CN106181747A - 一种大尺寸蓝宝石超薄双面抛光窗口片加工方法 - Google Patents
一种大尺寸蓝宝石超薄双面抛光窗口片加工方法 Download PDFInfo
- Publication number
- CN106181747A CN106181747A CN201610408281.3A CN201610408281A CN106181747A CN 106181747 A CN106181747 A CN 106181747A CN 201610408281 A CN201610408281 A CN 201610408281A CN 106181747 A CN106181747 A CN 106181747A
- Authority
- CN
- China
- Prior art keywords
- sapphire
- window sheet
- annealing
- polishing
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610408281.3A CN106181747B (zh) | 2016-06-13 | 2016-06-13 | 一种大尺寸蓝宝石超薄双面抛光窗口片加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610408281.3A CN106181747B (zh) | 2016-06-13 | 2016-06-13 | 一种大尺寸蓝宝石超薄双面抛光窗口片加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106181747A true CN106181747A (zh) | 2016-12-07 |
CN106181747B CN106181747B (zh) | 2018-09-04 |
Family
ID=57453142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610408281.3A Active CN106181747B (zh) | 2016-06-13 | 2016-06-13 | 一种大尺寸蓝宝石超薄双面抛光窗口片加工方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106181747B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107254717A (zh) * | 2017-05-19 | 2017-10-17 | 广东富源科技股份有限公司 | 一种增强蓝宝石手机盖板强度的方法 |
CN107326328A (zh) * | 2017-07-12 | 2017-11-07 | 合肥展游软件开发有限公司 | 一种电子屏的加工工艺 |
CN108262679A (zh) * | 2018-01-19 | 2018-07-10 | 厦门祐尼三的新材料科技有限公司 | 3d蓝宝石盖板、加工方法及电子设备 |
CN109623508A (zh) * | 2019-01-25 | 2019-04-16 | 云南蓝晶科技有限公司 | 基于高配比抛光液的led用蓝宝石晶片数控抛光方法 |
CN111775354A (zh) * | 2020-06-19 | 2020-10-16 | 山东省科学院新材料研究所 | 一种钽铌酸钾单晶基片元件的加工制作方法 |
CN112454160A (zh) * | 2020-10-27 | 2021-03-09 | 宜兴市科兴合金材料有限公司 | 双面抛光钼基板及其制备方法和在led发光芯片中的应用 |
CN113334148A (zh) * | 2021-06-18 | 2021-09-03 | 连城凯克斯科技有限公司 | 一种用于大尺寸蓝宝石板面的加工工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739589A (en) * | 1985-07-12 | 1988-04-26 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh | Process and apparatus for abrasive machining of a wafer-like workpiece |
WO2011105255A1 (ja) * | 2010-02-26 | 2011-09-01 | 株式会社Sumco | 半導体ウェーハの製造方法 |
CN104669106A (zh) * | 2015-02-10 | 2015-06-03 | 盐城工学院 | 大尺寸a向蓝宝石手机屏双面研磨双面抛光高效超精密加工方法 |
CN105034182A (zh) * | 2015-07-13 | 2015-11-11 | 苏州爱彼光电材料有限公司 | 超薄型蓝宝石片状体的加工方法 |
CN105128157A (zh) * | 2015-06-18 | 2015-12-09 | 江苏苏创光学器材有限公司 | 蓝宝石指纹识别面板的制备方法 |
CN105332060A (zh) * | 2015-10-30 | 2016-02-17 | 江苏吉星新材料有限公司 | 蓝宝石晶片的二次退火方法 |
CN105538131A (zh) * | 2015-12-02 | 2016-05-04 | 珠海东精大电子科技有限公司 | 蓝宝石窗口片加工工艺 |
-
2016
- 2016-06-13 CN CN201610408281.3A patent/CN106181747B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739589A (en) * | 1985-07-12 | 1988-04-26 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh | Process and apparatus for abrasive machining of a wafer-like workpiece |
WO2011105255A1 (ja) * | 2010-02-26 | 2011-09-01 | 株式会社Sumco | 半導体ウェーハの製造方法 |
CN104669106A (zh) * | 2015-02-10 | 2015-06-03 | 盐城工学院 | 大尺寸a向蓝宝石手机屏双面研磨双面抛光高效超精密加工方法 |
CN105128157A (zh) * | 2015-06-18 | 2015-12-09 | 江苏苏创光学器材有限公司 | 蓝宝石指纹识别面板的制备方法 |
CN105034182A (zh) * | 2015-07-13 | 2015-11-11 | 苏州爱彼光电材料有限公司 | 超薄型蓝宝石片状体的加工方法 |
CN105332060A (zh) * | 2015-10-30 | 2016-02-17 | 江苏吉星新材料有限公司 | 蓝宝石晶片的二次退火方法 |
CN105538131A (zh) * | 2015-12-02 | 2016-05-04 | 珠海东精大电子科技有限公司 | 蓝宝石窗口片加工工艺 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107254717A (zh) * | 2017-05-19 | 2017-10-17 | 广东富源科技股份有限公司 | 一种增强蓝宝石手机盖板强度的方法 |
CN107326328A (zh) * | 2017-07-12 | 2017-11-07 | 合肥展游软件开发有限公司 | 一种电子屏的加工工艺 |
CN108262679A (zh) * | 2018-01-19 | 2018-07-10 | 厦门祐尼三的新材料科技有限公司 | 3d蓝宝石盖板、加工方法及电子设备 |
CN109623508A (zh) * | 2019-01-25 | 2019-04-16 | 云南蓝晶科技有限公司 | 基于高配比抛光液的led用蓝宝石晶片数控抛光方法 |
CN111775354A (zh) * | 2020-06-19 | 2020-10-16 | 山东省科学院新材料研究所 | 一种钽铌酸钾单晶基片元件的加工制作方法 |
CN111775354B (zh) * | 2020-06-19 | 2021-10-01 | 山东省科学院新材料研究所 | 一种钽铌酸钾单晶基片元件的加工制作方法 |
CN112454160A (zh) * | 2020-10-27 | 2021-03-09 | 宜兴市科兴合金材料有限公司 | 双面抛光钼基板及其制备方法和在led发光芯片中的应用 |
CN113334148A (zh) * | 2021-06-18 | 2021-09-03 | 连城凯克斯科技有限公司 | 一种用于大尺寸蓝宝石板面的加工工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN106181747B (zh) | 2018-09-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106181747A (zh) | 一种大尺寸蓝宝石超薄双面抛光窗口片加工方法 | |
TWI249785B (en) | Method of chamfering semiconductor wafer | |
CN104536602B (zh) | 一种大屏蓝宝石手机面板加工工艺 | |
CN104999365B (zh) | 蓝宝石晶片研磨抛光方法 | |
US9221289B2 (en) | Sapphire window | |
SG170662A1 (en) | Method for producing a semiconductor wafer | |
CN105034182B (zh) | 超薄型蓝宝石片状体的加工方法 | |
TW200718647A (en) | Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same | |
TW200642796A (en) | Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same | |
MY153463A (en) | Method for producing a semiconductor wafer | |
CN104181027A (zh) | 一种黄金金相样品的制备及组织显示方法 | |
CN101583577A (zh) | 制造磁盘用玻璃衬底的方法 | |
KR20120042674A (ko) | 경취성 웨이퍼의 평탄화 가공 방법 및 평탄화 가공용 패드 | |
JP2011029355A (ja) | レーザマーク付き半導体ウェーハの製造方法 | |
JP5997235B2 (ja) | 複合砥粒とその製造方法と研磨方法と研磨装置 | |
JP6329733B2 (ja) | 半導体ウェハのエッチング方法、半導体ウェハの製造方法および半導体ウェハの結晶欠陥検出方法 | |
TW201238712A (en) | Polishing method of glass plate | |
EP2581906A3 (en) | Reader stop layers | |
JP2015157733A (ja) | 化学強化ガラス板の製造方法 | |
CN205600999U (zh) | 高边缘质量蓝宝石晶片的加工装置 | |
JP6747376B2 (ja) | シリコンウエーハの研磨方法 | |
CN105291287B (zh) | 蓝宝石晶片加工方法及其加工工艺中的中间物 | |
CN103231292A (zh) | 一种高像素智能手机用蓝玻璃的制备方法 | |
CN205325356U (zh) | 表盖的抛光夹紧装置 | |
TW201249600A (en) | Processing method for silicon target surface |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20161207 Assignee: Zhejiang Zhaojing New Material Technology Co.,Ltd. Assignor: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. Contract record no.: X2022980008188 Denomination of invention: A processing method of large-size sapphire ultra-thin double-sided polishing window slice Granted publication date: 20180904 License type: Common License Record date: 20220627 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230106 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230621 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |