CN106182479A - 硅锭切割机的工作台、硅锭切割机及硅锭切割方法 - Google Patents
硅锭切割机的工作台、硅锭切割机及硅锭切割方法 Download PDFInfo
- Publication number
- CN106182479A CN106182479A CN201610729510.1A CN201610729510A CN106182479A CN 106182479 A CN106182479 A CN 106182479A CN 201610729510 A CN201610729510 A CN 201610729510A CN 106182479 A CN106182479 A CN 106182479A
- Authority
- CN
- China
- Prior art keywords
- silicon ingot
- station
- cutting
- platform
- station platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 317
- 239000010703 silicon Substances 0.000 title claims abstract description 317
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 312
- 238000005520 cutting process Methods 0.000 title claims abstract description 243
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims abstract description 70
- 230000007246 mechanism Effects 0.000 claims description 75
- 230000005540 biological transmission Effects 0.000 claims description 35
- 230000008859 change Effects 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 description 25
- 230000007423 decrease Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 150000003376 silicon Chemical class 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610729510.1A CN106182479B (zh) | 2016-08-25 | 2016-08-25 | 硅锭切割机的工作台、硅锭切割机及硅锭切割方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610729510.1A CN106182479B (zh) | 2016-08-25 | 2016-08-25 | 硅锭切割机的工作台、硅锭切割机及硅锭切割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106182479A true CN106182479A (zh) | 2016-12-07 |
CN106182479B CN106182479B (zh) | 2019-08-13 |
Family
ID=57523491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610729510.1A Active CN106182479B (zh) | 2016-08-25 | 2016-08-25 | 硅锭切割机的工作台、硅锭切割机及硅锭切割方法 |
Country Status (1)
Country | Link |
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CN (1) | CN106182479B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108508956A (zh) * | 2018-07-11 | 2018-09-07 | 兰溪市宏科网络科技有限公司 | 一种线性稳压器 |
CN108943458A (zh) * | 2017-05-27 | 2018-12-07 | 浙江集英精密机器有限公司 | 单晶硅棒转运装置及单晶硅棒转运方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102849495A (zh) * | 2012-09-23 | 2013-01-02 | 南通烟滤嘴有限责任公司 | 星轮式盘纸回转盘 |
CN103753716A (zh) * | 2013-12-26 | 2014-04-30 | 中国有色桂林矿产地质研究院有限公司 | 单晶硅棒截断金刚石线锯装置 |
CN103909584A (zh) * | 2013-01-04 | 2014-07-09 | 德国太阳能有限公司 | 用于分割硅块的系统和方法 |
US9109302B2 (en) * | 2010-06-07 | 2015-08-18 | Solarworld Innovations Gmbh | Method for producing silicon wafers, and silicon solar cell |
CN105196434A (zh) * | 2015-09-25 | 2015-12-30 | 上海日进机床有限公司 | 多晶硅线切割设备及方法 |
CN105415509A (zh) * | 2015-09-25 | 2016-03-23 | 上海日进机床有限公司 | 硅锭开方机及硅锭开方切割方法 |
CN205915542U (zh) * | 2016-08-25 | 2017-02-01 | 上海日进机床有限公司 | 硅锭切割机及其工作台 |
-
2016
- 2016-08-25 CN CN201610729510.1A patent/CN106182479B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9109302B2 (en) * | 2010-06-07 | 2015-08-18 | Solarworld Innovations Gmbh | Method for producing silicon wafers, and silicon solar cell |
CN102849495A (zh) * | 2012-09-23 | 2013-01-02 | 南通烟滤嘴有限责任公司 | 星轮式盘纸回转盘 |
CN103909584A (zh) * | 2013-01-04 | 2014-07-09 | 德国太阳能有限公司 | 用于分割硅块的系统和方法 |
CN103753716A (zh) * | 2013-12-26 | 2014-04-30 | 中国有色桂林矿产地质研究院有限公司 | 单晶硅棒截断金刚石线锯装置 |
CN105196434A (zh) * | 2015-09-25 | 2015-12-30 | 上海日进机床有限公司 | 多晶硅线切割设备及方法 |
CN105415509A (zh) * | 2015-09-25 | 2016-03-23 | 上海日进机床有限公司 | 硅锭开方机及硅锭开方切割方法 |
CN205915542U (zh) * | 2016-08-25 | 2017-02-01 | 上海日进机床有限公司 | 硅锭切割机及其工作台 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108943458A (zh) * | 2017-05-27 | 2018-12-07 | 浙江集英精密机器有限公司 | 单晶硅棒转运装置及单晶硅棒转运方法 |
CN108508956A (zh) * | 2018-07-11 | 2018-09-07 | 兰溪市宏科网络科技有限公司 | 一种线性稳压器 |
GB2568172A (en) * | 2018-07-11 | 2019-05-08 | Lanxi Hongke Network Tech Co Ltd | A linear voltage stabilizer |
GB2568172B (en) * | 2018-07-11 | 2020-10-28 | Jinan Tongbei Lighting Co Ltd | A linear voltage stabiliser associated with silicon wafer cutting apparatus |
Also Published As
Publication number | Publication date |
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CN106182479B (zh) | 2019-08-13 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180517 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Zhejiang. Applicant after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Applicant before: Shanghai Nissin Machine Tool Co., Ltd. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180803 Address after: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Zhejiang Applicant after: Zhejiang Ji Ying Precision Machinery Co., Ltd. Address before: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Zhejiang. Applicant before: Haining Dijin science and Technology Co., Ltd. |
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CB02 | Change of applicant information |
Address after: 314400 6 Building 129, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Applicant after: Tiantong Tijin Precision Technology Co., Ltd. Address before: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Applicant before: Zhejiang Ji Ying Precision Machinery Co., Ltd. |
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CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Workbench of silicon ingot cutting machine, silicon ingot cutting machine and silicon ingot cutting method Effective date of registration: 20211126 Granted publication date: 20190813 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: TIANTONG RIJIN PRECISION TECHNOLOGY Co.,Ltd. Registration number: Y2021330002258 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |