CN106199271A - A kind of quick exciting method of electronic product significant deficiency - Google Patents
A kind of quick exciting method of electronic product significant deficiency Download PDFInfo
- Publication number
- CN106199271A CN106199271A CN201610559332.2A CN201610559332A CN106199271A CN 106199271 A CN106199271 A CN 106199271A CN 201610559332 A CN201610559332 A CN 201610559332A CN 106199271 A CN106199271 A CN 106199271A
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- Prior art keywords
- temperature
- limit
- electronic product
- test
- vibration
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
- G01M99/002—Thermal testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/60—Investigating resistance of materials, e.g. refractory materials, to rapid heat changes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0226—High temperature; Heating means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0228—Low temperature; Cooling means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a kind of quick exciting method of electronic product significant deficiency, be mainly made up of temperature stepping test procedure, fast temperature change trial step, vibration SST step and combined environment test step.The present invention has considered several critical environments factors affecting product reliability, including low temperature, high temperature, temperature Rapid Variable Design, vibration etc., environmental condition scope of design is big, environmental condition can be strengthened, product hidden danger that may be present can be excited as early as possible and find product limit stress, healthy and strong product design.
Description
Technical field
The present invention relates to electronic product measuring technology, be specially a kind of quick exciting method of electronic product significant deficiency.
Background technology
Electronic product to carry out comprehensive life of product and reliability testing, needs to consider ambient temperature height, temperature
The degree change various factors such as speed, vibration strong or weak, considers above-mentioned various factors only comprehensively, could when product is tested incite somebody to action
Its significant deficiency quickly excites.Current method of testing can not meet above-mentioned requirements, is typically all and divides each factor
Do not test, it is difficult to after each combined factors, product is tested comprehensively.
Summary of the invention
For above technical problem, the present invention provides a kind of quick exciting method of electronic product significant deficiency, and it can be combined
Closing various factors to test the reliability of product, test result is accurate, it is possible to excite product hidden danger that may be present as early as possible
With searching product limit stress, healthy and strong product design.
The present invention solves that its technical problem be the technical scheme is that
A kind of quick exciting method of electronic product significant deficiency, including:
Step one, carries out temperature SST to electronic product, obtains the low-temperature working limit, the low temperature damage limit, high temperature
Working limit and the high temperature limit；
Step 2, takes the 80% conduct height less than the high temperature limit obtained by step one and the low temperature damage limit
Temperature endpoint value, carries out fast temperature change trial to electronic product, obtains the rate of temperature change limit；
Step 3, carries out electronic product vibrating SST, obtains vibration stress working limit；
Step 4, uses the rate of temperature change limit acquired in step 2 and corresponding temperature inversion cycling condition as temperature
Degree experimental condition, is divided into some equal portions by the vibration stress working limit acquired in step 3, is incremented by portion by each circulation
Mode carries out combined environment test test to electronic product, until it reaches electronic product can operating bounds and failure approach index be
Only.
As preferred embodiment, testing initial temperature in step one is ambient temperature+20 DEG C～+30 DEG C, every step
Perform power on/off at least one times during equilibrium temperature start and draw load test, if product test is normal, carry out with the amplitudes of 10 DEG C
Variations in temperature, by that analogy until generating function fault, after temperature recovery to room temperature stablizing, then performs electrifying startup and draws
Carry test, observe whether its function is recovered, to judge whether to reach working limit or the limit of rupture, as function is normally recovered, then
Temperature value before fault is recorded as working limit, continues temperature again to be changed to find when recovery room temperature still cannot make simultaneously
The temperature value that function is recovered automatically, then this temperature value is the limit of rupture.
As preferred embodiment, step 2 takes and breaks less than the high temperature limit obtained by step one and low temperature
The 80% of the bad limit is as high/low temperature endpoint value, with the fast temperature rates of change of 60 DEG C per minute between this high/low temperature endpoint value
Interval in carry out no less than the change circulation of 5 high/low temperature, maximum temperature and minimum temperature in each circulation stop
10min, it is ensured that perform power on/off test after temperature stabilization again and draw load test, as there is restorability fault, then becomes temperature
Rate reduces by 10 DEG C/min and performs temperature cycles again, until 5 circulations are all without restorability fault, then this rate of temperature change is
The rate of temperature change limit.
As preferred embodiment, in step 3, the primary stress of vibration stress is 5Grms, and stepping step-length is 5Grms,
Time that each stage is maintained is minimum is 10 minutes, and carries out function or performance test in the time of staying in per stage simultaneously,
Continuously carry out vibration SST by that analogy until the vibration stress working limit of product is determined.
As preferred embodiment, in step 3 each stage terminate after stress is down to 5Grms ± 3Grms, vibration
Maintain a period of time, to find the situation of the solder joint fracture occurred when high-magnitude is vibrated.
As preferred embodiment, step 4 uses the rate of temperature change limit acquired in step 2 and temperature accordingly
Degree conversion cycling condition is as temperature test condition, if the vibration stress working limit acquired in step 3 is Gmax, and will vibration
Stress starts to coordinate each circulation to be incremented by Gmax/5 from Gmax/5, continues 10min the highest of each circulation and minimum temperature, treats
Perform power on/off after temperature stabilization and draw load test, so repeating until reach can be till operating bounds and failure approach index.
The invention has the beneficial effects as follows: the present invention has considered several critical environments factors affecting product reliability,
Including low temperature, high temperature, temperature Rapid Variable Design, vibration etc., environmental condition scope of design is big, and environmental condition can be strengthened, energy
Enough excite product hidden danger that may be present as early as possible and find product limit stress, healthy and strong product design.
Accompanying drawing explanation
It is further detailed with detailed description of the invention below in conjunction with the accompanying drawings:
Fig. 1 is the experiment process figure of the present invention；
Fig. 2 is the temperature stepping test profile map of the present invention；
Fig. 3 is fast temperature change trial profile of the present invention；
Fig. 4 is that the present invention vibrates SST profile；
Fig. 5 is combined environment test profile of the present invention.
Detailed description of the invention
With reference to Fig. 1, the quick exciting method of electronic product significant deficiency of the present invention is mainly by temperature stepping test procedure, fast
Speed temperature inversion test procedure, vibration SST step and combined environment test step composition.
Step one is temperature SST, and it is used for obtaining the low-temperature working limit, the low temperature damage limit, the hot operation limit
And the high temperature limit.Usually, test initial temperature is ambient temperature+20 DEG C～+30 DEG C, holds during every step equilibrium temperature
Row power on/off at least one times starts and draws load test, if product test is normal, carries out variations in temperature with the amplitudes of 10 DEG C, with
This analogizes until generating function fault, after temperature recovery to room temperature stablizing, then performs electrifying startup and draws load test, observing
Whether its function is recovered, to judge whether to reach working limit or the limit of rupture, as function is normally recovered, then by the temperature before fault
Angle value is recorded as working limit, continues temperature to be changed to find when recovery room temperature still cannot make function automatically recover simultaneously again
Temperature value, then this temperature value is the limit of rupture.The most first carry out low-temperature test during test, get the low-temperature working limit and low
The temperature limit of rupture, carries out high temperature test the most again, gets the hot operation limit and the high temperature limit.
Step 2 is fast temperature change trial step, in this step, takes and breaks less than the high temperature obtained by step one
The 80% of the bad limit and the low temperature damage limit, as high/low temperature endpoint value, carries out fast temperature change trial to electronic product, obtains
Take the rate of temperature change limit.Specifically, with reference to Fig. 3, take less than the high temperature limit obtained by step one and low temperature damage
The 80% of the limit is as high/low temperature endpoint value, with the fast temperature rates of change of 60 DEG C per minute between this high/low temperature endpoint value
Carrying out no less than 5 high/low temperature change circulations in interval, maximum temperature and minimum temperature in each circulation stop 10min,
Performing power on/off test after guaranteeing temperature stabilization again and draw load test, as there is restorability fault, then rate of temperature change being subtracted
Few 10 DEG C/min performs temperature cycles again, until 5 circulations are all without restorability fault, then this rate of temperature change is temperature change
The rate limit.
Step 3 is vibration SST step, is used for obtaining vibration stress working limit.This step is typically in pneumatic type
Carrying out on Triaxiality and six degrees of freedom vibration table, this vibration table can produce multiaxis continuous print non-gaussian broadband pseudorandom vibration signal, shakes
Dynamic frequency can be from 5Hz starting of oscillation, and high frequency can reach 10kHz, direction of vibration include X, Y, Z axis to linear acceleration and rotate accelerate
Degree.With reference to Fig. 4, during work, the primary stress of vibration stress is 5Grms, and stepping step-length is 5Grms, and each stage is maintained
Time is minimum is 10 minutes, and carries out function or performance test in the time of staying in per stage simultaneously, continuously carries out by that analogy
Vibration SST is until the vibration stress working limit of product is determined.As preferably, it is recommended that at each (or vibration level
After 20G) stage terminate after stress is down to 5Grms ± 3Grms (micro-vibration), to find the appearance when high-magnitude vibrate in time
Solder joint fracture situation, vibration hold time generally 2 minutes.
Step 4 is combined environment test step, specifically uses the rate of temperature change limit acquired in step 2 and corresponding
Vibration stress working limit acquired in step 3, as temperature test condition, is divided into some etc. by temperature inversion cycling condition
Part, it is incremented by a mode by each circulation and electronic product is carried out combined environment test test, until it reaches electronic product
Can be till operating bounds and failure approach index.With reference to Fig. 5, step 4 uses the rate of temperature change limit acquired in step 2 and phase
The temperature inversion cycling condition answered is as temperature test condition, if the vibration stress working limit acquired in step 3 is Gmax,
Start to coordinate each circulation to be incremented by Gmax/5 from Gmax/5 by vibration stress, continue the highest of each circulation and minimum temperature
10min, after temperature stabilization perform power on/off and draw load test, so repeat until reach can operating bounds and destroy boundary
Only it is limited to.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, that is made any repaiies
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (6)
1. the quick exciting method of electronic product significant deficiency, it is characterised in that including:
Step one, carries out temperature SST to electronic product, obtains the low-temperature working limit, the low temperature damage limit, hot operation
The limit and the high temperature limit；
Step 2, take less than the high temperature limit obtained by step one and the low temperature damage limit 80% as high/low temperature end
Point value, carries out fast temperature change trial to electronic product, obtains the rate of temperature change limit；
Step 3, carries out electronic product vibrating SST, obtains vibration stress working limit；
Step 4, uses the rate of temperature change limit acquired in step 2 and corresponding temperature inversion cycling condition to try as temperature
Test condition, the vibration stress working limit acquired in step 3 is divided into some equal portions, be incremented by a mode by each circulation
Electronic product is carried out combined environment test test, until it reaches electronic product can be till operating bounds and failure approach index.
A kind of quick exciting method of electronic product significant deficiency the most according to claim 1, it is characterised in that: in step one
Test initial temperature is ambient temperature+20 DEG C～+30 DEG C, perform during every step equilibrium temperature power on/off at least one times start and
Draw load test, if product test is normal, carries out variations in temperature with the amplitudes of 10 DEG C, by that analogy until generating function fault, incite somebody to action
Temperature recover to room temperature and stable after, then perform electrifying startup and draw load to test, observing whether its function is recovered, to judge whether
Reach working limit or the limit of rupture, as function is normally recovered, then the temperature value before fault is recorded as working limit, the most again
Continue temperature to be changed to find that then this temperature value is for destroying when recovering the temperature value that room temperature still cannot make function automatically recover
The limit.
A kind of quick exciting method of electronic product significant deficiency the most according to claim 1, it is characterised in that: in step 2
Take less than the high temperature limit obtained by step one and the low temperature damage limit 80% as high/low temperature endpoint value, with every point
The fast temperature rate of change of 60 DEG C of clock carries out in the interval between this high/low temperature endpoint value following no less than 5 high/low temperature changes
Ring, maximum temperature and minimum temperature in each circulation stop 10min, it is ensured that perform again after temperature stabilization power on/off test and
Drawing load test, as there is restorability fault, then rate of temperature change 10 DEG C/min of minimizing being performed temperature cycles again, until 5
Circulation is all without restorability fault, then this rate of temperature change is the rate of temperature change limit.
A kind of quick exciting method of electronic product significant deficiency the most according to claim 1, it is characterised in that: in step 3
The primary stress of vibration stress is 5Grms, and stepping step-length is 5Grms, and time that each stage is maintained is minimum is 10 minutes, and
Carry out function or performance test in the time of staying in per stage simultaneously, continuously carry out vibration SST by that analogy until product
Vibration stress working limit be determined.
A kind of quick exciting method of electronic product significant deficiency the most according to claim 4, it is characterised in that: in step 3
Stress is down to 5Grms ± 3Grms after terminating by each stage, and vibration maintains a period of time, to find when high-magnitude is vibrated
The situation of existing solder joint fracture.
A kind of quick exciting method of electronic product significant deficiency the most according to claim 1, it is characterised in that: in step 4
Use the rate of temperature change limit acquired in step 2 and temperature inversion cycling condition is as temperature test condition, if walking accordingly
Vibration stress working limit acquired in rapid three is Gmax, starts to coordinate each circulation to be incremented by from Gmax/5 by vibration stress
Gmax/5, continues 10min the highest of each circulation and minimum temperature, performs power on/off and draw load test after temperature stabilization,
So repeat until reach can be till operating bounds and failure approach index.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610559332.2A CN106199271A (en) | 2016-07-15 | 2016-07-15 | A kind of quick exciting method of electronic product significant deficiency |
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| CN201610559332.2A CN106199271A (en) | 2016-07-15 | 2016-07-15 | A kind of quick exciting method of electronic product significant deficiency |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932294A (en) * | 2017-03-22 | 2017-07-07 | 中国电子产品可靠性与环境试验研究所 | Computer motherboard method of testing and device |
| CN110412497A (en) * | 2019-06-11 | 2019-11-05 | 国网重庆市电力公司电力科学研究院 | A kind of intelligent electric energy meter weak links of reliability localization method and device |
| CN111190407A (en) * | 2019-12-26 | 2020-05-22 | 中国家用电器研究院 | Detection method for rapidly exciting and positioning faults in HALT test based on software self-inspection |
| CN111397937A (en) * | 2020-04-07 | 2020-07-10 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Liquid cooling product reliability strengthening test method |
| CN112213128A (en) * | 2020-06-11 | 2021-01-12 | 广东科鉴检测工程技术有限公司 | Test method for rapidly improving reliability of instrument and equipment |
| CN112461473A (en) * | 2020-12-07 | 2021-03-09 | 浙江省计量科学研究院 | High-acceleration life test method for core component of CT detector |
| CN116298618A (en) * | 2023-03-09 | 2023-06-23 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | DVPV detection method and device for automobile electronic component, electronic equipment and storage medium |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932294A (en) * | 2017-03-22 | 2017-07-07 | 中国电子产品可靠性与环境试验研究所 | Computer motherboard method of testing and device |
| CN110412497A (en) * | 2019-06-11 | 2019-11-05 | 国网重庆市电力公司电力科学研究院 | A kind of intelligent electric energy meter weak links of reliability localization method and device |
| CN111190407A (en) * | 2019-12-26 | 2020-05-22 | 中国家用电器研究院 | Detection method for rapidly exciting and positioning faults in HALT test based on software self-inspection |
| CN111397937A (en) * | 2020-04-07 | 2020-07-10 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Liquid cooling product reliability strengthening test method |
| CN112213128A (en) * | 2020-06-11 | 2021-01-12 | 广东科鉴检测工程技术有限公司 | Test method for rapidly improving reliability of instrument and equipment |
| CN112461473A (en) * | 2020-12-07 | 2021-03-09 | 浙江省计量科学研究院 | High-acceleration life test method for core component of CT detector |
| CN112461473B (en) * | 2020-12-07 | 2023-08-01 | 浙江省计量科学研究院 | High-acceleration life test method for core component of CT detector |
| CN116298618A (en) * | 2023-03-09 | 2023-06-23 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | DVPV detection method and device for automobile electronic component, electronic equipment and storage medium |
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