CN106165062A - Process the plasma reactor of the waste gas that process apparatus occurs - Google Patents
Process the plasma reactor of the waste gas that process apparatus occurs Download PDFInfo
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- CN106165062A CN106165062A CN201480077933.9A CN201480077933A CN106165062A CN 106165062 A CN106165062 A CN 106165062A CN 201480077933 A CN201480077933 A CN 201480077933A CN 106165062 A CN106165062 A CN 106165062A
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- Prior art keywords
- conduit
- electrode portion
- plasma
- coolant
- thickness
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/10—Treatment of gases
- H05H2245/17—Exhaust gases
Abstract
The present invention relates to a kind of plasma reactor processing the waste gas that process apparatus occurs, it is configured between process chamber and vacuum pump and decomposes the waste gas discharged from process chamber, including: conduit, it is formed by electrolyte, flows for described waste gas；First electrode portion, it is arranged on described conduit, and covers with the inner space of described conduit；And the second electrode portion, it is separated by configuration with described first electrode portion, by causing plasma discharge to decompose described waste gas with described first electrode portion；Wherein, the thickness of the part that plasma discharge described in described conduit is concentrated, more than the thickness of peripheral part, prevents described conduit to be damaged because of described plasma discharge.
Description
Technical field
The present invention relates to process the plasma reactor of waste gas that process apparatus occurs, particularly relate to one and have point
Solve the waste gas that process chamber is discharged, prevent the structure that conduit is damaged because of plasma discharge, can carry out cold time overheated
But the plasma reactor processing the waste gas that process apparatus occurs.
Background technology
The processing procedure of quasiconductor, display device, solar cell etc. is suitable for and forms the processing procedure such as functional film, dry ecthing.These
Processing procedure is typically all and carries out in vacuum chamber, utilizes various metals, nonmetal presoma conduct when forming functional film
Process gas, dry ecthing uses multiple etching gas.
The element of the system discharging waste gas from process chamber include process chamber, vacuum pump and scrubber etc. and that
This is connected by exhaust line.Herein, different because of processing procedure from process chamber expellant gas, it may include gaseous molecular or mist state
Unreacted precursor (precursor), solidity crystal seed (seed crystal) etc., it is also possible to include as carrying the lazy of gas
Property gas.These waste gas flow into vacuum pump along exhaust line, condition of high temperature compressed exhaust gas more than 100 inside vacuum pump, because of
This waste gas is susceptible to phase transformation, and therefore vacuum pump is internal easily forms accumulation solid by-product, the corrosive gas containing F, Cl etc.
Corrosion vacuum pump initiating failure.
The problem causing vacuum pump failure for solving waste gas, has attempted increasing low pressure plasma dress in the front end of vacuum pump
Put and reconstitute whole gas extraction system with the form of main equipment-low-voltage plasma body device-vacuum pump-scrubber and achieve very
Good effect.Korean granted patent the 1065013rd discloses and causes electric discharge by applying AC driving voltage at conduit barrier
The plasma reactor technology of method waste gas decomposition.
But, its problem is that plasma reactor is internal there is plasma discharge, is decomposed by plasma discharge
Waste gas minuteness particle damage plasma reactor conduit, cause the lost of life of plasma reactor.Further, send out
In the case of raw plasma discharge, the band point particle generated by plasma discharge passes through the inner peripheral surface of electric field collision conduit
(ion bom bardment) causes conduit to damage.Especially, the conduit rate of decay of plasma discharge concentrated area is faster, it is therefore desirable to frequently
The conduit of numerous replacing plasma reactor, needs when the conduit only changing plasma reactor cannot solve problem to change
Whole plasma reactor, therefore has the problem increasing the weight of burden for users.
Summary of the invention
Technical problem
It is an object of the invention to provide a kind of waste gas with the discharge of dissolution process chamber, prevent conduit because of plasma
The structure discharged and be damaged, can carry out the plasma reaction processing the waste gas that process apparatus occurs cooled down time overheated
Device.
Technical scheme
The present invention provides a kind of plasma reactor processing the waste gas that process apparatus occurs, and it is configured at process chamber
And decompose the waste gas discharged from process chamber between vacuum pump, including: conduit, it is formed by electrolyte, for described waste gas stream
Dynamic；First electrode portion, it is arranged on described conduit, and covers with the inner space of described conduit；And the second electrode portion,
It is separated by configuration with described first electrode portion, by causing plasma discharge to decompose described waste gas with described first electrode portion；
Wherein, the thickness of the part that plasma discharge described in described conduit is concentrated more than the thickness of peripheral part, prevent described in lead
Described in Guan Yin, plasma discharge is damaged.
Technique effect
The plasma reactor of the present invention has the effect that
First, along with tending to plasma discharge concentrated area, the thickness of conduit is gradually increased from setting benchmark, to prevent
Plasma discharge and the minuteness particle produced by plasma discharge waste gas decomposition damage conduit, can prevent from passing through plasma
The charged particle that body electric discharge generates causes conduit to damage by electric field and ionic bombardment conduit such that it is able to improve plasma reaction
The life-span of device.
Second, conduit is formed by two layers, the most directly contacts the material that the layer corrosion resistance of plasma discharge is strong
Formed, therefore, it is possible to prevent conduit from damaging, extend the life-span of plasma reactor.
3rd, there is temperature sensor, it is possible to utilize the surface temperature of the surface temperature of temperature sensor sensing tube, housing
The temperature of degree or clearance space is to judge that conduit is the most overheated.
4th, there is temperature sensor and cooling unit, therefore inject coolant when conduit is in superheat state when judging
Psychrophore, it is possible to prevent from overheated causing conduit to damage.Therefore, it is possible to extend the longevity of the plasma reactor comprising conduit
Life.
5th, owing to arranging the insulation division around the first electrode portion, therefore, it is possible to utilize cooling water cooling conduit.Especially,
Insulation division can protect temperature sensor, therefore, it is possible to prevent cooling down water to cause temperature sensor misoperation or damage.Due to also
Arranging insulation division, therefore coolant is not limited to use gas, it is also possible to use other multiple coolant.
Accompanying drawing explanation
Fig. 1 shows the annexation of process chamber, vacuum chamber, scrubber and plasma reactor；
Fig. 2 is the sectional view showing plasma reactor according to an embodiment of the invention；
Fig. 3 is the sectional view showing plasma reactor according to another embodiment of the present invention；
Fig. 4 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Fig. 5 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Fig. 6 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Fig. 7 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Fig. 8 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Fig. 9 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 10 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 11 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 12 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 13 is the block diagram of the composition of the cooling unit of plasma reactor shown in display Fig. 7 to Figure 12；
Figure 14 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 15 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 16 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 17 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 18 is the sectional view showing the plasma reactor according to further embodiment of this invention；
Figure 19 is the sectional view showing the plasma reactor according to further embodiment of this invention.
Detailed description of the invention
Fig. 2 shows plasma reactor according to an embodiment of the invention.
Before illustrating the composition of plasma reactor according to an embodiment of the invention, described plasma
Reactor 100 is in order to decompose metal precursor, nonmetal predecessor and process gas, the cleaning including discharging from process chamber 10
(cleaning) by-product of gas is at interior waste gas, is arranged between described process chamber 10 and vacuum pump 30.Described processing procedure
Decomposed by described plasma reactor 100 when waste gas in chamber 10 is discharged by described vacuum pump 30, after purifying
Flow to described vacuum pump 30.But, described plasma reactor 100 not necessarily have to be arranged in described process chamber 10 with
Between described vacuum pump 30, such as, can be only fitted between described vacuum pump 30 and described scrubber 50, as shown in (b) in Fig. 1.
Multiple described plasma reactor 100 can be installed and repeatedly carry out decomposition and the purification process of described waste gas.Described processing procedure
Chamber 10, described plasma reactor 100, described vacuum pump 30 and described scrubber 50 are connected to each other by exhaust line.
Described process chamber 10 be internally formed vacuum environment for perform ashing (ashing), deposit, etch, lithographic,
The processing procedures such as cleaning and nitrification.The present embodiment is said as a example by forming thin film in described process chamber 10 or carrying out dry ecthing
Bright.
When unreacted metal precursor molecule is through being decomposed to form metallicity by-product or unreacted nonmetal character forerunner
Body molecule, in the case of being decomposed to form nonmetal character by-product, accumulates the inner surface in described vacuum pump 30 or described washing
The inner surface of device 50 causes many problems.Reactant gas induction make described unreacted metal precursor molecule or described not
Reaction nonmetal character precursor molecule formed after decomposing metal oxide microparticle or nonmetal oxide microgranule rather than
Form metallicity by-product or nonmetal character by-product.Further, it is possible to the unreacted process gas of F atom or Cl atom will be comprised
And unreacted cleaning gas decompose time generate and flow into described vacuum pump 30 time be formed at described vacuum pump 30 inner surface
Metal surface reaction causes F-or Cl-of activation of corrosion/etching to become to comprise HF, HCl, metallic atom F-0, metallic atom
The amorphous alloy form of Cl-0 or metallic atom F-Cl-0.
Seeing Fig. 2, plasma reactor 100 comprises conduit the 110, first electrode portion according to an embodiment of the invention
120, the second electrode portion 130 and housing 140.First, the described conduit 110 of described plasma reactor 100 is described waste gas
The path of flowing, such as, have the internal cylindrical shape through to length direction.Described conduit 110 is by comprising aluminium oxide, zirconium oxide
(ZrO2), yittrium oxide (Y2O3), sapphire, quartz ampoule, the high dielectric of glass tubing etc. formed.
Described first electrode portion 120 extrapolation is arranged at the outer peripheral face of described conduit 110 with the periphery around described conduit 110
Face, and be separated by with described second electrode portion 130, and cause plasma discharge between described second electrode portion 130.For
Being circumferentially positioned at the outer peripheral face of described conduit 110, described first electrode portion 120 is tube shape.So that with described second
Plasma discharge, described first electrode portion 120 can be occurred between electrode portion 130 to typically serve to the effect of drive electrode.Cause
This, described first electrode portion 120 is applied in exchange (AC) voltage.
Seeing Fig. 2, described first electrode portion 120 is the long structure of the length direction formation along described conduit 110, but does not limits
In this.Can to inserting the described buffer part (not shown) of tubular construction between described conduit 110 and described first electrode portion 120,
Described buffer part (not shown) is formed by the material or electrolyte with electric conductivity, and tool is resilient such that described conduit 110
With described first electrode portion 120 close attachment.
Seeing Fig. 2, described second electrode portion 130 connects into described conduit 110 in the one or both ends of described conduit 110
Connected state.As it has been described above, the effect of the drive electrode being applied in AC voltage is played in described first electrode portion 120, therefore, described
The effect of the ground electrode that can cause plasma discharge with described first electrode portion 120 is played in second electrode portion 130.Cause
This, described second electrode portion 130 is formed by metallic object.
Seeing Fig. 2, the cross section in described second electrode portion 130 the most gradually reduces, but is not limited to this, permissible
The cross section making the length direction in described second electrode portion 130 is uniform shapes.It is connected to lead according to described second electrode portion 130
The position of pipe 110, the second electrode portion 130, play waste gas inflow entrance 131, the effect of outlet port 132.
Described waste gas is flowed into by described waste gas inflow entrance 131 and is flowed to described conduit 110.Described conduit 110 interior
There is the described waste gas with predetermined pressure in portion.Herein, AC voltage is applied to the described first electrode portion 120 as drive electrode
Time, and as starting movement that electronics occurs between the described second electrode portion 130 of ground electrode, occur plasma discharge with
Waste gas decomposition.
Described housing 140 with the outer peripheral face of the described conduit 110 of protection and inserts in outward described conduit around described conduit 110
The described first electrode portion 120 of the outer peripheral face of 110.Interval sky is formed between described housing 140 and the periphery of described conduit 110
Between.
On the other hand, there is described conduit 110 because sending out between described first electrode portion 120 and described second electrode portion 130
Raw plasma discharge and the problem that may be damaged.Especially, the part corresponding to plasma discharge concentrated area A is sent out
Raw very macrolesion.Therefore, the thickness of described conduit 110 is arranged to the thickness of described plasma discharge concentrated area A by the present invention
Degree is more than the thickness of peripheral part.This structure is for preventing the charged particle generated by plasma discharge from passing through electric field and ionic
Bombard described conduit 100 and damage described conduit 110.
It is said that in general, plasma discharge concentrated area A is described first electrode portion 120 and described second electrode portion 130
Between.Seeing Fig. 2, the both end sides of conduit 110 described in the present embodiment is described first electrode portion 120 and the second electrode portion 130
Between, being therefore equivalent to plasma discharge concentrated area A, this part is damaged.
Therefore, the present embodiment is arranged on the length direction of described conduit 110 as in figure 2 it is shown, work as described first electrode portion 120
In the case of central authorities, the thickness of described conduit 110 tends to described from length direction central authorities along the length direction of described conduit 110
The both ends progressive additive of conduit 110, i.e. has the Magnification of zero more than (0).See accompanying drawing, the length side of described conduit 110
Thickness t2 to the thickness t1 progressive additive at center to described conduit 110 both ends.
At ground floor 111 that thickness that described conduit 110 includes length direction is identical and plasma discharge concentrated area A
Thickness more than the second layer 112 of peripheral thickness.Manufacture the described ground floor 111 of described conduit 110 and the described second layer respectively
The described second layer 112 is interpolated into after 112 described ground floor 111 again makes described ground floor 111 and the described second layer 112 form one
Body, but be not limited to this, actually also by lamination, spray or impregnate (dipping) and form the described second layer 112 and make described
One is formed for one layer 111 with the described second layer 112.It is situated between as in figure 2 it is shown, spray conductive materials or the electricity in described ground floor 111
Matter lamination imperceptibly is at the core of described ground floor 111, and the thickness of the core of the most described ground floor 111 is more than just
Beginning thickness, but it is not limited to this, the second layer 112 can be formed in the way of not increasing ground floor 111 thickness.In this situation, may be used
The second layer 112 is inserted in ground floor 111 after the second layer 112 at separately manufactured ground floor 111.
As it has been described above, described conduit 110 is made up of electrolyte, the electrolyte forming the described second layer 112 includes than formation
The high dielectric that the electrolyte corrosion resistance of described ground floor 11 is high.Especially, when described ground floor 111 is formed by aluminium oxide, can
Using sintered alumina and yittrium oxide mixed-powder as the material of the described second layer 112, or can add to alumina material
The strong yittrium oxide of anti-sputter is as the material of the described second layer 112.Such as can use silicon nitride (Si3N4) or yittrium oxide
(Y2O3).Its reason is that the described second layer 112 is direct by between described first electrode portion 120 and described second electrode portion 130
The impact of the plasma discharge occurred.Therefore, etched by plasma discharge to reduce, make the described second layer of formation 112
Material in containing the strong material of corrosion resistance.
Further, after the described second layer 112, the described second layer 112 is interpolated into manufacture described ground floor 111 respectively
Described ground floor 111 forms one, can form described ground floor 111 and the described second layer with the material containing elastic material respectively
112.In the case of described ground floor 111 is only made up of electrolyte with the described second layer 112, it may occur that even if by described
The second layer 112 is interpolated into described ground floor 111 and still fixes bad problem.Therefore, make respectively with the material containing elastic material
In the case of making described ground floor 111 and the described second layer 112, described ground floor 111 is the most flexible with the described second layer 112,
In the case of inserting in described ground floor 111 in the described second layer 112, the described second layer 112 is tightly fixed to described ground floor
111.Therefore, described ground floor 111 forms one with the described second layer 112 such that it is able to prevent the described second layer 112 from described
Ground floor 111 comes off, separates, but is not limited to this, in addition only can form described ground floor 111 and institute respectively with electrolyte
State the second layer 112, when the described second layer 112 being interpolated into described ground floor 111 at described ground floor 111 and the described second layer
Cushion (not shown) is set up between 112.
It addition, as in figure 2 it is shown, can make when forming the described second layer 112 corresponding to described plasma discharge concentration zones
The thickness of the part of the neighboring area of territory A increases to predetermined thickness.Its reason is described plasma discharge concentrated area A's
Neighboring area the impact of the most not subject plasma electric discharge, concentrate even if being therefore not increased to be equivalent to plasma discharge
The thickness of the neighboring area of region A, but be allowed to that there is predetermined thickness and can protect described ground floor 111.
Fig. 3 shows plasma reactor 100a according to another embodiment of the present invention.To the described plasma shown in Fig. 3
In reactor according 100a identical with the composition of the plasma reactor 100 of said one embodiment constitute add identical attached
Figure labelling also omits it and illustrates, and the composition different from an embodiment is only described.
Difference in this case is that the shape of described conduit 110 '.Seeing Fig. 3, described conduit 110 ' is from length direction
Center is along the length direction of described conduit 110 ' towards both ends until setting position has uniform shape, then from setting
Position has thicker uniform thickness to described conduit 110 ' both ends.That is, from the length direction of described conduit 110 ' centrally along
The length direction of described conduit 110 ' towards described conduit 110 ' both ends until setting position has uniform thickness t1 ',
From described setting position, the both ends to described conduit 110 ' have than described uniform thickness t2 ' thicker for thickness t1 '.Such as,
Described thickness t1 ' is 6mm to 10mm, described thickness t2 ' 1mm to 2mm thicker than described t1 '.
Described plasma reactor 100b shown in Fig. 4 is the deformation form of embodiment as shown in Figure 3.See Fig. 4, root
According to the present embodiment, about the thickness of described conduit 110, because being formed with described the in the part that described first electrode portion 120 covers
Two layer 112 and the part that thickens are as thin as being equivalent to from described conduit to the thickness of part b in adjacent described second electrode portion 130
The thickness t1 ' of length direction center to setting position 110 ".Its reason is as it has been described above, described plasma discharge concentrates generation
In neighbouring described first electrode portion 120 and part A in described second electrode portion 130, but described first electrode portion 120 and the second electricity
Plasma discharge concentration degree between pole portion 13 is relatively low.Therefore, the thickness corresponding to the described conduit 110 of this part b is thin
To the thickness t1 ' from length direction center to the setting position of described conduit 110.
Fig. 5 shows the plasma reactor 100c according to further embodiment of this invention.Seeing Fig. 5, the present embodiment is different
Described second electrode portion 130a it is in place of Fig. 2 to embodiment illustrated in fig. 4.In the present embodiment, described second electrode portion 130a
Being a tube shape as described first electrode portion 120, extrapolation is arranged at the outer peripheral face of described conduit 110a.Herein, described
Two electrode portion 130a are provided in and described first electrode portion 120 is separated by the position setting interval.That is, described first electrode portion
120 and described second electrode portion 130a are separated by setting interval on the basis of the length direction center of described conduit 110a.
To embodiment illustrated in fig. 4, Fig. 2 illustrates that described first electrode portion is the drive electrode being applied in AC voltage, described
Two electrode portions are the ground electrodes that can cause plasma discharge between described first electrode portion, but are not limited to this.Root
According to the present embodiment, described first electrode portion 120 and described second electrode portion 130a are all applied in AC voltage, but to described first electricity
Pole portion 120 and any one applying in described second electrode portion 130a align mutually (+) voltage, to another apply relatively negative (-)
Voltage, causes plasma discharge by forming voltage difference between two electrode portions.
In the present embodiment, described conduit 110a is that described thickness becomes on the basis of the length direction center of described conduit 110a
To the shape that the both ends of described conduit 110a are the most thinning.In the present embodiment, described first electrode portion 120 and described second electricity
Pole portion 130a is separated by the basis of the length direction of described conduit 110a, the most described first electrode portion 120 and described the
Plasma discharge concentrated area A is become between two electrode portion 130a.Therefore, would correspond to the length direction of described conduit 110a
The position thickness at center is the thickest, even if therefore plasma discharge concentrates on this damage that the most still can minimize described conduit 110a.
Described plasma reactor 100d shown in Fig. 6 is the deformation form of embodiment illustrated in fig. 5.In the present embodiment,
The thickness at the length direction center of conduit 110b described in described conduit 110b is thick, this and the described conduit 110a phase shown in Fig. 5
Seemingly, but according to the present embodiment, until towards the two of described conduit 110b on the basis of the length direction center of described conduit 110b
The thickness of the setting position of end, for thickening thickness t4 ', from described setting position to the thickness at described conduit 110b both ends is
Thickness thinning t3 '.
Fig. 7 shows the plasma reactor 200 according to further embodiment of this invention.Fig. 7 the described grade shown in Fig. 1 from
Temperature sensor 157 and cooling unit is also included on the basis of daughter reactor 100.Described temperature sensor 157 is arranged at institute
State the inside of housing 140.Specifically, the inner peripheral surface of the outer peripheral face or described housing 140 that are attached to described conduit 110 senses institute
State the interval between the surface temperature of conduit 110, the surface temperature of described housing 140 or described conduit 110 and described housing 140
The temperature in space.As it has been described above, described temperature sensor 157 sense described conduit 110 or the surface temperature of described housing 140 or
Temperature information is also sent to following cooling unit by the temperature of described clearance space.In order to use described plasma more safely
Reactor according 200, senses the surface temperature of described conduit 110 than sensing the surface temperature of described housing 140 more added with gathering effect.This
Embodiment illustrates as a example by the surface temperature sensing described conduit 110.
The purpose arranging described cooling unit is to prevent the plasma discharge decomposition by described conduit 110 described
Produce during waste gas is thermally-induced overheated.The heat that its reason produces during being to decompose described waste gas is led described in being directly delivered to
Pipe 110.Because being delivered to the heat of described housing 140 from described conduit 110, it is thus possible to be difficult to use in described in correct judgement and lead
Pipe 110 is the most overheated.Therefore, the surface ratio described temperature sensor 157 being arranged on described conduit 110 is arranged on described housing
Effect is more gathered on the surface of 140, in the case of sensing the described surface temperature of housing 140 or the temperature information of clearance space, excellent
Choosing be using as the design temperature judging whether overheated benchmark be set as than sense described conduit 110 surface temperature information time
Low.
As it has been described above, the effect of described cooling unit is when the surface temperature of described conduit 110 is more than design temperature
Inject coolant to cool down described conduit 110.Described cooling unit includes control portion (not shown), coolant injection valve 151 and coolant
Withdrawer 153.Described control portion (not shown) judges that described conduit 110 is the most overheated and cools down described conduit 110 by coolant,
But it is not limited to this, in addition can pass through rung alarm or locked (lock) to stop described plasma discharge.Described control
Portion processed (not shown) receives the surface temperature information of described conduit 110 from described temperature sensor 157.As it has been described above, described temperature
Degree sensor 157 is arranged on the surface temperature information of the outer peripheral face described conduit 110 of sensing of described conduit 110, and will sense
The surface temperature information of described conduit 110 be sent to described control portion (not shown).Due in described control portion (not shown)
Storage has predetermined temperature, and the surface temperature of the described conduit 110 therefore received from described temperature sensor 157 is in advance
Judge that described conduit 110 is overheated time more than the temperature set.
More particularly, the (not shown) storage of described control portion has the first design temperature and the second design temperature.Described
The fiducial temperature that one design temperature is the most overheated as judging described conduit 110, is for preventing described conduit 110 from damaging
High-temperature.Described control portion (not shown) is when the surface temperature information of described conduit 110 is more than described first design temperature
Judge that described conduit 110 as superheat state and cools down.Described second design temperature is as having judged described conduit 110 the most
The fiducial temperature of cooling.The temperature value of described second design temperature can be with described first design temperature identical or less than described
One design temperature.In the case of described second design temperature and described first design temperature are identical setting value, its effect is
The time cooling down described conduit 110 shortens, and described second design temperature is the feelings of the setting value less than described first design temperature
Under condition, the longer working time of described cooling unit.
When described control portion (not shown) judges that described conduit 110 is overheated, by described coolant injection valve 151 to institute
The clearance space stating housing 140 injects coolant.Described coolant includes cold media gas or cooling water.The storage storing described coolant is held
Device (not shown) and described coolant injection valve 151 interconnect, if described control portion (not shown) judges described conduit 110 mistake
Heat, then inject coolant by described coolant injection valve 151 to the clearance space of described housing 140.It addition, described housing 140 shape
Become to have the coolant hand-hole 133 for connecting into connected state with described coolant injection valve 151.Generally, described housing 140 and institute
State coolant injection valve 151 and connect into connected state by described coolant hand-hole 133.
Position relative with described coolant hand-hole 133 in described housing 140 is also formed with coolant tap 134, described
Coolant tap 134 and described refrigerant recovering device 153 connect into connected state.Injected described by described coolant hand-hole 133
The coolant of the clearance space of housing 140 flows at the clearance space of described housing 140 to cool down described conduit 110, then passes through
Described coolant tap 134 is expelled to described refrigerant recovering device 153.Described refrigerant recovering device 153 such as by storagetank 153a and
Heat exchanger 153b is constituted.The described coolant being expelled to described refrigerant recovering device 153 is stored in described storagetank 153a, by institute
State heat exchanger 153b cooling.Or, store again to described storagetank after described heat exchanger 153b cooling can be first passed through
In 153a.Described conduit 110, Ke Yitong is cooled down in order to reuse the described coolant being stored in described refrigerant recovering device 153
Cross described coolant injection valve 151 to inject to the described clearance space of described housing 140.It is explained above described refrigerant recovering device
153 are made up of storagetank 153a and heat exchanger 153b, but are not limited to this, in addition can also be with the morphosis of pipeline.
It is explained above and recycles and reuses described coolant but it also may do not reuse described coolant, but arrange from described storagetank
Go out discarded.Herein, it is as the situation of described coolant using air, outside can being expelled to fan (fan) when discharging described coolant
Portion.
Generally, described plasma reactor 200 is once running the most ceaselessly continuous firing, it is thus possible to can be because dividing
Solve the heat of high temperature produced during described waste gas and impaired.Especially, directly by decomposing described waste gas the heat occurred time
Described conduit 110 is most possible because of overheated and impaired.And as described in one embodiment of the present of invention is arranged the situation of cooling unit
Under, the institute that the cooling of described cold media gas is overheated is injected when the surface temperature of described conduit 110 reaches to preset more than temperature
State conduit 110, therefore, it is possible to prevent described conduit 110 from damaging, extend the life-span.
It addition, also include described insulation division 125 in the case of described coolant is for cooling water.Its reason is described first
Electrode portion 120 extrapolation is arranged at described conduit 110 outer peripheral face and plays the effect of drive electrode, therefore injects to described clearance space
In the case of described cooling water, the described first electrode portion 120 directly contacting described cooling water may be impaired, and may
Be short-circuited (short) problem.That is, described insulation division 125 protects described first electrode portion 120.Described insulation division 125 is by insulating
Body or electrolyte are formed, and have tube shape for extrapolation is arranged at the outer peripheral face of described conduit 110.Further, due to described insulation
Portion 125 also around described temperature sensor 157, therefore protect described first electrode portion 120 and described temperature sensor 157 in order to avoid
By described cooling Water Damage.
Plasma reactor 200a shown in Fig. 8 is that the plasma reactor 100a shown in Fig. 3 also includes described temperature
Degree sensor 157 and the embodiment of described cooling unit.Plasma reactor 200b shown in Fig. 9 be the grade shown in Fig. 4 from
Daughter reactor 100b also includes described temperature sensor 157 and the embodiment of described cooling unit.Plasma shown in Figure 10
Reactor according 300 is that the plasma reactor 100c shown in Fig. 5 also includes described temperature sensor 157 and described cooling unit
Embodiment.Plasma reactor 300a shown in Figure 11 is that the plasma reactor 100d shown in Fig. 6 also includes described
Temperature sensor 157 and the embodiment of described cooling unit.
Figure 12 to Figure 14 display is according to the plasma reactor 400 of further embodiment of this invention.According to the present invention one
The plasma reactor 400 of embodiment includes that the 220, second electrode portion 230 of conduit the 210, first electrode portion, buffer part (are not shown
Go out), housing 240, temperature sensor 250 and cooling unit 260.First, the described conduit of described plasma reactor 200
210 is the flow path of described waste gas flowing, has the most through internal cylindrical shape.Described conduit 210 is by aoxidizing
Aluminum, zirconium oxide (ZrO2), yittrium oxide (Y2O3), sapphire, quartz ampoule, the high dielectric such as glass tubing formed.Especially, sintering oxidation
Aluminum and yittrium oxide mixed-powder use or have what the strong yittrium oxide etc. of anti-sputter was coated to alumina material thermal spraying
In the case of elching resistant rise.
Described first electrode portion 220 extrapolation is arranged on described conduit 210 around its outer peripheral face, with following described second
Electrode portion 230 is separated by, and causes plasma discharge between described second electrode portion 230.For described around being arranged at
The outer peripheral face of conduit 210, described first electrode portion 220 is tube shape.Owing to drive electrode is played in described first electrode portion 220
Effect, so being applied in AC voltage.Seeing Figure 12, described first electrode portion 220 is the length direction formation along described conduit 210
Long structure, but be not limited to this.In order to apply voltage by the different cycles, multiple described first electrode portion 220 can be set.Institute
State the buffer part (not shown) being inserted with tubular construction between conduit 210 and described first electrode portion 220.Described buffer part is by having
The material of electric conductivity is formed, and has elastic so that described conduit 210 can closely connect with described first electrode portion 220
Touch.
Described second electrode portion 230 connects into connected state in the one or both ends portion of described conduit 210 with described conduit 210
State.The work of the ground electrode causing plasma discharge between described first electrode portion 220 is played in described second electrode portion 230
With.Therefore, described second electrode portion 230 is formed by metallic object.The described waste gas discharged from described process chamber 10 passes through each institute
Any one of second electrode portion in the second electrode portion 230 that states flows into and flows in described conduit 210, then from another
Described second electrode portion 230 discharges.The most as shown in figure 12, any one of second electricity in each described second electrode portion 230
Pole portion 230 is formed with waste gas inflow entrance 201, and another described second electrode portion 230 is formed with outlet port 203.Accompanying drawing shows
Show that the cross section in described second electrode portion 230 is alongst gradually reduced, but be not limited to this, in addition can also make
Described second electrode portion 230 alongst has uniform cross section.
Described waste gas is flowed into by described waste gas inflow entrance 201 and is flowed to described conduit 210, and described conduit 210 is internal
There is the waste gas with predetermined pressure.Herein, the situation of AC voltage is applied to the described first electrode portion 220 as drive electrode
Under, and as starting movement that electronics occurs between the described second electrode portion 230 of ground electrode, occur plasma discharge with
Waste gas decomposition.
Described housing 240 with the outer peripheral face of the described conduit 210 of protection and is formed at described conduit around described conduit 210
The described first electrode portion 220 of the outer peripheral face of 210.Interval sky is formed between described housing 240 and the outer peripheral face of described conduit 210
Between.Described housing is typically formed by metal.
Described temperature sensor 250 is arranged on the inside of described housing 240.Specifically, it is attached to described conduit 210
Outer peripheral face or described housing 240 inner peripheral surface sensing the surface temperature of described conduit 210, the surface temperature of described housing 240 or
The temperature of the clearance space between described conduit 210 and described housing 240.As it has been described above, described temperature sensor 250 senses institute
State conduit 210 or the surface temperature of described housing 240, the temperature of described clearance space and temperature information is sent to following cooling
Unit 260.In order to use described plasma reactor 400 more safely, sense the surface temperature of described conduit 210 than sense
Survey the surface temperature of described housing 240 and more gather effect.The present embodiment is said as a example by the surface temperature sensing described conduit 210
Bright.
The plasma discharge that the purpose of described cooling unit 260 is to prevent in described conduit 110 is set and decomposes described
Produce during waste gas is thermally-induced overheated.The heat that its reason produces during being to decompose described waste gas is led described in being directly delivered to
Pipe 210.Because being delivered to the heat of described housing 240 from described conduit 210, it is thus possible to be difficult to use in described in correct judgement and lead
Pipe 210 is the most overheated.Therefore, the surface ratio described temperature sensor 250 being arranged on described conduit 210 is arranged on described housing
Effect is more gathered on the surface of 240, in the case of sensing the described surface temperature of housing 240 or the temperature information of clearance space, excellent
Choosing be using as the design temperature judging whether overheated benchmark be set as than sense described conduit 210 surface temperature information time
Low.
As it has been described above, the effect of described cooling unit 260 is when the surface temperature of described conduit 210 is more than design temperature
Time inject coolant to cool down described conduit 210.Seeing Figure 13, described cooling unit 260 includes control portion 261, coolant injection valve
263 and refrigerant recovering device 264.Described control portion 261 judges that described conduit 210 is the most overheated and cools down described conduit by coolant
110, but it is not limited to this, in addition can pass through rung alarm or locked (lock) to stop described plasma discharge.Institute
State control portion 261 and receive the surface temperature information of described conduit 210 from described temperature sensor 250.As it has been described above, described temperature
Sensor 250 is arranged on the outer peripheral face of described conduit 210 and senses the surface temperature information of described conduit 210, and will sense
The surface temperature information of described conduit 210 is sent to described control portion 261.Set in advance owing to described control portion 261 storing to have
Fixed temperature, the surface temperature of described conduit 210 therefore received from described temperature sensor 250 be predetermined temperature with
Judged time upper that described conduit 210 was overheated.
More particularly, the storage of described control portion 261 has the first design temperature and the second design temperature.Described first sets
The fiducial temperature that temperature is the most overheated as judging described conduit 210, is the highest temperature for preventing described conduit 210 from damaging
Degree.Described control portion 261 leads described in judging when the surface temperature information of described conduit 210 is more than described first design temperature
Pipe 210 is for superheat state and cools down.Described second design temperature is as the benchmark judging that described conduit 210 has cooled down the most
Temperature.The temperature value of described second design temperature can set temperature with described first design temperature identical or less than described first
Degree.In the case of described second design temperature and described first design temperature are identical setting value, its effect is that cooling is described
The time of conduit 210 shortens, in the case of described second design temperature is the setting value less than described first design temperature, described
The longer working time of cooling unit 260.
When described control portion 261 judges that described conduit 210 is overheated, by described coolant injection valve 263 to described shell
The clearance space of body 240 injects coolant.Described coolant includes cold media gas or cooling water.Store the hold-up vessel of described coolant
(not shown) and described coolant injection valve 263 interconnect, if described control portion 261 judges that described conduit 210 is overheated, then lead to
Cross described coolant injection valve 263 and inject coolant to the clearance space of described housing 240.It addition, described housing 240 is formed and institute
State coolant injection valve 263 and connect into the coolant hand-hole 241 of connected state.Generally, described housing 240 and described coolant injection valve
263 connect into connected state by described coolant hand-hole 241.
Position relative with described coolant hand-hole 241 in described housing 240 is also formed with coolant tap 245, described
Coolant tap 245 and described refrigerant recovering device 264 connect into connected state.Injected described by described coolant hand-hole 241
The coolant of the clearance space of housing 240 flows at the clearance space of described housing 240 to cool down described conduit 210, then passes through
Described coolant tap 245 is expelled to described refrigerant recovering device 264.Described refrigerant recovering device 264 such as by storagetank 264a and
Heat exchanger 264b is constituted.The described coolant being expelled to described refrigerant recovering device 264 is stored in described storagetank 264a, by institute
State heat exchanger 264b cooling.Or, store again to described storagetank after described heat exchanger 264b cooling can be first passed through
In 264a.Described conduit 210, Ke Yitong is cooled down in order to reuse the described coolant being stored in described refrigerant recovering device 264
Cross described coolant injection valve 261 to inject to the described clearance space of described housing 240.It is explained above described refrigerant recovering device
264 are made up of storagetank 264a and heat exchanger 264b, but are not limited to this, in addition can also be with the morphosis of pipeline.
It is explained above and recycles and reuses described coolant but it also may do not reuse described coolant, but arrange from described storagetank
Go out discarded.Herein, it is as the situation of described coolant using air, outside can being expelled to fan (fan) when discharging described coolant
Portion.
Generally, described plasma reactor 400 is once running the most ceaselessly continuous firing, it is thus possible to can be because dividing
Solve the heat of high temperature produced during described waste gas and impaired.Especially, directly by decomposing described waste gas the heat occurred time
Described conduit 210 is most possible because of overheated and impaired.And as described in one embodiment of the present of invention is arranged the feelings of cooling unit 260
Under condition, when the surface temperature of described conduit 210 reaches to preset more than temperature inject cold media gas cooling overheated described in
Conduit 210, therefore, it is possible to prevent described conduit 210 from damaging, extends the life-span.
Described insulation division 225 is also included in the case of described coolant is for cooling water.Its reason is described first electrode
Portion 220 extrapolation is arranged at described conduit 210 outer peripheral face and plays the effect of drive electrode, therefore injects described to described clearance space
In the case of cooling water, the described first electrode portion 220 directly contacting described cooling water may be impaired, and it may happen that
Short circuit (short) problem.That is, described insulation division 225 protects described first electrode portion 220.Described insulation division 225 by insulator or
Electrolyte is formed, and has tube shape for extrapolation is arranged at the outer peripheral face of described conduit 210.Further, due to described insulation division 225
Also around described temperature sensor 250, therefore protect described first electrode portion 220 and described temperature sensor 250 in order to avoid by institute
State cooling Water Damage.
Figure 15 shows the plasma reactor 400a according to further embodiment of this invention.In the present embodiment, described second
Electrode portion 230a not connects into connected state with described conduit 210, but extrapolation is arranged as described first electrode portion 220
Around its outer peripheral face on described conduit 210.Herein, the second electrode portion 230a is also tube shape.When described second electrode portion
When 230a is arranged on described conduit 210, and described first interval, electrode portion 220 is arranged.And described first electrode portion 220 with
In described second electrode portion 230a any one be applied in and align mutually (+) voltage, another be applied in relatively negative (-) voltage.And
And, in the case of described second electrode portion 230a is provided around the outer peripheral face of described conduit 210, can be at described conduit 210
Two ends combine and be formed with the flange (not shown) of waste gas inflow entrance 201 or waste gas flow export 202, for by described plasma
Reactor according 400a is connected to described process chamber 10 or the exhaust line of described vacuum pump 30.
Figure 16 shows the plasma reactor 400b according to further embodiment of this invention.See Fig. 6, according to the present invention again
The plasma reactor 400b of one embodiment includes with spiral loop around the coil portion 230 ' of the outer peripheral face of described conduit 210.
When applying electric current externally to described coil portion 230 ', there is radio frequency (RF) plasma discharge in described coil portion 230 ', from
And the described waste gas to the flowing of described conduit 110 can be decomposed.
Figure 17 shows the plasma reactor 400c according to further embodiment of this invention.See Figure 17, described plasma
The major part of reactor according 400c constitutes identical with the plasma reactor 400 shown in above-mentioned Figure 12 to Figure 14.But this enforcement
Example does not include temperature sensor.No matter the structure of the present embodiment is the surface temperature of described conduit 210, the table of described housing 240
The temperature of surface temperature or described clearance space is the most all passed through described cooling unit 260 and is injected described coolant in real time to prevent
State conduit 210 overheated.Therefore, the present embodiment need not judge the surface temperature of described conduit 210, the surface of above-mentioned housing 240
The temperature of temperature or described clearance space is the most overheated, even therefore omitting the control portion of described cooling unit 260.
Inject coolant by described cooling unit 260 to be manually completed by operating personnel, although accompanying drawing is not shown, but permissible
Set up the intervalometer (not shown) described cooling unit 260 of control to make it possible to inject to described clearance space in each setting time
Described coolant.
Plasma reactor 400d shown in Figure 18 is to save from the plasma reactor 400a structure shown in Figure 15
The embodiment of the most described temperature sensor, the plasma reactor 400e shown in Figure 19 is anti-from the plasma shown in Figure 16
Answer the embodiment omitting said temperature sensor in device 400b structure, plasma reactor 400c as described in Figure 17,
It is and senses the temperature of the surface temperature of described conduit 210, the surface temperature of described housing 240 or described clearance space independently
Described cooling unit 260 is utilized to prevent the overheated structure of described conduit 210 in real time.
The present invention sees embodiment shown in the drawings and is illustrated, but this is only intended to illustrate, the art general
Logical skilled person will appreciate that can carry out various deformation on this basis and implement other impartial embodiments.Therefore the present invention is true
Positive technical protection scope is the scope that technical scheme specifies.
Industrial applicibility
In the case of utilizing the plasma reactor processing the waste gas that plasma reactor occurs of the present invention, it is possible to
Produce prevent because of plasma discharge and overheated and impaired, prolong long-life plasma reactor.
Claims (24)
1. a plasma reactor, it is configured between process chamber and vacuum pump and decomposes from giving up that process chamber is discharged
Gas, including:
Conduit, it is formed by electrolyte, flows for described waste gas；
First electrode portion, it is arranged on described conduit, and covers with the inner space of described conduit；And
Second electrode portion, it is separated by configuration, by causing plasma to put with described first electrode portion with described first electrode portion
Electricity decomposes described waste gas；
Wherein, the thickness of the part that plasma discharge described in described conduit is concentrated, more than the thickness of peripheral part, prevents institute
State conduit and be damaged because of described plasma discharge.
Plasma reactor the most according to claim 1, also includes:
Housing, it is around forming clearance space between described conduit, and the outer peripheral face of described conduit.
Plasma reactor the most according to claim 1,
Described first electrode portion is tube shape, is extrapolated to the outer peripheral face of described conduit.
Plasma reactor the most according to claim 3,
Described second electrode portion connects into connected state with the one or both ends of described conduit,
The thickness of described conduit tends to described second electrode portion from described first electrode portion and has the Magnification of more than 0.
Plasma reactor the most according to claim 3,
Described second electrode portion extrapolation is arranged at the outer peripheral face of described conduit, and and described first electrode portion be separated by between setting
Every,
The thickness of the first electrode portion described in the thickness of described conduit and the mid portion between described second electrode portion is the thickest.
Plasma reactor the most according to claim 5,
The thickness of described conduit tends to described the from the mid portion between described first electrode portion and described second electrode portion
One electrode portion and described second electrode portion are respectively provided with the reduction rate of less than zero.
Plasma reactor the most according to claim 4,
Described first electrode portion is arranged at the length direction center of described conduit,
The thickness of described conduit from the length direction center of described conduit tend to described conduit one or both ends progressive additive or
There is identical thickness.
Plasma reactor the most according to claim 5,
Described first electrode portion and described second electrode portion be separated by the basis of the length direction center of described conduit identical between
Every,
The thickness of described conduit tends to described between described first electrode portion and described second electrode portion from the two ends of described conduit
Plasma discharge concentrate region progressive additive or there is identical thickness.
Plasma reactor the most according to claim 1, described conduit includes:
Ground floor, it has identical thickness along the length direction of described conduit；And
The second layer, it is configured on the inner peripheral surface of described ground floor, and the thickness of the part of described plasma discharge concentration
Thickness more than peripheral part.
Plasma reactor the most according to claim 9,
Described second layer interpolation is arranged at described ground floor.
11. plasma reactors according to claim 9,
The described second layer by lamination, spray or impregnate (dipping) and be formed at the inner side of described ground floor.
12. plasma reactors according to claim 9,
The described second layer has the corrosion resistance bigger than described ground floor.
13. plasma reactors according to claim 12,
Described second layer silicon nitride comprising or yittrium oxide.
14. plasma reactors according to claim 3,
Described second electrode portion is connected formation connected state with the one or both ends of described conduit,
About the thickness of described conduit, cover the thickness of the part in adjacent described second electrode portion in the part in described first electrode portion
Degree is more than the thickness between described first electrode portion and described second electrode portion.
15. plasma reactors according to claim 2, also include:
Cooling unit, it connects with described clearance space, cools down described conduit to prevent to described clearance space supply coolant
State conduit overheated.
16. plasma reactors according to claim 15, also include:
Temperature sensor, it senses the surface temperature of described conduit, the surface temperature of described housing or described on described conduit
The temperature of clearance space, and send the surface temperature information of described conduit, the surface temperature information of described housing or described interval
The temperature information in space is for judging that described conduit is the most overheated.
17. plasma reactors according to claim 16, described cooling unit includes:
Control portion, it receives described surface temperature information from described temperature sensor and judges that described conduit is the most overheated；
Coolant injection valve, it judges in described control portion to inject coolant to described clearance space when described conduit is overheated；And
Refrigerant recovering device, it discharges described coolant after cooling down described conduit by described coolant.
18. plasma reactors according to claim 17,
Described control portion is judged as described when the temperature information received from described temperature sensor is more than the first design temperature
Conduit is overheated.
19. plasma reactors according to claim 17,
Described control portion judges during described conduit to receive from described temperature sensor being cooled down by described coolant
Described temperature information be the second design temperature (less than described first design temperature) below time discharge described coolant.
20. plasma reactors according to claim 15,
Described coolant includes any one in cold media gas or cooling water.
21. plasma reactors according to claim 20,
Described cold media gas includes air or nitrogen.
22. plasma reactors according to claim 20:
Also include the insulation division in airtight described first electrode portion when described coolant is described cooling water, be used for protecting described first electricity
Pole portion.
23. plasma reactors according to claim 22,
Described insulation division is formed by insulator or electrolyte.
24. plasma reactors according to claim 15, described cooling unit includes:
Coolant injection valve, it is connected with described clearance space, for injecting described coolant to described clearance space；And
Refrigerant recovering device, it is discharged described coolant after described coolant cools down described conduit, or enters the described coolant discharged
Row heat exchange and by described refrigerant circulation to described coolant injection valve.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140045421A KR101563193B1 (en) | 2014-04-16 | 2014-04-16 | Facility for purifying exhaust gas which is generated in processing plasma reactor |
| KR10-2014-0045421 | 2014-04-16 | ||
| KR10-2014-0070600 | 2014-06-11 | ||
| KR1020140070600A KR101567562B1 (en) | 2014-06-11 | 2014-06-11 | Plasma reactor for purifying exhaust gas of the process facility |
| PCT/KR2014/010121 WO2015160058A1 (en) | 2014-04-16 | 2014-10-27 | Plasma reactor for treating exhaust gas generated from processing facility |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106165062A true CN106165062A (en) | 2016-11-23 |
Family
ID=54324234
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480077933.9A Pending CN106165062A (en) | 2014-04-16 | 2014-10-27 | Process the plasma reactor of the waste gas that process apparatus occurs |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106165062A (en) |
| TW (1) | TWI628980B (en) |
| WO (1) | WO2015160058A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110404382A (en) * | 2018-04-27 | 2019-11-05 | (株)因努彼亚 | Exhaust gas apparatus for processing plasma and exhaust gas plasma process system including it |
| CN112913334A (en) * | 2018-10-29 | 2021-06-04 | Eq全球株式会社 | Plasma reactor with multiple electrode assemblies or injected gases |
| CN114107951A (en) * | 2020-08-27 | 2022-03-01 | 铠侠股份有限公司 | Exhaust pipe device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI679376B (en) * | 2017-02-14 | 2019-12-11 | 鼎堅綠能科技股份有限公司 | Heat recovery device and plasma torch heat recovery equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004160312A (en) * | 2002-11-11 | 2004-06-10 | Masuhiro Kokoma | Pfc gas decomposition system and method used for the same |
| KR20050063383A (en) * | 2003-12-22 | 2005-06-28 | 동부아남반도체 주식회사 | Device and method for controling temperature in etching apparatus |
| CN101685749A (en) * | 2008-09-28 | 2010-03-31 | 四川世纪双虹显示器件有限公司 | Alternating current plasma display panel and methods for manufacturing nonuniform dielectric layer thereof |
| CN102085470A (en) * | 2009-10-16 | 2011-06-08 | 韩国机械研究院 | Plasma reactor for abating hazardous materials and driving method thereof |
| US20140004009A1 (en) * | 2010-12-27 | 2014-01-02 | Lot Vacuum Co., Ltd. | Apparatus for Processing Exhaust Fluid |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09276647A (en) * | 1996-04-12 | 1997-10-28 | Hitachi Ltd | No oxidation device and exhaust gas denitrification system for automotive way tunnel |
| US5928426A (en) * | 1996-08-08 | 1999-07-27 | Novellus Systems, Inc. | Method and apparatus for treating exhaust gases from CVD, PECVD or plasma etch reactors |
| KR100381162B1 (en) * | 2000-09-01 | 2003-04-23 | 주식회사 엘지이아이 | A Plasma discharging device |
| JP2004223365A (en) * | 2003-01-21 | 2004-08-12 | Rohm Co Ltd | Gas treatment equipment |
| CN100503017C (en) * | 2007-01-12 | 2009-06-24 | 南京师范大学 | Integrated motor-vehicle tail-gas purifying device of photocatalyzing in combination with plasma |
| KR101026457B1 (en) * | 2008-09-02 | 2011-03-31 | (주)트리플코어스코리아 | System for eliminating waste gases by making us of plasmas at low and high pressure |
| CN101835336A (en) * | 2010-05-21 | 2010-09-15 | 江苏大学 | Double-dielectric barrier discharge low-temperature plasma generator |
| KR101278682B1 (en) * | 2011-10-10 | 2013-06-26 | 한국기계연구원 | Plasma reactor with non-uniform diameter for abatement of pollutions |
-
2014
- 2014-10-27 CN CN201480077933.9A patent/CN106165062A/en active Pending
- 2014-10-27 WO PCT/KR2014/010121 patent/WO2015160058A1/en active Application Filing
- 2014-12-02 TW TW103141690A patent/TWI628980B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004160312A (en) * | 2002-11-11 | 2004-06-10 | Masuhiro Kokoma | Pfc gas decomposition system and method used for the same |
| KR20050063383A (en) * | 2003-12-22 | 2005-06-28 | 동부아남반도체 주식회사 | Device and method for controling temperature in etching apparatus |
| CN101685749A (en) * | 2008-09-28 | 2010-03-31 | 四川世纪双虹显示器件有限公司 | Alternating current plasma display panel and methods for manufacturing nonuniform dielectric layer thereof |
| CN102085470A (en) * | 2009-10-16 | 2011-06-08 | 韩国机械研究院 | Plasma reactor for abating hazardous materials and driving method thereof |
| US20140004009A1 (en) * | 2010-12-27 | 2014-01-02 | Lot Vacuum Co., Ltd. | Apparatus for Processing Exhaust Fluid |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110404382A (en) * | 2018-04-27 | 2019-11-05 | (株)因努彼亚 | Exhaust gas apparatus for processing plasma and exhaust gas plasma process system including it |
| CN112913334A (en) * | 2018-10-29 | 2021-06-04 | Eq全球株式会社 | Plasma reactor with multiple electrode assemblies or injected gases |
| CN114107951A (en) * | 2020-08-27 | 2022-03-01 | 铠侠股份有限公司 | Exhaust pipe device |
| US11872524B2 (en) | 2020-08-27 | 2024-01-16 | Kioxia Corporation | Exhaust pipe device |
| CN114107951B (en) * | 2020-08-27 | 2024-02-13 | 铠侠股份有限公司 | Exhaust pipe device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201542040A (en) | 2015-11-01 |
| TWI628980B (en) | 2018-07-01 |
| WO2015160058A1 (en) | 2015-10-22 |
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