CN106189250A - A kind of heat conductive silica gel tablet raw material and preparation method thereof - Google Patents
A kind of heat conductive silica gel tablet raw material and preparation method thereof Download PDFInfo
- Publication number
- CN106189250A CN106189250A CN201610640804.7A CN201610640804A CN106189250A CN 106189250 A CN106189250 A CN 106189250A CN 201610640804 A CN201610640804 A CN 201610640804A CN 106189250 A CN106189250 A CN 106189250A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- heat
- conducting silica
- gel sheet
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Compounds (AREA)
Abstract
The present invention relates to a kind of heat-conducting silica gel sheet new varieties, its molecular structural formula is as follows:Wherein: m and n is integer, its span is 10～1000；R1,R2,R3For thickening polar group.As: epoxy radicals, acyloxy, isocyanate group, chloro, vinyl etc..Product of the present invention (calling " hot sticky type heat-conducting silica gel sheet " in the following text) does not has any adhesiveness at normal temperatures, it is simple to manual operation uses.And the operational approach that " hot sticky type heat-conducting silica gel sheet " is pressed " common heat-conducting silica gel sheet " is placed between IC and radiating aluminium sheet, when generating heat after IC energising work, may result in " hot sticky type heat-conducting silica gel sheet " temperature and rise to more than 70 DEG C, now the polar group on " hot sticky type heat-conducting silica gel sheet " material Middle molecule main chain will occur chemical reaction with the molecule of aluminium material surface, form chemical bond, heating IC is firmly bonded together with radiating aluminium sheet.Therefore better heat-radiation effect, service life is longer.
Description
Technical field
The present invention relates to a kind of heat conductive silica gel tablet raw material and preparation method thereof, belong to organosilicon heat-conducting silica gel sheet field.
Background technology
It is to use heat conduction that heat conduction between heating electronic component and the radiating aluminium sheet of electronic product now links major part
Silica gel piece.
And heat-conducting silica gel sheet in the market is broadly divided into two big classes
1. self-adhering-type,
2. non-stick.
1. self-adhering-type heat-conducting silica gel sheet: have adhesiveness the most before use, it is normal because of viscous hands that this just makes operative's time
Broken, thus cause scrappage higher.The particularly percent defective of those very thin thickness (0.1mm ~ 0.3mm) is higher.Simultaneously
After adhesion, the icam gene vinyl of self-adhering-type heat-conducting silica gel sheet at high temperature can progressively be lost and lose adhesiveness.
2. non-stick heat-conducting silica gel sheet.Though scrappage is the highest when this product attaches, but due to it and heating electronic component,
There is no adhesiveness between radiating aluminium sheet, will certainly have space.So can be substantially reduced actual radiating effect (although silica gel piece itself
Heat conductivity is higher) therefore, provide the user a kind of easy to use, scrappage is extremely low, and the heat conductive silica gel that heat-conducting effect is the best
Sheet is necessary.
Summary of the invention
It is desirable to provide a kind of heat conductive silica gel tablet raw material and preparation method thereof.Product of the present invention (calls that " hot sticky type is led in the following text
Hot silica gel piece ") there is no any adhesiveness at normal temperatures, it is simple to and operative uses.And " hot sticky type heat-conducting silica gel sheet " is placed in
Between IC and radiating aluminium sheet, when IC operational heat causes " hot sticky type heat-conducting silica gel sheet " temperature to rise to more than 70 DEG C, in product
Polar group and the molecule generation chemical reaction of aluminium material surface, produce firm chemical bond and stick together firmly, reach more
It is beneficial to the effect of heat radiation.
To achieve these goals, technical scheme is as follows.
A kind of heat conductive silica gel tablet raw material, its molecular characterization is as follows:
In above-mentioned molecular structural formula, m and n is integer, and its span is 10～1000；R1,R2,R3For thickening polar group.
R1,R2,R3For epoxy radicals or acyloxy, isocyanate group, chloro, vinyl etc..
Above-mentioned heat-conducting silica gel sheet method for preparing raw material is: take corresponding silane coupler and band polar group (vinyl,
Hydroxyl, hydrogen-based, epoxy radicals, amino etc.) long-chain siloxanes carry out chemical reaction and produce；Preparation method is organosilicon condensation or adds
Become reaction method, wherein, for improving the hot strength of " autohension " heat-conducting silica gel sheet, add supporting material, adding of supporting material
The quality control entered is 3%～15%；According to the requirement of different heat conductivitys, add Heat Conduction Material, the consumption control of Heat Conduction Material
System is 65～75%；According to different requirements, choosing different types of fire proofing, consumption is between 0.05～0.5%.
Above-mentioned reinforced filling is white carbon black, silica flour or silicon powder；Heat filling is alumina powder, carborundum powder or silicon nitride
Powder；Fire-retardant filler is aluminium hydroxide or magnesium hydroxide.
This beneficial effect of the invention is: two processes separated bonding operation with produced viscosity, adds use
Convenience, saves production cost, and provides the expansion of product.One, before using, product does not has viscosity, it is simple to improve hands
The success rate of work operation, reduces loss thus has saved production cost, and provide convenience for commercial production；Its two, use
During, heat up and can reach the effect of abundant good bond with aluminium flake during due to heating IC work, therefore ensure that the effective of product
Property.Its three: different fillers can be added according to demand, on the basis of basic product, expand the intensity of product, heat conductivity, flammable
The performance such as property and color, can use in field more widely.
Embodiment 1
Heat conductive silica gel tablet raw material in the present embodiment, its general formula of molecular structure is as follows:
In above-mentioned general formula of molecular structure, m and n is integer word, and its span is 10～200；R1,R2,R3For thickening polarity
Group.
R1,R2,R3For epoxy radicals or acyloxy, isocyanate group, chloro, vinyl.
Above-mentioned heat-conducting silica gel sheet method for preparing raw material is: take the long-chain silicon of corresponding silane idol carbon agent and band polar group
Oxygen alkane carries out chemical reaction and produces；Preparation method is the hybrid additive reaction method of organosilicon, wherein, leads for improving " autohension "
The hot strength of hot silica gel piece, adds supporting material, and the quality control of the addition of supporting material is 3%～15%；According to different
The requirement of heat conductivity, adds Heat Conduction Material, and the quality control of Heat Conduction Material is 65～75%；According to different requirements, choose not
Congener fire proofing, consumption is between 0.05～0.5%.
Above-mentioned reinforced filling is white carbon black.Above-mentioned heat filling is alumina powder.Above-mentioned fire-retardant filler is aluminium hydroxide.
Product of the present invention does not has any adhesiveness before use, it is simple to operative uses, and is once bonded at heating
After between IC and radiating aluminium sheet, when generating heat IC work, the heat relying on heating IC to provide, make " hot sticky type heat-conducting silica gel sheet " temperature
When degree rising reaches 70 ° of more than C, the polar group in " hot sticky type heat-conducting silica gel sheet " occurs chemistry anti-with the molecule of aluminium material surface
Should, so that producing firm chemical bond between " hot sticky type heat-conducting silica gel sheet " and aluminium and sticking together firmly, thus reach
To the effect being more conducive to heat radiation.
Embodiment 2
Heat conductive silica gel tablet raw material in the present embodiment, its general formula of molecular structure is as follows:
In above-mentioned general formula of molecular structure, m and n is integer word, and its span is 900～1000；R1,R2,R3For thickening polarity
Group.R1,R2,R3For epoxy radicals or acyloxy, isocyanate group, chloro, vinyl.
Above-mentioned heat-conducting silica gel sheet method for preparing raw material is: take the long-chain silicon of corresponding silane idol carbon agent and band polar group
Oxygen alkane carries out chemical reaction and produces；Preparation method is the hybrid additive reaction method of organosilicon, wherein, leads for improving " autohension "
The hot strength of hot silica gel piece, adds supporting material, and the quality control of the addition of supporting material is 3%～15%；According to different
The requirement of heat conductivity, adds Heat Conduction Material, and the quality control of Heat Conduction Material is 65～75%；According to different requirements, choose not
Congener fire proofing, consumption is between 0.05～0.5%.
Above-mentioned reinforced filling is silica flour.Above-mentioned heat filling is carborundum powder.Above-mentioned fire-retardant filler be aluminium hydroxide or
Person's magnesium hydroxide.
Product of the present invention does not has any adhesiveness before use, it is simple to operative uses, and is once bonded at heating
After between IC and radiating aluminium sheet, when generating heat IC work, the heat relying on heating IC to provide, make " hot sticky type heat-conducting silica gel sheet " temperature
When degree rising reaches 70 ° of more than C, the polar group in " hot sticky type heat-conducting silica gel sheet " occurs chemistry anti-with the molecule of aluminium material surface
Should, so that producing firm chemical bond between " hot sticky type heat-conducting silica gel sheet " and aluminium and sticking together firmly, thus reach
To the effect being more conducive to heat radiation.
Embodiment 3
Heat conductive silica gel tablet raw material in the present embodiment, its general formula of molecular structure is as follows:
In above-mentioned general formula of molecular structure, m and n is integer word, and its span is 300～500；R1,R2,R3For thickening polarity
Group.R1,R2,R3For epoxy radicals or acyloxy, isocyanate group, chloro, vinyl.
Above-mentioned heat-conducting silica gel sheet method for preparing raw material is: take the long-chain silicon of corresponding silane idol carbon agent and band polar group
Oxygen alkane carries out chemical reaction and produces；Preparation method is the hybrid additive reaction method of organosilicon, wherein, leads for improving " autohension "
The hot strength of hot silica gel piece, adds supporting material, and the quality control of the addition of supporting material is 3%～15%；According to different
The requirement of heat conductivity, adds Heat Conduction Material, and the quality control of Heat Conduction Material is 65～75%；According to different requirements, choose not
Congener fire proofing, consumption is between 0.05～0.5%.
Above-mentioned reinforced filling is silicon powder.Above-mentioned heat filling is silicon nitride powder.Above-mentioned fire-retardant filler is magnesium hydroxide.
Product of the present invention does not has any adhesiveness before use, it is simple to operative uses, and is once bonded at heating
After between IC and radiating aluminium sheet, when generating heat IC work, the heat relying on heating IC to provide, make " hot sticky type heat-conducting silica gel sheet " temperature
When degree rising reaches 70 ° of more than C, the polar group in " hot sticky type heat-conducting silica gel sheet " occurs chemistry anti-with the molecule of aluminium material surface
Should, so that producing firm chemical bond between " hot sticky type heat-conducting silica gel sheet " and aluminium and sticking together firmly, thus reach
To the effect being more conducive to heat radiation.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
1. a heat conductive silica gel tablet raw material, it is characterised in that: its molecular structural formula is as follows:
Wherein: m and n is integer, its span is 10～1000；R1,R2,R3For thickening polar group；As: epoxy radicals,
Acyloxy, isocyanate group, chloro, vinyl etc..
" thermal viscosity " the most according to claim 1 heat conductive silica gel tablet raw material, it is characterised in that: above-mentioned heat conductive silica gel tablet raw material
Preparation method is: take (vinyl, hydroxyl, hydrogen-based, epoxy radicals, the amino etc.) of corresponding silane coupler and band polar group
Long-chain siloxanes carries out chemical reaction and produces.
3. the choosing of supporting material
For improving the hot strength of " autohension " heat-conducting silica gel sheet, add supporting material；The filler of supporting material is white carbon black, stone
English powder or silicon powder, consumption controls 3%～15%.
4. the choosing of Heat Conduction Material
According to the requirement of different heat conductivitys, add Heat Conduction Material；The filler of Heat Conduction Material be alumina powder, carborundum powder or
Silicon nitride powder, consumption controls 65～75%.
5. the choosing of fire proofing
According to different requirements, choose different types of fire proofing；The filler of fire proofing is aluminium hydroxide or hydroxide
Magnesium, consumption is between 0.05～0.5%.
6. the choosing of pigment
The pigment of different colours, consumption: in right amount is selected according to customer requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610640804.7A CN106189250A (en) | 2016-08-08 | 2016-08-08 | A kind of heat conductive silica gel tablet raw material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610640804.7A CN106189250A (en) | 2016-08-08 | 2016-08-08 | A kind of heat conductive silica gel tablet raw material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106189250A true CN106189250A (en) | 2016-12-07 |
Family
ID=57514409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610640804.7A Pending CN106189250A (en) | 2016-08-08 | 2016-08-08 | A kind of heat conductive silica gel tablet raw material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106189250A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04339816A (en) * | 1990-08-24 | 1992-11-26 | General Electric Co <Ge> | Epoxy-functional siloxane resin copolymer as controlled release additive |
-
2016
- 2016-08-08 CN CN201610640804.7A patent/CN106189250A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04339816A (en) * | 1990-08-24 | 1992-11-26 | General Electric Co <Ge> | Epoxy-functional siloxane resin copolymer as controlled release additive |
Non-Patent Citations (1)
| Title |
|---|
| 幸松民等编著: "《有机硅产品合成工艺及应用》", 31 March 2015 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106751904B (en) | Heat-conducting organic silicon gel and preparation method thereof | |
| CN109735112B (en) | Addition type organic silicon heat-conducting gel and preparation method thereof | |
| CN103030976B (en) | Single-component heat-curing liquid silicone rubber and preparation method thereof | |
| CN106905698B (en) | Insulating heat radiation sheet | |
| CN101724271B (en) | Silicone rubber sheet for thermocompression bonding | |
| CN111393855A (en) | High-thermal-conductivity gel composition with excellent weather resistance | |
| CN105315958A (en) | Addition heat-conducting self-adhesive silicone rubber and preparation method thereof | |
| CN204795648U (en) | Novel 3D printer heating bottom plate | |
| CN101121870A (en) | Dealcoholizing type organic silicon embedding glue | |
| CN103113846A (en) | Heat-conducting silica gel sheet and manufacturing method thereof | |
| CN104448829A (en) | Low-hardness and high-strength radiating silicone pad and preparation method thereof | |
| CN103215008A (en) | Adhesive composition and adhesive comprising the same | |
| CN113444497B (en) | Low-oil-yield heat-conducting gel and preparation method thereof | |
| CN103694949A (en) | Halogen-free flame retardant heat-conducting organic silicon sealing material for solar photovoltaic module and preparation of material | |
| TW200604279A (en) | Resin composition for radiating material and radiating material | |
| JP2006281670A (en) | Sheet for thermo-compression bonding | |
| CN108859324A (en) | Insulate silica gel pad and preparation method thereof and equipment | |
| CN108949056A (en) | A kind of preparation method of heat-conducting interface material and products thereof | |
| CN112143232B (en) | High-strength ultralow-dielectric-property foaming heat-conducting silica gel gasket and preparation method thereof | |
| CN103820074A (en) | One-component high-temperature-resistant quick-vulcanizing dealcoholization type silicone structural sealant and preparation method thereof | |
| CN104497585A (en) | High-thermal-conductivity silicone rubber and preparation method thereof | |
| CN102850724A (en) | Green and environment-friendly epoxy resin composition for high-power device packaging | |
| CN105368330A (en) | Alpha-cyanoacrylate heat-conducting glue and preparation method thereof | |
| CN106189250A (en) | A kind of heat conductive silica gel tablet raw material and preparation method thereof | |
| CN109023982A (en) | Zero DMF environment-friendly and high-performance silastic polymer synthetic leather and its manufacturing technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |