CN106165552A - A kind of electronic module repair method - Google Patents
A kind of electronic module repair method Download PDFInfo
- Publication number
- CN106165552A CN106165552A CN201580001964.0A CN201580001964A CN106165552A CN 106165552 A CN106165552 A CN 106165552A CN 201580001964 A CN201580001964 A CN 201580001964A CN 106165552 A CN106165552 A CN 106165552A
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- CN
- China
- Prior art keywords
- electronic module
- bottom plate
- suction device
- repair method
- base plate
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The open a kind of electronic module repair method of the present invention, for reprocessing the electronic module broken down.Electronic module repair method comprises the following steps: connecting fixing to suction device and the second base plate, so that the scolding tin between described suction device and described second base plate is when melted, described suction device and described second base plate remain secured to one；Electronic module is carried out heat treated, makes the scolding tin between electronic module and the first base plate melt；Reprocess the surface that board draws the suction device of electronic module, electronic module is disassembled from the first base plate and is beneficial to reprocess or change electronic module.The electronic module repair method that the present invention provides, owing to suction device and second base plate of electronic module are fixing in a heated state, even if at high operating temperatures, solder joint between suction device and the second base plate occurs melted, the suction device of electronic module and the second base plate still can keep complete one, it is ensured that electronic module is completely removable.
Description
Field, more particularly to a kind of electronic module repair method are repaired the present invention relates to electronic module.
LGA (Land Grid Array, land grid array) module is a kind of common wireless communication electronicses module, realizes because of its low cost and easily the advantage of exploitation upgrading, is used in more and more on some functional module products.When LGA modules, which break down, needs dismounting to reprocess, then needing to heat LGA modules makes the solder joint between LGA modules and bottom plate in state is melted again, to dismantle LGA modules.But, some are large-sized, there is bigger difficulty always in the reprocessing for LGA modules particularly with radome, reason is, at high operating temperatures, the solder joint of radome is melted, and the solder joint pulling force under molten condition is not enough to support PCB (printed circuit board, the printed circuit board (PCB)) plates of LGA modules and the device on pcb board and separate radome and the pcb board of LGA modules.Therefore, in the state of high temperature, if using radome as the face of absorption, the pcb board for easilying lead to radome with LGA modules is separated, so as to can not disassemble the pcb board of LGA modules.
In the prior art, when LGA modules, which break down, needs repair and replacement, mainly by BGA (Land Grid Array, ball grid array) board to LGA modules heat, after the solder joint of LGA modules melts tin, by operator by being reprocessed by hand using tweezers gripping LGA modules, fully functional LGA modules are mounted after then clearing up again bottom plate.It is above-mentioned it is artificial using tweezers gripping LGA modules by the way of be primarily present following defect：
1st, BGA boards melt after tin to the heating of LGA modules, heat head lifting, and the solder joint of LGA modules becomes curdled appearance by molten condition rapidly.It is therefore desirable to which the LGA module tweezers that operator will generally be intended to reprocess within the time of more than ten seconds are gripped, the operating time is short, if Operator action is slightly slow or hesitates, dismounting can be caused to fail.
2nd, the gripping dynamics of operator also can not be controlled accurately, if dynamics is too big, easily cause LGA module deformed damageds, and secondary recovery utilization and accident analysis can not be carried out to the LGA modules disassembled, if dynamics is too small, can not be disassembled LGA modules.
If the 3, operator can not disassemble LGA modules within the defined time, must LGA modules described in Repeat-heating, veneer heats 2~3 times, and pad is easy for coming off, so as to cause the LGA module damages disassembled to be scrapped.
4th, such a manual mode of operation, it is easy to cause the generation of the industrial accidents such as scald, the safety of operator can not ensure.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of electronic module repair method, the automatic dismantling of electronic module can not only be realized, reduce and manually operate the secondary damage caused or scrap, and may also be ensured that in the state of tin is melted, whole electronic module is smoothly disassembled.
To achieve these goals, embodiment of the present invention provides following technical scheme.
In a first aspect, the invention provides a kind of electronic module repair method, the electronic module for reprocessing failure.The electronic module is welded on the first bottom plate, and including the second bottom plate and the suction device being welded on second bottom plate.The electronic module repair method comprises the following steps：The suction device is fixedly connected with second bottom plate, so that the scolding tin between the suction device and second bottom plate is in the state of melting, the suction device remains secured to one with second bottom plate；The electronic module is heated, melts the scolding tin between the electronic module and first bottom plate；And the surface that board draws the suction device of the electronic module is reprocessed, the electronic module is disassembled from first bottom plate, in favor of reprocessing or changing the electronic module.
Include with reference in a first aspect, in first aspect in the first possible implementation, the step of described " being fixedly connected with the suction device with second bottom plate "：The glue that is heating and curing is set between the suction device and second bottom plate.
It is described " to be drawn described with reference in a first aspect, in second of possible embodiment of first aspect
Device is fixedly connected with second bottom plate " the step of include：Multiple avoidance holes are set on first bottom plate；Set at the edge of the suction device on multiple pins, second bottom plate and multiple through holes communicated respectively with the multiple avoidance hole are set；The multiple pin is each passed through the multiple through hole；And by the multiple pin bending to clasp second bottom plate, and the dogleg section of the multiple pin is housed in the multiple avoidance hole respectively.
Include with reference in a first aspect, in first aspect in the third possible embodiment, the step of described " being fixedly connected with the suction device with second bottom plate ":Multiple escape groove are set on first bottom plate；And multiple buckles are each passed through the escape groove, one end of the multiple buckle is held in second bottom plate, the other end of the multiple buckle is held in the suction device, so that second bottom plate and the suction device are held between the two ends of the multiple buckle.
The third possible embodiment with reference to first aspect, in the 4th kind of possible embodiment of first aspect, the multiple buckle is U-shaped.
With reference in a first aspect, in the 5th kind of possible embodiment of first aspect, the electronic module repair method also includes：Clear up the pad of first bottom plate；And the complete electronic module of One function is welded on first bottom plate.
With reference to first aspect or combine the mode that the first mode that may implement of first aspect to the 5th kind of first aspect may be implemented any one, in the 6th kind of possible embodiment of first aspect, the electronic module is land grid array module.
With reference to first aspect or combine the mode that the first mode that may implement of first aspect to the 5th kind of first aspect may be implemented any one, in the 7th kind of possible embodiment of first aspect, the suction device is metallic shield.
With reference to first aspect or combine the mode that the first mode that may implement of first aspect to the 5th kind of first aspect may be implemented any one, in the 8th kind of possible embodiment of first aspect, board is reprocessed using ball grid array and draws the electronic module.
With reference to the 8th kind of possible embodiment of first aspect, in the 9th kind of possible embodiment of first aspect
In, the electronic module is land grid array module.
The electronic module repair method that the present invention is provided, when the electronic module being welded on first bottom plate, which breaks down, to be needed to reprocess, because the suction device and the second bottom plate of the electronic module are still to be fixed as one in a heated state, even if at high operating temperatures, scolding tin between suction device and the second bottom plate is melted, the suction device of the electronic module and the second bottom plate still can keep complete one, to ensure that the electronic module is completely removable.As can be seen here, the electronic module repair method that the present invention is provided, by using reprocessing board electronic module described in automatic dismantling at high operating temperatures, avoid artificial operation, not only realize the automatic dismantling of electronic module, it can also avoid, due to manually operating the secondary damage caused, improving the maintenance yield of electronic module, and largely avoided the generation of operator's industrial accident simultaneously.
Technical scheme in order to illustrate the embodiments of the present invention more clearly, the required accompanying drawing used in embodiment will be briefly described below, apparently, drawings in the following description are only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram that the electronic module that the first embodiment of the invention is provided reprocesses fixed structure；
Fig. 2 is the exploded perspective view that the electronic module that second of embodiment of the invention is provided reprocesses fixed structure；
Fig. 3 is the bottom schematic view that electronic module reprocesses fixed structure in Fig. 2；
Fig. 4 is the enlarged diagram of circle IV parts in Fig. 3；
Fig. 5 is the assembling schematic diagram that the electronic module that the third embodiment of the invention is provided reprocesses fixed structure；
Fig. 6 is the bottom schematic view that electronics reprocesses fixed structure in Fig. 5；
Fig. 7 is the schematic flow sheet for the electronic module repair method that the present invention is provided.
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is entered
Row is explicitly described.
Please with reference to Fig. 1 to Fig. 6, the electronic module that the specific embodiment of the invention is provided, which reprocesses fixed structure, includes the first bottom plate 200 and the electronic module 100 being welded on first bottom plate 200.The electronic module 100 includes the second bottom plate 10 and the suction device 20 being welded on second bottom plate 10.The bottom plate 10 of suction device 20 and second is in a heated state in the state being fixed as one.The scolding tin that heated condition is usually between scolding tin between the electronic stencil 100 and first bottom plate 200 and the bottom plate 10 of suction device 10 and second of the electronic module 100 in present embodiment is in molten state.The electronic module 100 is in rework process, even if the scolding tin between the bottom plate 10 of suction device 10 and second of electronic module 100 is in molten state, because the bottom plate 10 of suction device 20 and second is in a heated state in the state being fixed as one, the surface of the suction device 20 need to only be drawn by reprocessing board, it is possible to disassemble the whole electronic module 100 from first bottom plate 200.
In the present embodiment, optionally, the electronic module 100 can be LGA (Land Grid Array, land grid array) module, first bottom plate 200 and second bottom plate 10 can be PCB (Printed circuit board, printed circuit board (PCB)).Multiple electronic components (not shown) are mounted on first bottom plate 200 and second bottom plate 10.
In present embodiment, the suction device 20 can be metallic shield, and the metallic shield is used to cover the electronic component on the electronic module 100, to reach the purpose that electromagnetic shielding is realized to the electronic module 100.In other embodiments, the suction device 20 can also be for other other devices being welded on second bottom plate 10 with absorption face, other components such as radiating element.
In the present embodiment, the board of reprocessing can reprocess board for BGA (Ball Grid Array, ball grid array).
When the electronic module 100 being welded on first bottom plate 200, which breaks down, to be needed to reprocess, board is reprocessed to heat electronic module 100 with so that the scolding tin between the bottom plate 200 of electronic module 100 and first melts, so as to which the electronic module 100 is disassembled from first bottom plate 200.When electronic module 100 is heated, the scolding tin between the bottom plate 10 of suction device 20 and second of the electronic module 100
It can also be melted in the state of high temperature.But, because the bottom plate 10 of suction device 20 and second of the electronic module 100 is fixed in the state of heating, even if at high operating temperatures, scolding tin between the bottom plate 10 of suction device 20 and second is melted, the suction device 20 of the electronic module 100 still can keep fixed with the second bottom plate 10, intactly be disassembled with ensureing that the electronic module 100 can be reprocessed board.
Simultaneously, the present invention is by using reprocessing board electronic module 100 described in automatic dismantling in a heated state, avoid artificial operation, not only realize the automatic dismantling of electronic module 100, it can also avoid due to manually operating the secondary damage caused simultaneously, the maintenance yield of electronic module 100 is improved, and largely avoided the generation of operator's industrial accident.
Fig. 1 is refer to, in the first embodiment that the present invention is provided, provided with the glue 30 that is heating and curing between the suction device 20 and second bottom plate 10.The glue 30 that is heating and curing is the colloid of heating solidify afterwards, and when being heated to the glue 30 that is heating and curing and reaching the temperature of its freezing point, the glue 30 that is heating and curing then is directly changed solid by body of paste.In present embodiment, the glue 30 that is heating and curing is red glue, yellow glue etc..Glue 30 be heating and curing so that suction device 20 can be also firmly combined together with second bottom plate 10 in the state of heating.
The electronic module 100 is heated when reprocessing board, when making the solder joint melting between the electronic module 100 and first bottom plate 200, solder joint between the suction device 20 and second bottom plate 10 also melts, and now, the glue 30 that is heating and curing solidifies in a heated state makes the suction device 20 be fixed together with second bottom plate 10.When reprocessing board and drawing the surface of the suction device 20, because the suction device 20 and second bottom plate 10 are still fixed on one in the state of high temperature, reprocessing board can be so that whole electronic module 100 to be disassembled together.
Referring to Fig. 2, Fig. 3 and Fig. 4, in second of embodiment, first bottom plate 200 is provided with multiple avoidance holes 210, and second bottom plate 10 is provided with multiple through holes 11 communicated respectively with the avoidance hole 210, and the suction device 20 is provided with multiple pins 21.The multiple pin 21 is each passed through the multiple through hole 11 and bending, and the multiple pin 21 clasps second bottom plate 10, such as Fig. 4
It is shown.
Specifically, when the electronic module 100 is normally run, multiple pins 21 of the suction device 20 are each passed through the multiple through hole 11.When needing to reprocess the electronic module 100, the bent buckling residence of pin 21 that the suction device 20 stretches out first can gently be stated to the bottom of the second bottom plate 10 with tweezers so that the dogleg section of the multiple pin 21 is contained in the avoidance hole 210 respectively.It is of course also possible to which the bent buckling residence of multiple pins 21 that the suction device 20 stretches out to be stated to the bottom of the second bottom plate 10 by machine or other bending technique equipment., can also be before reprocessing, such as in an assembling process in other embodiment, the bending of multiple pins 21 that the suction device 20 is stretched out is so that the suction device 20 to be fixed with second bottom plate 10.
The electronic module 100 is heated when reprocessing board, when making the solder joint melting between the electronic module 100 and first bottom plate 200, the solder joint between the suction device 20 and second bottom plate 10 also melts.When reprocessing the surface of the board absorption suction device 20, the suction device 20 is set to be fixed together with second bottom plate 10 because multiple pins 21 of the suction device 20 clasp second bottom plate 10, the board of reprocessing can be so that whole electronic module 100 to be disassembled together.
In the present embodiment, the multiple avoidance hole 210 is NPTH (Non Planting Though Hole, non- heavy copper hole), the multiple size of avoidance hole 210 will reach the degree that can make the multiple free bending of pin 21 and directly clasp second bottom plate 10.
In present embodiment, each edge of the suction device 20 is provided with 3 pins 21, and accordingly, the quantity of avoidance hole 210 that first bottom plate 200 is set per one side is 3, and the quantity for the through hole 11 that second bottom plate 10 is set per one side is also 3.In other embodiments, each edge of the suction device 20 can also set the quantity of the pin 21, other quantity such as 2,4 according to the size of the suction device 20.
Referring to Fig. 5 and Fig. 6, in the third embodiment of the present invention, the electronic module, which reprocesses fixed structure, also includes multiple buckles 40, and first bottom plate 200 is provided with multiple escape groove 220.During installation, the multiple buckle 40 is each passed through in the escape groove 220, and the one of the multiple buckle 40
End is held in second bottom plate 10, and the other end of the multiple buckle 40 is held in the surface of the suction device 20 so that second bottom plate 10 and the suction device 20 are held between the two ends of the multiple buckle 40.
When needing to reprocess the electronic module 100, the suction device 20 is fixed together with second bottom plate 10 using buckle 40.The electronic module 100 is heated when reprocessing board, when making the solder joint melting between the electronic module 100 and first bottom plate 200, because the suction device 20 with second bottom plate 10 is fixed as one by buckle 40, when reprocessing the surface of the board absorption suction device 20, even if the solder joint between suction device 20 and second bottom plate 10 also melts, whole electronic module 100 can also together be disassembled.
Specifically, the quantity that escape groove 220 is set on every one side of first bottom plate 200 can be 3, correspondingly, the quantity of buckle 40 that every one side of first bottom plate 200 is used can also be 3.In other embodiments, the quantity of the escape groove 220, other quantity such as 2,4 can also be set according to the size of the electronic module 100.
Specifically, the buckle 40 is U-shaped, the optional buckle 40 is made up of elastic material.In other embodiments, can also according to actual Demand Design buckle 40 shape.
Present invention also offers a kind of electronic module repair method, the electronic module 100 for reprocessing failure.Fig. 7 is refer to, the electronic module repair method comprises the following steps.
In the step s 100, the suction device 20 of the electronic module 100 is fixedly connected with second bottom plate 10, so that the scolding tin between the suction device 20 and second bottom plate 10 is in the state of melting, the suction device 20 remains secured to one with second bottom plate 10.
In the first embodiment, step S100 is that the glue 30 that is heating and curing is put between the suction device 20 and second bottom plate 10.The glue 30 that is heating and curing is coated between the edge of the suction device 20 and second bottom plate 10, as shown in Figure 1.The electronic module 100 is heated when reprocessing board, when making the solder joint melting between the electronic module 100 and first bottom plate 200, the solder joint between the suction device 20 and second bottom plate 10 also melts, and now, the glue that is heating and curing
30 in a heated state solidification the suction device 20 is fixed together with second bottom plate 10.In the present embodiment, the glue 30 that is heating and curing is red glue.In other embodiments, the glue 30 that is heating and curing can also be yellow glue.
In second of embodiment, step S100 includes following four step, i.e. step 1 to step 4.
Step 1, multiple avoidance holes 210 are set on first bottom plate 200.In the present embodiment, the avoidance hole 210 is NPTH (Non Planting Though Hole, non-heavy copper hole), and the size of avoidance hole 210 will reach the degree that can make the free bending of pin 21 and directly clasp second bottom plate 10.
In step 2, set at the edge of the suction device 20 on multiple pins 21, second bottom plate 10 and multiple through holes 11 communicated respectively with the multiple avoidance hole 210 are set.
Step 3, the pin 21 is each passed through the through hole 11.
Step 4, by the multiple bending of pin 21 to clasp second bottom plate 10, and the dogleg section of the multiple pin 21 is housed in the avoidance hole 210 respectively, so that the suction device 20 is fixed on one with second bottom plate 10.In present embodiment, in the electronic module 100 for needing to reprocess failure, the bent buckling residence of pin 21 that the suction device 20 stretches out gently is stated to the bottom of the second bottom plate 10 using tweezers, naturally it is also possible to which the bent buckling residence of pin 21 that the suction device 20 stretches out is stated to the bottom of the second bottom plate 10 by machine or other bending technique equipment.In other embodiments, can also be before reprocessing, such as in an assembling process, the bending of pin 21 that the suction device 20 is stretched out is so that the suction device 20 to be fixed with second bottom plate 10.
In the third embodiment, step S100 includes following two steps, i.e. step 1 ' and step 2 '.
Step 1 ' in, multiple escape groove 220 are set on first bottom plate 200.
Step 2 ' in, multiple buckles 40 are passed through in the escape groove 220, one end of multiple buckles 40 is held in second bottom plate 10, and the other end of the buckle 40 is held in the suction device 20.Namely
Say, between the two ends that second bottom plate 10 and the suction device 20 are held on to the multiple buckle 40, the suction device 20 is fixed on one with second bottom plate 10.
In present embodiment, the multiple buckle 40 takes the shape of the letter U.
Fig. 7 is refer to, in step s 110, the electronic module 100 is heated, makes the melts soldering tin between the electronic module 100 and first bottom plate 200.Now, reprocess board and suitable nozzle and suction nozzle are selected according to the formula set, and the electronic module 100 is heated.Now, the scolding tin between the suction device 20 and second bottom plate 10 can also melt.
In the step s 120, the surface that board draws the suction device 20 of the electronic module 100 is reprocessed, the whole electronic module 100 is disassembled from first bottom plate 200 to reprocess or change the electronic module 100.Specifically, the suction nozzle for reprocessing board draws the surface of the suction device 20 of the electronic module 100 according to the formula set, together with being integrally fixed at second bottom plate 10 due to the suction device 20, therefore, even if the scolding tin between the suction device 20 and second bottom plate 10 is in molten state, the board of reprocessing still can intactly disassemble the electronic module 100.Maintenance personal can repair to the electronic module 100 of the failure disassembled, to reach the secondary purpose utilized.
As a further improvement on the present invention, in the present embodiment, the electronic module repair method that the present invention is provided also includes step S130 and step S140.
Specifically, in step s 130, the pad of first bottom plate 200 is cleared up, and conductive material is printed on first bottom plate 200.In present embodiment, the conductive material is tin cream.
In step S140, the complete electronic module 100 of One function is welded on first bottom plate 200, so as to reach the purpose for changing the electronic module 100 broken down.
Certainly, in other embodiments, it can also decide whether to reinstall fully functional electronic module 100 on the first bottom plate 200 according to actual demand, so as to omit step S130 and step S140.
As can be seen here, the electronic module repair method that provides of the present invention, by the suction device 20 with it is described
Second bottom plate 10 is still fixed on one in the state of tin is melted, and uses the surface for reprocessing board suction device 20 described in automatic sucking at high temperature smoothly to dismantle the purpose of whole electronic module 100 to reach.
Electronic module repair method that the present invention is provided using electronic module 100 described in board automatic dismantling is reprocessed, greatly reduce due to manually operate the operational error brought and cause it is low reprocess yield, reduce the quantity that electronic module 100 is scrapped.Meanwhile, without operating personnel's contact fault product at high temperature, greatly reduce due to the generation for the industrial injury event that high temperature is caused.
Described above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; some improvements and modifications can also be made, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
- A kind of electronic module repair method, electronic module for reprocessing failure, the electronic module is welded on the first bottom plate, and the electronic module includes the second bottom plate and the suction device being welded on second bottom plate, characterized in that, the electronic module repair method comprises the following steps：The suction device is fixedly connected with second bottom plate, so that the scolding tin between the suction device and second bottom plate is in the state of melting, the suction device remains secured to one with second bottom plate；The electronic module is heated, melts the scolding tin between the electronic module and first bottom plate；AndThe surface that board draws the suction device of the electronic module is reprocessed, the electronic module is disassembled from first bottom plate, in favor of reprocessing or changing the electronic module.
- Electronic module repair method as claimed in claim 1, it is characterised in that include the step of described " being fixedly connected with the suction device with second bottom plate "：The glue that is heating and curing is set between the suction device and second bottom plate.
- Electronic module repair method as claimed in claim 1, it is characterised in that include the step of described " being fixedly connected with the suction device with second bottom plate "：Set on first bottom plate and multiple through holes communicated respectively with the multiple avoidance hole are set on multiple avoidance holes, second bottom plate；At the edge of the suction device, multiple pins are set；The multiple pin is each passed through the multiple through hole；AndBy the multiple pin bending to clasp second bottom plate, and the dogleg section of the multiple pin is housed in the multiple avoidance hole respectively.
- Electronic module repair method as claimed in claim 1, it is characterised in that include the step of described " being fixedly connected with the suction device with second bottom plate ":Multiple escape groove are set on first bottom plate；AndMultiple buckles are each passed through the escape groove, one end of the multiple buckle is held in second bottom plate, the other end of the multiple buckle is held in the suction device, so that second bottom plate and the suction device are held between the two ends of the multiple buckle.
- Electronic module repair method as claimed in claim 4, it is characterised in that the multiple buckle is U-shaped.
- Electronic module repair method as claimed in claim 1, it is characterised in that also include：Clear up the pad of first bottom plate；AndThe complete electronic module of One function is welded on first bottom plate.
- Electronic module repair method as claimed in any one of claims 1 to 6, it is characterised in that the electronic module is land grid array module.
- Electronic module repair method as claimed in any one of claims 1 to 6, it is characterised in that the suction device is metallic shield.
- Electronic module repair method as claimed in any one of claims 1 to 6, it is characterised in that board is reprocessed using ball grid array and draws the electronic module.
- Electronic module repair method as claimed in claim 9, it is characterised in that the electronic module is land grid array module.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/071612 WO2016119118A1 (en) | 2015-01-27 | 2015-01-27 | Electronic module repairing method |
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| Publication Number | Publication Date |
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| CN106165552A true CN106165552A (en) | 2016-11-23 |
| CN106165552B CN106165552B (en) | 2019-08-20 |
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| CN201580001964.0A Active CN106165552B (en) | 2015-01-27 | 2015-01-27 | A kind of electronic module repair method |
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| CN (1) | CN106165552B (en) |
| WO (1) | WO2016119118A1 (en) |
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| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
| CN111299736A (en) * | 2020-03-18 | 2020-06-19 | 英特尔产品（成都）有限公司 | Method for repairing product with desoldering failure |
| CN115295691A (en) * | 2022-10-10 | 2022-11-04 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
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| CN113784540B (en) * | 2021-08-09 | 2023-05-12 | 温州理工学院 | Automatic overhaul fusion welding device |
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| CN111299736B (en) * | 2020-03-18 | 2021-09-28 | 英特尔产品（成都）有限公司 | Method for repairing product with desoldering failure |
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| Publication number | Publication date |
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| CN106165552B (en) | 2019-08-20 |
| WO2016119118A1 (en) | 2016-08-04 |
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