CN106169447A - A kind of integrated circuit package structure of suspension-type - Google Patents
A kind of integrated circuit package structure of suspension-type Download PDFInfo
- Publication number
- CN106169447A CN106169447A CN201610462578.8A CN201610462578A CN106169447A CN 106169447 A CN106169447 A CN 106169447A CN 201610462578 A CN201610462578 A CN 201610462578A CN 106169447 A CN106169447 A CN 106169447A
- Authority
- CN
- China
- Prior art keywords
- load bearing
- bearing seat
- chip
- slot
- limiting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
The invention discloses the integrated circuit package structure of a kind of suspension-type, the both sides of its weight tray are fixed with load bearing seat, and the side of load bearing seat forms concave station, are mounted with IC chip in concave station, forming heat radiation slotted eye and slot on load bearing seat, slot is plugged with limiting plate；Gathering sill is formed on the upper bottom surface of load bearing seat slot, shifting block is formed on the upper surface of limiting plate, shifting block is plugged in the gathering sill of load bearing seat, it is plugged with stage clip in the slot of load bearing seat, the two ends of stage clip press up against on baffle plate and limiting plate, baffle plate is fixed in the slot of load bearing seat, if the both sides of IC chip form dry contact, some conducting strips it are inlaid with in limiting plate, one end of conducting strip forms the contact of circular arc, contact is resisted against on the contact of IC chip, and the other end of conducting strip is electrically connected by wire and stitch.The encapsulating structure good heat dissipation effect of the present invention, encapsulating structure is simple and convenient simultaneously, it is achieved IC chip assembles with the quick of package assembling.
Description
Technical field:
The present invention relates to the technical field of integrated circuit, the integrated antenna package more specifically to a kind of suspension-type is tied
Structure.
Background technology:
Electronic industry constantly reduces the size of electronic component, and is continuing to increase function at electronic component so that integrated electricity
Function and the complexity on road constantly promote.And this trend also orders about the encapsulation technology of integrated circuit component towards small size, height
The direction of foot number and high electricity/thermal efficiency is developed, and meets predetermined industrial standard.Owing to high-effect integrated circuit component produces more
High heat, and existing compact package technology is the most hermetically sealed, its not only radiating effect poor, and install when encapsulating
Trouble, packaging efficiency is the highest.
Summary of the invention:
The purpose of the present invention is aiming at the deficiency of prior art, and provides the integrated antenna package knot of a kind of suspension-type
Structure, it is advantageously integrated the encapsulation of circuit, improves packaging efficiency, be advantageously integrated the heat radiation of circuit simultaneously.
For achieving the above object, the technical solution used in the present invention is as follows:
The integrated circuit package structure of a kind of suspension-type, including weight tray, the both sides of weight tray are fixed with two phases
To load bearing seat, load bearing seat closes on the side at weight tray center and forms concave station, is mounted with IC chip in concave station, collection
Become and form heat radiation slotted eye on the load bearing seat on the downside of circuit chip, the load bearing seat on the upside of IC chip forms slot,
Slot is plugged with limiting plate, and one end of limiting plate is stretched out the slot of load bearing seat and is positioned at the top of IC chip；Described carrying
Form, on the upper bottom surface of seat slot, the gathering sill running through load bearing seat upper surface, the upper surface of limiting plate forms shifting block, dial
Block is plugged in the gathering sill of load bearing seat, is plugged with stage clip in the slot of load bearing seat, the two ends of stage clip press up against baffle plate and
On limiting plate, baffle plate grafting is fixed in the slot of load bearing seat, if the both sides of IC chip form dry contact, limiting plate
Inside being inlaid with some conducting strips, one end of conducting strip forms the contact of circular arc, and contact is resisted against touching of IC chip
On point, the other end of conducting strip is resisted against conducting block, and conducting block is electrically connected by wire and stitch in being embedded in load bearing seat, stitch
It is fixed on the two side of weight tray.
The number of described IC chip upper contact is identical with the conducting strip number on limiting plate, conducting strip number and pin
Foot number is identical.
Described contact is the both sides that two row are evenly distributed on IC chip, and stitch is linearly evenly distributed on carrying
The both sides of base plate.
Shifting block on described limiting plate exposes the upper surface of load bearing seat.
The length of the gathering sill on described load bearing seat stretches out the length of load bearing seat slot more than limiting plate.
The beneficial effects of the present invention is: it uses open encapsulating structure to fix IC chip, then dispel the heat
Effective, encapsulating structure is simple and convenient simultaneously, can realize the quick assembling of IC chip and package assembling, improve and assemble effect
Rate.
Accompanying drawing illustrates:
Fig. 1 is the structural representation that invention is three-dimensional；
Fig. 2 is the structural representation that invention is overlooked；
Fig. 3 is the structural representation of invention section view.
In figure: 1, weight tray；2, load bearing seat；21, concave station；22, heat radiation slotted eye；23, slot；24, load bearing seat；3, collection
Become circuit chip；31, contact；4, limiting plate；41, shifting block；5, stage clip；6, baffle plate；7, conducting strip；71, contact；8, conducting block；
9, stitch.
Detailed description of the invention:
Embodiment: as shown in Fig. 1 is to 3, the integrated circuit package structure of a kind of suspension-type, including weight tray 1, carry the end
The both sides of plate 1 are fixed with two relative load bearing seats 2, and load bearing seat 2 closes on the side at weight tray 1 center and forms concave station 21,
It is mounted with IC chip 3 in concave station 21, the load bearing seat 2 on the downside of IC chip 3 forms heat radiation slotted eye 22, integrated
Forming slot 23 on load bearing seat 2 on the upside of circuit chip 3, slot 23 is plugged with limiting plate 4, and one end of limiting plate 4 is stretched out and held
The slot 23 carrying seat 2 is positioned at the top of IC chip 3；Form to run through on the upper bottom surface of described load bearing seat 2 slot 23 and hold
Carrying the gathering sill 24 of seat 2 upper surface, the upper surface of limiting plate 4 forms shifting block 41, shifting block 41 is plugged on the guiding of load bearing seat 2
In groove 24, being plugged with stage clip 5 in the slot 23 of load bearing seat 2, the two ends of stage clip 5 press up against on baffle plate 6 and limiting plate 4, gear
Plate 6 grafting is fixed in the slot 23 of load bearing seat 2, if the both sides of IC chip 3 form dry contact 31, in limiting plate 4
Being inlaid with some conducting strips 7, one end of conducting strip 7 forms the contact 71 of circular arc, and contact 71 is resisted against IC chip 3
Contact 31 on, the other end of conducting strip 7 is resisted against conducting block 8, in conducting block 8 is embedded in load bearing seat 2 and pass through wire and pin
Foot 9 electrically connects, and stitch 9 is fixed on the two side of weight tray 1.
The number of described IC chip 3 upper contact 31 is identical with conducting strip 7 number on limiting plate 4, conducting strip 7
Number is identical with stitch 9 number.
Described contact 31 is evenly distributed on the both sides of IC chip 3 in two row, and stitch 9 is linearly evenly distributed on
The both sides of weight tray 1.
Shifting block 41 on described limiting plate 4 exposes the upper surface of load bearing seat 2.
The length of the gathering sill 24 on described load bearing seat 2 stretches out the length of load bearing seat 2 slot 23 more than limiting plate 4.
Operation principle: the present invention is the encapsulating structure of integrated circuit, it uses Open architecture to fix ic core
Sheet 3, IC chip 3 suspension is positioned on load bearing seat 2, and offers heat radiation slotted eye 22 on load bearing seat 2, good heat dissipation effect,
It is advantageously integrated the encapsulation of circuit chip 3 simultaneously, during encapsulation, moves to, in load bearing seat 2, put into collection by limiting plate 4 by shifting block 41
Become circuit chip, then unclamp shifting block 41, then limiting plate 4 resets under the effect of stage clip 5 and limits IC chip 3,
And realizing the contact 31 that the conducting strip 7 on limiting plate 4 electrically connects on IC chip 3, it is achieved contact 31 is electrically connected with stitch 9
Connect.
Claims (5)
1. an integrated circuit package structure for suspension-type, including weight tray (1), it is characterised in that: the two of weight tray (1)
Side is fixed with two relative load bearing seats (2), and load bearing seat (2) closes on the side at weight tray (1) center and forms concave station (21),
It is mounted with IC chip (3) in concave station (21), the load bearing seat (2) of IC chip (3) downside forms radiating groove
Hole (22), the load bearing seat (2) of IC chip (3) upside forms slot (23), and slot (23) is plugged with limiting plate
(4), one end of limiting plate (4) is stretched out the slot (23) of load bearing seat (2) and is positioned at the top of IC chip (3)；Described carrying
The gathering sill (24) running through load bearing seat (2) upper surface, the upper end of limiting plate (4) is formed on the upper bottom surface of seat (2) slot (23)
Forming shifting block (41) on face, shifting block (41) is plugged in the gathering sill (24) of load bearing seat (2), the slot (23) of load bearing seat (2)
Inside being plugged with stage clip (5), the two ends of stage clip (5) press up against on baffle plate (6) and limiting plate (4), and baffle plate (6) grafting is fixed on
In the slot (23) of load bearing seat (2), IC chip (3) if both sides form dry contact (31), limiting plate is inlayed in (4)
Having some conducting strips (7), one end of conducting strip (7) to form the contact (71) of circular arc, contact (71) is resisted against integrated circuit
On the contact (31) of chip (3), the other end of conducting strip (7) is resisted against conducting block (8), and conducting block (8) is embedded in load bearing seat (2)
In electrically connected by wire and stitch (9), stitch (9) is fixed on the two side of weight tray (1).
The integrated circuit package structure of a kind of suspension-type the most according to claim 1, it is characterised in that: described integrated circuit
The number of chip (3) upper contact (31) is identical with conducting strip (7) number on limiting plate (4), conducting strip (7) number and stitch
(9) number is identical.
The integrated circuit package structure of a kind of suspension-type the most according to claim 1, it is characterised in that: described contact
(31) be evenly distributed on the both sides of IC chip (3) in two row, stitch (9) is linearly evenly distributed on weight tray (1)
Both sides.
The integrated circuit package structure of a kind of suspension-type the most according to claim 1, it is characterised in that: described limiting plate
(4) shifting block (41) on exposes the upper surface of load bearing seat (2).
The integrated circuit package structure of a kind of suspension-type the most according to claim 1, it is characterised in that: described load bearing seat
(2) length of the gathering sill (24) on stretches out the length of load bearing seat (2) slot (23) more than limiting plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462578.8A CN106169447B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of suspension-type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462578.8A CN106169447B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of suspension-type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106169447A true CN106169447A (en) | 2016-11-30 |
| CN106169447B CN106169447B (en) | 2018-10-26 |
Family
ID=58064597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610462578.8A Active CN106169447B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of suspension-type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106169447B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155494A (en) * | 2016-12-05 | 2018-06-12 | 德克萨斯仪器股份有限公司 | Integrated circuit (IC) chip pocket |
| CN110970377A (en) * | 2019-12-18 | 2020-04-07 | 冯聪 | Packaging device convenient for packaging integrated circuit chip |
| CN112951773A (en) * | 2021-01-28 | 2021-06-11 | 安阳师范学院 | Welding and sealing structure of high-power semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060023431A1 (en) * | 2003-09-05 | 2006-02-02 | Gerhard Wetzel | Control unit and method for producing the same |
| CN203951016U (en) * | 2014-07-17 | 2014-11-19 | 温岭资发半导体有限公司 | Thyristor socket |
| CN104362133A (en) * | 2014-10-16 | 2015-02-18 | 东莞市柏尔电子科技有限公司 | Triode fixing device |
| CN204257601U (en) * | 2014-11-26 | 2015-04-08 | 四川大雁微电子有限公司 | A kind of semiconductor die package magazine of anti-collapse silk |
| CN204760377U (en) * | 2015-08-10 | 2015-11-11 | 泉州宏讯电子有限公司 | Integrated circuit chip |
-
2016
- 2016-06-20 CN CN201610462578.8A patent/CN106169447B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060023431A1 (en) * | 2003-09-05 | 2006-02-02 | Gerhard Wetzel | Control unit and method for producing the same |
| CN203951016U (en) * | 2014-07-17 | 2014-11-19 | 温岭资发半导体有限公司 | Thyristor socket |
| CN104362133A (en) * | 2014-10-16 | 2015-02-18 | 东莞市柏尔电子科技有限公司 | Triode fixing device |
| CN204257601U (en) * | 2014-11-26 | 2015-04-08 | 四川大雁微电子有限公司 | A kind of semiconductor die package magazine of anti-collapse silk |
| CN204760377U (en) * | 2015-08-10 | 2015-11-11 | 泉州宏讯电子有限公司 | Integrated circuit chip |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155494A (en) * | 2016-12-05 | 2018-06-12 | 德克萨斯仪器股份有限公司 | Integrated circuit (IC) chip pocket |
| CN108155494B (en) * | 2016-12-05 | 2021-03-12 | 德克萨斯仪器股份有限公司 | Integrated Circuit (IC) chip socket |
| CN110970377A (en) * | 2019-12-18 | 2020-04-07 | 冯聪 | Packaging device convenient for packaging integrated circuit chip |
| CN112951773A (en) * | 2021-01-28 | 2021-06-11 | 安阳师范学院 | Welding and sealing structure of high-power semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106169447B (en) | 2018-10-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180914 Address after: 362000 Fujian province Quanzhou Huian Taiwan investment area, Houhai village Houhai Village intersection Applicant after: QUANZHOU HENGYANG SHOES MATERIAL Co.,Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201013 Address after: 277300 south side of Keda West Road, Yicheng Development Zone, Zaozhuang City, Shandong Province Patentee after: Shandong Hanxin Technology Co.,Ltd. Address before: 362000 Fujian province Quanzhou Huian Taiwan investment area, Houhai village Houhai Village intersection Patentee before: QUANZHOU HENGYANG SHOES MATERIAL Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Suspension type integrated circuit packaging structure Effective date of registration: 20220214 Granted publication date: 20181026 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2022980001543 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230201 Granted publication date: 20181026 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2022980001543 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A suspended integrated circuit packaging structure Effective date of registration: 20230213 Granted publication date: 20181026 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2023980032481 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20181026 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2023980032481 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |