CN106192551A - High-frequency circuit plate substrate prepared by a kind of poly-virtue diazole fibrous material - Google Patents
High-frequency circuit plate substrate prepared by a kind of poly-virtue diazole fibrous material Download PDFInfo
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- CN106192551A CN106192551A CN201610654889.4A CN201610654889A CN106192551A CN 106192551 A CN106192551 A CN 106192551A CN 201610654889 A CN201610654889 A CN 201610654889A CN 106192551 A CN106192551 A CN 106192551A
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- paper
- diazole
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- virtue diazole
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Classifications
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H15/00—Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution
- D21H15/02—Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution characterised by configuration
- D21H15/10—Composite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
- B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
- B29C70/342—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation using isostatic pressure
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21D—TREATMENT OF THE MATERIALS BEFORE PASSING TO THE PAPER-MAKING MACHINE
- D21D1/00—Methods of beating or refining; Beaters of the Hollander type
- D21D1/02—Methods of beating; Beaters of the Hollander type
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
- D21F11/00—Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21G—CALENDERS; ACCESSORIES FOR PAPER-MAKING MACHINES
- D21G1/00—Calenders; Smoothing apparatus
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Abstract
The present invention relates to high-frequency circuit plate substrate prepared by a kind of poly-virtue diazole fibrous material.The present invention uses the poly-virtue diazole chopped fiber and poly-virtue diazole fibrid that resistance to elevated temperatures is excellent, by wet method copy paper method, through certain technique, prepare thermal linear expansion coefficient little, dielectric constant is uniform, the fibrous paper of excellent in mechanical performance, by processing technique such as impregnation, overlapping, hot pressing on the basis of fibrous paper, obtain a kind of low thermal coefficient of expansion, high thermal dimensional stability, the high-frequency circuit plate substrate that processing characteristics is excellent.
Description
Technical field
The present invention relates to electronics and field of compound material, relate more specifically to high-frequency circuit plate substrate.
Background technology
Along with electronic design technology and the progress of manufacturing process, electronic product the most progressively to densification, multifunction,
The compact trend development with high transfer rate；Add the developing rapidly of chip miniaturization, the increasing of data transmission quantity,
The operating frequency of system is more and more higher.
The rapid advances of communication industry, communication technology is from 2G, the development of 3G to 4G so that original commercial communication frequency range is gathered around
Squeezing, high-frequency communication part is gradually given civilian.Data transmission throughput is increasing, and the bandwidth of needs is more and more wider, channel radio
Believe and develop to high frequency.High information quantity transmits information requirements satellite communication, microblogging communication, fiber optic communication must high frequency.Equipment
Miniaturization be also one of following development trend, and equipment once diminishes, it is necessary to printed circuit board (PCB) (PCB) has higher
Heat conducting power and higher dielectric constant.
High-frequency circuit panel material be mainly used in high power amplifier, antenna for base station, global positioning system, weather radar and
Meteorological satellite and car radar and sensor etc..The overall performance of printed circuit board (PCB), processing characteristics, carrying of long-term reliability
Height is heavily dependent on stock.Transmit signal for reaching high-frequency high-speed, base material proposed following higher requirement:
(1) dielectric constant (Dk) is necessary little and the most stable, it is common that the smaller the better, the transfer rate of signal and material dielectric constant
Square root is inversely proportional to, and high-k easily causes signal transmission delay；(2) thermal coefficient of expansion with Copper Foil or silicon tries one's best one
Cause, because inconsistent meeting causes Copper Foil to separate in cold and hot change；(3) other thermostability, chemical resistance, impact strength, stripping
Intensity etc. also must be good.
The thermal coefficient of expansion (CTE) of material is one of physical characteristic of material, deformation that variations in temperature causes and bringing
Stress effect cannot change.Electronic component generally by having welded the interconnection of itself and circuit board, welding process
The heat of middle generation and the material that causes expands deformation, the reliability of butt welding point can produce impact, and then affect electronic component
Reliability and life-span.On the other hand, owing in high-frequency circuit board, signal frequency is high, speed is fast, so in normal situation about using
Its heat produced lower is the biggest.The CTE of copper is about 7um/m. DEG C, and the CTE of silicon is about 4um/m. DEG C, and uses common ring
The CTE of the PCB that oxygen glass fabric is made is about 20um/m. DEG C, if PCB substrate differs relatively big with the CTE of electrical equipment,
Stress can be produced and cause element displacement, inefficacy, even short circuit.So first the selection of frequency PCB base material should consider material
CTE whether CTE with electronic devices and components matches.
Present stage widely used high frequency substrate material has these several big classes such as polyphenylene oxide (PPO) resin, fluorine resin etc..PPO
Although resin cost is relatively low, but its dielectric loss, hot property are relatively poor in high frequency.Fluorine resin electric property in high frequency
The defects such as most preferably, but its weak point also has poor rigidity in addition to cost height, and burr is many and thermal coefficient of expansion is bigger.Additionally because of poly-
The molecule inertia of TFE itself, it is poor with Copper Foil associativity to cause, it is therefore desirable to use multiple chemical solvent to Copper Foil
Faying face carry out special surface and process, environmental pollution is bigger.
In addition, also have Dupont and the correlation technique of Shenzhen sky Gekko Swinhonis nation and patent at present, use p-aramid fiber
Or polyparaphenylene's benzodiazole (PBO) chopped fiber and p-aramid fiber fibrid prepare fibrous paper, its fibrous paper prepared
There is relatively low CTE value.But above method complex process, para-aramid fiber or PBO fibrid mechanical performance and modulus
Higher, it is difficult to disperse, be difficult to improve beating degree, need metal grinding and the making beating of long period, therefore obtained fibrous paper
Metal impurities are more, simultaneously because p-aramid fiber or PBO fibrid glass transition temperature are higher, fibrid is difficult at height
Temperature is lower produces enough bonding forces, therefore mechanics of materials intensity is relatively low, have impact on its application on circuit boards.
Summary of the invention
Therefore, in order to overcome the above-mentioned deficiency of prior art, it is an object of the present invention to provide a kind of poly-virtue two
Azoles fibrous paper, it is characterised in that described fibrous paper is by gathering virtue diazole chopped fiber and the fibrid mass ratio with 8:2-2:8
Mixing, is processed by wet method copy paper, drying and dehydrating and high pressure low temperature press polish and is prepared, wherein the poly-virtue diazole fibrous paper of gained
It is-20um/m. DEG C to-5um/m. DEG C at the planar linear thermal coefficient of expansion of 30-250 DEG C, described planar linear thermal coefficient of expansion
U.S.'s TA Q400 analyser is used to record according to GBT11998-1989 assay method.
In a preferred embodiment of the present invention, poly-virtue diazole chopped fiber and poly-virtue diazole fibrid are with 7:3's
Mass ratio mixes.
In one embodiment of the invention, described poly-virtue diazole chopped fiber is 1-6mm, and fiber modulus is 5-
15GPa, it discongests in standard fibers fluffer and disperses, and the time of discongesting is 1-5min.
In a preferred embodiment of the present invention, described poly-virtue diazole chopped fiber is 6mm.
In a preferred embodiment of the present invention, the time of discongesting of described poly-virtue diazole chopped fiber is 2min.
In another embodiment of the present invention, described poly-virtue diazole fibrid is carried out in ultrasound wave fluffer
Discongesting and disperse, frequency is 10-30KHz, and the time of discongesting is 1-5min, and after discongesting, the beating degree of poly-virtue diazole fibrid is
50-85 degree.
In a preferred embodiment of the present invention, the time of discongesting of described poly-virtue diazole fibrid is 3min.
In a preferred embodiment of the present invention, the beating degree after described poly-virtue diazole fibrid is discongested is 80 degree.
In another embodiment of the present invention, described wet method copy paper is manufactured paper with pulp in wet method paper machine, described in copy
Paper machine is any one in oblique net paper machine, long mesh paper making machine or cylinder mould machine.
In another embodiment of the present invention, wherein the online concentration of wet method copy paper is 1 ‰-10 ‰, filter screen precision
For 150-250 mesh.
In a preferred embodiment of the present invention, wherein the online concentration of wet method copy paper is 6 ‰.
In another embodiment of the present invention, high pressure low temperature press polish processes at pressure 5-50Mpa, temperature 0-50 DEG C
Carry out.
In a preferred embodiment of the present invention, high pressure low temperature press polish processes and carries out at temperature 10 DEG C.
Further object is that and provide a kind of method preparing poly-virtue diazole fibrous paper, described method includes
Following steps:
1) poly-virtue diazole chopped fiber being discongested in standard fibers fluffer and disperseed, poly-virtue diazole precipitating is fine
Dimension is discongested in ultrasound wave fluffer and disperses；
2) by through step 1) in the poly-virtue diazole chopped fiber that processed and poly-virtue diazole fibrid carry out mixing point
It is dispersed in water；
3) by step 2) composite fibre of gained manufactures paper with pulp in wet method paper machine；
4) by step 3) l Water Paper that obtains is dried dehydration by dryer roll；
5) dried paper is processed by high pressure low temperature calender.
Further object is that a kind of board substrate of offer, described board substrate comprises described poly-virtue
Diazole fibrous paper.
In another embodiment of the present invention, described board substrate be impregnated in by described poly-virtue diazole fibrous paper
Thermoset type resin, uses vacuum press after overlapping impregnation, heats compressing and prepared.
In another embodiment of the present invention, described thermoset type resin is epoxy resin or phenolic resin, polyamides
Imide resin or various modified heat convertible resin.
In another embodiment of the present invention, the thermal linear expansion coefficient of board substrate is less than 10um/m. DEG C.
In another embodiment of the present invention, the dielectric constant of board substrate is less than 5.
Present invention have the advantage that
1, raw material and process aspect
(1) poly-virtue diazole chopped fiber is used, compared with p-aramid fiber or pbo fiber, it is possible to be conducive to the dispersion of fiber
And making beating, heighten the brooming of the adhesion between fiber and fiber, beneficially fiber surface, improve the forming ability of paper；
(2) material chemical component and structure are single, need not add other dispersants or binding agent, halogen-free, nontoxic；Difference
In para-aramid fiber paper, its preparation process needs the dispersants such as polyethylene glycol oxide.
(3) poly-virtue diazole fibrous paper steady chemical structure, heatproof temperature is high, and thermal dimensional stability is good；
(4) ultrasonic wave concussion fluffer is used to process, poly-virtue diazole fibrid with traditional metal mill
Or mechanical processing equipment compares, fibrid beating degree can reach more than 85 degree, is conducive to improving the mechanics of paper and electrically
Performance.And it is short to process the time, efficiency is high, saves the energy.Introducing entirely without extraneous metal impurity, it is possible to increase circuit board
The uniformity of base material and electric property；
(5) unique high pressure low temperature press polish processes technique, processes different from traditional High Temperature High Pressure press polish.P-aramid paper
The High Temperature High Pressure press polish used processes, and apparatus and process is required height, and the too low paper of temperature is difficult to compressing, combines between fiber
Power is poor, and paper mechanical strength is relatively low, and paper surface is coarse, and fiber has obscission；Temperature is too high, and fiber starts to decompose, paper
Tensiometry intensity also can reduce, simultaneously the smooth combination being unfavorable for thermosetting resin of paper surface.And gather virtue diazole fiber
The technique that paper uses not only can guarantee that fibrid produces cold crystallization phenomenon, produces enough bonding forces, moreover it is possible to farthest
Reduce the three-dimensional transformation of its state of aggregation, material hot expansibility on three dimensions can be improved further.Be conducive to paper simultaneously
The control of surface roughness, during throttle circuit plate, produce good combination with thermosetting resin；
(6) a complete set of technique environmental protection, green, energy-conservation, pollution-free.
2, the feature of the board substrate of poly-virtue diazole fibrous paper is used
(1) lightweight of light specific gravity, beneficially electronic product；
(2) relatively low dielectric constant and dielectric loss, advantageously reduce the loss of signal, improves the high frequency characteristics of sheet material, more
The transmission in the pcb of applicable high-frequency signal.
(3) having high-performance, high reliability, at high temperature thermal expansion deformation is little, has the dimensional stability of excellence, especially
It is applicable to high frequency and the bigger place of variations in temperature, the beneficially densification of electronic product, high frequency.The most this base material
There is preferable mechanical property, it can be ensured that the reliability of metallic vias under various processing and operating condition.
Detailed description of the invention
Being described in detail embodiment of the present invention below in conjunction with embodiment, the following example is merely to illustrate this
Invention, and should not be taken as limiting the scope of the invention.
Use poly-virtue diazole chopped fiber and poly-virtue diazole fibrid, by wet method copy paper, through certain technique,
Preparing thermal linear expansion coefficient little, dielectric constant is uniform, the fibrous paper of excellent in mechanical performance, passes through on the basis of this fibrous paper
The processing technique such as impregnation, overlapping, hot pressing, obtain a kind of low thermal coefficient of expansion, high thermal dimensional stability, the height that processing characteristics is excellent
Frequency circuit plate substrate.
The preparation of poly-virtue diazole fibrous paper:
(1) Feedstock treating: by poly-virtue diazole chopped fiber (Jiangsu Baode New Material Co., Ltd. of 1-6mm, preferably 6mm
Produce) to discongest in standard fibers fluffer and disperse, the time of discongesting is 1-5min, preferably 2min, and fiber modulus is
5-15GPa；
Poly-virtue diazole fibrid (Jiangsu Baode New Material Co., Ltd.'s production) is carried out in ultrasound wave fluffer
Discongesting and disperse, frequency: 10-30KHz, the process time is 1-5min, preferably 3min, poly-virtue diazole fibrid after discongesting
Beating degree be 50-85 degree, preferably 80 degree；
(2) a certain proportion of two kinds of raw materials mixing being dispersed in water, manufacture paper with pulp in wet method paper machine, paper machine is
Any one in oblique net paper machine, long mesh paper making machine or cylinder mould machine, chopped fiber is=8 with the mixing quality ratio of fibrid:
2-2:8, preferably 7:3, online concentration is 1 ‰-10 ‰, is preferably 6 ‰, and filter screen precision is 150-250 mesh；
(3) l Water Paper is dried dehydration by dryer roll, and baking temperature is 50-100 DEG C；
(4) it is the hot expansibility reducing material further, improves tightness and the uniformity of paper simultaneously, improve paper
Electric property and mechanical property, dried paper is processed by high pressure low temperature calender, pressure 5-50Mpa, temperature 0-50
DEG C, preferably 10 DEG C, roller speed 1-30m/min, preferably 15m/min, press polish number of times 1-5 time, preferential 3 times.
Typical physical performance and the electric property of the poly-virtue diazole fibrous paper prepared are as follows:
Thickness: 0.04mm-0.13mm, paper sheet thickness instrument, ASTM D374；
Tightness: 0.3-0.7g/cc, paper density instrument, ASTM D646；
Surface roughness: Ra 52, GB/T 1031-2009；
The percent thermal shrinkage of 300 DEG C: 0.2%；
30-250 DEG C of planar linear thermal coefficient of expansion :-15um/m. DEG C, GBT11998-1989, U.S. TA Q400；
Initial heat decomposition temperature: more than 490 DEG C, U.S. TA Q600；
Dielectric constant: 1.7-2.5, ASTM D150；
Tensile strength: >=3.0KN/m, paper tensile strength tester, GB/T 12914-2008.
Under the conditions of same test, the CTE of the epoxy glass fiber cloth of prior art is 19um/m. DEG C；P-aramid fiber is fine
The performance of dimension paper is as follows: CTE is-4um/m. DEG C；Tensile strength is 0.8KN/m；The percent thermal shrinkage of 300 DEG C is 0.8%.
Poly-virtue diazole fibrous paper has the most prominent linear thermal expansion performance as can be seen from the above data, hence it is evident that low
In p-aramid paper of the prior art and epoxy glass fiber cloth.The material that simultaneously prepared by the present invention is keeping the resistance to height of excellence
While warm nature energy, have both preferable mechanical property.
The preparation of board substrate and performance thereof:
Prepared poly-virtue diazole fibrous paper be impregnated in thermoset type epoxy resin.Impregnation resin content is 10-20%, overlapping
Use vacuum press after impregnation, heat compressing, thus prepare the board substrate containing poly-virtue diazole fibrous paper.
According to JIS C6481 " use in printed circuit board copper plating film plywood test method ", this board substrate is carried out linearly
Thermal coefficient of expansion and the test of dielectric constant, result is as follows:
Planar linear thermal coefficient of expansion: 8um/m. DEG C, tests at 25-300 DEG C；
Dielectric constant: 3.0-3.3, tests at normal temperatures and pressures.
Can be drawn by result above, board substrate prepared by the present invention has relatively low coefficient of linear thermal expansion, remarkably
Dielectric and hot property, be more beneficial for the high frequency of circuit board, multiple stratification, lightweight.
Claims (12)
1. a poly-virtue diazole fibrous paper, it is characterised in that described poly-virtue diazole fibrous paper by gather virtue diazole chopped fiber and
Poly-virtue diazole fibrid mixes, by wet method copy paper, drying and dehydrating and high pressure with the mass ratio of 8:2-2:8, preferably 7:3
Low temperature press polish processes and prepares, and wherein the poly-fragrant diazole fibrous paper of gained is at the planar linear thermal coefficient of expansion of 30-250 DEG C
For-20um/m. DEG C to-5um/m. DEG C, described planar linear thermal coefficient of expansion use U.S. TA Q400 analyser according to
GBT11998-1989 assay method records.
Poly-virtue diazole fibrous paper the most according to claim 1, wherein said poly-virtue diazole chopped fiber is 1-6mm, excellent
Selecting 6mm, fiber modulus is 5-15GPa, and it is discongested in standard fibers fluffer and disperses, and the time of discongesting is 1-5min,
It is preferably 2min.
Poly-virtue diazole fibrous paper the most according to claim 1 and 2, wherein said poly-virtue diazole fibrid is ultrasonic
Discongesting in ripple fluffer and disperse, frequency is 10-30KHz, and the time of discongesting is 1-5min, preferably 3min, poly-after discongesting
The beating degree of virtue diazole fibrid is 50-85 degree, preferably 80 degree.
Poly-virtue diazole fibrous paper the most according to claim 1 and 2, wherein said wet method copy paper is entered in wet method paper machine
Row is manufactured paper with pulp, and described paper machine is any one in oblique net paper machine, long mesh paper making machine or cylinder mould machine.
Poly-virtue diazole fibrous paper the most according to claim 1 and 2, the online concentration of wherein said wet method copy paper is 1 ‰-
10 ‰, preferably 6 ‰, filter screen precision is 150-250 mesh.
Poly-virtue diazole fibrous paper the most according to claim 1 and 2, wherein high pressure low temperature press polish processes at pressure 5-
50Mpa, temperature 0-50 DEG C, carry out at preferably 10 DEG C.
7. the method preparing poly-virtue diazole fibrous paper according to any one of claim 1 to 6, described method bag
Include following steps:
1) poly-virtue diazole chopped fiber being discongested in standard fibers fluffer and disperseed, poly-virtue diazole fibrid exists
Ultrasound wave fluffer is discongested and disperses；
2) by through step 1) in the poly-virtue diazole chopped fiber that processed and poly-virtue diazole fibrid carry out mixing and be dispersed in
In water；
3) by step 2) composite fibre of gained manufactures paper with pulp in wet method paper machine；
4) by step 3) l Water Paper that obtains is dried dehydration by dryer roll；
5) dried paper is processed by high pressure low temperature calender.
8. a board substrate, described board substrate comprises according to any one of claim 1 to 6 poly-fragrant two
Azoles fibrous paper.
Board substrate the most according to claim 8, it be impregnated in thermoset type tree by described poly-virtue diazole fibrous paper
Fat, uses vacuum press after overlapping impregnation, heats compressing and prepared.
Board substrate the most according to claim 9, wherein said thermoset type resin be epoxy resin, phenolic resin,
Polyimide resin or various modified heat convertible resin.
11. board substrate according to claim 8, its thermal linear expansion coefficient is less than 10um/m. DEG C.
12. board substrates according to claim 8, its dielectric constant is less than 5.
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| CN201610654889.4A CN106192551B (en) | 2016-08-11 | 2016-08-11 | A kind of high-frequency circuit board base material prepared by Ju Fang oxadiazole fibrous materials |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512289A (en) * | 2020-11-23 | 2021-03-16 | 江苏展宝新材料有限公司 | Polyaryl oxadiazole shielding film and preparation method thereof |
| CN112501949A (en) * | 2020-11-23 | 2021-03-16 | 江苏展宝新材料有限公司 | Polyaryloxadiazole fiber basalt composite material and preparation method thereof |
| CN112553970A (en) * | 2020-12-01 | 2021-03-26 | 江苏展宝新材料有限公司 | Preparation method of layered composite polyaryl oxadiazole fiber paper |
| CN115247289A (en) * | 2022-01-27 | 2022-10-28 | 四川大学 | Co-spun fibers and methods of making the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112512289A (en) * | 2020-11-23 | 2021-03-16 | 江苏展宝新材料有限公司 | Polyaryl oxadiazole shielding film and preparation method thereof |
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| CN112553970A (en) * | 2020-12-01 | 2021-03-26 | 江苏展宝新材料有限公司 | Preparation method of layered composite polyaryl oxadiazole fiber paper |
| CN115247289A (en) * | 2022-01-27 | 2022-10-28 | 四川大学 | Co-spun fibers and methods of making the same |
| CN115247289B (en) * | 2022-01-27 | 2023-09-22 | 四川大学 | Co-spun fibers and method of making same |
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