CN106222708B - 提高电铸微流控镍模具寿命的方法及电铸微流控镍模具 - Google Patents
提高电铸微流控镍模具寿命的方法及电铸微流控镍模具 Download PDFInfo
- Publication number
- CN106222708B CN106222708B CN201610772529.4A CN201610772529A CN106222708B CN 106222708 B CN106222708 B CN 106222708B CN 201610772529 A CN201610772529 A CN 201610772529A CN 106222708 B CN106222708 B CN 106222708B
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- China
- Prior art keywords
- electroforming
- mold
- micro
- fluidic
- nickel
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 156
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 78
- 238000005323 electroforming Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 53
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims abstract description 22
- 238000001259 photo etching Methods 0.000 claims abstract description 21
- 238000006263 metalation reaction Methods 0.000 claims abstract description 18
- 238000013461 design Methods 0.000 claims abstract description 17
- 238000011161 development Methods 0.000 claims abstract description 14
- 238000004528 spin coating Methods 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 abstract description 15
- 238000009510 drug design Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 229920001486 SU-8 photoresist Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 230000005226 mechanical processes and functions Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
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CN201610772529.4A CN106222708B (zh) | 2016-08-30 | 2016-08-30 | 提高电铸微流控镍模具寿命的方法及电铸微流控镍模具 |
Applications Claiming Priority (1)
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CN201610772529.4A CN106222708B (zh) | 2016-08-30 | 2016-08-30 | 提高电铸微流控镍模具寿命的方法及电铸微流控镍模具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106222708A CN106222708A (zh) | 2016-12-14 |
CN106222708B true CN106222708B (zh) | 2018-07-13 |
Family
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Family Applications (1)
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CN201610772529.4A Expired - Fee Related CN106222708B (zh) | 2016-08-30 | 2016-08-30 | 提高电铸微流控镍模具寿命的方法及电铸微流控镍模具 |
Country Status (1)
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CN (1) | CN106222708B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108193236A (zh) * | 2017-12-20 | 2018-06-22 | 广东工业大学 | 一种基于uv-liga技术的微模具制造方法 |
CN108149282A (zh) * | 2017-12-20 | 2018-06-12 | 广东工业大学 | 一种基底表面金属化射流电铸成型的微模具制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1551930A (zh) * | 2002-02-20 | 2004-12-01 | 住友电气工业株式会社 | 微细电铸用模具及其制造方法 |
CN101413138A (zh) * | 2008-09-20 | 2009-04-22 | 大连理工大学 | 一种提高微电铸铸层尺寸精度的方法 |
CN102189633A (zh) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | 微流控芯片的制造方法及系统 |
CN102192988A (zh) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | 微流控芯片的基片模具及其制造方法 |
CN103353627A (zh) * | 2013-07-12 | 2013-10-16 | 厦门理工学院 | 微透镜阵列模具的制作方法 |
CN105734619A (zh) * | 2016-03-03 | 2016-07-06 | 北京同方生物芯片技术有限公司 | 一种电铸模具及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10100250A (ja) * | 1996-10-01 | 1998-04-21 | Victor Co Of Japan Ltd | 光情報記録媒体用電鋳金型及びその製造方法 |
WO2003006221A1 (en) * | 2001-07-10 | 2003-01-23 | Aclara Biosciences, Inc. | Injection molding a flash free microfluidic structure |
JP4848494B2 (ja) * | 2005-04-06 | 2011-12-28 | 株式会社プロセス・ラボ・ミクロン | 金型の製造方法及び金型 |
WO2009129858A1 (en) * | 2008-04-24 | 2009-10-29 | Hewlett-Packard Development Company, L.P. | High aspect ratio microstructures |
-
2016
- 2016-08-30 CN CN201610772529.4A patent/CN106222708B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1551930A (zh) * | 2002-02-20 | 2004-12-01 | 住友电气工业株式会社 | 微细电铸用模具及其制造方法 |
CN101413138A (zh) * | 2008-09-20 | 2009-04-22 | 大连理工大学 | 一种提高微电铸铸层尺寸精度的方法 |
CN102189633A (zh) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | 微流控芯片的制造方法及系统 |
CN102192988A (zh) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | 微流控芯片的基片模具及其制造方法 |
CN103353627A (zh) * | 2013-07-12 | 2013-10-16 | 厦门理工学院 | 微透镜阵列模具的制作方法 |
CN105734619A (zh) * | 2016-03-03 | 2016-07-06 | 北京同方生物芯片技术有限公司 | 一种电铸模具及其制备方法 |
Non-Patent Citations (1)
Title |
---|
电沉积技术制作高聚物微流控芯片模具;罗怡等;《电化学》;20050531;第11卷(第2期);第204-207页 * |
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Publication number | Publication date |
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CN106222708A (zh) | 2016-12-14 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20180517 Address after: 100000 Beijing Haidian District 6 graduated from Tsinghua University. Applicant after: BEIJING TONGFANG OPTICAL DISC CO.,LTD. Address before: 101500 Room 202, Tsinghua Tongfang information complex, 4 water source road, Miyun Economic and Technological Development Zone, Miyun, Beijing Applicant before: BEIJING TONGFANG BIOCHIP TECHNOLOGY Co.,Ltd. |
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Address after: 101500 6 floor, Huaye building, Tsinghua University, Haidian District, Beijing. Applicant after: BEIJING TONGFANG OPTICAL DISC CO.,LTD. Address before: 100000 Beijing Haidian District 6 graduated from Tsinghua University. Applicant before: BEIJING TONGFANG OPTICAL DISC CO.,LTD. |
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