CN106181026A - Focal position in a kind of Laser Processing determines equipment, method and device - Google Patents
Focal position in a kind of Laser Processing determines equipment, method and device Download PDFInfo
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- CN106181026A CN106181026A CN201610670751.3A CN201610670751A CN106181026A CN 106181026 A CN106181026 A CN 106181026A CN 201610670751 A CN201610670751 A CN 201610670751A CN 106181026 A CN106181026 A CN 106181026A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The focal position that the invention provides in a kind of Laser Processing determines equipment, method and device, relates to technical field of laser processing.Focal position in this Laser Processing determines that equipment includes: have the laser Machining head of annular wall, condenser lens, CCD coaxial visual field monitor and multi-path laser instruction optical generator；Condenser lens is arranged in the laser Machining head with annular wall；Multi-path laser instruction optical generator is arranged at around annular wall, irradiates surface of the work for sending multi-path laser instruction light；Multi-path laser instruction luminous energy is overlapping in Laser Processing focal position；CCD coaxial visual field monitor is arranged at the upper end of the laser Machining head with annular wall, to monitor the multi-path laser instruction light overlapping cases information at surface of the work, and is determined the focal position of Laser Processing by overlapping cases information.The present invention can solve the most simply, efficiently to determine focal position of laser in laser processing procedure, improves the quality of Laser Processing and the problem of efficiency.
Description
Technical field
The present invention relates to technical field of laser processing, particularly relate to a kind of Laser Processing in focal position determine equipment,
Method and device.
Background technology
At present, laser processing technology is high due to its energy density, and welding deformation is little, simultaneously being easily integrated of welding process,
Automatization, flexibility, can the advantage such as high accuracy, efficient welding, obtain in fields such as Aero-Space, automobile, machine-building in recent years
To being widely applied.In field of laser processing, this area is it is believed that laser spot and workpiece to be processed in Ji Guangjiagong
Between distance (i.e. defocusing amount Δ f), is one of key factor affecting Laser Welding Quality, and it directly affects the inside of weld seam
Pore and shaping surface.In Aerospace Products, all there is higher requirement the fatigue life generally for structural member, the most such as
What accurately controls focal position of laser, or controls defocusing amount Δ f, most important for Laser Processing.
At present, the determination method of focal position of laser in laser processing procedure, general employing mechanical type or employing electric capacity
Approach sensor is carried out.Wherein, in mechanical type method, determine focal position first, be usually and use according to part profile situation
Focusing thimble way of contact simulation focal position carries out teaching programmed process.Such as, as it is shown in figure 1, laser beam 102 is by focusing on
After lens 101, its focal position 103 (focal position 103 is on workpiece 104 surface to be welded herein) Range Focusing lens 101 away from
From for H.According to the size at existing laser head, measure the size of h1 in Fig. 1, then processing focusing thimble 105 so that focusing top
Size h2=H-h1 of pin 105.Focusing thimble 105 is threadeded with condenser lens 101 position, now focusing thimble 105 needle point
Position is exactly laser spot 103 position.During teaching, welding tip 106 is disassembled and changes the focusing processing size
Thimble 105, i.e. can determine that the position of laser spot.But, for mechanical type method, at the curved surface zero that processing thin-wall rigidity is poor
During part, due to the diversity of its profile Yu digital-to-analogue, need to be according to the true form of curved surface part, pointwise collection, use multi-point fitting
The mode of curve determines that laser spot is in surface of the work all the time, and this process is time-consuming, laborious.It addition, capacitance sensor mode one
As in the laser cutting process, its principle is to use the capacitance difference situation between sensor measurement workpiece and laser Machining head,
Along with the distance between laser head and workpiece changes, the electric capacity between both also can change, and regulates cut mistake
Focal position situation in journey.But capacitance sensor mode the most only apply with cut in, during welding processing due to weldering
Connecing heat input relatively big, its more heat has great destructiveness, the plasma simultaneously produced in welding process to sensor
More serious to signal disturbing, current capacitance sensor is not yet applied in laser processing procedure.Therefore, in laser processing procedure
The most simply, efficiently determine focal position of laser, be the key of impact Laser Processing quality and efficiency.
Summary of the invention
Embodiments of the invention provide the focal position in a kind of Laser Processing to determine equipment, method and device, to solve
In laser processing procedure, the most simply, efficiently determine focal position of laser, improve the quality of Laser Processing and the problem of efficiency.
For reaching above-mentioned purpose, the present invention adopts the following technical scheme that
Focal position in a kind of Laser Processing determines equipment, including: there is the laser Machining head of annular wall, focus on thoroughly
Mirror, CCD coaxial visual field monitor and multi-path laser instruction optical generator；
Described condenser lens has in the laser Machining head of annular wall described in being arranged at；Described multi-path laser instruction light occurs
Device is arranged at around described annular wall, irradiates surface of the work for sending multi-path laser instruction light；Described multi-path laser indicates
Luminous energy is overlapping in Laser Processing focal position；Described CCD coaxial visual field monitor is arranged at the laser Machining head with annular wall
Upper end, in the overlapping cases information of surface of the work and true by described overlapping cases information to monitor multi-path laser instruction light
The focal position of fixed Laser Processing.
Concrete, in described multi-path laser instruction optical generator, every two-way laser designation optical generator is one group of laser designation
Optical generator, the circle center that each group of laser designation optical generator is formed relative to annular wall is axisymmetricly.
Focal position in a kind of Laser Processing determines method, and the focal position being applied in above-mentioned Laser Processing determines
Equipment, method includes:
In laser processing procedure, control multi-path laser instruction optical generator and send multi-path laser instruction light irradiation workpiece table
Face；Described multi-path laser instruction luminous energy is overlapping in Laser Processing focal position；
Control the CCD coaxial visual field monitor monitoring multi-path laser instruction light overlapping cases information at surface of the work, and lead to
Cross described overlapping cases information and determine the focal position of Laser Processing.
Concrete, in described multi-path laser instruction optical generator, every two-way laser designation optical generator is one group of laser designation
Optical generator, the circle center that each group of laser designation optical generator is formed relative to annular wall is axisymmetricly；Described control is many
Road laser designation optical generator sends multi-path laser instruction light and irradiates surface of the work, including:
Control one group of laser designation optical generator and send two-way laser designation light irradiation surface of the work；Described two-way laser refers to
Show that luminous energy is overlapping in Laser Processing focal position.
Further, the focal position in this Laser Processing determines method, also includes:
If the two-way laser designation light that one group of laser designation optical generator sends is blocked and cannot irradiate surface of the work, control
Make laser designation optical generator corresponding to the two-way laser designation light being blocked to close；
Control another group laser designation optical generator and send two-way laser designation light irradiation surface of the work.
Concrete, described overlapping cases information includes that two-way laser designation light irradiates the incident angle α of surface of the work, two-way
The laser designation light spot diameter d when surface of the work is completely overlapped, two-way laser designation light are the most completely overlapped at surface of the work
Time hot spot maximum dimension D.
Concrete, the focal position of Laser Processing is determined by described overlapping cases information, including:
According to formula:
Determine that two-way laser designation light irradiates the defocusing amount Δ f of surface of the work；Described defocusing amount Δ f is two-way laser designation
The surface of the work that light irradiates and the distance laser machining focal position；
The focal position of Laser Processing is determined according to described defocusing amount Δ f.
Concrete, the focal position of Laser Processing is determined according to described defocusing amount Δ f, including:
If Δ f=0, determine that the focal position of Laser Processing is positioned at the surface of the work that two-way laser designation light irradiates；
If Δ f ＞ 0, determine that the focal position of Laser Processing is positioned at Δ above the surface of the work that two-way laser designation light irradiates
At f；
If Δ f ＜ 0, determine the focal position of Laser Processing be positioned at two-way laser designation light irradiate surface of the work below-
At Δ f.
Focal position in a kind of Laser Processing determines device, and the focal position being applied in above-mentioned Laser Processing determines
Equipment, the focal position in described Laser Processing determines that device includes:
Laser designation optical generator control unit, in laser processing procedure, controls multi-path laser instruction light and occurs
Device sends multi-path laser instruction light and irradiates surface of the work；Described multi-path laser instruction luminous energy is overlapping in Laser Processing focal position；
CCD coaxial visual field monitor control unit, is used for controlling CCD coaxial visual field monitor monitoring multi-path laser instruction light
Overlapping cases information at surface of the work；
The focal position of Laser Processing determines unit, for being determined the focus of Laser Processing by described overlapping cases information
Position.
Additionally, every two-way laser designation optical generator is one group of laser designation light in described multi-path laser instruction optical generator
Generator, the circle center that each group of laser designation optical generator is formed relative to annular wall is axisymmetricly；Described laser designation
Optical generator control unit, specifically for:
Control one group of laser designation optical generator and send two-way laser designation light irradiation surface of the work；Described two-way laser refers to
Show that luminous energy is overlapping in Laser Processing focal position.
Further, described laser designation optical generator control unit, it is additionally operable to:
When the two-way laser designation light that one group of laser designation optical generator sends is blocked and cannot irradiate surface of the work,
Control laser designation optical generator corresponding to the two-way laser designation light that is blocked to close；
Control another group laser designation optical generator and send two-way laser designation light irradiation surface of the work.
Concrete, the overlapping cases information that described CCD coaxial visual field monitor control unit is monitored includes two-way laser
Instruction light irradiate spot diameter d when surface of the work is completely overlapped of the incident angle α of surface of the work, two-way laser designation light,
The two-way laser designation light hot spot maximum dimension D when surface of the work is the most completely overlapped.
Additionally, the focal position of described Laser Processing determines unit, specifically for:
According to formula:
Determine that two-way laser designation light irradiates the defocusing amount Δ f of surface of the work；Described defocusing amount Δ f is two-way laser designation
The surface of the work that light irradiates and the distance laser machining focal position；
The focal position of Laser Processing is determined according to described defocusing amount Δ f.
Further, the focal position of described Laser Processing determines unit, is specifically additionally operable to:
When Δ f=0, determine that the focal position of Laser Processing is positioned at the surface of the work that two-way laser designation light irradiates；
When Δ f ＞ 0, determine that the focal position of Laser Processing is positioned at above the surface of the work that two-way laser designation light irradiates
At Δ f；
When Δ f ＜ 0, determine that the focal position of Laser Processing is positioned under the surface of the work that two-way laser designation light irradiates
At side-Δ f.
Focal position in a kind of Laser Processing that the embodiment of the present invention provides determines equipment, method and device, this equipment
Including: there is the laser Machining head of annular wall, condenser lens, CCD coaxial visual field monitor and multi-path laser instruction light and occur
Device；Described condenser lens has in the laser Machining head of annular wall described in being arranged at；Described multi-path laser instruction optical generator sets
It is placed in around described annular wall, irradiates surface of the work for sending multi-path laser instruction light；Described multi-path laser instruction luminous energy
Overlapping in Laser Processing focal position；Described CCD coaxial visual field monitor is arranged at laser Machining head upper with annular wall
End, to monitor the multi-path laser instruction light overlapping cases information at surface of the work, and determines sharp by described overlapping cases information
The focal position of light processing.The present invention is radiated at the overlapping cases information of surface of the work by multi-path laser instruction light, can be convenient
Accurately determine the focal position of Laser Processing, such that it is able to solution the most simply, efficiently determines sharp in laser processing procedure
Optical focus position, improves the quality of Laser Processing and the problem of efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, also may be used
To obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is that in prior art, in laser processing procedure, the mechanical type of focal position of laser determines scheme schematic diagram；
Focal position in a kind of Laser Processing that Fig. 2 provides for the embodiment of the present invention determines the structural representation of equipment；
Focal position in a kind of Laser Processing that Fig. 3 provides for the embodiment of the present invention determines annular wall and the laser of equipment
The structural relation schematic diagram of instruction optical generator；
Focal position in a kind of Laser Processing that Fig. 4 provides for the embodiment of the present invention determines the flow chart one of method；
Focal position in a kind of Laser Processing that Fig. 5 provides for the embodiment of the present invention determines the flowchart 2 of method；
Fig. 6 is the overlapping cases schematic diagram one of the two-way laser designation light in the embodiment of the present invention；
Fig. 7 is the overlapping cases schematic diagram two of the two-way laser designation light in the embodiment of the present invention；
Fig. 8 is that the focal position of the Laser Processing in the embodiment of the present invention is positioned at the workpiece table that two-way laser designation light irradiates
Schematic diagram above face；
Fig. 9 is that the focal position of the Laser Processing in the embodiment of the present invention is positioned at the workpiece table that two-way laser designation light irradiates
Schematic diagram below face；
Figure 10 is the schematic diagram that the two-way laser designation light in the embodiment of the present invention irradiates surface of the work；
Figure 11 is after two-way laser designation light in the embodiment of the present invention irradiates surface of the work, hot spot maximum dimension D with from
The relation schematic diagram of burnt amount Δ f；
Focal position in a kind of Laser Processing that Figure 12 provides for the embodiment of the present invention determines the structural representation of device.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
As in figure 2 it is shown, the embodiment of the present invention provides the focal position in a kind of Laser Processing to determine equipment, including: have
The laser Machining head 202 of annular wall 201, condenser lens 203, CCD coaxial visual field monitor 204 and multi-path laser instruction light are sent out
Raw device 205.
This condenser lens 203 is arranged in the laser Machining head 202 with annular wall 201.This multi-path laser instruction light is sent out
Raw device 205 is arranged at around described annular wall 201 (herein can be as it is shown on figure 3, list 6 laser designation light and send out in figure 3
Raw device 205, it should be noted that the quantity of this multi-path laser instruction optical generator 205 is not only limited to this, it is also possible to be 4,
8,10 the most, will not enumerate herein), for send multi-path laser instruction light 206 irradiate workpiece 207 table
Face；Described multi-path laser instruction light 206 can be overlapping in Laser Processing focal position 208；Described CCD coaxial visual field monitor 204
It is arranged at the upper end of the laser Machining head 202 with annular wall 201, to monitor multi-path laser instruction light 206 on workpiece 207 surface
Overlapping cases information, and determine that (in fig. 2, laser adds for the focal position 208 of Laser Processing by described overlapping cases information
The focal position 208 of work is just at workpiece 207 surface, but under practical situation, the focal position 208 of Laser Processing can be at this
Workpiece 207 surface or lower section, specifically may refer to embodiment of the method below).
Concrete, as it is shown on figure 3, every two-way laser designation optical generator 205 in this multi-path laser instruction optical generator 205
It is one group of laser designation optical generator, the circle center that each group of laser designation optical generator 205 is formed relative to annular wall 201
Axisymmetricly.
Above-mentioned CCD coaxial visual field monitor is a kind of CCD (Charge-coupled Device) imageing sensor, also
It is referred to as image controller.
The diameter of above-mentioned laser designation light can be 1 to 10mm, and wave field can be 938nm, but be not only limited to this.
Focal position in a kind of Laser Processing that the embodiment of the present invention provides determines equipment, comprising: have annular wall
Laser Machining head, condenser lens, CCD coaxial visual field monitor and multi-path laser instruction optical generator；Described condenser lens
Have in the laser Machining head of annular wall described in being arranged at；Described multi-path laser instruction optical generator is arranged at described annular wall week
Enclose, irradiate surface of the work for sending multi-path laser instruction light；Described multi-path laser instruction luminous energy is in Laser Processing focus position
Put overlap；Described CCD coaxial visual field monitor is arranged at the upper end of the laser Machining head with annular wall, to monitor multi-path laser
Instruction light is in the overlapping cases information of surface of the work, and is determined the focal position of Laser Processing by described overlapping cases information.
The present invention is radiated at the overlapping cases information of surface of the work by multi-path laser instruction light, can convenient, accurately determine laser and add
The focal position of work, such that it is able to solve the most simply, efficiently to determine focal position of laser in laser processing procedure, improves and swashs
The quality of light processing and the problem of efficiency.
As shown in Figure 4, the embodiment of the present invention provides the focal position in a kind of Laser Processing to determine method, is applied to above-mentioned
Focal position in Laser Processing shown in Fig. 2, Fig. 3 determines that equipment, the method include:
Step 301, in laser processing procedure, control multi-path laser instruction optical generator send multi-path laser instruction illumination
Penetrate surface of the work.
Wherein, described multi-path laser instruction luminous energy is overlapping in Laser Processing focal position.
Step 302, control CCD coaxial visual field monitor monitoring multi-path laser instruction light are believed at the overlapping cases of surface of the work
Breath, and the focal position of Laser Processing is determined by described overlapping cases information.
Focal position in a kind of Laser Processing that the embodiment of the present invention provides determines method, in laser processing procedure,
Control multi-path laser instruction optical generator and send multi-path laser instruction light irradiation surface of the work.Light is indicated afterwards by multi-path laser
Be radiated at the overlapping cases information of surface of the work, can convenient, accurately determine the focal position of Laser Processing, such that it is able to solve
In laser processing procedure, the most simply, efficiently determine focal position of laser, improve the quality of Laser Processing and the problem of efficiency.
In order to make those skilled in the art be better understood by the present invention, a more detailed embodiment is set forth below,
As it is shown in figure 5, the embodiment of the present invention provides the focal position in a kind of Laser Processing to determine method, it is applied to above-mentioned Fig. 2, Fig. 3
The shown focal position in Laser Processing determines that equipment, the method include:
Step 401, in laser processing procedure, control one group of laser designation optical generator and send two-way laser designation illumination
Penetrate surface of the work.
Wherein, described two-way laser designation luminous energy is overlapping in Laser Processing focal position.
After step 401, perform step 402 or step 404.
If the two-way laser designation light that one group of laser designation optical generator of step 402 sends is blocked and cannot irradiate work
Part surface, controls laser designation optical generator corresponding to the two-way laser designation light that is blocked and closes.
Step 403, control another group laser designation optical generator send two-way laser designation light irradiate surface of the work.
The focal position in Laser Processing in above-mentioned Fig. 2, Fig. 3 determines in equipment, multi-path laser instruction optical generator
Use the anti-arrangement mode that blocks to design, be distributed axisymmetricly between each instruction light, when normally working, relative two-way laser designation
Light works.When running into deep camber workpiece or other foreign body blocks any one road in two-way laser designation light, needs will be by
The laser designation optical generator that the two-way laser designation light that blocks is corresponding cuts out, and controls another group laser designation optical generator and send out
Go out two-way laser designation light and irradiate surface of the work.Continue executing with step 404 after step 403.
Step 404, control CCD coaxial visual field monitor monitoring multi-path laser instruction light are believed at the overlapping cases of surface of the work
Breath.
Wherein, described overlapping cases information includes that two-way laser designation light irradiates the incident angle α of surface of the work, two-way swashs
Light indicates the light spot diameter d when surface of the work is completely overlapped, two-way laser designation light when surface of the work is the most completely overlapped
Hot spot maximum dimension D.
Two-way laser designation luminous energy is overlapping in Laser Processing focal position, if Laser Processing focal position is on the surface of the workpiece
Side, then overlapping cases information is as shown in Figure 6.If Laser Processing focal position is below surface of the work, then overlapping cases information is such as
Shown in Fig. 7.
Step 405, according to formula:
Determine that two-way laser designation light irradiates the defocusing amount Δ f of surface of the work.Formula hereinIt is
According to trigonometric function relationObtain.
Wherein, described defocusing amount Δ f is surface of the work and the Laser Processing focal position of two-way laser designation light irradiation
Distance.
Step 406, determine the focal position of Laser Processing according to described defocusing amount Δ f.
In a step 406, if Δ f=0, determine that the focal position of Laser Processing is positioned at the work that two-way laser designation light irradiates
Part surface.
As shown in Figure 8, if Δ f ＞ 0, determine that the focal position of Laser Processing is positioned at the workpiece that two-way laser designation light irradiates
At the Δ f of surface.
If as it is shown in figure 9, Δ f ＜ 0, determining that the focal position of Laser Processing is positioned at the workpiece that two-way laser designation light irradiates
At lower face-Δ f.
An instantiation it is set forth below so that the concrete effect of above-mentioned steps 401 to step 406 to be described, with 5000W IPG
Laser instrument is as light source, using the burnt long HighYAG laser welding system of 250mm as laser focusing system.At laser welding head annular
6 laser designation optical generators (specifically may refer to the structure shown in Fig. 2 and Fig. 3) are installed around wall, laser designation light
Beam diameter 5.91mm, wavelength 938nm, single bundle instruction light energy is 5mw.6 bundle instruction luminous energy are in the focal position of Laser Processing
Overlapping.Angle α between laser designation light and horizontal workpiece is 80 degree.Same at the CCD of laser welding system band installed above scale
Axle visual field monitor, observes hot spot overlapping cases.Can calculate under different hot spot overlapping cases by the formula of step 405, right
The Δ f defocusing amount situation answered, as shown in Figure 10 and Figure 11 and table 1.The numeric representation of Δ f is exactly the focal position laser machined
The distance of the surface of the work that distance laser designation light irradiates, i.e. the focal position in Laser Processing is relative to the position of workpiece.
If it is desired to further determine that focal position is positioned at the either above or below of workpiece, laser head can be moved up and down.Example
As, when moving up laser head, if D value becomes big explanation laser spot and is positioned at the top of workpiece, if D value first diminishes so always
Rear change is big, illustrates that former laser spot is positioned at the lower section of workpiece.
The corresponding relation of defocusing amount Δ f Yu D when table 1: α is 80 degree
Focal position in a kind of Laser Processing that the embodiment of the present invention provides determines method, in laser processing procedure,
Control multi-path laser instruction optical generator and send multi-path laser instruction light irradiation surface of the work.Light is indicated afterwards by multi-path laser
Be radiated at the overlapping cases information of surface of the work, can convenient, accurately determine the focal position of Laser Processing, such that it is able to solve
In laser processing procedure, the most simply, efficiently determine focal position of laser, improve the quality of Laser Processing and the problem of efficiency.
Corresponding to the embodiment of the method shown in above-mentioned Fig. 4 and Fig. 5, as shown in figure 12, the embodiment of the present invention provides one to swash
Focal position in light processing determines device, and the focal position being applied in the Laser Processing shown in above-mentioned Fig. 2 and Fig. 3 determines and sets
Standby, the focal position in described Laser Processing determines that device includes:
Laser designation optical generator control unit 51, in laser processing procedure, controls multi-path laser instruction light and sends out
Raw device sends multi-path laser instruction light and irradiates surface of the work；Described multi-path laser instruction luminous energy is at Laser Processing focal position weight
Folded.
CCD coaxial visual field monitor control unit 52, is used for controlling the monitor monitoring multi-path laser instruction of CCD coaxial visual field
Light is in the overlapping cases information of surface of the work.
The focal position of Laser Processing determines unit 53, for being determined Jiao of Laser Processing by described overlapping cases information
Point position.
Additionally, every two-way laser designation optical generator is one group of laser designation light in described multi-path laser instruction optical generator
Generator, the circle center that each group of laser designation optical generator is formed relative to annular wall is axisymmetricly；Described laser designation
Optical generator control unit 51, specifically for:
Control one group of laser designation optical generator and send two-way laser designation light irradiation surface of the work；Described two-way laser refers to
Show that luminous energy is overlapping in Laser Processing focal position.
Further, described laser designation optical generator control unit 51, it is additionally operable to:
When the two-way laser designation light that one group of laser designation optical generator sends is blocked and cannot irradiate surface of the work,
Control laser designation optical generator corresponding to the two-way laser designation light that is blocked to close.
Control another group laser designation optical generator and send two-way laser designation light irradiation surface of the work.
Concrete, the overlapping cases information that described CCD coaxial visual field monitor control unit 52 is monitored includes that two-way swashs
Light instruction light irradiates the incident angle α of surface of the work, the two-way laser designation light spot diameter when surface of the work is completely overlapped
D, the two-way laser designation light hot spot maximum dimension D when surface of the work is the most completely overlapped.
Additionally, the focal position of described Laser Processing determines unit 53, specifically for:
According to formula:
Determine that two-way laser designation light irradiates the defocusing amount Δ f of surface of the work；Described defocusing amount Δ f is two-way laser designation
The surface of the work that light irradiates and the distance laser machining focal position.
The focal position of Laser Processing is determined according to described defocusing amount Δ f.
Further, the focal position of described Laser Processing determines unit 53, is specifically additionally operable to:
When Δ f=0, determine that the focal position of Laser Processing is positioned at the surface of the work that two-way laser designation light irradiates.
When Δ f ＞ 0, determine that the focal position of Laser Processing is positioned at above the surface of the work that two-way laser designation light irradiates
At Δ f.
When Δ f ＜ 0, determine that the focal position of Laser Processing is positioned under the surface of the work that two-way laser designation light irradiates
At side-Δ f.
What deserves to be explained is, the focal position in a kind of Laser Processing that the embodiment of the present invention provides determines the concrete of device
Implementation may refer to the embodiment of the method that above-mentioned Fig. 4 with Fig. 5 is corresponding, and here is omitted.
Focal position in a kind of Laser Processing that the embodiment of the present invention provides determines device, in laser processing procedure,
Control multi-path laser instruction optical generator and send multi-path laser instruction light irradiation surface of the work.Light is indicated afterwards by multi-path laser
Be radiated at the overlapping cases information of surface of the work, can convenient, accurately determine the focal position of Laser Processing, such that it is able to solve
In laser processing procedure, the most simply, efficiently determine focal position of laser, improve the quality of Laser Processing and the problem of efficiency.
Those skilled in the art are it should be appreciated that embodiments of the invention can be provided as method, system or computer program
Product.Therefore, the reality in terms of the present invention can use complete hardware embodiment, complete software implementation or combine software and hardware
Execute the form of example.And, the present invention can use at one or more computers wherein including computer usable program code
The upper computer program product implemented of usable storage medium (including but not limited to disk memory, CD-ROM, optical memory etc.)
The form of product.
The present invention is with reference to method, equipment (system) and the flow process of computer program according to embodiments of the present invention
Figure and/or block diagram describe.It should be understood that can the most first-class by computer program instructions flowchart and/or block diagram
Flow process in journey and/or square frame and flow chart and/or block diagram and/or the combination of square frame.These computer programs can be provided
Instruction arrives the processor of general purpose computer, special-purpose computer, Embedded Processor or other programmable data processing device to produce
A raw machine so that the instruction performed by the processor of computer or other programmable data processing device is produced for real
The device of the function specified in one flow process of flow chart or multiple flow process and/or one square frame of block diagram or multiple square frame now.
These computer program instructions may be alternatively stored in and computer or other programmable data processing device can be guided with spy
Determine in the computer-readable memory that mode works so that the instruction being stored in this computer-readable memory produces and includes referring to
Make the manufacture of device, this command device realize at one flow process of flow chart or multiple flow process and/or one square frame of block diagram or
The function specified in multiple square frames.
These computer program instructions also can be loaded in computer or other programmable data processing device so that at meter
Perform sequence of operations step on calculation machine or other programmable devices to produce computer implemented process, thus at computer or
The instruction performed on other programmable devices provides for realizing at one flow process of flow chart or multiple flow process and/or block diagram one
The step of the function specified in individual square frame or multiple square frame.
The present invention applies specific embodiment principle and the embodiment of the present invention are set forth, above example
Explanation be only intended to help to understand method and the core concept thereof of the present invention；Simultaneously for one of ordinary skill in the art,
According to the thought of the present invention, the most all will change, in sum, in this specification
Hold and should not be construed as limitation of the present invention.
Claims (14)
1. the focal position in a Laser Processing determines equipment, it is characterised in that including: have the Laser Processing of annular wall
Head, condenser lens, CCD coaxial visual field monitor and multi-path laser instruction optical generator；
Described condenser lens has in the laser Machining head of annular wall described in being arranged at；Described multi-path laser instruction optical generator sets
It is placed in around described annular wall, irradiates surface of the work for sending multi-path laser instruction light；Described multi-path laser instruction luminous energy
Overlapping in Laser Processing focal position；Described CCD coaxial visual field monitor is arranged at laser Machining head upper with annular wall
End, to monitor the multi-path laser instruction light overlapping cases information at surface of the work, and determines sharp by described overlapping cases information
The focal position of light processing.
Focal position in Laser Processing the most according to claim 1 determines equipment, it is characterised in that described multi-path laser
In instruction optical generator, every two-way laser designation optical generator is one group of laser designation optical generator, and each group of laser designation light is sent out
The circle center that raw device is formed relative to annular wall is axisymmetricly.
3. the focal position in a Laser Processing determines method, it is characterised in that be applied to swashing described in claim 1 or 2
Focal position in light processing determines that equipment, method include:
In laser processing procedure, control multi-path laser instruction optical generator and send multi-path laser instruction light irradiation surface of the work；
Described multi-path laser instruction luminous energy is overlapping in Laser Processing focal position；
Control the CCD coaxial visual field monitor monitoring multi-path laser instruction light overlapping cases information at surface of the work, and pass through institute
State overlapping cases information and determine the focal position of Laser Processing.
Focal position in Laser Processing the most according to claim 3 determines method, it is characterised in that described multi-path laser
In instruction optical generator, every two-way laser designation optical generator is one group of laser designation optical generator, and each group of laser designation light is sent out
The circle center that raw device is formed relative to annular wall is axisymmetricly；Described control multi-path laser instruction optical generator sends multichannel and swashs
Light instruction light irradiates surface of the work, including:
Control one group of laser designation optical generator and send two-way laser designation light irradiation surface of the work；Described two-way laser designation light
Can be overlapping in Laser Processing focal position.
Focal position in Laser Processing the most according to claim 4 determines method, it is characterised in that also include:
If the two-way laser designation light that one group of laser designation optical generator sends is blocked and cannot irradiate surface of the work, control quilt
The laser designation optical generator that the two-way laser designation light that blocks is corresponding cuts out；
Control another group laser designation optical generator and send two-way laser designation light irradiation surface of the work.
Focal position in Laser Processing the most according to claim 5 determines method, it is characterised in that described overlapping cases
Information includes that the two-way laser designation light irradiation incident angle α of surface of the work, two-way laser designation light are the heaviest at surface of the work
Spot diameter d time folded, the two-way laser designation light hot spot maximum dimension D when surface of the work is the most completely overlapped.
Focal position in Laser Processing the most according to claim 6 determines method, it is characterised in that by described overlap
Situation information determines the focal position of Laser Processing, including:
According to formula:
Determine that two-way laser designation light irradiates the defocusing amount Δ f of surface of the work；Described defocusing amount Δ f is two-way laser designation illumination
The surface of the work penetrated and the distance laser machining focal position；
The focal position of Laser Processing is determined according to described defocusing amount Δ f.
Focal position in Laser Processing the most according to claim 7 determines method, it is characterised in that according to described out of focus
Amount Δ f determines the focal position of Laser Processing, including:
If Δ f=0, determine that the focal position of Laser Processing is positioned at the surface of the work that two-way laser designation light irradiates；
If Δ f ＞ 0, determine that the focal position of Laser Processing is positioned at above the surface of the work that two-way laser designation light irradiates at Δ f；
If Δ f ＜ 0, determine the focal position of Laser Processing be positioned at two-way laser designation light irradiate surface of the work below-Δ f
Place.
9. the focal position in a Laser Processing determines device, it is characterised in that be applied to swashing described in claim 1 or 2
Focal position in light processing determines that equipment, the focal position in described Laser Processing determine that device includes:
Laser designation optical generator control unit, in laser processing procedure, controls multi-path laser instruction optical generator and sends out
Go out multi-path laser instruction light and irradiate surface of the work；Described multi-path laser instruction luminous energy is overlapping in Laser Processing focal position；
CCD coaxial visual field monitor control unit, is used for controlling CCD coaxial visual field monitor monitoring multi-path laser instruction light in work
The overlapping cases information on part surface；
The focal position of Laser Processing determines unit, for being determined the focus position of Laser Processing by described overlapping cases information
Put.
Focal position in Laser Processing the most according to claim 9 determines device, it is characterised in that described multichannel swashs
In light instruction optical generator, every two-way laser designation optical generator is one group of laser designation optical generator, each group of laser designation light
The circle center that generator is formed relative to annular wall is axisymmetricly；Described laser designation optical generator control unit, specifically uses
In:
Control one group of laser designation optical generator and send two-way laser designation light irradiation surface of the work；Described two-way laser designation light
Can be overlapping in Laser Processing focal position.
Focal position in 11. Laser Processings according to claim 10 determines device, it is characterised in that described laser refers to
Show optical generator control unit, be additionally operable to:
When the two-way laser designation light that one group of laser designation optical generator sends is blocked and cannot irradiate surface of the work, control
The laser designation optical generator that the two-way laser designation light that is blocked is corresponding cuts out；
Control another group laser designation optical generator and send two-way laser designation light irradiation surface of the work.
Focal position in 12. Laser Processings according to claim 11 determines device, it is characterised in that described CCD is same
The overlapping cases information that axle visual field monitor control unit is monitored includes that two-way laser designation light irradiates the incidence of surface of the work
Spot diameter d when surface of the work is completely overlapped of angle [alpha], two-way laser designation light, two-way laser designation light are at surface of the work
Hot spot maximum dimension D time the most completely overlapped.
Focal position in 13. Laser Processings according to claim 12 determines device, it is characterised in that described laser adds
The focal position of work determines unit, specifically for:
According to formula:
Determine that two-way laser designation light irradiates the defocusing amount Δ f of surface of the work；Described defocusing amount Δ f is two-way laser designation illumination
The surface of the work penetrated and the distance laser machining focal position；
The focal position of Laser Processing is determined according to described defocusing amount Δ f.
Focal position in 14. Laser Processings according to claim 13 determines device, it is characterised in that described laser adds
The focal position of work determines unit, is specifically additionally operable to:
When Δ f=0, determine that the focal position of Laser Processing is positioned at the surface of the work that two-way laser designation light irradiates；
When Δ f ＞ 0, determine that the focal position of Laser Processing is positioned at Δ f above the surface of the work that two-way laser designation light irradiates
Place；
When Δ f ＜ 0, determine the focal position of Laser Processing be positioned at two-way laser designation light irradiate surface of the work below-Δ f
Place.
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| CN108274111A (en) * | 2017-12-29 | 2018-07-13 | 大族激光科技产业集团股份有限公司 | A kind of Calibration of Laser focus installations and its method |
| CN109014567A (en) * | 2018-08-09 | 2018-12-18 | 厦门盈趣科技股份有限公司 | A kind of cost laser optimal process height adjuster and method |
| CN110686596A (en) * | 2019-10-18 | 2020-01-14 | 扬州镭奔激光科技有限公司 | Automatic monitoring device and monitoring method for focal plane of laser shot blasting system |
| CN112536528A (en) * | 2019-09-20 | 2021-03-23 | 西刻标识设备（上海）有限公司 | Laser marking device |
| CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
| CN115931961A (en) * | 2023-01-06 | 2023-04-07 | 西南交通大学 | Method and device for testing melting point of zirconium alloy |
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| CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
| CN115931961A (en) * | 2023-01-06 | 2023-04-07 | 西南交通大学 | Method and device for testing melting point of zirconium alloy |
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