and electricity
The connection pass of road layout 50 is identical with first embodiment, does not repeats in this appearance.
Fig. 6 show the probe card of third embodiment of the invention, and it has the knot being approximately identical to aforementioned first embodiment
Structure.Except for the difference that, recessed two groove 61a1, the 61a2 that are formed of first 61a of its adaptor 61, and its inductive element L1,
L2 is respectively arranged at respectively in this groove 61a1,61a2.Wherein, each inductive element L1, L2 and the annexation of circuit layout 50
Identical with first embodiment, do not repeat in this appearance.Additionally, on first of adaptor 61, also the most recessed one can be formed with recessed
Groove, and this inductive element L1, L2 are all arranged in same groove, and there is the effect saving wiring space.
Fig. 7 show the probe card of fourth embodiment of the invention, and it has the knot being approximately identical to aforementioned first embodiment
Structure.Except for the difference that, adaptor 62 is between first in the face of printed circuit board (PCB) and second in the face of electronic devices under test
The 3rd 62a on, and with the 3rd 62a phase back to fourth face 62b on, the most recessed be formed a groove 62a1,
62b1.And each inductive element L1, L2 are respectively arranged at respectively in this groove 62a1,62b1.Wherein, each inductive element L1, L2
Identical with first embodiment with the annexation of circuit layout 50, do not repeat in this appearance.Additionally, this inductive element L1, L2 are also
May be disposed on same side, in the most same groove, and be effectively reduced the space taking this adaptor.
Referring to shown in Fig. 8, for the probe card of fifth embodiment of the invention, it is with previous embodiment difference,
Its circuit layout 50 is arranged at adaptor 63 on first 63a of this printed circuit board (PCB) 10；And in first recessed formation
There are two groove 63a1,63a2, and inductive element L1, L2 are then respectively arranged at respectively in this groove 63a1,63a2.Wherein this two electricity
Inductive element L1, L2 are connected with the signal line of printed circuit board (PCB), Yi Jiyu again by the connection line on adaptor
This circuit layout 50 is electrically connected with, and is electrically connected with first probe the 42, second probe 44 the most respectively.It addition, this two inductance
Property element L1, L2 also may be disposed at adaptor 63 in the face of second 63b of electronic devices under test 2, or be arranged between first
On the 3rd 63c between face 63a and second 63b, do not repeat in this appearance.
Referring to shown in Fig. 9, for the probe card of sixth embodiment of the invention, it has and is approximately identical to previous embodiment
Structure.Adaptor 64 have back to one first 64a and one second 64b, and be positioned at this first 20a with this second
The 3rd 64c of between the 64b of face 1, this first 20a are in the face of this printed circuit board (PCB) 10, and this second 20b is in the face of this electricity to be measured
Sub-device 2.Being in previous embodiment difference, its circuit layout 50 is arranged on the 3rd 64c；And in the 3rd
64c is recessed is formed with two groove 64c1,64c2, and inductive element L1, L2 are respectively arranged at respectively in this groove 64c1,64c2.Its
In, each inductive element L1, L2 electrically connect again by the connection line on adaptor with the annexation of circuit layout 50
Connect, and roughly the same with previous embodiment, repeat no more in this.Other one is mentioned that, this two inductive element L1, L2 also can divide
Or be not simultaneously arranged at first 64a of this adaptor 64, second 64b and the one of which of the 3rd 64c, and not as
Limit.
Refer to shown in Figure 10, for seventh embodiment of the invention probe card, be arranged at a detection device 1 and and treat
Survey between electronic installation 2, and include printed circuit board (PCB) 10 and a probe module.This printed circuit board (PCB) and previous embodiment
Identical, repeat no more in this.And this probe module has needle stand 30,1 first probe 42 and one second probe 44, a turn
Fitting 70, one capacitive element C, one first cabling 82 and one second cabling 84, wherein:
This adaptor 70 is arranged between printed circuit board (PCB) 10 and needle stand 30, as the signal line of printed circuit board (PCB) 10
Between 12,14 and first, second probes 42,44, the switching of signal transmission is used.In the present embodiment, this adaptor 70 is more than one
Layer ceramic wafer, but be not limited, also can be an organic support plate of multilamellar.This adaptor 70 have back to one first 70a
With one second 70b, and one the 3rd 70c between this first 70a and this second 70b, this first 70a face
To this printed circuit board (PCB) 10, this second 70b is in the face of this electronic devices under test 2, and this second recessed formation of 70b is fluted
70b1。
This adaptor 70 is provided with several connection lines, and for purposes of illustration only, hereby based on four connection lines 71～74.Should
One end of two connection lines 71,72 connects with respectively this signal line 12,14 of this printed circuit board (PCB) 10 respectively, and the other end is then distinguished
It is formed with contact 71a, 72a in second 70b vicinity.One end of other two connection lines 73,74 respectively with adaptor 70
The contact 42a, 44a of second 70b connects, and the other end is respectively formed with a contact in the groove face of groove 70b1.
This needle stand 30 structure is identical with previous embodiment, arranges with the second probe 44 with for the first probe 42 equally.Should
The top of the first probe 42 connects this contact 42a；The top of the second probe 44 connects this contact 44a, and respectively this probe 42,44
Bottom is for tapping the tested position of this electronic devices under test 2.
This capacitive element C is arranged in groove 70b1, and its two ends are electrically connected with this adjacent two connection line 73,
74。
This first cabling 82 connects on second 70b being arranged at this adaptor 70, at the present embodiment with this second cabling 84
In, this first cabling 82 is formed so that copper sheet is printed on the surface of adaptor 70 with the second cabling 84, and in other embodiments,
Also can be formed with transfer, impressing or thin-film technique mode by other modes, such as other metal materials, tool conductive characteristic material.
Refer to shown in Figure 11, one end of this first cabling 82 is connected to this contact 71a, with this connection line 71 and
The signal line 12 of printed circuit board (PCB) 10 is electrically connected with, and this first cabling 82 has one first bending segment 82a, in bending continuously
Bow font state.One end of this second cabling 84 is connected to this contact 72a, with this connection line 72 and this printed circuit board (PCB) 10
On signal line 14 be electrically connected with, this second cabling 84 has one second bending segment 84a, this second bending segment 84a equally in
The bow font state of bending continuously.
Accordingly, when the detection terminal 1a of this detection device 1 exports direct current or during low frequency test signal, this first cabling 82 with
This second cabling 84 is to signal in short circuit or the state of low resistance, and signal can directly pass through；And the honoured element C of this electricity to signal in
Open circuit or high impedance status.Therefore signal transmission path is as shown in figure 12, test signal is by the detection terminal 1a detecting device 1
Through the signal line 12 of this printed circuit board (PCB) 10, this connection line the 71, first cabling 82 to the first probe 42, flow through this to be measured
Electronic installation 2 returns to this detection dress back through second probe the 44, second cabling 84, connection line 72 and signal line 14 again
Put the detection terminal 1a of 1, make the formation loop, path of test signal reach the purpose of detection.
It addition, when this electronic devices under test 2 is intended to carry out oneself's detection and exports the test signal of high frequency, due to this first
The design in bending bow font state continuously of cabling 82 and this second cabling 84, therefore, for high-frequency signal, the first cabling 82
With the state that the second cabling 84 can present open circuit or high impedance.And this capacitive element C is short-circuit or low-impedance state.It is
With, signal transmission path as shown in figure 13, after test signal is exported by electronic devices under test 2, through the first probe 42 and
After capacitive element C, then it is back to this electronic devices under test 2 by the second probe 44, and makes to test signal and can pass through extremely short
Path forms test loop, and then reaches the purpose of oneself's detection.
Figure 14 show the probe card of eighth embodiment of the invention, and it has the structure being approximately identical to the 7th embodiment.
Except for the difference that, its capacitive element C is embedded in adaptor 90.Wherein, this first cabling 82 and second cabling 84 and capacitive character
The annexation of element C is roughly the same with the 7th embodiment, does not repeats in this appearance.
Figure 15 show the probe card of ninth embodiment of the invention, and it has the knot being approximately identical to aforementioned 7th embodiment
Structure.Except for the difference that, its capacitive element C is arranged at adaptor 91 in the face of first the recessed formation of 91a of printed circuit board (PCB) 10
Groove 91a1 in.Wherein, this first cabling 82 is with the connection on adaptor as the second cabling 84 and capacitive element C
Circuit is electrically connected with, and does not repeats in this appearance.
Shown in Figure 16, for the probe card of tenth embodiment of the invention, being with previous embodiment difference, it first is walked
Line 82 and the second cabling 84 are formed on the adaptor 92 the 3rd 92c between first 92a and second 92b, and
3rd the recessed groove 92c1 that is formed of 92c, for accommodating its capacitive element C.Wherein, this first cabling 82 and second cabling
84 is to be electrically connected with the connection line on adaptor as capacitive element C, does not repeats in this appearance.It addition, in practice,
This capacitive element C also can change and is arranged on first 92a, second 92b, or is arranged at first 92a's or second 92b
In groove, and it is not limited.
Shown in Figure 17, for the probe card of eleventh embodiment of the invention, being with previous embodiment difference, it is first years old
Cabling 82 and the second cabling 84 are formed on first 93a of printed circuit board (PCB) 10 faced by this adaptor 93, and in first 93a
Recessed the groove 93a1 that is formed, its capacitive element C are arranged in this groove 93a1.Wherein, this first cabling 82 and second
Cabling 84 is to be electrically connected with the connection line on adaptor as capacitive element C, does not repeats in this appearance.It addition, in reality
In business, this capacitive element C also can change and is arranged at this adaptor 93 second 93b towards this electronic devices under test, or arranges
In the 3rd 93c between first 93a and second 93b of being situated between, or be disposed on second 93b, the 3rd 93c its
In in a groove, and be not limited.
It is noted that refer to equivalent-circuit model figure shown in Figure 18.Wherein, implement in first embodiment to the 6th
Among example, on the circuit 101,102 that circuit layout 50 is connected with the first probe 42 and the second probe 44 respectively, also can distinguish also
Joining a terminated line 201,202, the circuit respectively held between first probe the 42, second probe 44 to reduce circuit layout 50 hinders
Anti-, and then promote the usefulness of transmission signal.Under same principle, among the 7th embodiment to the 11st embodiment, also
In parallel one also can be distinguished on the circuit 101,102 that capacitive element C is connected with the first probe 42 and the second probe 44 respectively
Terminated line 201,202, respectively holds the line impedance between first probe the 42, second probe 44 reducing capacitive element C, enters
And promote the usefulness of transmission signal.
The foregoing is only the preferred possible embodiments of the present invention, the adaptor of the present invention is except with stack of ceramic plates
Outside form realizes, also can be realized by flexible circuit board even thin flm circuit；The technical concept of the present invention is except on being applicable to
State the framework of the vertical probe of each embodiment, be equally applicable for the probe of mems probe, cantalever type probe or other kenel.
Such as the equivalence change that application description of the invention and claim are done, ought to comprise within the scope of the present invention.
Claims (18)
1. possess a probe module for feedback test function, be located between a printed circuit board (PCB) and an electronic devices under test；
This probe module includes:
One adaptor, is provided with two connection lines；
Two inductive elements, are arranged at this adaptor, and respectively this inductive element has two ends, and wherein one end is electrically connected with this company
Link；
One first cabling, is arranged at this adaptor, and is connected with the other end of wherein this inductive element；
One second cabling, is arranged at this adaptor, and is connected with the other end of another this inductive element；Wherein, this first is walked
Line is close to each other with this second cabling but does not contacts, and the partial portion of this second cabling is positioned at the upright projection of this first cabling
In the range of；
One first probe, its one end is electrically connected with this first cabling, and the other end is for tapping the tested portion of this electronic devices under test
Position；And
One second probe, its one end is electrically connected with this second cabling, and the other end is for tapping the tested portion of this electronic devices under test
Position.
Possesses the probe module of feedback test function the most as claimed in claim 1, it is characterised in that this adaptor has opposing
To one first with one second, and the 3rd between this first and this second, faced by this first
This printed circuit board (PCB), this second in the face of this electronic devices under test；Wherein this first cabling and this second cabling be arranged at this
In one side, this two inductive element is arranged at this first, second and the one of which of the 3rd.
Possess the probe module of feedback test function the most as claimed in claim 2, it is characterised in that this first, this second
The surface of the one of which of face and the 3rd is recessed is formed with a groove, and this two inductive element is arranged in this groove.
Possesses the probe module of feedback test function the most as claimed in claim 1, it is characterised in that this adaptor has opposing
To one first with one second, and the 3rd between this first and this second, faced by this first
This printed circuit board (PCB), this second in the face of this electronic devices under test；Wherein this first cabling and this second cabling be arranged at this
On two, this two inductive element is arranged at this first, second and the one of which of the 3rd.
Possess the probe module of feedback test function the most as claimed in claim 4, it is characterised in that this first, this second
The surface of the one of which of face and the 3rd is recessed is formed with a groove, and this two inductive element is arranged in this groove.
Possesses the probe module of feedback test function the most as claimed in claim 1, it is characterised in that this adaptor has opposing
To one first with one second, and the 3rd between this first and this second, faced by this first
This printed circuit board (PCB), this second in the face of this electronic devices under test；Wherein this first cabling and this second cabling be arranged at this
On three, this two inductive element is arranged at this first, second and the one of which of the 3rd.
Possess the probe module of feedback test function the most as claimed in claim 6, it is characterised in that this first, this second
The surface of the one of which of face and the 3rd is recessed is formed with a groove, and this two inductive element is arranged in this groove.
Possesses the probe module of feedback test function the most as claimed in claim 1, it is characterised in that this two inductive element
At least one of which is embedded in this adaptor.
Possesses the probe module of feedback test function the most as claimed in claim 1, it is characterised in that also include two matched lines
Road, wherein this terminated line is parallel between this first cabling and this first probe, another this terminated line be parallel to this
Between two cablings and this second probe.
10. possess a probe module for feedback test function, be located between a printed circuit board (PCB) and an electronic devices under test；
This probe module includes:
One adaptor, is provided with two connection lines；
One first cabling, has one first bending segment, and one end of this first cabling connects wherein this connection line；
One second cabling, has one second bending segment, and one end of this second cabling connects another this connection line；
One capacitive element, has one first end and one second end, and this first end is connected with the other end of this first cabling, should
Second end is connected with the other end of this second cabling；
One first probe, its one end is electrically connected with the first end of this capacitive element, and the other end is for tapping this electronics to be measured dress
The tested position put；And
One second probe, its one end is electrically connected with the second end of this capacitive element, and the other end is for tapping this electronics to be measured dress
The tested position put.
11. probe modules possessing feedback test function as claimed in claim 10, it is characterised in that this adaptor has phase
Back to one first with one second, and the 3rd between this first and this second, this first face
To this printed circuit board (PCB), this second in the face of this electronic devices under test；Wherein this first cabling and this second cabling are arranged at this
First, this capacitive element is arranged at this first, this second and the one of which of the 3rd.
12. probe modules possessing feedback test function as claimed in claim 11, it is characterised in that this first, this
The surface of the one of which of two and the 3rd is recessed is formed with a groove, and this capacitive element is arranged in this groove.
13. probe modules possessing feedback test function as claimed in claim 10, it is characterised in that this adaptor has phase
Back to one first with one second, and the 3rd between this first and this second, this first face
To this printed circuit board (PCB), this second in the face of this electronic devices under test；Wherein this first cabling and this second cabling are arranged at this
Second, this capacitive element is arranged at this first, this second and the one of which of the 3rd.
14. probe modules possessing feedback test function as claimed in claim 13, it is characterised in that this first, this
The surface of the one of which of two and the 3rd is recessed is formed with a groove, and this capacitive element is arranged in this groove.
15. probe modules possessing feedback test function as claimed in claim 10, it is characterised in that this adaptor has phase
Back to one first with one second, and the 3rd between this first and this second, this first face
To this printed circuit board (PCB), this second in the face of this electronic devices under test；Wherein this first cabling and this second cabling are arranged at this
3rd, this capacitive element is arranged at this first, this second and the one of which of the 3rd.
16. probe modules possessing feedback test function as claimed in claim 15, it is characterised in that this first, this
The surface of the one of which of two and the 3rd is recessed is formed with a groove, and this capacitive element is arranged in this groove.
17. probe modules possessing feedback test function as claimed in claim 10, it is characterised in that this capacitive element buries
It is located in this adaptor.
18. probe modules possessing feedback test function as claimed in claim 10, it is characterised in that also include two couplings
Circuit, wherein this terminated line connects the first end and this first probe of this capacitive element, and another this terminated line connects
Second end of this capacitive element and this second probe.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104118416 | 2015-06-05 | ||
| TW104118416A TWI583960B (en) | 2015-06-05 | 2015-06-05 | Probe module with feedback test function (3) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106249007A true CN106249007A (en) | 2016-12-21 |
Family
ID=57614007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610390456.2A Pending CN106249007A (en) | 2015-06-05 | 2016-06-03 | Probe module with feedback test function |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106249007A (en) |
| TW (1) | TWI583960B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI647457B (en) * | 2017-10-23 | 2019-01-11 | 旺矽科技股份有限公司 | Probe card and signal path switching module assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060290357A1 (en) * | 2005-06-13 | 2006-12-28 | Richard Campbell | Wideband active-passive differential signal probe |
| CN101047148A (en) * | 2006-03-31 | 2007-10-03 | 株式会社瑞萨科技 | Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test |
| CN104297534A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| CN104297536A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | probe module with feedback test function |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958598B2 (en) * | 2003-09-30 | 2005-10-25 | Teradyne, Inc. | Efficient switching architecture with reduced stub lengths |
| TWI493194B (en) * | 2013-07-15 | 2015-07-21 | Mpi Corp | Probe module with feedback test function |
-
2015
- 2015-06-05 TW TW104118416A patent/TWI583960B/en not_active IP Right Cessation
-
2016
- 2016-06-03 CN CN201610390456.2A patent/CN106249007A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060290357A1 (en) * | 2005-06-13 | 2006-12-28 | Richard Campbell | Wideband active-passive differential signal probe |
| CN101047148A (en) * | 2006-03-31 | 2007-10-03 | 株式会社瑞萨科技 | Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test |
| CN104297534A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| CN104297536A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | probe module with feedback test function |
Non-Patent Citations (2)
| Title |
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| 师宇东等: "《实用理疗电子问答》", 31 May 1987, 电子工业出版社 * |
| 庄奕琪: "《电子设计可靠性工程》", 31 October 2014, 西安电子科技大学出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI583960B (en) | 2017-05-21 |
| TW201643438A (en) | 2016-12-16 |
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