CN106211609A - The screen printing method of thick copper printed circuit board (PCB) - Google Patents
The screen printing method of thick copper printed circuit board (PCB) Download PDFInfo
- Publication number
- CN106211609A CN106211609A CN201610600735.7A CN201610600735A CN106211609A CN 106211609 A CN106211609 A CN 106211609A CN 201610600735 A CN201610600735 A CN 201610600735A CN 106211609 A CN106211609 A CN 106211609A
- Authority
- CN
- China
- Prior art keywords
- screen printing
- time
- pcb
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
The present invention relates to the screen printing method of a kind of thick copper printed circuit board (PCB), including step: nog plate；Open oil；Ink silk screen printing for the first time；The most pre-baked；Ink silk screen printing for the second time；The most pre-baked；Para-position and exposure；Development.The screen printing method of above-mentioned thick copper printed circuit board (PCB), is provided with twice ink silk screen printing.In first time ink silk screen printing, in substrate regions and be close to the edge of copper circuit, forming the ink band surrounding copper circuit, this ink band is for reducing the drop between copper circuit and the substrate surface that thickness is bigger.For the second time in ink silk screen printing, copper land and substrate regions are carried out the ink silk screen printing of spreadability.By said method, the problem that the ink thickness of the copper circuit edge solving thick copper printed circuit board (PCB) is the most up to standard, improves conforming product rate.
Description
Technical field
The present invention relates to a kind of printed-board technology field, particularly relate to the silk-screen side of a kind of thick copper printed circuit board (PCB)
Method.
Background technology
In the production process of printed circuit board (PCB), by etch process, the Copper Foil on printed circuit board (PCB) is etched into copper line
Behind road (forming end layers of copper), carry out plating and thicken copper cash (formation additional copper layers), then one layer of ink is coated in printed circuit
Plate is not required on circuit and the base material of welding, and the green oil that such as industry is conventional, its effect is: (1) prevents the physical property of conductor circuit
Broken string；(2), in welding procedure, the short circuit produced because of bridging is prevented；(3) only weld in the part that must weld, it is to avoid weldering
Material waste；(4) copper staining of butt welding splicing groove is reduced；(5) prevent because the outside environmental elements such as dust, moisture content causes insulation to dislike
Change, corrode；(6) there is high-insulativity, make the densification of circuit be possibly realized.
The copper of the end layers of copper of copper circuit is thick general 1 ounce (thickness is about 35 μm) the most in the printed circuit boards, and
Some is for the current load power of circuit requires bigger client, and the current carrying capacity that the copper of 1 ounce is thick is the lowest, because of
This, for this kind of client, producer needs the copper increasing end layers of copper thick, after adding additional copper layers, total copper of whole copper circuit
Thickness too increases much, the thickest copper printed circuit board (PCB) of the thick bigger printed circuit board (PCB) of this kind of copper.Additionally, copper circuit
The sidewall at edge not vertical substrate surface, but an inclined plane, the cross section of copper circuit present one inverted trapezoidal.And
The problem that the increase that copper is thick brings is, after traditional printed circuit board (PCB) ink silk screen printing, owing to copper thickness increases, and copper circuit
The surface of edge and base material create transnormal drop value, after method ink for screen printing traditionally, ink is to line
The covering of road and base material is uneven, and the particularly ink in copper circuit edge is thin relative to other regions a lot, at inclined plane
Being difficult to be completely covered by ink, ink thickness is the most up to standard, and ink herein is easily breakdown during test and use, it is impossible to
Meeting the demand of client, conforming product rate is low.
Summary of the invention
Based on this, the present invention provides the screen printing method of a kind of thick copper printed circuit board (PCB) improving conforming product rate.
A kind of screen printing method of thick copper printed circuit board (PCB), including step:
There is provided one to complete the printed circuit board (PCB) that the plating of copper circuit thickeies, this printed circuit board (PCB) is polished；
Allotment ink, is adjusted to 50Pa s～80Pa s by the oil viscosity of opening of ink；
Complete printed circuit board (PCB) of polishing carries out ink silk screen printing for the first time, and ink silk screen printing is being printed by ink silk screen printing for the first time
The substrate regions of printed circuit board and at the edge of copper circuit, and form the ink band surrounding copper circuit, ink band is adjacent
The sidewall at the edge of copper circuit also covers the top at edge of copper circuit；
Printed circuit board (PCB) complete for first time ink silk screen printing is carried out the most pre-baked；
Pre-baked complete printed circuit board (PCB) for the first time is carried out second time ink silk screen printing, and ink silk screen printing is by ink silk for the second time
It is imprinted on substrate regions and the copper land of printed circuit board (PCB), and forms covering substrate regions and the oil of copper land
Ink cover layer；
Printed circuit board (PCB) complete for second time ink silk screen printing is carried out second time pre-baked；
The pre-baked complete printed circuit board (PCB) of second time is carried out para-position and exposure；
Develop exposing complete printed circuit board (PCB).
The screen printing method of above-mentioned thick copper printed circuit board (PCB), is provided with twice ink silk screen printing.In first time ink silk screen printing,
In substrate regions and be close to the edge of copper circuit, forming the ink band surrounding copper circuit, this ink band is used for reducing thickness
The bigger drop between copper circuit and substrate surface.For the second time in ink silk screen printing, to copper land and substrate regions
Carry out the ink silk screen printing of spreadability.This screen printing method, one side ensure that the oil of the copper circuit edge after silk-screen
Ink thickness, on the other hand, when first time ink silk screen printing, only the copper circuit edge in substrate regions carries out silk-screen, and the
Secondary then carries out comprehensive covering of copper circuit and base material, saves the consumption of ink.By said method, solve thick copper printing
The problem that the ink thickness of the copper circuit edge of circuit board is the most up to standard, improves conforming product rate.
Wherein in an embodiment, the most pre-baked temperature is 70 DEG C～75 DEG C, and the most pre-baked time is
18min～25min.
Wherein in an embodiment, the most pre-baked temperature is 72 DEG C, and the most pre-baked time is 20min.
Wherein in an embodiment, the most pre-baked temperature is 70 DEG C～75 DEG C, and the most pre-baked time is
38min～45min.
Wherein in an embodiment, the most pre-baked temperature is 72 DEG C, and the most pre-baked time is 40min.
Wherein in an embodiment, the width at the top at the edge of the copper circuit covered by described ink band is
0.12mm～0.17mm.
Wherein in an embodiment, the width at the top at the edge of the copper circuit covered by described ink band is
0.15mm。
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the screen printing method of the thick copper printed circuit board (PCB) of an embodiment of the present invention；
Fig. 2 is copper circuit limit after the first time ink silk screen printing in the screen printing method of the thick copper printed circuit board (PCB) shown in Fig. 1
Schematic cross-section at Yan；
In accompanying drawing, the implication of each label is:
10-printed circuit board (PCB)；
20-copper circuit；
30-base material；
40-ink band.
Detailed description of the invention
By inventive feature, technological means and the specific purposes reached, function can be further appreciated that, resolve this
Bright advantage and spirit, be further understood the detailed description of the present invention with detailed description of the invention by below in conjunction with accompanying drawing.
Seeing accompanying drawing 1 and Fig. 2, it is the screen printing method of thick copper printed circuit board (PCB) of an embodiment of the present invention.
As it is shown in figure 1, the screen printing method of this kind of thick copper printed circuit board (PCB), including step:
S10: provide one to complete the printed circuit board (PCB) 10 that the plating of copper circuit thickeies, carry out this printed circuit board (PCB) 10 beating
Mill.
S20: allotment ink, is adjusted to 50Pa s～80Pa s by the oil viscosity of opening of ink.Preferably, opening oil viscosity is
65Pa s, in other embodiments, ink open oil viscosity can also be adjusted to 50Pa s, 60Pa s, 70Pa s or
80Pa·s。
S30: complete printed circuit board (PCB) 10 of polishing is carried out ink silk screen printing for the first time, and ink silk screen printing is by ink silk for the first time
It is imprinted on base material 30 region of printed circuit board (PCB) 10 and at the edge of copper circuit 20, and forms the ink surrounding copper circuit 20
Band 40, the sidewall at the edge of ink band 40 adjacent copper circuit 20 also covers the top at edge of copper circuit 20.For the first time
During ink silk screen printing, making the shelves net matched and nail bed according to the layout of printed circuit board (PCB) 10, shelves net is for by for the first time
The silk-screen district of ink and non-silk-screen separate from, and follow closely bed for blocking the via on printed circuit board (PCB) 10 and by printed circuit board (PCB) 10
Set up, the two-sided of printed circuit board (PCB) 10 can be carried out silk-screen simultaneously.Herein, as in figure 2 it is shown, ink band 40 adjacent copper line
The sidewall at the edge on road 20 also covers the top at edge of copper circuit 20；Specifically, the cross section of the copper cash on copper circuit 20
For inverted trapezoidal, ink band 40 cross section in the direction of the width that ink silk screen printing is formed for the first time is adjacent copper circuit 20
The sidewall at edge and cover the slope at top at edge of copper circuit 20.The outer slope of ink band 40 is 40 °～50 °,
Such as 42 °, 45 ° or 47 °, the inner side of ink band 40 is filled with what the sidewall at the edge of copper circuit 20 and base material 30 surface were formed
Angle space, and ink band 40 also covers the top at edge of copper circuit 20.Additionally, the copper covered by ink band 40
The width (D see marked in accompanying drawing 2) at the top at the edge of circuit 20 is 0.12mm～0.17mm.Being preferably, this width is
0.15mm.And in other embodiments, the width at the top at the edge of the copper circuit 20 covered by ink band 40 can also be
0.12mm, 0.13mm, 0.14mm, 0.16mm or 0.17mm.
S40: printed circuit board (PCB) 10 complete for first time ink silk screen printing is carried out the most pre-baked.The most pre-baked temperature
Being 70 DEG C～75 DEG C, the most pre-baked time is 18min～25min.It is preferably: the most pre-baked temperature is 72 DEG C, the
The most pre-baked time is 20min.In other embodiments, the most pre-baked temperature can also be 70 DEG C, 71 DEG C, 73 DEG C,
74 DEG C or 75 DEG C.The most pre-baked time can be 18min, 19min, 21min, 2min, 23min or 25min.
S50: pre-baked complete printed circuit board (PCB) 10 for the first time carries out second time ink silk screen printing, and ink silk screen printing will for the second time
Ink silk screen printing is in base material 30 region of printed circuit board (PCB) 10 and copper land, and forms covering base material 30 region and copper
The ink cover layer of land.After first time ink silk screen printing, the edge of copper circuit 20 subtracts with the drop on base material 30 surface
Few, now, by second time ink silk screen printing, copper circuit and base material 30 are carried out ink covering.It should be noted that second time
The overlay area of ink silk screen printing refers to the non-solder region on printed circuit board (PCB) 10.For welding region (such as copper circuit 20
On pad, via etc.) and be not belonging to the overlay area of second time ink silk screen printing.
S60: printed circuit board (PCB) 10 complete for second time ink silk screen printing is carried out second time pre-baked.The most pre-baked temperature
Being 70 DEG C～75 DEG C, the most pre-baked time is 38min～45min.Being preferably, the most pre-baked temperature is 72 DEG C, the
Secondary pre-baked time is 40min.In other embodiments, the most pre-baked temperature can also be 70 DEG C, 71 DEG C, 73 DEG C,
74 DEG C or 75 DEG C.The most pre-baked time can be 38min, 39min, 41min, 42min, 43min or 45min.
S70: the pre-baked complete printed circuit board (PCB) 10 of second time is carried out para-position and exposure.
S80: develop exposing complete printed circuit board (PCB) 10.
The screen printing method of above-mentioned thick copper printed circuit board (PCB), is provided with twice ink silk screen printing.In first time ink silk screen printing,
On base material 30 region and be close to the edge of copper circuit 20, forming the ink band 40 surrounding copper circuit 20, this ink band 40 is used
In the drop reduced between copper circuit 20 and base material 30 surface that thickness is bigger, it is filled with the sidewall at the edge of copper circuit 20
Hole region between inclined-plane and base material 30, forms the smooth excessiveness district of junction between a copper circuit 20 and base material 30.
For the second time in ink silk screen printing, copper land and base material 30 region are carried out the ink silk screen printing of spreadability.This screen printing method,
One side ensure that the ink thickness of copper circuit 20 edge after silk-screen, on the other hand, in first time ink silk screen printing
Time, only copper circuit 20 edge on base material 30 region carries out silk-screen, and second time then carries out copper circuit 20 and base material 30
Comprehensive covering, save the consumption of ink.By said method, solve copper circuit 20 edge of thick copper printed circuit board (PCB)
Ink thickness problem the most up to standard, improve conforming product rate.
Each technical characteristic of above example can combine arbitrarily, for making description succinct, not to above-described embodiment
In all possible combination of each technical characteristic be all described, but, as long as there is not lance in the combination of these technical characteristics
Shield, is all considered to be the scope that this specification is recorded.
Above example only have expressed the present invention preferred embodiment, and it describes more concrete and detailed, but not
Can therefore be construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection model of the present invention
Enclose.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (7)
1. the screen printing method of a thick copper printed circuit board (PCB), it is characterised in that include step:
There is provided one to complete the printed circuit board (PCB) that the plating of copper circuit thickeies, this printed circuit board (PCB) is polished；
Allotment ink, is adjusted to 50Pa s～80Pa s by the oil viscosity of opening of ink；
Complete printed circuit board (PCB) of polishing carries out ink silk screen printing for the first time, and ink silk screen printing is electric in printing by ink silk screen printing for the first time
The substrate regions of road plate and at the edge of copper circuit, and form the ink band surrounding copper circuit, described ink band is adjacent
The sidewall at the edge of described copper circuit also covers the top at edge of described copper circuit；
Printed circuit board (PCB) complete for first time ink silk screen printing is carried out the most pre-baked；
Pre-baked complete printed circuit board (PCB) for the first time is carried out second time ink silk screen printing, and ink silk screen printing is existed by ink silk screen printing for the second time
The substrate regions of printed circuit board (PCB) and copper land, and formed and cover the ink of substrate regions and copper land and cover
Cap rock；
Printed circuit board (PCB) complete for second time ink silk screen printing is carried out second time pre-baked；
The pre-baked complete printed circuit board (PCB) of second time is carried out para-position and exposure；
Develop exposing complete printed circuit board (PCB).
The screen printing method of thick copper printed circuit board (PCB) the most according to claim 1, it is characterised in that described first time is pre-baked
Temperature is 70 DEG C～75 DEG C, and pre-baked time described first time is 18min～25min.
The screen printing method of thick copper printed circuit board (PCB) the most according to claim 2, it is characterised in that described first time is pre-baked
Temperature is 72 DEG C, and pre-baked time described first time is 20min.
The screen printing method of thick copper printed circuit board (PCB) the most according to claim 1, it is characterised in that described second time is pre-baked
Temperature is 70 DEG C～75 DEG C, and described second time pre-baked time is 38min～45min.
The screen printing method of thick copper printed circuit board (PCB) the most according to claim 4, it is characterised in that described second time is pre-baked
Temperature is 72 DEG C, and described second time pre-baked time is 40min.
The screen printing method of thick copper printed circuit board (PCB) the most according to claim 1, it is characterised in that covered by described ink band
The width at top at edge of copper circuit be 0.12mm～0.17mm.
The screen printing method of thick copper printed circuit board (PCB) the most according to claim 6, it is characterised in that covered by described ink band
The width at top at edge of copper circuit be 0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600735.7A CN106211609B (en) | 2016-07-27 | 2016-07-27 | The screen printing method of thick copper printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600735.7A CN106211609B (en) | 2016-07-27 | 2016-07-27 | The screen printing method of thick copper printed circuit board |
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| Publication Number | Publication Date |
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| CN106211609A true CN106211609A (en) | 2016-12-07 |
| CN106211609B CN106211609B (en) | 2019-02-01 |
Family
ID=57495347
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| CN201610600735.7A Active CN106211609B (en) | 2016-07-27 | 2016-07-27 | The screen printing method of thick copper printed circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107027240A (en) * | 2017-05-09 | 2017-08-08 | 东莞福哥电子有限公司 | A kind of high resistance carbon film wiring board and its manufacture method |
| CN109152235A (en) * | 2018-10-09 | 2019-01-04 | 珠海杰赛科技有限公司 | A kind of printing method of circuit board |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN112087884A (en) * | 2020-08-17 | 2020-12-15 | 鹤山市中富兴业电路有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN113710000A (en) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | Linemask processing technology of thick copper plate |
| CN114449764A (en) * | 2021-12-31 | 2022-05-06 | 广东兴达鸿业电子有限公司 | Circuit board silk-screen method |
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| CN101977483A (en) * | 2010-08-20 | 2011-02-16 | 奥士康精密电路（惠州）有限公司 | Welding resistance method for industrial control panel |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN105307413A (en) * | 2015-10-29 | 2016-02-03 | 胜华电子（惠阳）有限公司 | Ultra-thick white oil circuit board screen-printing method |
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| JP2000340931A (en) * | 1999-05-19 | 2000-12-08 | Qunce Electronic Co Ltd | Solder mask forming method |
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
| CN101977483A (en) * | 2010-08-20 | 2011-02-16 | 奥士康精密电路（惠州）有限公司 | Welding resistance method for industrial control panel |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107027240A (en) * | 2017-05-09 | 2017-08-08 | 东莞福哥电子有限公司 | A kind of high resistance carbon film wiring board and its manufacture method |
| CN109152235A (en) * | 2018-10-09 | 2019-01-04 | 珠海杰赛科技有限公司 | A kind of printing method of circuit board |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN112087884A (en) * | 2020-08-17 | 2020-12-15 | 鹤山市中富兴业电路有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN113710000A (en) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | Linemask processing technology of thick copper plate |
| CN114449764A (en) * | 2021-12-31 | 2022-05-06 | 广东兴达鸿业电子有限公司 | Circuit board silk-screen method |
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| CN106211609B (en) | 2019-02-01 |
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