CN106205950A - Common-mode filter and manufacture method thereof - Google Patents
Common-mode filter and manufacture method thereof Download PDFInfo
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- CN106205950A CN106205950A CN201510292493.5A CN201510292493A CN106205950A CN 106205950 A CN106205950 A CN 106205950A CN 201510292493 A CN201510292493 A CN 201510292493A CN 106205950 A CN106205950 A CN 106205950A
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- 239000002131 composite material Substances 0.000 claims description 11
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- 239000010410 layer Substances 0.000 description 105
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2866—Combination of wires and sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/42—Balance/unbalance networks
- H03H7/425—Balance-balance networks
- H03H7/427—Common-mode filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/008—Electric or magnetic shielding of printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F2017/0093—Common mode choke coil
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Abstract
Disclose a kind of common-mode filter and manufacture method thereof.According to an aspect of the present invention, common-mode filter includes: substrate；Wave filtering layer, including coil and insulating barrier, and wave filtering layer is formed on substrate, is used for removing signal noise；Magnetic coupling layer, is laminated on wave filtering layer；Electrostatic attraction electrode pattern, is formed on magnetic coupling layer, is used for destaticing, and a part for electrostatic attraction electrode pattern is exposed to the side surface of magnetic coupling layer；Sealant, is laminated on electrostatic attraction electrode pattern, to seal electrostatic attraction electrode pattern；Side surface electrode, a part for the described exposure with electrostatic attraction electrode pattern is connected and is formed in a longitudinal direction between sealant and substrate.
Description
This application claims and be submitted to the of Korean Intellectual Property Office on August 25th, 2014
The rights and interests of 10-2014-0110879 korean patent application, this application entire disclosure is by quoting bag
It is contained in this.
Technical field
The present invention relates to a kind of common-mode filter and manufacture method thereof.
Background technology
Along with recent scientific and technological progress, increasing electronic installation (such as, mobile phone, household electric
Sub-electrical equipment, PC, PDA and LCD) become digital display circuit from analog systems.Additionally, due to quilt
The amount of the data processed increases, it is therefore desirable to electronic installation runs faster.
Along with electronic installation by digitized and becomes faster, electronic installation can more come from extraneous stimulation
The sensitiveest.That is, any little abnormal voltage of being incorporated into the internal circuit of electronic installation from the external world or
High-frequency noise may result in the damage of circuit or the distortion of signal.
The circuit causing electronic installation damages or the source of the abnormal voltage of distorted signals and noise includes dodging
Electricity, be charged the electrostatic of human body electric discharge, the switching voltage produced in circuit, be included in power supply electricity
Power supply noise in pressure, unnecessary electromagnetic signal or electromagnetic noise etc..
In order to prevent electronic installation circuit damage or distorted signals, wave filter need be installed to be prevent different
Often voltage and high-frequency noise are introduced in circuit.Specifically, generally common-mode filter is arranged on (example
As) high-speed differential signal circuit removes common-mode noise.
Meanwhile, in order to suppress to go out at the input/output terminal in common differential signal transmission system
Existing static discharge (ESD), in addition to common-mode filter, in addition it is also necessary to use diode, rheostat and
/ or other passive element, to remove common-mode noise.
Extra passive element is used to cause erection space increase, production cost to increase to solve ESD problem
And the distortion of signal.
The prior art of the present invention is disclosed in 10-2012-0033644 Korean Patent Publication (2012
On April 9, in is open).
Summary of the invention
The embodiment provides common-mode filter and the manufacture of a kind of function having and destaticing
The method of common-mode filter, wherein, common-mode filter has wave filtering layer, the magnetic being sequentially laminated on substrate
Property composite bed, electrostatic attraction electrode pattern and sealant, and make electrostatic attraction electrode pattern be electrically connected to along longitudinal side
To the side surface electrode formed.
Here, wave filtering layer, magnetic coupling layer, electrostatic attraction electrode pattern and sealant can be laminated and be formed at core
A surface on, and substrate can be bonded to wave filtering layer remove the surface of core from it.
According to an aspect of the present invention, a kind of common-mode filter includes: substrate；Wave filtering layer, including coil
And insulating barrier, and described wave filtering layer is formed on substrate, is used for removing signal noise；Magnetic coupling layer,
It is laminated on wave filtering layer；Electrostatic attraction electrode pattern, is formed on magnetic coupling layer, is used for destaticing, and
And a part for electrostatic attraction electrode pattern is exposed to the side surface of magnetic coupling layer；Sealant, is laminated to electrostatic
On electrode pattern, to seal electrostatic attraction electrode pattern；Side surface electrode, with electrostatic attraction electrode pattern described cruelly
The part connection of dew, and be formed in a longitudinal direction between sealant and substrate.
According to a further aspect in the invention, a kind of common-mode filter includes: substrate；Wave filtering layer, including line
Enclose and insulating barrier, and described wave filtering layer is formed on substrate, is used for removing signal noise；Magnetic coupling
Layer, is laminated on wave filtering layer；Electrostatic attraction electrode pattern, is formed on magnetic coupling layer, is used for destaticing；
Sealant, is laminated on electrostatic attraction electrode pattern, to seal electrostatic attraction electrode pattern, and described electrostatic attraction electrode
Pattern penetrates a part for sealant so that the part exposure of electrostatic attraction electrode pattern；Side surface electrode,
Described exposure with electrostatic attraction electrode pattern a part is connected, and be formed in a longitudinal direction sealant and
Between substrate.
According to another aspect of the invention, a kind of method forming common-mode filter includes: at one of core
Coil is formed on surface；By forming filtering at core surface overlaminate insulating barrier to cover coil
Layer；Magnetic coupling is pressed on wave filtering layer layer by layer；Magnetic coupling layer is formed electrostatic attraction electrode pattern, quiet
A part for electricity electrode pattern is exposed to the side surface of magnetic coupling layer；In the upper strata densification of electrostatic attraction electrode pattern
Sealing；Core is removed from wave filtering layer；The surface that the core of substrate bonding to wave filtering layer is removed.
Accompanying drawing explanation
Fig. 1 is the perspective view illustrating common-mode filter according to an embodiment of the invention.
Fig. 2 is the sectional view illustrating common-mode filter according to an embodiment of the invention.
Fig. 3 is the flow chart illustrating the method manufacturing common-mode filter according to an embodiment of the invention.
Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10 and Figure 11 show according to the present invention's
The key step of the method manufacturing common-mode filter of embodiment.
Figure 12 is the sectional view illustrating common-mode filter according to another embodiment of the present invention.
Detailed description of the invention
Hereinafter, will be described in detail with reference to the accompanying drawings certain of the common-mode filter according to the present invention and manufacture method thereof
A little embodiments.During describing the present invention with reference to the accompanying drawings, any identical or corresponding element will be by
Identical label instruction, and the repeated description of identical or corresponding element will be provided.
Such as " first " can be only used for the term of " second " distinguishing element identical with another or
Corresponding element, but said elements is not restricted to above-mentioned term.
When an element be described as " in conjunction with " to another element time, be not only refer to these elements it
Between physical contact, directly contact, and also should include another element between these elements and these
The probability that each element in element contacts with described another element.
Fig. 1 is the perspective view illustrating common-mode filter according to an embodiment of the invention.Fig. 2 is to illustrate root
Sectional view according to the common-mode filter of embodiments of the invention.
See figures.1.and.2, according to an embodiment of the invention common-mode filter 1000 include substrate 100,
Wave filtering layer 200, magnetic coupling layer 300, electrostatic attraction electrode pattern 400, sealant 500 and side surface electrode
600, and may also include tack coat 700.
Substrate 100 can form magnetic field with magnetic coupling layer 300, and wherein, substrate 100 is to support wave filtering layer
The parts of 200.In this case, substrate 100 is used for supporting wave filtering layer 200 and may be provided at basis
The bottom of the common-mode filter 1000 of the present embodiment.
Here, substrate 100 can include magnetic material and be used as closed magnetic circuit.Such as, substrate 100 can wrap
Include ferrite sintered body or the ceramic material of such as forsterite.Substrate 100 can be according to common-mode filter 1000
Shape and formed according to predetermined area or thickness.
Wave filtering layer 200 includes coil 210,211 and insulating barrier 220,221, and wave filtering layer 200 sets
Put on the substrate 100, be used for removing signal noise.As in figure 2 it is shown, wave filtering layer 200 can include lamination
Multiple insulating barriers 220,221 and multiple coil 210,211.
It is to say, wave filtering layer 200 can include the coil being sequentially laminated on the upper surface of substrate 100
211, insulating barrier 221, coil 210 and insulating barrier 220, wherein, coil 211 and 210 is respectively provided with
Between insulating barrier 221 and substrate 100 and between insulating barrier 221 and insulating barrier 220.Here, as
Fruit needs, and insulating barrier 220,221 can be made from a variety of materials.
Such as, being formed at the insulating barrier 220 at the part contacted with magnetic coupling layer 300 can be by lamination
Bonding composite sheet and formed, to promote and the combination of magnetic coupling layer 300.
Insulating barrier 220,221 can be by using polyimides, epoxy resin, benzocyclobutene (BCB)
Or any other polymer and formed, or can be by utilizing photosensitive hole forming method (photo via method)
Or laser punching method is formed.Here, photosensitive hole forming method refers to utilize special the showing being added with insulating resin
Shadow ink is as the laminating method of insulating barrier 220,221.
Additionally, as in figure 2 it is shown, cavity can be formed at a part of place of insulating barrier 220,221, and pass through
Magnet (such as, magnetic coupling layer 300) is utilized to fill this cavity and strengthen magnetic flux.
Coil 210,211 in wave filtering layer 200 can be with side surface electrode 600 or single outside terminal electricity
Connecting, side surface electrode 600 or individually outside terminal are formed at the common-mode filter according to the present embodiment
On the side surface of 1000 or top surface.
The magnetic coupling layer 300 being laminated on wave filtering layer 200 can form magnetic field with substrate 100.Additionally,
Magnetic coupling layer 300 can protect wave filtering layer 200 together with substrate 100.
Specifically, in the case of electrostatic attraction electrode pattern 400 contact laminating is on coil 210,211, can
The loss of pcrmeability can occur, thus weaken the function of common-mode filter.Therefore, coil 210,211 can
Sealed by magnetic coupling layer 300, and electrostatic attraction electrode pattern 400 can be formed on magnetic coupling layer 300.
Meanwhile, as it has been described above, be formed at a part for the insulating barrier 220,221 of wave filtering layer 200 at cavity
In the case of place, magnetic coupling layer 300 can be laminated on wave filtering layer 200 while filling this cavity.
The absorbable too much voltage caused owing to there is electrostatic of electrostatic attraction electrode pattern 400, to suppress quiet
Discharge of electricity (ESD), wherein, electrostatic attraction electrode pattern 400 is formed on magnetic coupling layer 300 to remove quiet
Electricity also makes a part for electrostatic attraction electrode pattern 400 be exposed to the side surface of magnetic coupling layer 300.
Electrostatic attraction electrode pattern 400 can be by Organic substance and from by TiO2、RuO2、Pt、Pd、Ag、Au、
The material that at least one conductive material chosen in the group of Ni, Cr, W, Cu and Al composition mixes
Make.Additionally, electrostatic attraction electrode pattern 400 can by utilize exposed and developed typography and according to
Predetermined pattern is formed.
In this case, as in figure 2 it is shown, a part for electrostatic attraction electrode pattern 400 can be exposed to magnetic
The side surface of composite bed 300, to electrically connect with side surface electrode 600.
It is laminated on electrostatic attraction electrode pattern 400 can lead to the sealant 500 sealing electrostatic attraction electrode pattern 400
Cross sealing electrostatic attraction electrode pattern 400 and fix and protect electrostatic attraction electrode pattern 400.That is, sealant 500
It is a kind of solder mask for preventing electrostatic attraction electrode pattern 400 from exposing and can be formed according to shown in Fig. 2
The uppermost surface of the common-mode filter 1000 of the present embodiment.
Side surface electrode 600 allows top surface and end table at the common-mode filter 1000 according to the present embodiment
Conducting electricity between face, wherein, side surface electrode 600 is exposed to magnetic coupling with electrostatic attraction electrode pattern 400
Layer 300 side surface a part connection, with between sealant 500 and substrate 100 along longitudinal side
Formed to (that is, the vertical direction in Fig. 1).
In the common-mode filter 1000 according to the present embodiment, electrostatic attraction electrode pattern 400 is provided only on common mode
In the top of wave filter 1000.Therefore, in order to make electrostatic attraction electrode pattern 400 and common-mode filter 1000
Bottom electrical connection, it may be necessary in magnetic coupling layer 300 and substrate 100, form via etc., and
May need to introduce other grinding technics, thus cause manufacturing process to increase.
But, as it has been described above, in the common-mode filter 1000 according to the present embodiment, side surface can be passed through
Electrode 600 conducts electricity between the top surface and basal surface of common-mode filter 1000, and therefore, this can make manufacture
Technique is minimized, and saves processing cost and process time.
In the common-mode filter 1000 according to the present embodiment, a part for electrostatic attraction electrode pattern 400 can be led to
Cross and penetrate sealant 500 and be exposed to the top surface of sealant 500, and the electrostatic attraction electrode pattern exposed
400 can electrically connect with side surface electrode 600.
In the common-mode filter 1000 according to the present embodiment, can be at core 10 (figure 4 illustrates)
It is sequentially laminated and is formed wave filtering layer 200, magnetic coupling layer 300, electrostatic attraction electrode pattern 400 on one surface
With sealant 500, what substrate 100 can be bonded to wave filtering layer 200 removes the surface of core 10 from it.
In other words, the coil 210,211 being used for removing signal noise can be by utilizing single core 10
Formed as interim carrier.Then, can be by electrostatic attraction electrode pattern 400 (being used for destaticing)
Removing core 10 after being formed on wave filtering layer 200, wherein, wave filtering layer 200 has the line being formed thereon
Circle 210,211.Then, by substrate 100 being bonded in from the surface that it removes core 10, can shape
Become there is the common-mode filter 1000 of the structure shown in Fig. 1 and Fig. 2.
When manufacturing traditional thin common-mode filter, introducing is needed to spray, electroplate, grind and interlayer pair
The technique that the cost of (inter-layer alignment) is at a relatively high together forms wave filtering layer, thus relatively increases
Add process costs and time.
But, in the common-mode filter 1000 according to the present embodiment, with general multilayer board
Identical, single core 10 forms the coil 210,211 of metal, to remove generally traditional
The needs of aligned process introduced in the manufacture process of thin common-mode filter.Additionally, due to magnetic is multiple
Conjunction layer 300 can be laminated as the manufacture process of general multilayer board and form, so can be minimum
Change relevant technique.
Tack coat 700 can provide smooth bonding surface and stronger bonding, wherein, tack coat 700
Between substrate 100 and wave filtering layer 200, it is used for making substrate 100 be bonded to one another with wave filtering layer 200.
Tack coat 700 by using polyimides, epoxy resin, benzocyclobutene (BCB) or can be appointed
What its polymer and formed, and by utilizing (such as) rotary coating layer, lamination, slit type to be coated with
Cloth (slit die coating) etc. regulate the thickness of tack coat 700 and regulate its impedance.
Additionally, tack coat 700 may be structured to by (such as) via utilizing magnetically permeable material
(magnetically-permeable material) strengthens magnetic flux and improves the merit of common-mode filter 1000
Energy.
In the case of magnetic coupling layer 300 is formed by the composite sheet comprising magnetic material, can be more effectively
Manufacture the common-mode filter 1000 according to the present embodiment.Such as, magnetic coupling layer 300 can be by comprising
The chip architecture that the epoxy resin of ferrite powder is formed.
Because for the common-mode filter 1000 according to the present embodiment, composite sheet only need to be attached to filter
On the top surface of ripple layer 200, and without magnetic coupling layer 300 is coated on wave filtering layer 200 or
The complicated technique being filled in wave filtering layer 200 by magnetic coupling layer 300, so can more easily manufacture
Common-mode filter 1000.
Magnetic coupling layer 300 can substitute with insulating barrier 220,221 or can be formed by paste.
Figure 12 is the sectional view illustrating common-mode filter according to another embodiment of the present invention.
As shown in figure 12, common-mode filter 2000 according to another embodiment of the present invention includes substrate
100, wave filtering layer 200, magnetic coupling layer 300, electrostatic attraction electrode pattern 400, sealant 500 and side table
Face electrode 600, and may also include tack coat 700.
Specifically, as shown in figure 12, in the common-mode filter 2000 according to the present embodiment, sealant
500 are laminated on electrostatic attraction electrode pattern 400, to seal electrostatic attraction electrode pattern 400, and electrostatic attraction electrode figure
Case 400 penetrates a part for sealant 500 so that the part exposure of electrostatic attraction electrode pattern 400.
Side surface electrode 600 and the exposure being exposed by sealant 500 of electrostatic attraction electrode pattern 400
Partly connect (as mentioned above), and formed in a longitudinal direction between sealant 500 and substrate 100.
In other words, a part for electrostatic attraction electrode pattern 400 is exposed to the top surface of common-mode filter 2000,
And the electrostatic attraction electrode pattern 400 being exposed to top surface can electrically connect with side surface electrode 600.
Therefore, common-mode filter 2000 according to another embodiment of the present invention also can minimized other mistake
The formation in hole etc., therefore, makes manufacturing process minimized, and saves processing cost and process time.
Except said elements, the major part unit of common-mode filter 2000 according to another embodiment of the present invention
Part identical with those elements of common-mode filter 1000 according to an embodiment of the invention or similar, because of
This, will not provide any repetitive description at this.
Fig. 3 is the flow chart illustrating the method manufacturing common-mode filter according to an embodiment of the invention.Figure
4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10 and Figure 11 show according to embodiments of the invention
The key step of method manufacturing common-mode filter.
As shown in Fig. 3 to Figure 11, the method manufacturing common-mode filter according to an embodiment of the invention starts
In forming coil 211 (S100, Fig. 4) on a surface of core 10.
In this case, conductive layer pattern can be then made to be formed by electroplated conductive layer on core 10
Coil 211.
Then, by core 10 surface overlaminate insulating barrier 221 cover coil 211 and according to
Identical method forms coil 210 and insulating barrier 220 and forms wave filtering layer 200 (S200, Fig. 5).?
In this case, wave filtering layer 200 can include being sequentially laminated on the top surface of core 10 coil 211, absolutely
Edge layer 221, coil 210 and insulating barrier 220, wherein, coil 211 and 210 is separately positioned on insulating barrier
Between 221 and core 10 and between insulating barrier 221 and insulating barrier 220.
Here, if it is desired, insulating barrier 220,221 can be made from a variety of materials.Such as, it is formed at
The insulating barrier 220 at part contacted with magnetic coupling layer 300 can be formed by laminated bonding composite sheet,
To promote to bond with magnetic coupling layer 300.
Additionally, as it is shown in figure 5, cavity can be formed at a part of place of insulating barrier 220,221, and pass through
Magnet (such as, magnetic coupling layer 300) is utilized to fill this cavity and strengthen magnetic flux.
It follows that at wave filtering layer 200 overlaminate magnetic coupling layer 300 (S300, Fig. 6).In this feelings
Under condition, magnetic coupling layer 300 can form magnetic field together with substrate 100.Additionally, magnetic coupling layer 300
Wave filtering layer 200 can be protected together with substrate 100.
Specifically, in the case of electrostatic attraction electrode pattern 400 contact laminating is on coil 210,211, can
The loss of pcrmeability can occur, thus weaken the function of common-mode filter.Therefore, magnetic coupling can be passed through
Layer 300 sealed loop 210,211, and electrostatic attraction electrode pattern 400 can on magnetic coupling layer 300 shape
Become.
Then, magnetic coupling layer 300 forms electrostatic attraction electrode pattern 400 (S400, Fig. 7), electrostatic
A part for electrode pattern 400 is exposed to the side surface of magnetic coupling layer 300.In this case, quiet
The absorbable too much voltage caused owing to there is electrostatic of electricity electrode pattern 400, to suppress static discharge
(ESD)。
Electrostatic attraction electrode pattern 400 can be exposed to the side surface of magnetic coupling layer 300, with side surface electrode
600 electrical connections.
Then, at electrostatic attraction electrode pattern 400 overlaminate sealant 500 (S500, Fig. 8).Here, close
Sealing 500 is laminated on electrostatic attraction electrode pattern 400 seal electrostatic attraction electrode pattern 400, and can be by close
Envelope electrostatic attraction electrode pattern 400 fixes and protects electrostatic attraction electrode pattern 400.
It is to say, sealant 500 is a kind of solder mask for preventing electrostatic attraction electrode pattern 400 from exposing
And the uppermost surface of common-mode filter 1000 according to the present embodiment can be formed.
Afterwards, core 10 (S600, Fig. 9) can be removed from wave filtering layer 200.In this case, can pass through
(such as) core 10 is removed by circuit stripping technology (routing process) from wave filtering layer 200.As a result,
The surface that can make wave filtering layer 200 exposes.
Hereafter, substrate 100 can be bonded to wave filtering layer 200 from its remove core 10 surface (S800, figure
10).That is, when manufacturing common-mode filter 1000, can be sequentially laminated on single core 10 and form filter
Ripple layer 200, magnetic coupling layer 300, electrostatic attraction electrode pattern 400 and sealant 500, then, finally
Can be bondd after removing core 10 substrate 100.
So, the method manufacturing common-mode filter according to the present embodiment, the multilamellar general with manufacture are utilized
The method of printed circuit board (PCB) is identical, forms the coil 210,211 of metal, to go on single core 10
Except to the needs usually introducing aligned process in the manufacture process at traditional thin common-mode filter.Additionally,
Form owing to magnetic coupling layer 300 can be laminated as the manufacture process of general multilayer board,
So can minimized relevant technique.
Manufacturing according in the method for the common-mode filter of the present embodiment, can be at sealant 500 and substrate 100
Between form side surface electrode 600 (S900, Figure 11), wherein, side surface electrode in a longitudinal direction
600 are connected with the part of the side surface being exposed to magnetic coupling layer 300 of electrostatic attraction electrode pattern 400.
As a result, side surface electrode 600 can allow to lead between top surface and the basal surface of common-mode filter 1000
Electricity.
In the common-mode filter 1000 according to the present embodiment, electrostatic attraction electrode pattern 400 is provided only on common mode
In the top of wave filter 1000.Therefore, in order to make electrostatic attraction electrode pattern 400 and common-mode filter 1000
Bottom electrical connection, it may be necessary in magnetic coupling layer 300 and substrate 100, form via etc., and
May need to introduce other grinding technics, thus cause manufacturing process to increase.
But, as it has been described above, manufacturing according in the method for the common-mode filter of the present embodiment, can pass through
Side surface electrode 600 and make between top surface and the basal surface of common-mode filter 1000 conduct electricity, therefore, this
Manufacturing process can be made minimized, and save processing cost and process time.
The method manufacturing common-mode filter according to the present embodiment may also include that in step S600 and step
Between S800, tack coat 700 is laminated to wave filtering layer 200 from the surface that it removes core 10 (S700).
In this case, tack coat 700 can be between substrate 100 and wave filtering layer, to provide smooth
Bonding surface and stronger bonding.Additionally, tack coat 700 may be structured to by (such as) warp
By utilizing magnetically permeable Material reinforcement magnetic flux to improve the function of common-mode filter 1000.
Manufacturing according in the method for the common-mode filter of the present embodiment, step S300 can include comprising magnetic
The compact layer of property material is pressed in (S310) on wave filtering layer 200.Such as, magnetic coupling layer 300 can be
The chip architecture formed by the epoxy resin comprising ferrite powder.
Due to for manufacture the method for common-mode filter according to the present embodiment, only need to be attached by composite sheet
On the top surface of wave filtering layer 200, and without magnetic coupling layer 300 is coated in wave filtering layer 200
Upper or that magnetic coupling layer 300 is filled in wave filtering layer 200 complicated technique, it is possible to be easier to
Ground manufactures common-mode filter 1000.
Meanwhile, in the method manufacturing common-mode filter according to an embodiment of the invention, the most
Describe the main element of common-mode filter 1000 according to an embodiment of the invention, will not provide at this and appoint
What repetitive description.
Although it have been described that only certain embodiments of the present invention, but ordinary skill of the art
Personnel it will be appreciated that without departing from the technical concept of the present invention being defined by the claims and the feelings of scope
Under condition, can there is very many arrangements and amendment in the present invention.It will also be appreciated that except above-mentioned enforcement
Multiple other embodiments beyond example are included in the claim of the present invention.
Claims (9)
1. a common-mode filter, including:
Substrate；
Wave filtering layer, including coil and insulating barrier, and described wave filtering layer is formed on substrate, is used for removing
Signal noise；
Magnetic coupling layer, is laminated on wave filtering layer；
Electrostatic attraction electrode pattern, is formed on magnetic coupling layer, is used for destaticing, and electrostatic attraction electrode figure
A part for case is exposed to the side surface of magnetic coupling layer；
Sealant, is laminated on electrostatic attraction electrode pattern, to seal electrostatic attraction electrode pattern；
Side surface electrode, a part for the described exposure with electrostatic attraction electrode pattern is connected, and along longitudinal side
To being formed between sealant and substrate.
Common-mode filter the most according to claim 1, wherein, wave filtering layer, magnetic coupling layer, quiet
Electricity electrode pattern and sealant are sequentially laminated and are formed on a surface of core,
Wherein, the surface that substrate bonding is removed to the core of wave filtering layer.
Common-mode filter the most according to claim 2, described common-mode filter also includes tack coat,
Tack coat is between substrate and wave filtering layer, so that substrate is bonded to one another with wave filtering layer.
Common-mode filter the most according to any one of claim 1 to 3, wherein, described magnetic is multiple
Close layer to be formed by the composite sheet comprising magnetic material.
5. a common-mode filter, including:
Substrate；
Wave filtering layer, including coil and insulating barrier, and described wave filtering layer is formed on substrate, is used for removing
Signal noise；
Magnetic coupling layer, is laminated on wave filtering layer；
Electrostatic attraction electrode pattern, is formed on magnetic coupling layer, is used for destaticing；
Sealant, is laminated on electrostatic attraction electrode pattern, to seal electrostatic attraction electrode pattern, and described electrostatic
Electrode pattern penetrates a part for sealant so that the part exposure of electrostatic attraction electrode pattern；
Side surface electrode, a part for the described exposure with electrostatic attraction electrode pattern is connected, and along longitudinal side
To being formed between sealant and substrate.
6. the method forming common-mode filter, described method includes:
A surface of core is formed coil；
By forming wave filtering layer at core surface overlaminate insulating barrier to cover coil；
Magnetic coupling is pressed on wave filtering layer layer by layer；
Forming electrostatic attraction electrode pattern on magnetic coupling layer, a part for electrostatic attraction electrode pattern is exposed to magnetic
The side surface of composite bed；
At electrostatic attraction electrode pattern overlaminate sealant；
Core is removed from wave filtering layer；
The surface that the core of substrate bonding to wave filtering layer is removed.
Method the most according to claim 6, described method also includes: after bonding substrate,
Side surface electrode, side surface electrode and electrostatic attraction electrode figure is formed in a longitudinal direction between sealant and substrate
The part connection of the described exposure of case.
Method the most according to claim 7, described method also includes: removing core and bonding substrate
Step between, the surface overlaminate tack coat that the core at wave filtering layer is removed.
9. according to the method according to any one of claim 6 to 8, wherein, laminated magnetic composite bed bag
Include the composite sheet comprising magnetic material at wave filtering layer overlaminate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140110879A KR20160024262A (en) | 2014-08-25 | 2014-08-25 | Common mode filter and manufacturing method thereof |
| KR10-2014-0110879 | 2014-08-25 |
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| Publication Number | Publication Date |
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| CN106205950A true CN106205950A (en) | 2016-12-07 |
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| CN201510292493.5A Pending CN106205950A (en) | 2014-08-25 | 2015-06-01 | Common-mode filter and manufacture method thereof |
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| Country | Link |
|---|---|
| US (1) | US20160055957A1 (en) |
| KR (1) | KR20160024262A (en) |
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| KR20170130699A (en) * | 2016-05-19 | 2017-11-29 | 삼성전기주식회사 | Common mode filter and manufacturing method of the same |
| KR101872596B1 (en) * | 2016-08-23 | 2018-06-28 | 삼성전기주식회사 | Composite electronic component |
| CN110676041B (en) * | 2019-09-29 | 2021-09-03 | 苏州蓝沛无线通信科技有限公司 | Assembling method of wireless charging receiving coil module |
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| US20160055957A1 (en) | 2016-02-25 |
| KR20160024262A (en) | 2016-03-04 |
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