TWI493194B - Probe module with feedback test function - Google Patents

Description

Probe module with feedback test function

The invention relates to a probe; in particular to a probe module with a feedback test function.

According to the method for detecting whether the electrical connection between the precision electronic components of the electronic product is true, a probe card is used as a transmission interface between the test signal and the power signal between the detecting device and the electronic device to be tested.

With the advancement of digital technology, the computing speed of the electronic device to be tested and the amount of signal transmission per second are also increasing, so that the frequency of the test signal generated by the processor of the detecting device cannot satisfy the electronic device to be tested. The required signal transmission capacity of the high frequency test signal. Therefore, in order to solve the above problems, the electronic device itself to be tested is used to generate the required high-frequency test signal, and then transmitted back to the electronic device to be tested through the probe card for detection, thereby achieving the purpose of high-frequency testing.

Referring to FIG. 1, a conventional probe card is provided with a relay 72 on its printed circuit board 70, and controls the relay 72 to switch the DC test signal of the detecting device 300 through a line on the printed circuit board, and is to be tested. The signal path of the high frequency test signal that the electronic device 400 self-detects. It is well known that the longer the signal line, the larger the micro inductance it attaches. In other words, when the frequency of the high frequency test signal is higher, the conventional probe card has a longer path for transmitting the test signal (by the probe module 80 through the substrate 75, the printed circuit board 70, the relay 72, and the capacitor 74). Then, the other relay 72 returns to the printed circuit board 70, the substrate 75 and the probe module 80), so that the micro-inductance is large, so that the impedance value of the signal path is large when the high-frequency signal is transmitted, thereby causing the line. Increased loss, making high frequency test signals impossible Passing smoothly, the signal is not easily recognized by the electronic device to be tested, and it is easy to have a test misjudgment.

In view of this, the object of the present invention is to provide a probe module with a feedback test function, which can effectively reduce the signal path length when transmitting a high frequency signal.

In order to achieve the above object, the probe module provided with the feedback test function of the present invention is disposed between a printed circuit board and an electronic device to be tested, and includes a substrate, a needle holder, two probes, and two Path conversion component and a capacitor. The substrate has two connection lines and two space conversion lines, and one end of the space conversion lines is electrically connected to the printed circuit board; the needle is disposed between the substrate and the electronic device to be tested; the two probes The probe is disposed on the needle holder, and one end of each of the probes is protruded from the outside of the needle holder to be electrically connected to one end of each connecting line of the substrate, and the other end is protruded from the outside of the needle holder to be touched. a portion of the electronic device that is to be tested; the two path switching elements are disposed on the needle holder, and each of the path conversion elements is electrically connected to each of the space conversion lines of the substrate and the other end of each of the connection lines; The two path conversion elements are electrically connected to the two sides of the needle holder.

According to the above concept, the path conversion component is an inductive component, one end is electrically connected to the space conversion line, and the other end is electrically connected to the capacitor and the connection line.

According to the above concept, the path conversion component is a relay and has a first contact, a second contact, and a third contact, and can be controlled to switch the first contact to the second contact. Or the first contact is electrically connected to the third contact; in addition, the first contact is electrically connected to the connection line, the second contact is electrically connected to the space conversion line, and the third contact is electrically connected Connect the capacitor.

Therefore, through the above design, the signal path length during signal transmission can be effectively reduced, thereby reducing the small inductance on the line, so that when the high frequency signal is transmitted, the high frequency test signal can pass smoothly, and the test will not be tested. The electronic device was misjudged.

10‧‧‧Printed circuit board

12‧‧‧ Signal Line

20‧‧‧Substrate

22‧‧‧ Space Conversion Line

24‧‧‧Connected lines

30‧‧‧ needle holder

35‧‧‧ needle holder

351‧‧‧Depression

352‧‧‧Connected line

40‧‧‧ probe

50‧‧‧Conductor

60‧‧‧ needle holder

62‧‧‧Perforation

R‧‧‧ relay

P1‧‧‧ first contact

P2‧‧‧second junction

P3‧‧‧ third joint

C‧‧‧ capacitor

L‧‧‧Inductive components

100‧‧‧Detection device

110‧‧‧Test terminals

200‧‧‧Electronic device to be tested

70‧‧‧Printed circuit board

72‧‧‧ Relay

74‧‧‧ Capacitance

80‧‧‧ probe module

300‧‧‧Detection device

400‧‧‧Electronic device to be tested

1 is a structural diagram of a conventional probe card; FIG. 2 is a structure of a probe card having a probe module of the first embodiment; and FIG. 3 is a path diagram of a structure of FIG. 2 when a DC or low frequency signal is used; FIG. 2 is a schematic diagram of a probe card structure of the probe module of the second embodiment; FIG. 6 is a probe diagram of the probe module of the third embodiment; FIG. 7 is a path diagram of the structure of FIG. 6 when the DC or low frequency signal is used; FIG. 8 is a path diagram of the structure of FIG. 6 when the high frequency signal is used;

In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings. As shown in FIG. 2, the probe card of the first preferred embodiment of the present invention is disposed between a detecting device 100 and an electronic device 200 to be tested, and includes a printed circuit board 10 and a probe module. A plurality of signal lines 12 are disposed in the printed circuit board 10, and one of the signal lines is connected to the detecting terminal 110 of the detecting device 100, and the other end is formed with a contact on the bottom surface of the printed circuit board 10. . The probe module includes a substrate 20, a needle holder 30, four probes 40, four relays R, a plurality of conductors 50, and two capacitors C. among them: In this embodiment, the substrate 20 is a multi-layer ceramic board, and a plurality of space conversion lines 22 and a plurality of connection lines 24 are embedded, and one end of the space conversion lines 22 and each of the printed circuit boards 10 are The signal lines 12 are connected, and the two ends of each of the connection lines 24 and the other end of each of the space conversion lines 22 form a contact point on the bottom surface of the substrate 20.

The needle holder 30 has a hollow rectangle and is disposed above the electronic device 200 to be tested for the probes 40 to achieve the effect of fixing the spacing of the probes 40. The bottom end is exposed outside the needle holder 30, and the top ends of the probes 40 are respectively connected to a part of the contact of the bottom surface of the substrate, and the one end of each of the connection lines 24 is electrically connected, and the probes 40 are The bottom end is used to touch the tested portion of the electronic device 200 to be tested.

The relays R are soldered to the surface of the needle holder 20 facing the substrate 20 and located between the needle holder 30 and the substrate 20. In addition, in order to achieve the effect of shortening the path and thinning design, the size of each of the relays R is recommended to be less than 125 cubic centimeters, and preferably the height is selected (ie, the electronic device 200 to be tested is directed to the detecting device 100). Length) less than 5 mm relay. In the embodiment, the size of the relay R is 3*3*3 mm ³ . Furthermore, each of the relays R has a first contact P1, a second contact P2 and a third contact P3, and can be controlled by a wire or a flexible circuit board (not shown) connected to the detecting device 100. And switching the first contact P1 and the second contact P2 to be turned on, or the first contact P1 and the third contact P3 are turned on.

In this embodiment, each of the conductors 50 is an elastic metal thimble, and a part of the conductor 50 is connected to the first contact P1 of each of the relays R, and the other end is connected to a part of the bottom surface of the substrate 20, The first contact P1 of each of the relays R is electrically connected to the other end of each of the connection lines 24. In addition, another portion of the conductor 50 is connected to the second contact P2 of each of the relays R, and the other end is connected to the remaining surface of the substrate 20. The second connection P2 of each of the relays R is electrically connected to the other end of each of the space conversion lines 22.

The two capacitors C are soldered on the surface of the needle holder 30 facing the substrate 20 and located between the needle holder 30 and the substrate 20 . In addition, one end of the capacitor C is electrically connected to the third contact P3 of the relay R, and the other ends of the capacitor C are electrically connected to the third of the relay R, respectively. Contact R3.

Therefore, when the detecting terminal 110 of the detecting device 100 outputs a DC or low frequency test signal, the relays R are controlled to turn on the first contact P1 and the second contact P2, and block the first connection. Point P1 and the third contact P3. At this time, the signal transmission path is as shown in FIG. 3. After the test signal is outputted by the detection terminal 110 of the detecting device 100, the signal line 12 of the printed circuit board 10, the space conversion line 22 of the substrate 20, the relay R, and then The connection line 24 to the probe 40 of the substrate flow through the electronic device 200 to be tested, and then the other probe 40, the connection line 24, the relay R, the space conversion line 22, and the signal line 12 are returned to the detecting device 100. The detecting terminal 110 makes the path of the test signal form a loop for the purpose of detection.

In addition, when the electronic device 200 to be tested is to perform self-detection and output a high frequency test signal, the relays R are controlled to turn on the first contact P1 and the third contact P3, and block the first A contact P1 and the second contact P2. At this time, the signal transmission path is as shown in FIG. 4, and after the test signal is output by the electronic device 200 to be tested, the probe 40, the connection line 24 of the substrate 20, the relay R to the capacitor C, and the other A relay R, a connection line 24, and a probe 40 are returned to the electronic device 200 to be tested, so that the test signal forms a loop in a shorter path, thereby achieving self-detection.

In this way, through the above design, in addition to effectively shortening the transmission path during high-frequency transmission, the line impedance is greatly reduced, and more Effectively avoiding high frequency signals from being interfered by electronic components or other lines on the carrier 10, so that the high frequency test signal returned to the electronic device 200 to be tested can be easily recognized without test misjudgment. The situation arises.

In addition, in the above circuit structure, in order to achieve a thinner effect, please refer to FIG. 5, the probe module of the second preferred embodiment of the present invention is different from the foregoing embodiment in that the needle holder 35 is Six recesses 351 are formed on the top surface, and the relay R and the capacitor C are respectively disposed in the recesses 351, and the lead wire 352 is disposed on the needle frame 35 to make the relay R and the corresponding capacitor C The electrodes are electrically connected to each other and are in contact with the bottom of the substrate 20, so that the relay is electrically connected to the space conversion line 22 of the substrate 20 and the connection line 24, thereby achieving the aforementioned effect of shortening the transmission path at the time of high frequency transmission.

It is to be noted that, in addition to the foregoing structure, referring to FIG. 6, the probe module of the third preferred embodiment of the present invention includes a substrate 20, a needle holder 60, four probes 40, and four inductive components L. The structure of the substrate 20, the probe 40, the conductor 50, and the capacitor C is the same as that of the first embodiment, and will not be described herein. The difference is that the inductive component L is used as a path conversion component, and in the embodiment, the inductive component L is a choke, but a coil and a winding can also be used. (Winding) or magnetic beads (Bead) and other components with inductive characteristics instead. In addition, the inductive components L and the capacitors C are soldered to the needle holder 60 in this embodiment, and the inductive component L and the position of the capacitors C are changed. A plurality of through holes 62 are formed on the surface of the needle holder 60 facing the substrate, and the equal conductors 50 are respectively disposed in the through holes 62, and one end is connected to each end of each inductive element L, and the other end is abutted correspondingly. The space conversion lines 22 and the connection lines 24 electrically connect the inductive elements L to the space conversion lines 22 and the connection lines 24. Furthermore, one of the two ends of the capacitor C is separately charged The two ends of the capacitor C are connected to one end of the connecting line 24, and the other ends of the capacitor C are electrically connected to the other end of the connecting unit 24.

Therefore, when the detecting terminal 110 of the detecting device 100 outputs a DC or low frequency test signal, the inductive elements L may exhibit a short circuit or a low resistance state, and the capacitors C may be in an open circuit or high resistance state. At this time, as shown in FIG. 7, the signal transmission path is outputted by the detection terminal 110 of the detecting device 100, and then passes through the signal line 12 of the carrier 10, the space conversion circuit 22, the inductive component L, and the connection line. After 24 to the probe 40, the signal flowing through the electronic device 200 to be tested and then recirculated through the other probe 40, the connecting line 24, the inductive component L, the space conversion line 22, and the carrier 10 back to the detecting device The detecting terminal 110 of 100 makes the path of the test signal form a loop for the purpose of detection.

In addition, when the electronic device 200 to be tested is to perform self-detection and output a high-frequency test signal, the inductive components L may be in an open circuit or high-resistance state, and the capacitors C may be short-circuited or low-resistance. status. At this time, the signal transmission path is as shown in FIG. 8. After the test signal is output from the electronic device 200 to be tested, after passing through the probe 40, the connection line 24, and the capacitor C, the other connection line 24 and the probe 40 are returned to the test circuit. The electronic device 200 to be tested allows the test signal to form a loop through a very short path, thereby achieving self-detection.

In this way, through the design of the second embodiment, the electrical characteristics of the passive components (inductive component L and capacitor C) can be instantaneously transmitted through the difference of signal frequencies without providing additional power. Switching of the signal transmission path. In addition, the foregoing design can effectively shorten the transmission path during high-frequency transmission, so that the line impedance is greatly reduced, and the high-frequency test signal returned to the electronic device 200 to be tested can be easily recognized without being There are cases where the test is misjudged.

In addition, the above description is only for the preferred embodiment of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

10‧‧‧Printed circuit board

12‧‧‧ Signal Line

20‧‧‧Substrate

22‧‧‧ Space Conversion Line

24‧‧‧Connected lines

30‧‧‧ needle holder

40‧‧‧ probe

50‧‧‧Conductor

R‧‧‧ relay

P1‧‧‧ first contact

P2‧‧‧second junction

P3‧‧‧ third joint

C‧‧‧ capacitor

100‧‧‧Detection device

110‧‧‧Test terminals

200‧‧‧Electronic device to be tested

Claims (9)

A probe module with a feedback test function is disposed between a printed circuit board and an electronic device to be tested, and includes: a substrate having two connection lines and two space conversion lines, and the space conversion One end of the line is electrically connected to the printed circuit board; a needle holder is disposed between the substrate and the electronic device to be tested; two probes are disposed on the needle holder, and one end of each of the probes protrudes The other end of the needle holder is electrically connected to one end of each connecting line of the substrate, and the other end protrudes from the outside of the needle holder to touch the tested portion of the electronic device to be tested; and the second path conversion component is disposed on the needle holder And each of the path conversion elements is electrically connected to each of the space conversion lines of the substrate and the other end of each of the connection lines; and a capacitor is disposed on the needle holder, and the two ends thereof are electrically connected to the two paths respectively a conversion component; wherein the path conversion component is an inductive component, one end is electrically connected to the space conversion line, and the other end is electrically connected to the capacitor and the connection line. The probe module with the feedback test function as claimed in claim 1, wherein the inductive component is a choke. A probe module with a feedback test function is disposed between a printed circuit board and an electronic device to be tested, and includes: a substrate having two connection lines and two space conversion lines, and the space conversion One end of the line is electrically connected to the printed circuit board; a needle holder is disposed between the substrate and the electronic device to be tested; two probes are disposed on the needle holder, and one end of each of the probes protrudes from the outer side of the needle holder and the connecting line of the substrate One end is electrically connected, and the other end is protruded from the outside of the needle holder to touch the tested portion of the electronic device to be tested; two path conversion elements are disposed on the needle holder, and each of the path conversion elements is electrically connected to the Each of the space conversion lines of the substrate and the other end of each of the connection lines; and a capacitor is disposed on the needle holder, and the two ends of the substrate are electrically connected to the two path conversion components respectively; wherein the path conversion component is a relay And having a first contact, a second contact, and a third contact, and controllably switching the first contact to the second contact, or the first contact and the third The first contact is electrically connected to the connection line, the second contact is electrically connected to the space conversion line, and the third contact is electrically connected to the capacitor. The probe module with a feedback test function according to claim 1 or 3, wherein the two path conversion component and the capacitor are disposed on a surface of the needle holder facing the substrate. The probe module of claim 4, wherein the needle holder is formed with a plurality of depressions on a surface of the substrate, and the two path conversion elements are respectively located in the depressions. The probe module with the feedback test function of claim 4, wherein the needle holder is formed with at least one recess toward the surface of the substrate, and the capacitor is located in the recess. The probe module with the feedback test function of claim 1 or 3, wherein the needle holder is hollow, and the two path conversion elements and the capacitor are disposed in the needle holder. The probe module with the feedback test function of claim 7 further includes a plurality of conductors, and the needle holder has a plurality of through holes on a surface of the substrate: the conductors are respectively disposed in the through holes, and Each of the path conversion elements is connected to one end, and the other end abuts the space conversion lines or the connection lines, and the path conversion elements are electrically connected to the space conversion lines and the connection lines. The probe module with the feedback test function according to claim 8, wherein each of the conductors is a metal thimble having elasticity.