CN106220982A - 集成电路或rfid标签元器件用保护膜 - Google Patents

集成电路或rfid标签元器件用保护膜 Download PDF

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CN106220982A
CN106220982A CN201610652074.2A CN201610652074A CN106220982A CN 106220982 A CN106220982 A CN 106220982A CN 201610652074 A CN201610652074 A CN 201610652074A CN 106220982 A CN106220982 A CN 106220982A
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Abstract

本发明公开了一种集成电路或RFID标签元器件用保护膜,属于电子元器件领域,其原料由乙烯‑丙烯酸共聚物、丁二烯基三乙氧基硅、杜仲胶、草木灰、低品位氧化锌矿、硬脂酸、沸石粉和脂肪酸聚乙二醇酯组成;本发明制得的厚度为10‑100μm的薄膜或者厚度为30‑100μm的涂覆膜,以200℃ ×1 小时进行处理后的30℃下的拉伸强度达到51MPa以上、伸长率为在5%以下,具有优异的机械性能,本发明可以作为自支撑膜或者复合膜的基膜;其表面电阻值为1×106Ω≤ Rs<1×109Ω,非接触防静电电压值达到12kv以上,具有优异的防静电性能,同时,具有优异的耐酸碱耐高温低温性能。

Description

集成电路或RFID标签元器件用保护膜
本申请为中国专利:申请号2016104352901;发明名称:电子元器件用保护膜;申请日:2016.06.18的分案申请。
技术领域
本发明涉及电子元器件领域,特别涉及一种电子元器件用保护膜。
背景技术
电子元器件是构成电子设备或者机电设备的重要组成部分,电子元器件的种类繁多,而且体积相对较小,在电子设备中常常较为零散地分布。但是,由于电子元器件在使用过程中,常常受环境和周围元器件的影响而产生变形、被氧化或者容易被静电干扰。
比如,太阳能电池背板,其要在户外环境甚至是恶劣的环境中使用,从而要求具有较高的机械性能以实现自支撑免受外界的物理损坏,要求具有优秀的抗氧化耐腐蚀性能;
又比如集成电路(IC)元器件、IC电子标签、LED、LCD等电子元器件,对于防静电的要求也很高,尤其是IC,静电对于电子元器件的影响主要包括:静电吸附灰尘、改变电路间的阻抗,影响产品的功能和寿命,因电场或电流破坏元件的绝缘或导体,使元器件不能工作(完全损坏),因瞬间的电场或电流产生的热,元器件受伤;
也就是说,因为产生变形、被氧化腐蚀或者静电的原因,往往会导致电子元器件的功能受到影响,进而使整个设备受到损害,造成重大的经济损失,有时候甚至会发生严重的人身伤害。
为了防止上述情况的发生,目前采用的方式包括涂覆膜、贴膜、复合膜等方式,效果也不尽如人意,比如现有的技术一般采用有机材料组成,其抗氧化防辐射性能较差,而且成本较高,不适合于工业化大生产应用。
发明内容
本发明的发明目的在于:提供一种电子元器件保护膜,这种保护膜同时具有优异的机械性能、优异的抗氧化防腐蚀性能和优异的防静电性能,以解决上述问题。
本发明采用的技术方案是这样的:一种电子元器件用膜,由下述重量百分比计的组分组成:
乙烯-丙烯酸共聚物 35-45%
硅烷偶联剂 3-5%
天然植物胶 15-25%
草木灰 2-5%
低品位氧化锌矿 15-20%
硬脂酸 3-5%
沸石粉 2-5%
脂肪酸聚乙二醇酯 1-3%;
上述组分总计为100%。
上述组分中,草木灰是草本和木本植物充分燃烧后的残余物,其中含有大量无机离子和微量元素,本发明的草木灰优选粉碎至粒径小于30μm;
低品位氧化锌矿是锌矿资源中占有量较多的矿产,其中由于锌含量较低,导致其利用率较低,资源浪费严重,本申请的发明人发现,典型的低品位氧化锌矿中的主要化学成分含量为:碳酸锌10.26%、硅酸锌2.19%. 硫化锌0.89%、铁锌尖晶石3.96%、二氧化硅25.35%,氧化钙28.05%、钛0.16%、钒0.38%和微量碱金属,本申请中的“低品位氧化锌矿”的组成也是指上述的组成,本申请将上述低品位氧化锌矿粉碎至粒径小于50μm后,并筛选出适宜的聚合物,与其他成分协同,得到的胶料可以制成薄膜,或者将胶料涂覆在电子元器件表面,可以具有优异的机械性能、优异的抗氧化防腐蚀性能和优异的防静电性能,同时,也对现有技术中浪费的草木灰、低品位氧化锌矿等资源进行了有效地回收利用,具有重大的经济效益和社会效益;
本发明的电子元器件用膜的制备方法为,包括以下步骤:
(1)称量:按所述比例进行称量;
(2)粉碎:将草木灰粉碎至粒径小于30μm,将低品位氧化锌矿粉碎至粒径小于50μm;
(3)熔融反应:将乙烯-丙烯酸共聚物、硅烷偶联剂、天然植物胶、草木灰、硬脂酸和脂肪酸聚乙二醇酯按所述比例混合,600r/min搅拌5min,然后加热至熔融状态,并在185℃下搅拌20min,然后加入所述比例的低品位氧化锌矿和沸石粉,在178℃下反应15min,得到胶料;
(4)制膜或涂覆:将步骤(3)得到的胶料,采用吹塑等工艺制成厚度为10-100μm的薄膜,或者采用涂覆的方式,得到厚度为30-100μm的薄膜。
作为优选的技术方案:所述硅烷偶联剂为异丁基三乙氧基硅烷。具有更佳的机械性能和抗氧化防腐蚀性能。
作为优选的技术方案:所述天然植物胶为杜仲胶。其综合性能更佳。当然,也可以采用其他植物胶,其他植物胶在使用时先水合,然后再与其他原料混合反应。
综上所述,由于采用了上述技术方案,本发明的有益效果是:本发明制得的厚度为10-100μm的薄膜或者厚度为30-100μm的涂覆膜,以200℃ ×1 小时进行处理后的30℃下的拉伸强度达到51MPa以上、伸长率为在5%以下,具有优异的机械性能,可以作为自支撑膜或者复合膜的基膜;其表面电阻值为1×106Ω≤ Rs<1×109Ω,非接触防静电电压值达到12kv以上,具有优异的防静电性能,同时,具有优异的耐酸碱耐高温低温性能。
具体实施方式
下面对本发明作详细的说明。
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
实施例1:
一种电子元器件用膜,由下述重量份的组分组成:
乙烯-丙烯酸共聚物 40%
异丁基三乙氧基硅烷 3%
杜仲胶 25%
草木灰 3%
低品位氧化锌矿 16%
硬脂酸 5%
沸石粉 5%
脂肪酸聚乙二醇酯 3%
上述电子元器件用膜的制备方法为,包括以下步骤:
(1)称量:按所述比例进行称量;
(2)粉碎:将草木灰粉碎至粒径小于30μm,将低品位氧化锌矿粉碎至粒径小于50μm;
(3)熔融反应:将乙烯-丙烯酸共聚物、硅烷偶联剂、天然植物胶、草木灰、硬脂酸和脂肪酸聚乙二醇酯按所述比例混合,600r/min搅拌5min,然后加热至熔融状态,并在185℃下搅拌20min,然后加入所述比例的低品位氧化锌矿和沸石粉,在178℃下反应15min,得到胶料;
(4)制膜或涂覆:将步骤(3)得到的胶料,采用吹塑等工艺制成厚度为30μm的“保护膜A”;
性能测试:
A、防静电性能测试:
A1、表面电阻值:将“保护膜A”用于太阳能电池的背板,采用表面电阻测试仪测试其的表面电阻值,其值为3.21×107Ω;
A2:非接触防静电电压:
测试方法:将“保护膜A”用于太阳能电池的背板,测试太阳能电池静电电压,从2 kV开始增加,每次增加2 kV,直到20 kV为止,即测试静电电压分别为2 kV,4 kV,6 kV,8 kV,10kV,12 kV,14 kV,16 kV,18 kV,20 kV,平行测试5次,结果到12kv时,太阳能电池无任何损坏,功能完全正常,14kv时开始出现异常,即非接触防静电电压为12kv;
B、机械性能测试:
将“保护膜A”(1*10cm)以200℃ ×1 小时进行处理后的30℃下的拉伸强度为61.6MPa、伸长率为在3.1%;
C、抗氧化防腐蚀性能测试:
将“保护膜A”分别进行下述实验:
C1:耐酸性:浸入60g/L H2SO4溶液中7天后取出,结果无任何损坏,直至第10天后取出,出现细微损坏;
C2:耐碱性:浸入60g/LNaOH 溶液中7天后取出,结果无任何损坏,直至第9天后取出,出现细微损坏;
C3:耐高温耐湿:从室温在30min内加热到160℃,然后自然冷却,置于水中浸泡6h,取出,再从室温在30min内加热到160℃,然后自然冷却,如此循环10次,结果无任何损坏;
从上述性能测试结果看,保护膜A尤其适合用于太阳能电池背板,因为其机械性能和抗氧化防腐蚀性能尤其突出。
实施例2
一种电子元器件用膜,由下述重量百分比计的组分组成:
乙烯-丙烯酸共聚物 45%
丁二烯基三乙氧基硅 5%
杜仲胶 15%
草木灰 5%
低品位氧化锌矿 20%
硬脂酸 3%
沸石粉 4%
脂肪酸聚乙二醇酯 3%
上述电子元器件用膜的制备方法为,包括以下步骤:
(1)称量:按所述比例进行称量;
(2)粉碎:将草木灰粉碎至粒径小于30μm,将低品位氧化锌矿粉碎至粒径小于50μm;
(3)熔融反应:将乙烯-丙烯酸共聚物、硅烷偶联剂、天然植物胶、草木灰、硬脂酸和脂肪酸聚乙二醇酯按所述比例混合,600r/min搅拌5min,然后加热至熔融状态,并在185℃下搅拌20min,然后加入所述比例的低品位氧化锌矿和沸石粉,在178℃下反应15min,得到胶料;
(4)制膜或涂覆:将步骤(3)得到的胶料,将其涂覆于IC元器件表面,得到“保护膜B”;
性能测试:
A、防静电性能测试:
A1、表面电阻值:采用表面电阻测试仪测试其的表面电阻值,其值为6.36×108Ω;
A2:非接触防静电电压:
测试方法:测试其静电电压,从2 kV开始增加,每次增加2 kV,直到20 kV为止,即测试静电电压分别为2 kV,4 kV,6 kV,8 kV,10 kV,12 kV,14 kV,16 kV,18 kV,20 kV,平行测试5次,结果到16kv时,太阳能电池无任何损坏,功能完全正常,18kv时开始出现异常,即非接触防静电电压为16kv;
B、机械性能测试:
将“保护膜B” (1*10cm)以200℃ ×1 小时进行处理后的30℃下的拉伸强度为53.9MPa、伸长率为在3.7%;
C、抗氧化防腐蚀性能测试:
将“保护膜B”分别进行下述实验:
C1:耐酸性:浸入60g/L H2SO4溶液中6天后取出,结果无任何损坏,直至第8后取出,出现细微损坏;
C2:耐碱性:浸入60g/LNaOH 溶液中6天后取出,结果无任何损坏,直至第8天后取出,出现细微损坏;
C3:耐高温耐湿:从室温在30min内加热到160℃,然后自然冷却,置于水中浸泡6h,取出,再从室温在30min内加热到160℃,然后自然冷却,如此循环6次,结果无任何损坏,
从上述性能测试结果看,保护膜B尤其适合于集成电路(IC)元器件、RFID标签等,因为其防静电性能尤其突出。

Claims (1)

1.一种集成电路或RFID标签元器件用保护膜,其特征在于,由下述重量百分比计的组分组成:
乙烯-丙烯酸共聚物 45%
丁二烯基三乙氧基硅 5%
杜仲胶 15%
草木灰 5%
低品位氧化锌矿 20%
硬脂酸 3%
沸石粉 4%
脂肪酸聚乙二醇酯 3%。
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58128819A (ja) * 1982-01-27 1983-08-01 Dainippon Printing Co Ltd 熱収縮性合成樹脂フイルムの製造法
CN104804356A (zh) * 2014-01-23 2015-07-29 神华集团有限责任公司 一种阻燃抗静电组合物及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1034126C (zh) * 1990-03-15 1997-02-26 中国科学院化学研究所 机载雷达波导天线杜仲密封材料
TWI227717B (en) * 1999-05-24 2005-02-11 Mitsui Chemicals Inc A polyolefin stretch film
JP2010196053A (ja) * 2009-01-30 2010-09-09 Sekisui Plastics Co Ltd ポリオレフィン系樹脂フィルム及び積層シート
CN102134333B (zh) * 2010-12-13 2013-04-17 北京宜科博泰生态科技有限公司 高强度生物降解热塑性淀粉树脂及其制备方法和应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58128819A (ja) * 1982-01-27 1983-08-01 Dainippon Printing Co Ltd 熱収縮性合成樹脂フイルムの製造法
CN104804356A (zh) * 2014-01-23 2015-07-29 神华集团有限责任公司 一种阻燃抗静电组合物及其制备方法

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
丁浩: "《塑料工业使用手册.上册》", 31 August 2000, 化学工业出版社 *
乔庆东等: "《碳五烯烃的精细化工利用》", 31 January 2015, 辽宁科学技术出版社 *
郭静: "《高分子材料改性》", 31 January 2009, 中国纺织出版社 *
陈乐怡: "《合成树脂及塑料牌号手册(上册)》", 31 July 2003, 中国石化出版社 *
马康健等: "《首届国际杜仲学术会议文集》", 31 May 1999, 中国林业出版社 *

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