JP2018170315A - Coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce difference of transmission characteristics between signal lines, in a coil component where three or more coils are magnetically coupled with each other.SOLUTION: A coil component includes spiral coils C11, C12 connected in parallel between terminal electrodes E1, E2, spiral coils C13, C14 connected in parallel between terminal electrodes E3, E4, and spiral coils C15, C16 connected in parallel between terminal electrodes E5, E6. The spiral coils C11, C13 are arranged to be coupled magnetically with each other, the spiral coils C12, C15 are arranged to be coupled magnetically with each other, and the spiral coils C14, C16 are arranged to be coupled magnetically with each other. Since combinations of two signal lines are created from three or more signal lines, and each combination is coupled magnetically, variation in the coupling characteristics between respective signal lines can be reduced.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a coil component, and more particularly to a coil component for magnetically coupling three or more signal lines to each other.

  A common common mode filter is a coil component in which two coils are magnetically coupled to each other, and is widely used to remove common mode noise superimposed on a pair of differential transmission lines. However, in recent years, a transmission line having three signal lines as a set is sometimes used. As a coil component for removing common mode noise superimposed on such a transmission line, three coils are magnetically connected to each other. There is a need for coil parts to be joined.

  As coil parts in which three coils are magnetically coupled to each other, coil parts described in Patent Documents 1 to 3 are known.

JP 2005-050956 A Japanese Patent No. 4147904 Japanese Patent No. 4415930

  In a coil component in which three coils are magnetically coupled to each other, the coupling characteristics between the signal lines need to match each other. That is, when the three signal lines are line A, line B, and line C, respectively, the coupling characteristics between the lines A-B, the coupling characteristics between the lines A-C, and the coupling characteristics between the lines B-C are mutually equal. Must match.

  However, the coil components described in Patent Documents 1 to 3 have a problem in that transmission characteristics differ from line to line because coupling characteristics vary between lines. Such a problem occurs not only in a coil component in which three coils are magnetically coupled to each other but also in a coil component in which four or more coils are magnetically coupled.

  Accordingly, an object of the present invention is to reduce a difference in transmission characteristics between signal lines in a coil component in which three or more coils are magnetically coupled to each other.

  The coil component according to the present invention includes first to sixth terminal electrodes, first and second spiral coils connected in parallel between the first and second terminal electrodes, and the third and fourth terminals. Third and fourth spiral coils connected in parallel between terminal electrodes; and fifth and sixth spiral coils connected in parallel between the fifth and sixth terminal electrodes. And the third spiral coil are arranged to be magnetically coupled to each other, the second and fifth spiral coils are arranged to be magnetically coupled to each other, and the fourth and sixth spiral coils are magnetically coupled to each other. It is arranged so that it may be arranged.

  According to the present invention, a combination of two signal lines is created from among three or more signal lines, and each combination is magnetically coupled, so that variations in coupling characteristics between the signal lines can be reduced. it can. Thereby, it is possible to reduce the difference in transmission characteristics between the signal lines.

  In the present invention, the first and third spiral coils overlap each other in plan view, the second and fifth spiral coils overlap each other in plan view, and the fourth and sixth spiral coils overlap each other in plan view. It is preferable to overlap. According to this, it becomes possible to increase the magnetic coupling of each spiral coil.

  In this case, the semiconductor device further includes first and second conductor layers, and an insulating layer provided between the first conductor layer and the second conductor layer, and the first to sixth spiral coils. It is preferable that any three are formed in the first conductor layer, and the remaining three of the first to sixth spiral coils are formed in the second conductor layer. According to this, the capacitance components generated between the spiral coils can be matched with each other, and the capacitance components generated between the spiral coils can be adjusted according to the thickness of the insulating layer.

  In the present invention, the first and third spiral coils have the same number of turns, the second and fifth spiral coils have the same number of turns, and the fourth and sixth spiral coils have the same number of turns. Preferably equal. According to this, it can be used as a common mode filter having a three-line configuration. In this case, it is preferable that the first to sixth spiral coils have the same number of turns, the areas of the inner diameter regions surrounded by the coils in the plan view are the same, and the spaces between the conductors are the same. According to this, the signal balance of each signal line can be increased.

  In the present invention, the second and fifth spiral coils are located between the first and third spiral coils and the fourth and sixth spiral coils in a plan view, and the second and fifth spiral coils The winding direction of the spiral coil is preferably opposite to the winding direction of the first, third, fourth and sixth spiral coils. According to this, since the magnetic fluxes generated in each spiral coil strengthen each other, a high inductance can be obtained.

  The coil component according to the present invention includes seventh and eighth spiral coils connected in series to the first and second spiral coils, respectively, and series connected to the third and fourth spiral coils, respectively. The first terminal electrode, further comprising: connected ninth and tenth spiral coils; and eleventh and twelfth spiral coils connected in series to the fifth and sixth spiral coils, respectively. Is connected to the outer peripheral ends of the first and second spiral coils, the second terminal electrode is connected to the outer peripheral ends of the seventh and eighth spiral coils, and the third terminal electrode is The fourth terminal electrode is connected to the outer peripheral ends of the third and fourth spiral coils, and the fourth terminal electrode is connected to the outer peripheral ends of the ninth and tenth spiral coils. Is connected to they said fifth and the outer peripheral end of the sixth spiral coil, the sixth terminal electrode is preferably connected to the outer peripheral end of the first 11 and second 12 spiral coils. According to this, the conductor pattern for connecting the inner peripheral end of the spiral coil and the terminal electrode becomes unnecessary.

  In this case, the first, third, seventh and ninth spiral coils are arranged to be magnetically coupled to each other, and the second, fifth, eighth and eleventh spiral coils are magnetically coupled to each other. Preferably, the fourth, sixth, tenth and twelfth spiral coils are arranged so as to be magnetically coupled to each other. According to this, higher inductance can be obtained.

  The coil component according to the present invention includes seventh and eighth terminal electrodes, and a seventh spiral coil connected in parallel with the first and second spiral coils between the first and second terminal electrodes, An eighth spiral coil connected in parallel with the third and fourth spiral coils between the third and fourth terminal electrodes; and the fifth and sixth terminals between the fifth and sixth terminal electrodes. A ninth spiral coil connected in parallel with the spiral coil; and tenth, eleventh and twelfth spiral coils connected in parallel between the seventh and eighth terminal electrodes; The seventh and tenth spiral coils are arranged to be magnetically coupled to each other, and the eighth and eleventh spiral coils are arranged to be magnetically coupled to each other, and the ninth and twelfth spars are arranged. Rarukoiru is may be arranged to magnetically coupled to each other. According to this, since combinations of two signal lines are respectively created from four or more signal lines and each combination is magnetically coupled, it becomes possible to magnetically couple four or more signal lines to each other. .

  According to the present invention, in a coil component for magnetically coupling three or more signal lines to each other, it is possible to reduce a difference in transmission characteristics between the signal lines.

FIG. 1 is a schematic perspective view showing an appearance of a coil component 10 according to a preferred embodiment of the present invention, and shows a state where the coil component 10 is turned upside down with respect to a mounted state. FIG. 2 is a schematic exploded perspective view of the coil component 10, and in particular, is a view for explaining the structure of the laminated structure 20 </ b> A according to the first embodiment. FIG. 3 is a perspective plan view of the laminated structure 20A as viewed in plan. FIG. 4 is an equivalent circuit diagram of the laminated structure 20A. FIG. 5 is a schematic plan view for explaining the pattern shape of the circuit board 2 on which the coil component 10 is mounted. FIG. 6 is a schematic diagram for explaining a combination of signal lines that are magnetically coupled in the first embodiment. FIG. 7 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 8 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 9 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 10 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 11 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 12 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 13 is a process diagram for explaining a method of forming the laminated structure 20A. FIG. 14 is a perspective plan view when the laminated structure according to the modification is viewed in a plan view. FIG. 15 is another schematic exploded perspective view of the coil component 10, and in particular, is a view for explaining the structure of the laminated structure 20 </ b> B according to the second embodiment. FIG. 16 is an equivalent circuit diagram of the laminated structure 20B. FIG. 17 is a schematic diagram for explaining a combination of signal lines to be magnetically coupled in the second embodiment. FIG. 18 is a schematic diagram for explaining a combination of signal lines that are magnetically coupled in the first modification. FIG. 19 is a schematic diagram for explaining a combination of signal lines that are magnetically coupled in the second modification. FIG. 20 is an equivalent circuit diagram of the coil component 10C according to the third embodiment. FIG. 21 is a schematic diagram for explaining an example of a combination of signal lines that are magnetically coupled in the third embodiment. FIG. 22 is a schematic diagram for explaining another example of a combination of signal lines to be magnetically coupled in the third embodiment.

  Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic perspective view showing an appearance of a coil component 10 according to a preferred embodiment of the present invention, and shows a state where the coil component 10 is turned upside down with respect to a mounted state.

  As shown in FIG. 1, the coil component 10 according to the present embodiment is a surface-mounted common mode filter having a substantially rectangular parallelepiped shape, and includes a magnetic substrate 11, a laminated structure 20 provided on the magnetic substrate 11, The first to sixth terminal electrodes E1 to E6 and the magnetic resin layer 12 provided on the laminated structure 20 are provided. Specific configurations of the stacked structure 20 include the stacked structure 20A according to the first embodiment and the stacked structure 20B according to the second embodiment, and details thereof will be described later. At the time of mounting, it is turned upside down from the state shown in FIG. 1 and mounted so that the xy plane provided with the first to sixth terminal electrodes E1 to E6 faces the printed board. The coil component 10 according to the present embodiment is a laminated thin-film coil component in which a laminated structure 20 is laminated on a magnetic substrate 11, and is a so-called wound-type coil component obtained by winding a wire around a magnetic core or bobbin. Are of different types.

  The magnetic substrate 11 is a substrate for laminating the laminated structure 20, physically protects the laminated structure 20, and constitutes a magnetic path of the coil component 10. As the material of the magnetic substrate 11, sintered ferrite, composite ferrite (ferrite powder-containing resin), and the like can be used, and it is particularly preferable to use sintered ferrite having high mechanical strength and excellent magnetic properties.

  Among the six terminal electrodes E1 to E6, the first, third and fifth terminal electrodes E1, E3 and E5 are provided along one long side extending in the x direction, and the second, fourth and fourth terminals are provided. The six terminal electrodes E2, E4, E6 are provided along the other long side extending in the x direction. Although not particularly limited, the terminal electrodes E 1, E 2, E 5, E 6 are disposed at the corners of the coil component 10. Therefore, the terminal electrodes E1, E2, E5, and E6 are exposed on the three side surfaces (xy plane, xz plane, and yz plane) of the coil component 10. On the other hand, the remaining terminal electrodes E3 and E4 are exposed on the two side surfaces (xy plane and xz plane) of the coil component 10. Although not particularly limited, the terminal electrodes E1 to E6 are formed by thick film plating, and the thickness thereof is sufficiently thicker than an electrode pattern formed by sputtering or screen printing.

  The magnetic resin layer 12 physically protects the laminated structure 20, and fixes and supports the first to sixth terminal electrodes E1 to E6. The magnetic resin layer 12 includes the first to sixth terminal electrodes E1 to E6. It is provided to embed the surroundings. The upper surface (xy surface) of the magnetic resin layer 12 constitutes substantially the same plane as the upper surfaces (xy surface) of the first to sixth terminal electrodes E1 to E6. As a material of the magnetic resin layer 12, it is preferable to use composite ferrite. The magnetic resin layer 12 has high magnetic properties and constitutes a magnetic path together with the magnetic substrate 11.

<First Embodiment>
FIG. 2 is a schematic exploded perspective view of the coil component 10, and in particular, is a view for explaining the structure of the laminated structure 20 </ b> A according to the first embodiment. FIG. 3 is a perspective plan view of the laminated structure 20A as viewed in plan.

  A laminated structure 20A illustrated in FIG. 2 includes insulating layers 31 to 34 that are sequentially stacked from the magnetic substrate 11 side toward the magnetic resin layer 12 side, and three conductor layers M11 are provided between the insulating layers 31 to 34. To M13 are formed. The insulating layers 31 to 34 are made of, for example, a resin and serve to separate the first to third conductor layers M11 to M13 from each other.

  The first conductor layer M11 formed on the surface of the insulating layer 31 includes first, second, and fourth spiral coils C11, C12, C14. These three spiral coils are arranged side by side in the x direction, and their size, number of turns, area of the inner diameter region surrounded by the coil in plan view, and the space between the conductors are designed to be equal to each other. The first spiral coil C <b> 11 has an outer peripheral end connected to the conductor pattern 41 and an inner peripheral end connected to the conductor pattern 42. The second spiral coil C <b> 12 has an outer peripheral end connected to the conductor pattern 41 and an inner peripheral end connected to the conductor pattern 43. Further, the fourth spiral coil C <b> 14 has an outer peripheral end connected to the conductor pattern 44 and an inner peripheral end connected to the conductor pattern 45. Here, the first and fourth spiral coils C11 and C14 are wound clockwise (clockwise) from the outer peripheral end toward the inner peripheral end, whereas the second spiral coil C11, C14 is sandwiched between them in plan view. The spiral coil C12 is wound counterclockwise (counterclockwise) from the outer peripheral end toward the inner peripheral end.

  The second conductor layer M12 formed on the surface of the insulating layer 32 includes third, fifth, and sixth spiral coils C13, C15, and C16. These three spiral coils are arranged side by side in the x direction, and are arranged at positions that overlap the first, second, and fourth spiral coils C11, C12, and C14, respectively, in plan view. Therefore, the first and third spiral coils C11 and C13 are magnetically coupled to each other, the second and fifth spiral coils C12 and C15 are magnetically coupled to each other, and the fourth and sixth spiral coils C14 and C16 are coupled to each other. Magnetically coupled.

  The sizes, the number of turns, the area of the inner diameter region surrounded by the coils and the space between the conductors in the third, fifth and sixth spiral coils C13, C15, C16 are designed to be equal to each other. In particular, it is preferable to design the six spiral coils C11 to C16 to have the same size, the number of turns, the area of the inner diameter region surrounded by the coils in plan view, and the space between the conductors. The third spiral coil C <b> 13 has an outer peripheral end connected to the conductor pattern 51 and an inner peripheral end connected to the conductor pattern 52. The fifth spiral coil C15 has an outer peripheral end connected to the conductor pattern 53 and an inner peripheral end connected to the conductor pattern 54. Further, the sixth spiral coil C <b> 16 has an outer peripheral end connected to the conductor pattern 53 and an inner peripheral end connected to the conductor pattern 55. Here, the third and sixth spiral coils C13 and C16 are wound clockwise (clockwise) from the outer peripheral end toward the inner peripheral end, whereas the fifth spiral coil C13, C16 is sandwiched between them in plan view. The spiral coil C15 is wound counterclockwise (counterclockwise) from the outer peripheral end toward the inner peripheral end.

  Conductive patterns 56 to 59 are further provided on the conductive layer M12. The conductor patterns 56, 51, 53 are connected to the conductor patterns 41, 44, 46 included in the first conductor layer M11 via through holes provided in the insulating layer 32, respectively. The conductor patterns 57 to 59 are connected to the conductor patterns 42, 43, and 45 included in the first conductor layer M11 via through holes provided in the insulating layer 32, respectively.

  The third conductor layer M13 formed on the surface of the insulating layer 33 includes conductor patterns 62, 64, 66 and conductor patterns 71-76. As shown in FIG. 3, the conductor pattern 62 is connected to the conductor pattern 72 and connected to the conductor patterns 57 and 58 included in the second conductor layer M12 through the through holes provided in the insulating layer 33, respectively. Connected. The conductor pattern 64 is connected to the conductor pattern 74 and is also connected to the conductor patterns 52 and 59 included in the second conductor layer M12 through through holes provided in the insulating layer 33. Furthermore, the conductor pattern 66 is connected to the conductor pattern 76 and is also connected to the conductor patterns 54 and 55 included in the second conductor layer M12 through the through holes provided in the insulating layer 33, respectively. On the other hand, the conductor patterns 71, 73, 75 are connected to the conductor patterns 56, 51, 53 included in the second conductor layer M12 via through holes provided in the insulating layer 33, respectively.

  The terminal electrodes E1 to E6 are connected to the conductor patterns 71 to 76 included in the third conductor layer M13 through through holes provided in the insulating layer 34, respectively. With this configuration, two spiral coils C11 and C12 are connected in parallel between the first terminal electrode E1 and the second terminal electrode E2, and between the third terminal electrode E3 and the fourth terminal electrode E4. The two spiral coils C13 and C14 are connected in parallel, and the two spiral coils C15 and C16 are connected in parallel between the fifth terminal electrode E5 and the sixth terminal electrode E6.

  Here, since the first spiral coil C11 and the third spiral coil C13 overlap in plan view, they are magnetically coupled to each other. Similarly, since the second spiral coil C12 and the fifth spiral coil C15 overlap in plan view, they are magnetically coupled to each other. Furthermore, since the fourth spiral coil C14 and the sixth spiral coil C16 overlap in plan view, they are magnetically coupled to each other.

  FIG. 4 is an equivalent circuit diagram of the laminated structure 20A.

  As shown in FIG. 4, the first and second spiral coils C11 and C12 are connected in parallel between the first terminal electrode E1 and the second terminal electrode E2. Further, the third and fourth spiral coils C13 and C14 are connected in parallel between the third terminal electrode E3 and the fourth terminal electrode E4. Furthermore, the fifth and sixth spiral coils C15 and C16 are connected in parallel between the fifth terminal electrode E5 and the sixth terminal electrode E6.

  As described above, the first and third spiral coils C11 and C13 are magnetically coupled, the second and fifth spiral coils C12 and C15 are magnetically coupled, and the fourth and sixth spiral coils C14, C16 is magnetically coupled. Thereby, the coil component 10 according to the present embodiment can be used as a common mode filter having a three-line configuration.

  FIG. 5 is a schematic plan view for explaining the pattern shape of the circuit board 2 on which the coil component 10 is mounted.

  The circuit board 2 shown in FIG. 5 has a mounting area 10A on which the coil component 10 is mounted. The mounting region 10A is provided with first to sixth land patterns P1 to P6 corresponding to the first to sixth terminal electrodes E1 to E6, respectively, and when the coil component 10 is mounted on the mounting region 10A. The first to sixth terminal electrodes E1 to E6 and the first to sixth land patterns P1 to P6 are electrically connected to each other through the solder.

  The circuit board 2 is provided with first to sixth signal wirings S1 to S6 connected to the first to sixth land patterns P1 to P6, respectively. Among these, the three lines of signal wirings S1 to S3 constitute one set of wiring group IN, and the three lines of signal wiring S4 to S6 also constitute one set of wiring group OUT. The wiring group IN is, for example, an input-side wiring group, and the wiring group OUT is, for example, an output-side wiring group. The three signals transmitted by the wiring groups IN and OUT are represented by the potential difference between the two signals. For example, in the wiring group IN, the level relationship between the level of the signal wiring S1 and the level of the signal wiring S2, the level relationship between the level of the signal wiring S1 and the level of the signal wiring S3, and the level of the signal wiring S2 and the level of the signal wiring S3. Data is expressed by the level relationship. The same applies to the wiring group OUT. Therefore, in this example, 3-bit data can be transmitted at a time.

  Then, by inserting the coil component 10 according to the present embodiment between the wiring group IN and the wiring group OUT, the common mode noise superimposed on the three signals can be removed. Here, in order to obtain high signal quality, it is necessary to match the transmission characteristics of the three signal lines L1 to L3 as much as possible. For this purpose, it is preferable that the coupling characteristics between the two signal lines are substantially the same between the signal lines. That is, it is desirable that the coupling characteristics between the signal lines L1 and L2, the coupling characteristics between the signal lines L1 and L3, and the coupling characteristics between the signal lines L2 and L3 are substantially the same. .

  FIG. 6 is a schematic diagram for explaining a combination of signal lines to be magnetically coupled in the present embodiment.

  As shown in FIG. 6, in this embodiment, three coupling regions A1, B1, and C1 are formed. Among these, the coupling region A1 is a region where the signal lines L1 and L2 are coupled, and is configured by first and third spiral coils C11 and C13 that overlap in a plan view. The coupling region B1 is a region where the signal lines L1 and L3 are coupled, and is configured by second and fifth spiral coils C12 and C15 that overlap in a plan view. Further, the coupling region C1 is a region where the signal lines L2 and L3 are coupled, and is configured by fourth and sixth spiral coils C14 and C16 that overlap in a plan view.

  As described above, in this embodiment, each of the signal lines L1 to L3 is divided into two, and the spiral coils C11 to C16 are connected to the divided lines, and the signal lines L1 to L3 are selected from the three signal lines L1 to L3. Three pairs having different combinations are created, and these pairs are magnetically coupled to each other. And if the size of these spiral coils C11 to C16, the number of turns, the area of the inner diameter region surrounded by the coils in a plan view, and the space between the conductors are made to coincide with each other, the inductances of the spiral coils C11 to C16 substantially match. . In addition, since the upper and lower spiral coils are separated by a single insulating layer 32, the capacitive components between the two spiral coils that overlap in plan view coincide with each other in the three pairs. As a result, since the coupling balance between the signal lines L1 to L3 becomes substantially equal, the transmission characteristics of the signal lines L1 to L3 can be substantially matched.

  If the film thickness of the insulating layer 32 is changed at the design stage, the capacitance component between the two spiral coils overlapping in plan view changes, so that the transmission characteristics can be adjusted. In this case, if the film thickness of the insulating layer 32 is changed, the changes given to the three pairs are always equal, so that the balance of the transmission characteristics between the signal lines L1 to L3 is not lost.

  Next, a method for forming the laminated structure 20A shown in FIG. 2 will be described.

  7 to 13 are process diagrams for explaining a method of forming the laminated structure 20A shown in FIG.

  First, a magnetic substrate 11 made of sintered ferrite or the like having a predetermined thickness is prepared, and an insulating layer 31 is formed on the upper surface thereof. Next, as shown in FIG. 7, the first, second, and fourth spiral coils C <b> 11, C <b> 12, C <b> 14 and the conductor layer M <b> 11 including the conductor patterns 41 to 46 are formed on the upper surface of the insulating layer 31. As a method for forming these conductors, it is preferable to form a base metal film using a thin film process such as a sputtering method, and then to perform plating growth to a desired film thickness using an electrolytic plating method. The same applies to the method of forming other conductors formed thereafter.

  Next, as illustrated in FIG. 8, the insulating layer 32 is formed on the upper surface of the insulating layer 31 so as to cover the conductor layer M <b> 11, and then the through holes 32 a to 32 f are formed in the insulating layer 32. Specifically, the insulating layer 32 having the through holes 32a to 32f can be formed by applying a resin material by spin coating and then forming a predetermined pattern by photolithography. The same applies to a method for forming an insulating layer to be formed later. The through holes 32a to 32f shown in FIG. 8 are formed at positions where the conductor patterns 41 to 46 are exposed.

  Next, as shown in FIG. 9, the third, fifth, and sixth spiral coils C13, C15, and C16 and the conductor layer M12 including the conductor patterns 51 to 59 are formed on the upper surface of the insulating layer 32. As already described, the third, fifth, and sixth spiral coils C13, C15, and C16 are aligned so as to overlap the first, second, and fourth spiral coils C11, C12, and C14, respectively, in plan view. Conductive patterns 56, 57, 58, 51, 59, and 53 are formed at positions corresponding to through holes 32a to 32f, respectively. Thereby, the conductor patterns 56, 57, 58, 51, 59, 53 are respectively connected to the conductor patterns 41 to 46 provided in the first conductor layer M11.

  Next, as shown in FIG. 10, the insulating layer 33 is formed on the upper surface of the insulating layer 32 so as to cover the conductor layer M <b> 12, and then the through holes 33 a to 33 i are formed in the insulating layer 33. The through holes 33a to 33i shown in FIG. 10 are formed at positions where the conductor patterns 51 to 59 are exposed.

  Next, as shown in FIG. 11, a conductor layer M <b> 13 including conductor patterns 62, 64, 66, 71 to 76 is formed on the upper surface of the insulating layer 33. The connection areas 62a and 62b of the conductor pattern 62 are formed at positions corresponding to the through holes 33g and 33h, respectively, and the connection areas 64a and 64b of the conductor pattern 64 are formed at positions corresponding to the through holes 33b and 33i, respectively. The connection regions 66a and 66b of 66 are formed at positions corresponding to the through holes 33d and 33e, respectively. As a result, the inner peripheral ends of the first and second spiral coils C11 and C12 are both connected to the conductor pattern 72, and the inner peripheral ends of the third and fourth spiral coils C13 and C14 are both connected to the conductor pattern 74. The inner peripheral ends of the fifth and sixth spiral coils C15 and C16 are both connected to the conductor pattern 76.

  On the other hand, the conductor patterns 71, 73, and 75 are formed at positions corresponding to the through holes 33f, 33a, and 33c, respectively. Accordingly, the outer peripheral ends of the first and second spiral coils C11 and C12 are both connected to the conductor pattern 71, and the outer peripheral ends of the third and fourth spiral coils C13 and C14 are both connected to the conductor pattern 73. The outer peripheral ends of the fifth and sixth spiral coils C15 and C16 are both connected to the conductor pattern 75.

  Next, as illustrated in FIG. 12, the insulating layer 34 is formed on the upper surface of the insulating layer 33 so as to cover the conductor layer M <b> 13, and then the through holes 34 a to 34 f are formed in the insulating layer 34. The through holes 34a to 34f shown in FIG. 12 are formed at positions where the conductor patterns 71 to 76 are exposed.

  Next, as shown in FIG. 13, first to sixth terminal electrodes E <b> 1 to E <b> 6 are formed on the surface of the insulating layer 34. A method of forming the first to sixth terminal electrodes E1 to E6 is as follows. First, a Cu film as a base is formed by electroless plating on the entire surface of the insulating layer 34 where the conductor patterns 71 to 76 are exposed. Thereafter, the sheet resist is pasted, exposed and developed to selectively remove the sheet resist in the region where the first to sixth terminal electrodes E1 to E6 are to be formed, and expose the Cu film in the region. . In this state, thick first to sixth terminal electrodes E1 to E6 are formed by electroplating. Thereafter, by removing the sheet resist and removing the unnecessary Cu film by etching the entire surface, columnar first to sixth terminal electrodes E1 to E6 are formed.

  When a composite ferrite paste is formed on the entire surface and cured, the magnetic resin layer 12 filling the periphery of the first to sixth terminal electrodes E1 to E6 is formed. Thereafter, if unnecessary composite ferrite on the first to sixth terminal electrodes E1 to E6 is removed, the coil component 10 according to the present embodiment is completed.

  As described above, the coil component 10 according to the present embodiment divides each signal line L1 to L3 into two and creates three pairs having different combinations from the three signal lines. Since the pairs are magnetically coupled, the transmission characteristics between the signal lines L1 to L3 can be substantially matched. In addition, since the common insulating layer 32 is interposed between the two spiral coils overlapping in plan view, the capacitance component does not vary.

  Moreover, the winding directions of the first, third, fourth, and sixth spiral coils C11, C13, C14, and C16 are opposite to the winding directions of the second and fifth spiral coils C12 and C15. Therefore, the magnetic fluxes generated in each spiral coil strengthen each other. Thereby, compared with the case where it is made the same with the winding direction of all the spiral coils, it becomes possible to obtain a high inductance.

  Further, since the laminated structure 20A described above is composed of the three conductor layers M11 to M13, the number of manufacturing steps is small, which is advantageous for cost reduction, and the thickness in the z direction can be reduced. .

  However, it is not essential to configure the laminated structure 20A with the three conductor layers M11 to M13, and the four conductor layers are used as in the modification shown in FIG. 14, and the conductor patterns 81 to 83 and the conductor patterns 91 to 93 are used. May be formed in another conductor layer. Here, in the example shown in FIG. 14, the conductor pattern 81 connects between the conductor patterns 57 and 72, the conductor pattern 82 connects between the conductor patterns 58 and 72, and the conductor pattern 83 connects between the conductor patterns 55 and 74. To do. The conductor pattern 91 connects the conductor patterns 52 and 74, the conductor pattern 92 connects the conductor patterns 54 and 76, and the conductor pattern 93 connects the conductor patterns 59 and 76. If such conductor patterns 81-83, 91-93 are used, the difference in wiring distance between the conductor patterns 72, 74, 76 and the conductor patterns 52, 54, 55, 57, 58, 59 is reduced. High signal quality can be obtained.

<Second Embodiment>
FIG. 15 is another schematic exploded perspective view of the coil component 10, and in particular, is a view for explaining the structure of the laminated structure 20 </ b> B according to the second embodiment. 15, the same elements as those in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

  A laminated structure 20B shown in FIG. 15 includes insulating layers 31, 32, 33, 104, and 105 stacked in order from the magnetic substrate 11 side to the magnetic resin layer 12 side, and four conductors are provided between these insulating layers. Layers M11, M12, M23, and M24 are formed. The insulating layers 31, 32, 33, 104, and 105 are made of resin, for example, and serve to separate the first to fourth conductor layers M11, M12, M23, and M24 from each other.

  The configurations of the insulating layers 31 to 33 and the conductor layers M11 and M12 are the same as those in the first embodiment shown in FIG.

  On the other hand, the third conductor layer M23 formed on the surface of the insulating layer 33 includes seventh, eighth and tenth spiral coils C21, C22, C24. These three spiral coils are arranged side by side in the x direction, and their size, number of turns, area of the inner diameter region surrounded by the coil in plan view, and the space between the conductors are designed to be equal to each other. The seventh spiral coil C <b> 21 has an outer peripheral end connected to the conductor pattern 112 and an inner peripheral end connected to the conductor pattern 121. The eighth spiral coil C <b> 22 has an outer peripheral end connected to the conductor pattern 112 and an inner peripheral end connected to the conductor pattern 122. Further, the tenth spiral coil C 24 has an outer peripheral end connected to the conductor pattern 114 and an inner peripheral end connected to the conductor pattern 123. Here, the seventh and tenth spiral coils C21 and C24 are wound clockwise (clockwise) from the inner peripheral end toward the outer peripheral end, whereas the eighth spiral coil C21, C24 is sandwiched between them in plan view. The spiral coil C22 is wound counterclockwise (counterclockwise) from the inner peripheral end to the outer peripheral end.

  The conductor patterns 121 to 123 are connected to the conductor patterns 57 to 59 included in the second conductor layer M12 through through holes provided in the insulating layer 33, respectively. The third conductor layer M23 is also provided with conductor patterns 111, 113, 115, and 124 to 126, which are included in the second conductor layer M12 through through holes provided in the insulating layer 33. Are connected to conductor patterns 56, 51, 53, 52, 54, and 55, respectively.

  The fourth conductor layer M24 formed on the surface of the insulating layer 104 includes ninth, eleventh and twelfth spiral coils C23, C25 and C26. These three spiral coils are arranged side by side in the x direction, and are arranged at positions overlapping with the seventh, eighth, and tenth spiral coils C21, C22, and C24, respectively, in plan view. Therefore, the seventh and ninth spiral coils C21 and C23 are magnetically coupled to each other, the eighth and eleventh spiral coils C22 and C25 are magnetically coupled to each other, and the tenth and twelfth spiral coils C24 and C26 are mutually coupled. Magnetically coupled.

  The sizes, the number of turns, the area of the inner diameter region surrounded by the coils in plan view, and the space between the conductors are designed to be equal to each other in the ninth, eleventh and twelfth spiral coils C23, C25, C26. In particular, it is preferable to design the six spiral coils C21 to C26 to have the same size, number of turns, area of the inner diameter region surrounded by the coils in plan view, and the space between the conductors. , C21 to C26 are more preferably designed to have the same size, number of turns, area of the inner diameter region surrounded by the coil in plan view, and the space between the conductors.

  The ninth spiral coil C23 has an outer peripheral end connected to the conductor pattern 134 and an inner peripheral end connected to the conductor pattern 141. The eleventh spiral coil C25 has an outer peripheral end connected to the conductor pattern 136 and an inner peripheral end connected to the conductor pattern 142. Further, the twelfth spiral coil C26 has an outer peripheral end connected to the conductor pattern 136 and an inner peripheral end connected to the conductor pattern 143. Here, the ninth and twelfth spiral coils C23 and C26 are wound clockwise (clockwise) from the inner peripheral end toward the outer peripheral end, whereas the eleventh sandwiched between them in a plan view. The spiral coil C25 is wound counterclockwise (counterclockwise) from the inner peripheral end to the outer peripheral end.

  The conductor patterns 131 to 136 and 141 to 143 included in the fourth conductor layer M24 pass through the through holes provided in the insulating layer 104, and the conductor patterns 111 to 116, 124 to included in the third conductor layer M23. 126, respectively.

  The terminal electrodes E1 to E6 are connected to the conductor patterns 131 to 136 included in the fourth conductor layer M24 through through holes provided in the insulating layer 105, respectively. With this configuration, four spiral coils C11, C12, C21, and C22 are connected between the first terminal electrode E1 and the second terminal electrode E2, and the third terminal electrode E3 and the fourth terminal electrode E4 are connected to each other. Four spiral coils C13, C14, C23, C24 are connected between them, and four spiral coils C15, C16, C25, C26 are connected between the fifth terminal electrode E5 and the sixth terminal electrode E6. It will be.

  Since the first, third, seventh, and ninth spiral coils C11, C13, C21, and C23 overlap in plan view, they are magnetically coupled to each other. Similarly, the second, fifth, eighth, and eleventh spiral coils C12, C15, C22, and C25 overlap each other in plan view, and are magnetically coupled to each other. Furthermore, the fourth, sixth, tenth, and twelfth spiral coils C14, C16, C24, and C26 overlap each other in plan view, so that they are magnetically coupled to each other.

  The laminated structure 20B having such a configuration can be manufactured using a method similar to that of the above-described laminated structure 20A.

  FIG. 16 is an equivalent circuit diagram of the laminated structure 20B.

  As shown in FIG. 16, the first and seventh spiral coils C11 and C21 are connected in series between the first terminal electrode E1 and the second terminal electrode E2, and the second and eighth spiral electrodes C11 and C21 are connected in series. Spiral coils C12 and C22 are connected in series. The series body of spiral coils C11 and C21 and the series body of spiral coils C12 and C22 are connected in parallel to each other. The third and ninth spiral coils C13 and C23 are connected in series between the third terminal electrode E3 and the fourth terminal electrode E4, and the fourth and tenth spiral coils C14 and C24 are connected. Are connected in series. The series body of the spiral coils C13 and C23 and the series body of the spiral coils C14 and C24 are connected in parallel to each other. Further, the fifth and eleventh spiral coils C15 and C25 are connected in series between the fifth terminal electrode E5 and the sixth terminal electrode E6, and the sixth and twelfth spiral coils C16 and C26. Are connected in series. The series body of the spiral coils C15 and C25 and the series body of the spiral coils C16 and C26 are connected in parallel to each other.

  Here, since the configurations of the seventh to twelfth spiral coils C21 to C26 have the same configuration as the first to sixth spiral coils C11 to C16, the circuit described in the first embodiment is the same. The configuration is such that two are connected in series. Thereby, it is possible to obtain an inductance higher than that of the first embodiment. Moreover, in the present embodiment, the inner peripheral ends of the spiral coils C11 to C16 formed on the first and second conductor layers M11 and M12 and the spiral formed on the third and fourth conductor layers M23 and M24. Since the inner peripheral ends of the coils C21 to C26 are connected, a conductor pattern for connecting the inner peripheral end and the terminal electrode is unnecessary. For this reason, it is possible to obtain a high inductance while minimizing an increase in the number of conductor layers.

  FIG. 17 is a schematic diagram for explaining a combination of signal lines to be magnetically coupled in the present embodiment.

  As shown in FIG. 17, in this embodiment, three coupling regions A2, B2, and C2 are formed. Among these, the coupling region A2 is a region where the signal lines L1 and L2 are coupled, and includes first, third, seventh, and ninth spiral coils C11, C13, C21, and C23 that are overlapped in plan view. The coupling region B2 is a region where the signal lines L1 and L3 are coupled, and is configured by the second, fifth, eighth, and eleventh spiral coils C12, C15, C22, and C25 overlapping in plan view. Further, the coupling region C2 is a region where the signal lines L2 and L3 are coupled, and is configured by fourth, sixth, tenth, and twelfth spiral coils C14, C16, C24, and C26 that overlap in a plan view.

  However, the configuration of the coupling regions A2, B2, and C2 is not limited to this, and the configuration shown in FIG. 18 or the configuration shown in FIG. 19 may be used. The configuration shown in FIGS. 18 and 19 is different from the configuration shown in FIG. 17 in that two spiral coils (for example, C11 and C21) configuring the same signal line are arranged in adjacent conductor layers. In such a configuration, the capacitance component between different signal lines is adjusted by adjusting the film thickness of the insulating layer 33 positioned between the second conductor layer M12 and the third conductor layer M23. Can do.

<Third Embodiment>
FIG. 20 is an equivalent circuit diagram of the coil component 10C according to the third embodiment.

  The coil component 10C according to the third embodiment has an eight-terminal configuration and magnetically couples the four signal lines L1 to L4 to each other. Specifically, it has a configuration in which two terminal electrodes E7 and E8 are added to the above-described coil component 10 having a six-terminal configuration.

  As shown in FIG. 20, three spiral coils C31 to C33 are connected in parallel between the first terminal electrode E1 and the second terminal electrode E2, and the third terminal electrode E3 and the fourth terminal electrode E4. Three spiral coils C41 to C43 are connected in parallel, and three spiral coils C51 to C53 are connected in parallel between the fifth terminal electrode E5 and the sixth terminal electrode E6. Three spiral coils C61 to C63 are connected in parallel between the terminal electrode E7 and the eighth terminal electrode E8. Then, six pairs having different combinations are created from the four signal lines L1 to L4, and these pairs are magnetically coupled.

  That is, the spiral coils C31 and C41 are magnetically coupled, the spiral coils C32 and C51 are magnetically coupled, the spiral coils C33 and C61 are magnetically coupled, the spiral coils C42 and C52 are magnetically coupled, and the spiral coils C43 and C62 are magnetically coupled. The spiral coils C53 and C63 are magnetically coupled. Thereby, since the coupling balance between the signal lines L1 to L4 becomes substantially equal, the transmission characteristics between the signal lines L1 to L4 can be substantially matched.

  Actually, two conductor layers M11 and M12 are used, and as shown in FIG. 21, spiral coils C31, C32, C33, C42, C43 and C53 are formed in the first conductor layer M11, and the second conductor layer M12 is formed. The spiral coils C41, C51, C61, C52, C62, and C63 may be formed on the two, and two corresponding spiral coils may be magnetically coupled in the six coupling regions A3 to F3. Alternatively, as shown in FIG. 22, spiral coils C31, C32, C42, C33, C43, and C53 are formed on the first conductor layer M11, and spiral coils C41, C51, C52, C61, and the like are formed on the second conductor layer M12. In addition to forming C62 and C63, two spiral coils corresponding to each other in the six coupling regions A3 to F3 may be magnetically coupled.

  As illustrated in the present embodiment, the coil component according to the present invention can evenly magnetically couple even when there are four or more signal lines.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. Needless to say, it is included in the range.

  For example, in the first and second embodiments described above, the terminal electrodes E1 to E6 have a bump shape embedded in the magnetic resin layer 12, but the shape and structure of the terminal electrode are limited to this in the present invention. Is not to be done. Therefore, a terminal electrode formed by baking a silver paste or the like on the surface of the substrate may be used, or a terminal electrode formed by bonding a terminal fitting to the substrate may be used.

  In the first and second embodiments described above, the magnetic material is not provided in the inner diameter region of each spiral coil. However, by providing a through hole in the inner diameter region of each spiral coil, the inside of the through hole is magnetic. The same material as the resin layer 12 may be embedded. According to this, higher magnetic characteristics can be obtained.

2 Circuit board 10, 10C Coil component 10A Mounting area 11 Magnetic board 12 Magnetic resin layers 20, 20A, 20B Laminated structures 31-34, 104, 105 Insulating layers 32a-32f, 33a-33i, 34a-34f Through holes 41- 46,51-59,62,64,66,71-76,81-83,91-93,111-116,121-126,131-136,141-143 Conductor pattern 62a, 62b, 64a, 64b, 66a , 66b Connection regions C11 to C16, C21 to C26, C31 to C33, C41 to C43, C51 to C53, C61 to C63 Spiral coils E1 to E8 Terminal electrodes L1 to L4 Signal lines M11 to M13, M23, M24 Conductor layers P1 to P6 Land pattern S1 to S6 Signal wiring

Claims (8)

First to sixth terminal electrodes;
First and second spiral coils connected in parallel between the first and second terminal electrodes;
Third and fourth spiral coils connected in parallel between the third and fourth terminal electrodes;
A fifth and a sixth spiral coil connected in parallel between the fifth and sixth terminal electrodes,
The first and third spiral coils are arranged to be magnetically coupled to each other;
The second and fifth spiral coils are arranged to be magnetically coupled to each other;
The coil component, wherein the fourth and sixth spiral coils are arranged to be magnetically coupled to each other. The first and third spiral coils overlap each other in plan view,
The second and fifth spiral coils overlap each other in plan view,
The coil component according to claim 1, wherein the fourth and sixth spiral coils overlap each other in a plan view. First and second conductor layers;
An insulating layer provided between the first conductor layer and the second conductor layer, and
Any three of the first to sixth spiral coils are formed in the first conductor layer,
3. The coil component according to claim 2, wherein the remaining three of the first to sixth spiral coils are formed on the second conductor layer.   The first to sixth spiral coils have the same number of turns, the areas of the inner diameter regions surrounded by the coils in plan view are equal to each other, and the spaces between the conductors are equal to each other. The coil component as described in any one of thru | or 3. The second and fifth spiral coils are located between the first and third spiral coils and the fourth and sixth spiral coils in a plan view,
5. The winding direction of the second and fifth spiral coils is opposite to the winding direction of the first, third, fourth and sixth spiral coils. The coil component according to claim 1. Seventh and eighth spiral coils connected in series to the first and second spiral coils, respectively;
Ninth and tenth spiral coils connected in series to the third and fourth spiral coils, respectively;
Eleventh and twelfth spiral coils connected in series to the fifth and sixth spiral coils, respectively,
The first terminal electrode is connected to outer peripheral ends of the first and second spiral coils,
The second terminal electrode is connected to outer peripheral ends of the seventh and eighth spiral coils,
The third terminal electrode is connected to outer peripheral ends of the third and fourth spiral coils,
The fourth terminal electrode is connected to outer peripheral ends of the ninth and tenth spiral coils,
The fifth terminal electrode is connected to outer peripheral ends of the fifth and sixth spiral coils,
The coil component according to any one of claims 1 to 5, wherein the sixth terminal electrode is connected to outer peripheral ends of the eleventh and twelfth spiral coils. The first, third, seventh and ninth spiral coils are arranged to be magnetically coupled to each other;
The second, fifth, eighth and eleventh spiral coils are arranged to be magnetically coupled to each other;
The coil component according to claim 6, wherein the fourth, sixth, tenth and twelfth spiral coils are arranged to be magnetically coupled to each other. Seventh and eighth terminal electrodes;
A seventh spiral coil connected in parallel with the first and second spiral coils between the first and second terminal electrodes;
An eighth spiral coil connected in parallel with the third and fourth spiral coils between the third and fourth terminal electrodes;
A ninth spiral coil connected in parallel with the fifth and sixth spiral coils between the fifth and sixth terminal electrodes;
A tenth, eleventh and twelfth spiral coils connected in parallel between the seventh and eighth terminal electrodes;
The seventh and tenth spiral coils are arranged to be magnetically coupled to each other;
The eighth and eleventh spiral coils are arranged to be magnetically coupled to each other;
The coil component according to any one of claims 1 to 5, wherein the ninth and twelfth spiral coils are arranged to be magnetically coupled to each other.

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