CN106165552B - A kind of electronic module repair method - Google Patents
A kind of electronic module repair method Download PDFInfo
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- CN106165552B CN106165552B CN201580001964.0A CN201580001964A CN106165552B CN 106165552 B CN106165552 B CN 106165552B CN 201580001964 A CN201580001964 A CN 201580001964A CN 106165552 B CN106165552 B CN 106165552B
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- electronic module
- bottom plate
- suction device
- repair method
- module
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a kind of electronic module repair method, for reprocessing the electronic module of failure.Electronic module repair method is the following steps are included: suction device is fixedly connected with the second bottom plate, to make the scolding tin between the suction device and second bottom plate in the state of melting, the suction device and second bottom plate are still secured to one；Electronic module is heated, the scolding tin between electronic module and the first bottom plate is melted；The surface that board draws the suction device of electronic module is reprocessed, electronic module is disassembled from the first bottom plate in favor of reprocessing or replacing electronic module.Electronic module repair method provided by the invention, since the suction device of electronic module and the second bottom plate are fixed in a heated state, even if at high operating temperatures, solder joint between suction device and the second bottom plate melts, the suction device of electronic module and the second bottom plate still can keep complete one, guarantee that electronic module is completely removable.
Description
Technical field
The present invention relates to electronic module maintenance field more particularly to a kind of electronic module repair methods.
Background technique
LGA (Land Grid Array, land grid array) module is a kind of common wireless communication electronics module, because
Its low cost and the advantage of exploitation upgrading easy to accomplish, are used in more and more on some functional module products.When LGA mould
When block failure needs disassembly to reprocess, then needing is in the solder joint between LGA module and bottom plate to the heating of LGA module melts shape again
State, to dismantle LGA module.But it is some large-sized, especially the LGA module with shielding case reprocess always exist compared with
Big difficulty, the reason is that, at high operating temperatures, the solder joint of shielding case melts, the solder joint pulling force under molten condition is insufficient
Make to shield in PCB (printed circuit board, the printed circuit board) plate of support LGA module and the device on pcb board
Cover is separated with the pcb board of LGA module.Therefore, in the state of high temperature, if being easily lead to using shielding case as absorption face
Shielding case is separated with the pcb board of LGA module, to can not disassemble the pcb board of LGA module.
In the prior art, when LGA module failure need replacing maintenance when, mainly by BGA (Ball Grid Array,
Ball grid array) board is to the heating of LGA module, after the solder joint of LGA module melts tin, by operator by by hand using tweezers clamping
LGA module is reprocessed, and fully functional LGA module is mounted after then clearing up again bottom plate.It is above-mentioned artificial using tweezers clamping
The mode of LGA module is primarily present following defect:
1, after BGA board melts tin to the heating of LGA module, heating head lifting, the solder joint of LGA module is become by molten condition rapidly
At curdled appearance.It is therefore desirable under the LGA module that operator will usually be intended to reprocess within more than ten seconds time is clamped with tweezers
Come, the operating time is short, if Operator action is slightly slow or hesitates, it will cause disassemblies to fail.
2, the clamping dynamics of operator is also unable to accurately control, if dynamics is too big, be easy to cause LGA module deformation damage
It is bad, secondary recovery utilization and accident analysis can not be carried out to the LGA module disassembled, it, can not be by LGA mould if dynamics is too small
Block disassembles.
If 3, operator can not before the deadline disassemble LGA module, LGA described in necessary Repeat-heating
Module, veneer heat 2~3 times, and pad is easy for falling off, and scraps so as to cause the LGA module damage disassembled.
4, such manual mode of operation, it is easy to cause the generation of the industrial accidents such as scald, the safety of operator can not protect
Card.
Summary of the invention
Technical problem to be solved by the present invention lies in a kind of electronic module repair method is provided, it is not only able to achieve electronic die
The automatic dismantling of block reduces secondary damage caused by manual operation or scraps, and may also be ensured that in the state of melting tin, whole
A electronic module is smoothly disassembled.
To achieve the goals above, embodiment of the present invention provides the following technical solutions.
In a first aspect, the present invention provides a kind of electronic module repair methods, for reprocessing the electronic module of failure.
The electronic module is welded on the first bottom plate, and including the second bottom plate and the suction device being welded on second bottom plate.
The electronic module repair method is the following steps are included: the suction device is fixedly connected with second bottom plate, to make
Scolding tin between the suction device and second bottom plate is in the state of melting, the suction device and second bottom plate
It is still secured to one；The electronic module is heated, the weldering between the electronic module and first bottom plate is made
Tin melts；And the surface that board draws the suction device of the electronic module is reprocessed, by the electronic module from first bottom
It is disassembled on plate, in favor of reprocessing or replacing the electronic module.
With reference to first aspect, in a first possible implementation of that first aspect, described " by the suction device and institute
The second bottom plate is stated to be fixedly connected " the step of include: between the suction device and second bottom plate setting be heating and curing glue.
With reference to first aspect, described " by the suction device and institute in second of first aspect possible embodiment
The second bottom plate is stated to be fixedly connected " the step of include: that multiple avoid holes are set on first bottom plate；In the suction device
Multiple pins are arranged in edge, and multiple through-holes communicated respectively with the multiple avoid holes are arranged on second bottom plate；It will be described
Multiple pins are each passed through the multiple through-hole；And by the multiple pin bending to clasp second bottom plate, and it is described more
The dogleg section of a pin is housed in respectively in the multiple avoid holes.
With reference to first aspect, described " by the suction device and institute in first aspect in the third possible embodiment
The second bottom plate is stated to be fixedly connected " the step of include: that multiple escape groove are set on first bottom plate；And multiple buckles are distinguished
Across the escape groove, one end of the multiple buckle is held in second bottom plate, and the other end of the multiple buckle supports
In the suction device, so that second bottom plate and the suction device be made to be held between the both ends of the multiple buckle.
The third possible embodiment with reference to first aspect, in the 4th kind of possible embodiment of first aspect, institute
It is U-shaped to state multiple buckles.
With reference to first aspect, in the 5th kind of possible embodiment of first aspect, the electronic module repair method is also
It include: the pad for clearing up first bottom plate；And a fully functional electronic module is welded on first bottom plate.
The first mode that may implement is real to the 5th kind of possibility of first aspect with reference to first aspect or with reference to first aspect
Any one for the mode applied, in the 6th kind of possible embodiment of first aspect, the electronic module is contact grid battle array
Column module.
The first mode that may implement is real to the 5th kind of possibility of first aspect with reference to first aspect or with reference to first aspect
Any one for the mode applied, in the 7th kind of possible embodiment of first aspect, the suction device is metallic shield.
The first mode that may implement is real to the 5th kind of possibility of first aspect with reference to first aspect or with reference to first aspect
Any one for the mode applied is reprocessed board using ball grid array and is drawn in the 8th kind of possible embodiment of first aspect
The electronic module.
8th kind of possible embodiment with reference to first aspect, in the 9th kind of possible embodiment of first aspect, institute
Stating electronic module is land grid array module.
Electronic module repair method provided by the invention, when the electronic module being welded on first bottom plate breaks down
When needing to reprocess, being in a heated state with the second bottom plate due to the suction device of the electronic module is still to be fixed as one
, even if at high operating temperatures, the scolding tin between suction device and the second bottom plate melts, the extractor of the electronic module
Part and the second bottom plate still can keep complete one, to guarantee that the electronic module is completely removable.It can be seen that
Electronic module repair method provided by the invention, by using reprocessing board electronic die described in automatic dismantling at high operating temperatures
Block, avoids manual operation, not only realizes the automatic dismantling of electronic module, while can also avoid causing due to manual operation
Secondary damage, improve the maintenance yield of electronic module, and largely avoided the generation of operator's industrial accident.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the schematic diagram that the electronic module that the first embodiment of the invention provides reprocesses fixed structure；
Fig. 2 is the perspective view of the explosion that the electronic module that second of embodiment of the invention provides reprocesses fixed structure；
Fig. 3 is the bottom schematic view that electronic module reprocesses fixed structure in Fig. 2；
Fig. 4 is the enlarged diagram of the circle part IV in Fig. 3；
Fig. 5 is the assembling schematic diagram that the electronic module that the third embodiment of the invention provides reprocesses fixed structure；
Fig. 6 is the bottom schematic view that electronics reprocesses fixed structure in Fig. 5；
Fig. 7 is the flow diagram of electronic module repair method provided by the invention.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Ground description.
Please with reference to Fig. 1 to Fig. 6, it includes that the electronic module that the specific embodiment of the invention provides, which reprocesses fixed structure,
One bottom plate 200 and the electronic module 100 being welded on first bottom plate 200.The electronic module 100 includes the second bottom plate 10
And it is welded on the suction device 20 on second bottom plate 10.The suction device 20 is in a heated state with the second bottom plate 10
The state being fixed as one.Heated condition is usually between the electronic stencil 100 and first bottom plate 200 in present embodiment
Scolding tin and the electronic module 100 suction device 10 and the second bottom plate 10 between scolding tin be in molten state.The electricity
Submodule 100 is in rework process, even if the scolding tin between the suction device 10 of electronic module 100 and the second bottom plate 10 is in molten
Change state reprocesses board only since the suction device 20 and the second bottom plate 10 are in the state being fixed as one in a heated state
The surface of the suction device 20 need to be drawn, so that it may by the entire electronic module 100 under first bottom plate 200 disassembly
Come.
In the present embodiment, optionally, the electronic module 100 can be LGA (Land Grid Array, contact grid
Lattice array) module, first bottom plate 200 and second bottom plate 10 can be PCB (Printed circuit board,
Printed circuit board).Multiple electronic components (not shown) is mounted on first bottom plate 200 and second bottom plate 10.
In present embodiment, the suction device 20 can be metallic shield, and the metallic shield is used for shelter
The electronic component on electronic module 100 is stated, is electromagnetically shielded with achieving the purpose that realize the electronic module 100.Other
Embodiment in, the suction device 20 or other there is being welded on second bottom plate 10 of absorption face
Other components such as other devices, such as radiating element.
In the present embodiment, the board of reprocessing can be BGA (Ball Grid Array, ball grid array) repairing machine
Platform.
When the electronic module 100 being welded on first bottom plate 200, which breaks down, to be needed to reprocess, board is reprocessed to electricity
Submodule 100 is heated so that the scolding tin between electronic module 100 and the first bottom plate 200 melts, so as to will be described
Electronic module 100 is disassembled from first bottom plate 200.When electronic module 100 is heated, the electronic module 100
Scolding tin between suction device 20 and the second bottom plate 10 can also melt in the state of high temperature.But due to the electronics
The suction device 20 of module 100 and the second bottom plate 10 are fixed in the state of heating, even if at high operating temperatures, extractor
Scolding tin between part 20 and the second bottom plate 10 melts, and the suction device 20 of the electronic module 100 and the second bottom plate 10 are still
It can so be kept fixed, completely be disassembled with guaranteeing that the electronic module 100 can be reprocessed board.
Meanwhile the present invention is avoided by using board electronic module 100 described in automatic dismantling in a heated state is reprocessed
Manual operation not only realizes the automatic dismantling of electronic module 100, while can also avoid secondary as caused by manual operation
Damage, improves the maintenance yield of electronic module 100, and largely avoided the generation of operator's industrial accident.
Fig. 1 is please referred to, in the first embodiment provided by the invention, the suction device 20 and second bottom plate
The glue 30 that is heating and curing is equipped between 10.The glue 30 that is heating and curing is cured colloid after heating, is heated simultaneously when to the glue 30 that is heating and curing
When reaching the temperature of its freezing point, the glue 30 that is heating and curing then directly becomes solid by body of paste.In present embodiment, the heating
Solidification glue 30 is red glue, yellow glue etc..The glue 30 that is heating and curing makes suction device 20 and second bottom plate 10 in the state of heating
Under can also be firmly combined together.
The electronic module 100 is heated when reprocessing board, makes the electronic module 100 and first bottom plate
When solder joint between 200 melts, the solder joint between the suction device 20 and second bottom plate 10 also melts, and this
When, the glue 30 that is heating and curing solidifies in a heated state makes the suction device 20 be fixed on one with second bottom plate 10
It rises.When reprocessing board and drawing the surface of the suction device 20, since the suction device 20 exists with second bottom plate 10
Still one is fixed in the state of high temperature, reprocessing board can disassemble together entire electronic module 100.
Referring to Fig. 2, Fig. 3 and Fig. 4, in the second embodiment, first bottom plate 200 is equipped with multiple keep away
Allow hole 210, second bottom plate 10 is equipped with multiple through-holes 11 communicated respectively with the avoid holes 210, the suction device
20 are equipped with multiple pins 21.The multiple pin 21 is each passed through the multiple through-hole 11 and bending, and the multiple pin 21 is detained
The second bottom plate 10 is stated in residence, as shown in Figure 4.
Specifically, when the electronic module 100 operates normally, multiple pins 21 of the suction device 20 are each passed through
The multiple through-hole 11.When needing to reprocess the electronic module 100, first gently the suction device 20 can be stretched with tweezers
The bottom of the second bottom plate 10 is stated in 21 bent buckling residence of pin out, so that the dogleg section of the multiple pin 21 is respectively accommodated in
In the avoid holes 210.It is of course also possible to the suction device 20 be stretched out by machine or other bending technique equipment more
State the bottom of the second bottom plate 10 in a 21 bent buckling residence of pin.It, can also be before reprocessing in other embodiment, such as assembling
In the process, 21 bending of the multiple pins suction device 20 stretched out is with by the suction device 20 and second bottom plate 10
It is fixed.
The electronic module 100 is heated when reprocessing board, makes the electronic module 100 and first bottom plate
When solder joint between 200 melts, the solder joint between the suction device 20 and second bottom plate 10 also melts.When reprocessing
When board draws the surface of the suction device 20, since multiple pins 21 of the suction device 20 clasp second bottom plate
10 make the suction device 20 be fixed together with second bottom plate 10, and the board of reprocessing can be by entire electronic module
100 disassemble together.
In the present embodiment, the multiple avoid holes 210 be NPTH (Non Planting Though Hole, it is non-heavy
Copper hole), the multiple 210 size of avoid holes, which will reach, can make the multiple 21 free bending of pin and directly clasp described
The degree of two bottom plates 10.
In present embodiment, each edge of the suction device 20 is equipped with 3 pins 21, correspondingly, described first
Every 210 quantity of avoid holes being arranged on one side of bottom plate 200 is 3, the quantity of the every through-hole 11 being arranged on one side of second bottom plate 10
It also is 3.In other embodiments, each edge of the suction device 20 can also be according to the suction device 20
The quantity of the pin 21, such as other quantity such as 2,4 are arranged in size.
Referring to Fig. 5 and Fig. 6, in the third embodiment of the invention, the electronic module reprocesses fixed knot
Structure further includes multiple buckles 40, and first bottom plate 200 is equipped with multiple escape groove 220.When installation, the multiple buckle 40
It is each passed through in the escape groove 220, one end of the multiple buckle 40 is held in second bottom plate 10, the multiple buckle
40 other end is held in the surface of the suction device 20, so that second bottom plate 10 is held on the suction device 20
Between the both ends of the multiple buckle 40.
When needing to reprocess the electronic module 100, by the suction device 20 with second bottom plate 10 using buckle
40 are fixed together.The electronic module 100 is heated when reprocessing board, makes the electronic module 100 and described first
When solder joint between bottom plate 200 melts, what it is due to the suction device 20 is fixed by buckle 40 with second bottom plate 10
Be integrated, when reprocessing board and drawing the surface of the suction device 20, even if suction device 20 and second bottom plate 10 it
Between solder joint also melt, entire electronic module 100 can also be disassembled together.
Specifically, the quantity in every setting escape groove 220 upper on one side of first bottom plate 200 can be 3, accordingly
Every 40 quantity of buckle used on one side on ground, first bottom plate 200 may be 3.In other embodiments, may be used
The quantity of the escape groove 220, such as other quantity such as 2,4 to be arranged according to the size of the electronic module 100.
Specifically, the buckle 40 is U-shaped, the optional buckle 40 is made of elastic material.In other embodiment
In, 40 shape can also be buckled according to actual Demand Design.
The present invention also provides a kind of electronic module repair methods, for reprocessing the electronic module 100 of failure.It please join
According to Fig. 7, the electronic module repair method includes the following steps.
In the step s 100, by the suction device 20 of the electronic module 100 and the fixed company of second bottom plate 10
It connects, thus make the scolding tin between the suction device 20 and second bottom plate 10 in the state of melting, the suction device
20 are still secured to one with second bottom plate 10.
In the first embodiment, step S100 is that point adds between the suction device 20 and second bottom plate 10
Heat-curable glue 30.The glue 30 that is heating and curing is coated between the edge and second bottom plate 10 of the suction device 20, such as
Shown in Fig. 1.The electronic module 100 is heated when reprocessing board, makes the electronic module 100 and first bottom plate
When solder joint between 200 melts, the solder joint between the suction device 20 and second bottom plate 10 also melts, and this
When, the glue 30 that is heating and curing solidifies in a heated state makes the suction device 20 be fixed on one with second bottom plate 10
It rises.In the present embodiment, the glue 30 that is heating and curing is red glue.In other embodiments, the glue 30 that is heating and curing
It can be yellow glue.
In the second embodiment, step S100 includes following four step, that is, step 1 to step 4.
Step 1, multiple avoid holes 210 are set on first bottom plate 200.In the present embodiment, the avoid holes
210 be NPTH (Non Planting Though Hole, non-heavy copper hole), and 210 size of avoid holes, which will reach, can make institute
It states 21 free bending of pin and directly clasps the degree of second bottom plate 10.
In step 2, multiple pins 21 are set at the edge of the suction device 20, are arranged on second bottom plate 10 multiple
The through-hole 11 communicated respectively with the multiple avoid holes 210.
Step 3, the pin 21 is each passed through the through-hole 11.
Step 4, by the multiple 21 bending of pin to clasp second bottom plate 10, and the bending of the multiple pin 21
Part is housed in respectively in the avoid holes 210, so that the suction device 20 be made to be fixed on one with second bottom plate 10.
In present embodiment, in the electronic module 100 for needing to reprocess failure, using tweezers gently by the suction device
State the bottom of the second bottom plate 10 in the 20 21 bent buckling residences of pin stretched out, naturally it is also possible to be set by machine or other bending techniques
The standby bottom that the 21 bent buckling residence of pin that the suction device 20 stretches out is stated to the second bottom plate 10.In other embodiments,
It can also be before reprocessing, such as in an assembling process, 21 bending of pin that the suction device 20 is stretched out is with by the absorption
Device 20 and second bottom plate 10 are fixed.
In the third embodiment, step S100 includes following two step, that is, step 1 ' and step 2 '.
Step 1 ' in, multiple escape groove 220 are set on first bottom plate 200.
Step 2 ' in, multiple buckles 40 are passed through in the escape groove 220, one end of multiple buckles 40 is held in described the
The other end of two bottom plates 10, the buckle 40 is held in the suction device 20.That is, by second bottom plate 10 and institute
It states suction device 20 to be held between the both ends of the multiple buckle 40, keeps the suction device 20 and second bottom plate 10 solid
Due to one.
In present embodiment, the multiple buckle 40 is in U-shape.
Fig. 7 is please referred to, in step s 110, the electronic module 100 is heated, the electronic module is made
Melts soldering tin between 100 and first bottom plate 200.At this point, reprocessing board according to the suitable spray of formula selection set
Mouth and suction nozzle, and the electronic module 100 is heated.At this point, the suction device 20 and second bottom plate 10
Between scolding tin can also melt.
In the step s 120, the surface that board draws the suction device 20 of the electronic module 100 is reprocessed, it will be entire
The electronic module 100 disassembles to reprocess or replace the electronic module 100 from first bottom plate 200.Tool
Body, the suction nozzle for reprocessing board draw the suction device 20 of the electronic module 100 according to the formula set
Surface, since the suction device 20 is fixed together with second bottom plate 10, even if the suction device 20
Scolding tin between second bottom plate 10 is in molten state, and the board of reprocessing still can be by the electronic module 100
Completely disassemble.Maintenance personal can repair the electronic module 100 of the failure disassembled, to reach
To the purpose of secondary use.
As a further improvement of the present invention, in the present embodiment, electronic module repair method provided by the invention is also
Including step S130 and step S140.
Specifically, in step s 130, the pad of first bottom plate 200 is cleared up, and is printed on first bottom plate 200
Brush conductive material.In present embodiment, the conductive material is tin cream.
In step S140, a fully functional electronic module 100 is welded on first bottom plate 200, thus
The electronic module 100 that replacement is broken down is achieved the purpose that.
Certainly, in other embodiments, can also be decided whether according to actual demand in the first bottom plate
Fully functional electronic module 100 is reinstalled on 200, to omit step S130 and step S140.
It can be seen that electronic module repair method provided by the invention, by the suction device 20 and second bottom plate
10 are still fixed on one in the state of melting tin, using the table for reprocessing board suction device 20 described in automatic sucking at high temperature
Face is to achieve the purpose that smoothly to dismantle entire electronic module 100.
Electronic module repair method provided by the invention is using electronic module 100 described in board automatic dismantling is reprocessed, significantly
Reduce as the operation error of manual operation bring and caused by it is low reprocess yield, reduce the number that electronic module 100 is scrapped
Amount.Meanwhile it being not necessarily to operator's contact fault product at high temperature, greatly reduce the hair of the industrial injury event as caused by high temperature
It is raw.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of electronic module repair method, for reprocessing the electronic module of failure, the electronic module is welded on first
On bottom plate, and the electronic module includes the second bottom plate and the suction device that is welded on second bottom plate, which is characterized in that
The electronic module repair method the following steps are included:
The suction device is fixedly connected with second bottom plate, to make between the suction device and second bottom plate
Scolding tin in the state of melting, the suction device and second bottom plate are still secured to one；
The electronic module is heated, the scolding tin between the electronic module and first bottom plate is melted；And
The surface that board draws the suction device of the electronic module is reprocessed, the electronic module is torn open from first bottom plate
It unloads down, in favor of reprocessing or replacing the electronic module.
2. electronic module repair method as described in claim 1, which is characterized in that it is described " by the suction device with it is described
Second bottom plate is fixedly connected " the step of include:
The glue that is heating and curing is set between the suction device and second bottom plate.
3. electronic module repair method as described in claim 1, which is characterized in that it is described " by the suction device with it is described
Second bottom plate is fixedly connected " the step of include:
Multiple avoid holes are set on first bottom plate, be arranged on second bottom plate it is multiple respectively with the multiple avoid holes
The through-hole communicated；
At the edge of the suction device, multiple pins are set；
The multiple pin is each passed through the multiple through-hole；And
By the multiple pin bending to clasp second bottom plate, and the dogleg section of the multiple pin is housed in institute respectively
It states in multiple avoid holes.
4. electronic module repair method as described in claim 1, which is characterized in that it is described " by the suction device with it is described
Second bottom plate is fixedly connected " the step of include:
Multiple escape groove are set on first bottom plate；And
Multiple buckles are each passed through the escape groove, one end of the multiple buckle is held in second bottom plate, described more
The other end of a buckle is held in the suction device, so that it is described more to be held on second bottom plate and the suction device
Between the both ends of a buckle.
5. electronic module repair method as claimed in claim 4, which is characterized in that the multiple buckle is U-shaped.
6. electronic module repair method as described in claim 1, which is characterized in that further include:
Clear up the pad of first bottom plate；And
One fully functional electronic module is welded on first bottom plate.
7. electronic module repair method as claimed in any one of claims 1 to 6, which is characterized in that the electronic module is to connect
Point grid array module.
8. electronic module repair method as claimed in any one of claims 1 to 6, which is characterized in that the suction device is gold
Belong to shielding case.
9. electronic module repair method as claimed in any one of claims 1 to 6, which is characterized in that reprocessed using ball grid array
Board draws the electronic module.
10. electronic module repair method as claimed in claim 9, which is characterized in that the electronic module is contact grid battle array
Column module.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/071612 WO2016119118A1 (en) | 2015-01-27 | 2015-01-27 | Electronic module repairing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106165552A CN106165552A (en) | 2016-11-23 |
| CN106165552B true CN106165552B (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580001964.0A Active CN106165552B (en) | 2015-01-27 | 2015-01-27 | A kind of electronic module repair method |
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| Country | Link |
|---|---|
| CN (1) | CN106165552B (en) |
| WO (1) | WO2016119118A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109317369B (en) * | 2018-11-23 | 2023-05-23 | 东莞市奥海科技股份有限公司 | Coating machine for coating red glue on circuit board and coating method thereof |
| CN111299736B (en) * | 2020-03-18 | 2021-09-28 | 英特尔产品（成都）有限公司 | Method for repairing product with desoldering failure |
| CN113784540B (en) * | 2021-08-09 | 2023-05-12 | 温州理工学院 | Automatic overhaul fusion welding device |
| CN115295691B (en) * | 2022-10-10 | 2022-12-23 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5748450A (en) * | 1995-10-19 | 1998-05-05 | Lg Semicon Co., Ltd. | BGA package using a dummy ball and a repairing method thereof |
| CN2521874Y (en) * | 2001-11-17 | 2002-11-20 | 莫列斯公司 | Datachable adsorption plate for power supply connector |
| CN1501433A (en) * | 2002-11-15 | 2004-06-02 | 华为技术有限公司 | Method for reprocessing power device |
| CN1750750A (en) * | 2004-09-15 | 2006-03-22 | 华为技术有限公司 | Method for realizing connection of other device by BGA package device pin repair |
| CN104080323A (en) * | 2013-03-28 | 2014-10-01 | 华为终端有限公司 | Shield frame and electronic equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201249314Y (en) * | 2008-08-18 | 2009-06-03 | 和硕联合科技股份有限公司 | Tool for disassembling chip stacking module |
| CN104227168A (en) * | 2014-08-23 | 2014-12-24 | 华东光电集成器件研究所 | Device for detaching circuit with pins on four sides |
-
2015
- 2015-01-27 CN CN201580001964.0A patent/CN106165552B/en active Active
- 2015-01-27 WO PCT/CN2015/071612 patent/WO2016119118A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5748450A (en) * | 1995-10-19 | 1998-05-05 | Lg Semicon Co., Ltd. | BGA package using a dummy ball and a repairing method thereof |
| CN2521874Y (en) * | 2001-11-17 | 2002-11-20 | 莫列斯公司 | Datachable adsorption plate for power supply connector |
| CN1501433A (en) * | 2002-11-15 | 2004-06-02 | 华为技术有限公司 | Method for reprocessing power device |
| CN1750750A (en) * | 2004-09-15 | 2006-03-22 | 华为技术有限公司 | Method for realizing connection of other device by BGA package device pin repair |
| CN104080323A (en) * | 2013-03-28 | 2014-10-01 | 华为终端有限公司 | Shield frame and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016119118A1 (en) | 2016-08-04 |
| CN106165552A (en) | 2016-11-23 |
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