CN106145963A - There is the artificial retina sealing structure - Google Patents
There is the artificial retina sealing structure Download PDFInfo
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- CN106145963A CN106145963A CN201610520882.3A CN201610520882A CN106145963A CN 106145963 A CN106145963 A CN 106145963A CN 201610520882 A CN201610520882 A CN 201610520882A CN 106145963 A CN106145963 A CN 106145963A
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- sealing structure
- green sheet
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
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Abstract
The present invention provides a kind of artificial retina having and sealing structure, wherein, in sealing structure, accommodate electronic unit, this electronic unit electrically connects with the stimulating electrode sealing structural outer via metal column, and the manufacture method of this sealing structure includes: prepare the mould with multiple through hole for making ceramic green sheet；Many metal columns are passed through multiple through holes, and one end of many metal columns is kept；Prepare ceramic powder, and ceramic powder is filled into mould；Utilize mould that ceramic powder is compressing, form ceramic green sheet, and make metal column pass through the upper and lower surface of ceramic green sheet；And metal column is sintered together with ceramic green sheet, is consequently formed the ceramic bases with metal column, sintering during, along metal column long side direction to ceramic green sheet apply pressure.Thereby, it is possible to make to be combined more closely between metal column with ceramic structure, thus improve and seal the biological safety of structure and be chronically implanted reliability.
Description
The application is filing dateOn December 31st, 2015, Application No.201511033067.6, invention entitledImplant The manufacture method of the sealing structure of formula deviceThe divisional application of patent application.
Technical field
The present invention relates to a kind of artificial retina having and sealing structure.
Background technology
At present, built-in type device has been widely used for recovering body function, improves quality of life or save life etc.
Various aspects.Such built-in type device for example includes being implanted into internal pacemaker, deep brain stimulator, artitificial ear
Snail, artificial retina etc..
It owing to built-in type device needs implant and be retained in internal for a long time, is therefore implanted to internal implanted device
Part needs to face internal complex physiologic environment, and this physiological environment condition is often harsher, and built-in type device is chronically implanted
After be possible to implant site around tissue and organ interact, the material of such as built-in type device can occur aging, fall
Solve, cracking, again crosslinking etc. are physically or chemically reacted, thus are adversely affected implantation object and for example cause the bad lifes such as inflammation
Thing reacts.Therefore, for built-in type device, biological safety, the requirement being chronically implanted reliability etc. are all very high.Logical
Often, in order to ensure built-in type device biological safety, be chronically implanted reliability etc., on the one hand need by biological safety and length
Phase implants the good seal casinghousing of reliability by the abiotic security component such as silicon base chip in built-in type device, printing electricity
Road plates (PCB) etc. are isolated with implanted position (such as blood, tissue or bone)；On the other hand, in addition it is also necessary to from this seal casinghousing
Draw and for example carry out the mutual function wire of signal with stimulating parts.
In view of the biological safety of built-in type device, seal casinghousing is usually with the good glass of biological safety, pottery
Deng as substrate (substrate), and formed close by covering the good metal cap body of biological safety etc. in substrate
Seal structure.In such sealing structure, substrate is generally of multiple through hole (via), is filled with metal and leads in these through holes
Road (feedthrough).In addition, be encapsulated in the electronic unit within this seal casinghousing via these metal passages and outside
Carry out signal mutual.
Content of the invention
In the sealing structure of existing built-in type device, generally open (drill) at brills such as the potsherds as substrate many
Individual cylindrical hole, then inserts the part substantially adapting to through-hole diameter in these through holes and is coated with earthenware (ceramic
Tube) metal column (such as platinum post), then the edge at metal column and potsherd carries out soldering, thus is formed with gold
Belong to the ceramic bases of post.Then, further the ceramic bases with metal column is welded with metal cap body, thus by ceramic bases
Fit together with metal cap body and form sealing structure.
But, in the sealing structure of existing built-in type device, by soldering, metal column is welded with ceramic bases.?
In this case, during owing to processing at the sintering (burning altogether) of metal column and ceramic bases, as the pottery of ceramic bases
Blank is often heated inequality and is caused the contraction or expansion degree of metal column in each through hole different, its result, metal column and pottery
The stickiness of the through hole of blank is bad, and the air-tightness causing existing sealing structure is not good.
The present inventor etc. find through long-term practice, and the air-tightness of above-mentioned existing sealing structure is bad mainly to exist
Thermal coefficient of expansion (CTE:coefficient of thermal in, ceramic green sheet and the metal column being coated with earthenware
Expansion) and incomplete same, therefore, in this case, use above-mentioned existing technique by ceramic green sheet be coated with
After the metal column of earthenware sinters together, how many metal column and through holes of ceramic green sheet there will be the untight problem of laminating, lead
The air-tightness of fine and close seal structure is not good.
The present invention completes in view of the situation of above-mentioned prior art, its object is to provide one can improve air-tightness
The manufacture method of the sealing structure of the built-in type device of energy.
The manufacture method of the sealing structure of the built-in type device involved by an aspect of of the present present invention, comprising: prepare to be used for
Make the mould with multiple through hole of ceramic green sheet；Many metal columns are passed through the plurality of through hole, and by described
One end of many metal columns keeps；Prepare ceramic powder, and described ceramic powder is filled into described mould；Utilize described mould
By compressing for described ceramic powder, forms described ceramic green sheet, and make described metal column pass through the upper table of described ceramic green sheet
Face and lower surface；And described metal column is sintered together with described ceramic green sheet, is consequently formed the pottery with described metal column
Porcelain substrate, described sintering during, along described metal column long side direction to described ceramic green sheet apply pressure.
In the manufacture method of the sealing structure of built-in type device involved in the present invention, during sintering, pass through
Utilize mould to apply pressure along the long side direction of metal column to ceramic green sheet, make the contraction of ceramic green sheet substantially along substantially flat
Row is carried out in the direction of the upper and lower surface of ceramic green sheet, therefore, for the sintering process of prior art, can make metal
Post is combined between the ceramic structure in ceramic bases more closely, it is possible to more efficiently to suppress moisture, gas or
Other compositions leak into sealing structural outer along the contact interface of metal column and ceramic bases, it is possible to improve seal and tie
The biological safety of structure and be chronically implanted reliability.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, described mould
By can constitute along the mold of the described long side direction relative movement of described metal column and lower mold, described mold with described
Lower mold is formed with the cavity of the shape determining described ceramic bases after assembling.Thereby, it is possible to make manufacture process be more prone to behaviour
Make.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, sintered
Cheng Zhong, keeps the relative position of described metal column and described ceramic green sheet.In this case, metal column and ceramic blank can be made
Piece is preferably fixed.In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, pottery
Porcelain substrate is made up of the aluminum oxide of more than 99%.In this case, the biological safety of made ceramic bases and institute's shape
The air-tightness of the sealing structure becoming is more preferably.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, metal column by
At least one composition in platinum, iridium, niobium, tantalum or gold.Thereby, it is possible to obtain air-tightness better seal structure.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, described metal
The minimum diameter of post is 50 μm to 500 μm.Thereby, it is possible to manufacture density higher ceramic seal structure.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, described pottery
The particle diameter of powder is 50 μm to 200 μm.Thereby, it is possible to it is tightr to make metal column be combined with ceramic structure.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, metal column by
The platinum of more than 99% is constituted.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, at ceramic powder
Body is added with dispersant and binding agent.
The manufacture method of the sealing structure of the built-in type device involved by another aspect of the present invention, comprising: prepare long
The metal column of strip and ceramic powder；Described metal column is injected ceramic powder；Long side direction pressure along described metal column
Make described ceramic powder, form the ceramic green sheet with upper and lower surface of regulation shape；And by described metal column with
Described ceramic green sheet sinters together, is consequently formed the ceramic bases with described metal column, during described sintering, along
The long side direction of described metal column applies pressure to described ceramic green sheet.Sealing knot at built-in type device involved in the present invention
In the manufacture method of structure, during sintering, by the long side direction along metal column, pressure is applied to ceramic green sheet, make pottery
The contraction of porcelain blank is carried out substantially along the direction of the upper and lower surface being roughly parallel to ceramic green sheet, therefore, compared to existing skill
For the sintering process of art, can make to be combined more closely between metal column with ceramic structure, it is possible to more efficiently
Suppression moisture, gas or other compositions leak into sealing structural outer along the contact interface of metal column and ceramic bases, by
This can improve the biological safety sealing structure and be chronically implanted reliability.
Brief description
Fig. 1 shows the stereochemical structure of the sealing structure of the built-in type device involved by the first embodiment of the present invention
Figure.
Fig. 2 shows the schematic internal view of the sealing structure of the built-in type device shown in Fig. 1.
Fig. 3 shows the plane of the ceramic bases of the sealing structure of the built-in type device shown in Fig. 1.
Fig. 4 shows cutting of the ceramic bases that the ceramic bases of the sealing structure shown in Fig. 3 intercepts along straight line A-A'
Face figure.
Fig. 5 shows the ceramic bases of the sealing structure of the built-in type device involved by the first embodiment of the present invention
The flow chart of manufacturing step.
Fig. 6 (A) to Fig. 6 (F) shows the sealing knot of the built-in type device involved by first embodiment of the present invention
The schematic diagram of the manufacturing step of the ceramic bases of structure.
Fig. 7 (A) is the ceramic bases of the sealing structure of the built-in type device involved by the first embodiment of the present invention
The perspective view of the mould used in manufacture, Fig. 7 (B) is that the stereogram of the mould shown in Fig. 7 (A) intercepts along B-B'
The sectional view of mould.
Fig. 8 shows the ceramic bases of the sealing structure of the built-in type device involved by second embodiment of the present invention
Schematic section.
Fig. 9 shows the ceramic bases of the sealing structure of the built-in type device involved by third embodiment of the present invention
Schematic section.
Figure 10 shows the ceramic base of the sealing structure of the built-in type device involved by the 4th embodiment of the present invention
The schematic section at the end.
Figure 11 shows the ceramic base of the sealing structure of the built-in type device involved by the 5th embodiment of the present invention
The schematic section at the end.
Symbol description:
10th, the 101st, the 102nd, the 103rd, 104 ... seal structure, the 11st, the 111st, the 112nd, the 113rd, 114 ... ceramic bases, 11c ... through hole,
12 ... becket, 13 ... crown cap, 11a ... upper surface, 11b ... lower surface, the 20th, the 201st, the 202nd, the 203rd, 204 ... metal column, 30 ...
Electronic unit, 40 (40a, 40b) ... mould.
Detailed description of the invention
Hereinafter, with reference to accompanying drawing, the preferred embodiment of the present invention is explained.In the following description, for identical
Parts give identical symbol, the repetitive description thereof will be omitted.In addition, accompanying drawing is simply schematically schemed, parts chi each other
The shapes of very little ratio or parts etc. can be different from actual.
Sealing structure 10 involved in the present invention goes for built-in type device and for example includes being implanted into the internal heart
Dirty pacemaker, deep brain stimulator, artificial cochlea, artificial retina etc..In addition, the sealing structure 10 involved by present embodiment
It is also especially suitable for high density ceramic encapsulation technology.
Further, since sealing structure 10 involved by present embodiment needs to be placed in and implants the internal of object, therefore, for
Sealing structure involved in the present invention for those skilled in the art, it is readily understood that arrive, with blood, tissue or bone-contact
The exterior material of 10 (includes the ceramic bases being described later on the 11st, becket the 12nd, crown cap 13 and is filled in ceramic bases 11
The constituent material etc. of the metal column 20 of through hole) all need to meet required standard (such as ISO 10993 (international standard), GB/T
16886 (Chinese Industrial Standards (CIS)s)) biological safety and be chronically implanted reliability.
(the first embodiment)
Fig. 1 shows the three-dimensional knot of the sealing structure 10 of the built-in type device involved by the first embodiment of the present invention
Composition.Fig. 2 shows the schematic internal view of the sealing structure 10 of the built-in type device shown in Fig. 1.
As depicted in figs. 1 and 2, the sealing structure 10 of the built-in type device involved by present embodiment includes ceramic bases
11st, becket 12 and crown cap 13.Specifically, sealing structure 10 has gold by arranging (such as welding) in ceramic bases 11
Belong to ring 12 and crown cap 13 and be formed as the seal with the receiving space for accommodating electronic unit 30.In addition, seal knot
The bottom (being ceramic bases 11 in the present embodiment) of structure 10 is provided with and is electrically connected (for example for electro photoluminescence) with outside
Feed through pole or feed through pole array.
In addition, as it is shown in figure 1, seal structure 10 in generally a cylindrical shape.In the present embodiment, typical sealing is tied
A size of the diameter of bottom surface is about 5mm～40mm for structure 10 cylindrical, and height is about 5mm～40mm.Although there is illustrated
Sealing structure 10 is cylindrical structure, but the shape sealing structure 10 is not particularly limited, it is also possible to be other shapes.Example
As, seal structure 10 also can shape in approximately parallelepiped body, the size of typical rectangular shape for example, length 10mm ×
Width 10mm × highly 10mm.In addition, seal structure 10 also can be other regular shapes column for example cylindric, oval, three
Corner post shape etc., it is also possible to be irregularly shaped (including regular shape and the irregularly shaped shape being combined into).
In the present embodiment, ceramic bases 11 can be by aluminum oxide (chemical formula Al2O3, it include monocrystalline sapphire and
Ruby or polycrystalline α-Al2O3), zirconium oxide (chemical formula ZrO2, it includes magnesia partial stabilized zirconia (Mg-PSZ)),
The structures such as the tetragonal zirconia polycrystal (Ce-TZP) of the tetragonal zirconia polycrystal (Y-TZP) of stabilized with yttrium oxide or ceria stabilized
Become.
In the present embodiment, ceramic bases 11 is preferably by more than 96% (unless specifically stated otherwise, the equal table of percentage here
Show mass fraction) aluminum oxide (Al2O3) constitute.In addition, ceramic bases 11 is more preferably made up of the aluminum oxide of more than 99%.This
Outward, ceramic bases 11 is most preferably made up of the aluminum oxide of more than 99.99%.
It is said that in general, in ceramic bases 11, with aluminum oxide (Al2O3) increase of mass fraction, principal crystalline phase increases, pottery
The physical property of porcelain substrate 11 also gradually steps up, and such as compression strength (MPa), bending strength (MPa), elastic modelling quantity (GPa) are also
Correspondingly improve, thus it is believed that more preferable biological safety and long-term reliability can be presented.
In the present embodiment, the thickness of ceramic bases 11 is not particularly limited, for example, can be more than 0.1mm and 2mm
Below.In the present embodiment, the thickness of ceramic bases 11 is preferably more than 0.25mm and below 0.75mm.
In the present embodiment, becket 12 is shaped generally as circulus.Becket 12 is along the limit of ceramic bases 11
Edge arranges and welds (such as soldering) in ceramic bases 11.The thickness (i.e. the thickness of ring wall) of becket 12 does not limit especially
System, for example in the present embodiment, the ring wall thickness of becket 12 is about more than 0.3mm, and just can to reach good support strong
Degree, for example, the ring wall thickness of becket 12 is preferably 0.3mm～4mm.In addition, the height of becket 12 (i.e. along with ceramic base
The height of the ring wall on the upper surface at the end 11 or the orthogonal direction of lower surface) can sealing structure 10 according to mentioned by above-mentioned
Accommodate the size in space and determine, it is however generally that, as long as being able to ensure that the electronic unit 30 (being described later on) accommodating in space i.e.
Can.
In addition, crown cap 13 is arranged on becket 12, for example can be by laser welding by crown cap 13 and becket
12 weld together.Thus, the ceramic bases fitting together the 11st, becket 12 and crown cap 13 constitute the close of present embodiment
Seal structure 10 (seeing Fig. 1).
Here, welding (such as laser welding) skill of the ceramic welding (such as soldering) with metal and metal and metal
Art belongs to well known to a person skilled in the art technology, therefore, in this manual, with regard to pottery and metal and metal with
The solder technology of metal will not be described in great detail.
In the present embodiment, becket 12 and crown cap 13 can by titanium and alloy thereof, noble metal (include gold, silver and
Platinum group metal (ruthenium, rhodium, palladium, osmium, iridium, platinum)) and alloy, medical grade (biograde) stainless steel, tantalum, niobium, Nitinol
Or Ni, Co, Cr molybdenum alloy (MP35N) etc. is constituted (Nitinol).Additionally, in the present embodiment, becket 12 and crown cap 13
Can be made up of identical metal material, it is also possible to be made up of different metal materials.In addition, becket 12 preferably by titanium or
Titanium alloy material is constituted.Crown cap 13 is it is also preferred that be made up of titanium or titanium alloy material.
Furthermore, in order to simplify manufacturing process, in the sealing structure 10 involved by present embodiment, becket 12 and metal
Lid 13 also can be one-body molded.For example, becket 12 and crown cap 13 are integrally formed as metal cap body.
As in figure 2 it is shown, (specifically seal the receiving space of structure 10) in sealing structure 10, accommodate electronic unit
30.In the present embodiment, electronic unit 30 can be by including such as resistor, electricity in the upper making of printed circuit board (PCB) (PCB)
The discrete component such as container or inductor or IC chip (IC) such as special IC (ASIC), FPGA
Circuit (FPGA), electricallyerasable ROM (EEROM) (EEPROM) etc. and constitute.In addition, electronic unit 30 also can be other functions
Parts, as long as disclosure satisfy that specific implantation uses the function requiring.
In addition, electronic unit 30 is via the metal column 20 being described later on the functional part sealing outside structure 10 (not
Diagram) such as stimulating electrode electrical connection.In the present embodiment, electronic unit 30 for example can play to input signal, stimulation
The various signals such as signal or detection signal carry out the effect of signal transacting.
For built-in type device, seal the electronic unit 30 in structure 10 by ceramic bases 11 with irriate side
(such as brain, retina, heart etc.) produce reciprocation (such as electro photoluminescence).In addition, in ceramic bases 11, it is also possible to from
Ceramic bases 11 is extended stimulating electrode and is acted on above-mentioned irriate position.
Fig. 3 shows the plane of the ceramic bases 11 of the sealing structure 10 of built-in type device.Fig. 4 shows Fig. 3
The schematic section of the ceramic bases 11 that the ceramic bases 11 of shown sealing structure 10 intercepts along straight line A-A'.
As shown in Figure 3 and Figure 4, ceramic bases 11 has upper surface 11a and lower surface 11b.In addition, ceramic bases 11 is upper
Surface 11a can be substantially parallel to each other each other with lower surface 11b.As it is shown on figure 3, in terms of the plane of ceramic bases 11, pottery
Substrate 11 is also substantially in cylindrical shape.In addition, ceramic bases 11 has multiple through hole 11c.Wherein, outermost through hole 11c
And retain non-functional area between the edge of ceramic bases 11, to ensure that follow-up becket 12 is securely provided in ceramic bases
On 11.
Ceramic bases the 11st, becket 12 and crown cap 13 are assembled with constitute present embodiment sealing structure 10 when,
Can respectively first the upper surface 11a and lower surface 11b in ceramic bases 11 carry out the metal pattern wiring of gold (such as) and carry out shape
Become specific connection line (not shown).Then, the ceramic bases 11 after patterning (for example has the upper surface of connection line
11a) can for example be engaged with electronic unit 30 to ceramic bases 11 by electronic unit 30 is installed (such as welding)
(bonding)。
The step of the metal pattern in ceramic bases 11 can include metal deposit (deposition) or sputtering
(sputtering) Conventional process steps such as, photoetching (lithography), etching (etching), due to these common process step
Suddenly belong to known technology, therefore repeat no more here.In addition, the metal pattern in ceramic bases 11 also can use public affairs
The silk-screen printing technique known.
In addition, metal column 20 also can pass through ceramic bases 11 with external contact surface (i.e. lower surface 11b) and from
Lower surface 11b highlights.Thus, metal column 20 can work directly as stimulating electrode.
In addition, as it is shown on figure 3, ceramic bases 11 has the through hole 11c being arranged in 5 × 5 two-dimensional arraies.In addition, each leads to
Hole 11c can be formed as cylindrical hole shape, and through ceramic bases 11 and the upper surface 11a and the following table that reach ceramic bases 11
Face 11b.In other words, ceramic bases 11 is formed with the through hole 11c of through upper surface 11a and lower surface 11b.
In addition, it is said that in general, the direction of the central shaft l (seeing Fig. 4) of through hole 11c can substantially upper with ceramic bases 11
Surface 11a is vertical with lower surface 11b.But, the central shaft l of the through hole 11c of present embodiment is not limited to this, such as through hole
The direction of the central shaft l of 11c also can tilt relative to the upper surface 11a or lower surface 11b of ceramic bases 11, for example, incline
Oblique angle is preferably about 1 °～10 °, but also can be according to circumstances other angles of inclination.
In the present embodiment, although showing that the quantity of through hole 11c is 25 (5 × 5), but the number of through hole 11c
Amount is not particularly limited, and can determine according to specific needs, and the such as quantity of through hole 11c can be more than 2 such as 32
Individual, 64, in extreme circumstances, the quantity of through hole 11c also can be 1.
It although the diameter of through hole 11c is not particularly limited in the present embodiment, but is in order at high density ceramic encapsulation
Viewpoint, the diameter of through hole 11c can be more than 0.1mm and below 0.5mm.In addition, through hole 11c also can be other shapes, only
Through hole 11c to be ensured is capable of the upper surface 11a and lower surface 11b of through ceramic bases 11.
As shown in Figure 3 and Figure 4, it is filled with metal column 20 in through hole 11c.The shape of metal column 20 can be joined with through hole 11c
Closing, thus, metal column 20 effectively blocks ceramic bases 11 by the combination between the hole wall of the through hole 11c of ceramic bases 11
The diffusion of gas etc. between both sides, so that it is guaranteed that high-air-tightness.For example, in the case that through hole 11c is cylindrical hole shape, metal
The shape of post 20 can be cylinder.
In addition, in the present embodiment, metal column 20 can be solid column structure, it is also possible to be the column knot of hollow
Structure (not shown), can also is that the structure of other shapes, as long as ensureing that the metal column 20 being positioned at through hole 11c is able to ensure that pottery
The electrical connection of upper surface 11a and the lower surface 11b both sides of substrate 11.Here, the number of the quantity of metal column 20 and through hole 11c
Measure corresponding.
In addition, along the long side direction of metal column 20, the diameter of metal column 20 not necessarily immobilizes, but can occur
Change.In the present embodiment, the minimum diameter of metal column 20 is 50 μm to 500 μm, more preferably 100 μm to 500 μm.This
In " minimum diameter " of metal column 20 refer in the middle of the diameter of the metal column 20 of the long side direction of metal column 20 minimum
Diameter.
As the exemplary of high density ceramic encapsulation, the central shaft of adjacent metal column 20 and central shaft are (in this enforcement
In mode, the central shaft of metal column 20 overlaps with through hole 11c central shaft l) between spacing can be for example more than 0.1mm and 1mm
Hereinafter, preferably more than 0.25mm and below 0.5mm.So, the quantity arranging metal column 20 in ceramic bases 11 can be improved,
It is thus possible to provide the ceramic package with high-density electrode.
In addition, metal column 20 can be by least in platinum (Pt), iridium (Ir), niobium (Ni), tantalum (Ta) or gold (Au)
Plant and constitute.For biological safety and the viewpoint being chronically implanted reliability, metal column 20 is preferably made up of platinum, more preferably by 99%
Above platinum is constituted, and is most preferably made up of the platinum of more than 99.99%.
In the present embodiment, the output (not shown) being contained in the electronic unit 30 sealing in structure 10 can be via
Solder or lead-in wire electrically connect with metal column 20, then, then via metal column 20 and the functional part electricity sealing outside structure 10
Connecting, thus, electronic unit 30 is capable of mutual with the electrical connection of the functional part sealing outside structure 10 or signal.
In addition, in the assembling process sealing structure 10, such as (include printed circuit board (PCB), discrete unit at electronic unit 30
Part or integrated IC etc.) install (such as welding) in ceramic bases 11 after, by becket 12 along the edge of ceramic bases 11
Ceramic bases 11 is arrived in welding (such as soldering), then fills electronic unit 30 and ceramic bases with the resin such as silica gel, epoxy resin
Crown cap 13 is finally welded (e.g., laser welded) to the gold being positioned in ceramic bases 11 by the gap between 11 or other positions
Belong to ring 12, thus, obtain the sealing structure 10 involved by present embodiment.
Hereinafter, with reference to Fig. 5, Fig. 6 (A) to Fig. 6 (F), Fig. 7 (A) and Fig. 7 (B), explain involved by present embodiment
The manufacture method of ceramic bases 11 of sealing structure 10.
Wherein, Fig. 5 shows the ceramic bases 11 of the sealing structure 10 involved by the first embodiment of the present invention
The flow chart of manufacturing step.Fig. 6 (A) to Fig. 6 (F) (i.e. Fig. 6 (A), Fig. 6 (B), Fig. 6 (C), Fig. 6 (D), Fig. 6 (E), Fig. 6 (F))
Show the schematic diagram of the manufacturing step of the ceramic bases 11 of the sealing structure 10 involved by the first embodiment of the present invention.
Fig. 7 (A) be the present invention the first embodiment in ceramic bases 11 manufacture process used in the perspective view of mould,
Fig. 7 (B) is the sectional view of the mould intercepting along B-B' of Fig. 7 (A).
In addition, in Fig. 6 (A) to Fig. 6 (F), Fig. 7 (A) and Fig. 7 (B), in order to make it easy to understand, illustrate only with lining up
The schematic diagram of the manufacture process of the ceramic bases of 5 metal columns of a line, but in the manufacture of actual ceramic bases, permissible
Make the metal column of the different arrangement of respective numbers (such as one or more than two) as required.In addition, for convenience of description, figure
6 (A) to Fig. 6 (F), Fig. 7 (A) and Fig. 7 (B) only illustrate the manufacture method of ceramic bases 11, and for final sealing structure 10
Manufacture, it is only necessary in ceramic bases 11, weld becket 12 and crown cap 13 further.
When manufacturing the ceramic bases 11 of sealing structure 10 of such built-in type device, by the making of metal column 20,
The making of ceramic powder, the method such as making of ceramic green sheet make the ceramic bases of the sealing structure 10 including metal column 20
11。
In the manufacture process of the ceramic bases 11 of present embodiment, first, many (being 5 in present embodiment) are prepared
The metal column 20 (seeing Fig. 6 (A)) (step S1) of strip.In the present embodiment, metal column 20 is in strip, and its length is simultaneously
Being not particularly limited, from the viewpoint of metal column 20 convenient to operate, the length of metal column 20 is slightly larger than the height of mould 40, or
Total height after cooperating more than mold 41 and lower mold 42.For example, the typical length of the metal column 20 being prepared is permissible
It is 20～100mm.In addition, the diameter of metal column 20 is it is not also specifically limited, can be for example 100 μm～500 μm.Additionally, institute
The metal column 20 preparing for example can be made up of the platinum (Pt) of more than 99%.
In addition, in the present embodiment, mould 40 includes mold 41 and lower mold 42 (seeing Fig. 6 (B)).Mold 41
It is the mould cooperating with lower mold 42.
Mold 41 has base portion 41a and the protuberance 41b (for example, see Fig. 7 (A) and Fig. 7 (B)) from base portion 41a projection.
Mold 41 have simultaneously through base portion 41a and protuberance 41b through hole 41c1～41c5 (i.e. 41c1,41c2,41c3,41c4,
41c5)。
In the present embodiment, all cylindrical structure of base portion 41a and protuberance 41b of mold 41.In present embodiment
In, although base portion 41a and protuberance 41b is represented as cylindrical-shaped structure, but base portion 41a and protuberance 41b also can be different
Shape, such as base portion 41a can be the column structures that bottom surface is rectangle, and protuberance 41b remains cylindrical-shaped structure.
In addition, the form fit of the shape of protuberance 41b and the recess 42b being described later on.Additionally, protuberance 41b and recess 42b
Form fit after the space that formed substantially determine the shape of ceramic bases 11.Specifically, mold 41 and lower mold
The shape of 42 inner spaces assembling corresponds roughly to the ceramic bases 11 of the sealing structure 10 manufactured by present embodiment
Shape.Here, the shape of the inner space that mold 41 and lower mold 42 combine can be tied according to manufactured sealing
The change of the shape of structure 10 and change, such as when sealing structure 10 and being generally cylindrical structure, mold 41 and lower mold 42
The shape of the inner space combining also is generally cylindrical structure.
In addition, in the present embodiment, mold 41 can along the inwall of lower mold 42 at above-below direction (i.e. and lower mold
The end face generally perpendicular direction of tool 42) relative movement, that is, mold 41 and lower mold 42 for example can be along metal columns 20
Long side direction relative movement.
Lower mold 42 has base portion 42a and the recess 42b being formed in base portion 42a.Base portion 42a is generally cylindrical body knot
Structure.Recess 42b also can be in generally a cylindrical shape structure.In addition, recess 42b also can structure in other shapes, as long as guaranteeing
Can be with the mating shapes of above-mentioned protuberance 41b.
In addition, the base portion 42a of lower mold 42 is formed with the through hole of the bottom surface of throughgoing recesses 42b and the end face of lower mold 42
42c1～42c5 (i.e. 42c1,42c2,42c3,42c4,42c5).
Here, the through hole 42c1～42c5 one_to_one corresponding of the through hole 41c1～41c5 of mold 41 and lower mold 42.
In addition, in order to when mold 41 coordinates with lower mold 42, through hole 41c1～41c5 and through hole 42c1～4,2c5 mono-a pair
Should, respectively locator protrusions and corresponding positioning hole (not shown) can be set at mold 41 and lower mold 42.
Then, the metal column 20 of the many root lengths strip being prepared is sequentially inserted into the through hole 42c1～42c5 of mould 40
In (step S2).Specifically, the metal column 20 of many (the being 5 in the present embodiment) strips being prepared is inserted into
Through hole 42c1～the 42c5 (such as Fig. 6 (C)) of lower mold 42.
In the present embodiment, the operation of through hole 42c1～42c5 that many metal columns 20 are inserted into lower mold 42 can
To be carried out by machine, it is also possible to by manual operations.
In addition, for convenience metal column 20 is inserted into the through hole 42c1～42c5 of lower mold 42 and to be inserted after a while
In the through hole 41c1～41c5 of mold 41, the diameter of the through hole in mould 40 (the through hole 41c1 of mold 41～
The diameter of the through hole 42c1～42c5 of the diameter of 41c5 and lower mold 42) it is more than the straight of (always slightly greater than) metal column 20
Footpath.
When metal column 20 is sequentially inserted into the 42c1～42c5 of lower mold 42, preferably make one end of metal column 20 under
The end face of mould 42 stretches out (the such as end face from lower mold 42 extends slightly out), and for example protects the part stretched out with fixture
Hold, it is possible to guarantee the relative position between metal column 20 with lower mold 42.
Then, the ceramic powder of ceramic bases 11 involved by present embodiment for the composition after preparing to be used for burning till, and profit
With mould, ceramic powder is pressed into ceramic green sheet (step S3).Now, metal column 20 is inserted into this ceramic powder.
Specifically, in step s3, the ceramic powder being prepared is filled in lower mold 42, and by mold 41 with
Lower mold 42 fits together.Then, the long side direction along metal column 20 is suppressed by clamped by mold 41 and lower mold 42
Ceramic powder, thus form the ceramic green sheet with upper and lower surface of regulation shape.In addition, ceramic powder is also permissible
For example prepared in step sl before step S3.
It is said that in general, the particle of ceramic powder is thinner, activation degree is higher, then powder is easy for carrying out ceramic post sintering, and
And the temperature of ceramic post sintering is lower.Therefore, the ceramic powder for ceramic bases 11 in the present invention is preferably used average grain diameter
The ceramic powders of for example, 20 μm to 200 μm.Fall within the range by the average grain diameter making ceramic powder such that it is able to manufacture
The good ceramic green sheet of compactness.
In the present embodiment, the making of ceramic powder is not particularly limited, for example can be by being incited somebody to action by homogeneous mixer
After the mixing such as ceramic powders, organic carrier, carry out disperseing in three-roller or ball mill, rod mill, knead and make.On
Stating organic carrier is to make resin glue be dissolved in organic carrier obtained from solvent.The binding agent being used as organic carrier
Resin is not particularly limited, and can illustrate the common various resin glues such as ethyl cellulose, acrylic resin.In addition, have
The solvent that airborne body is used is it is not also specifically limited, use common solvent such as water, ethanol etc..
In addition, the making of ceramic powder also can be obtained by carrying out pulverizing the ceramic block of solid-like by ball mill later
Arrive (mechanical crushing method).
In the making of above-mentioned ceramic powder, the ceramic powder allocated is preferably with oxidation that mass fraction is more than 96%
Aluminium (Al2O3) it is principal component.In addition, the mass fraction shared by aluminum oxide preferably more than 98% in ceramic powder, more preferably 99%
Above.Additionally, ceramic powder can add the dispersant of proper proportion, binding agent etc..
When assembling mold 41 with lower mold 42, by have been inserted into the through hole 42c1 of lower mold 42～
The metal column 20 (the specifically other end of metal column 20) of 42c5 is also inserted into the through hole 41c1～41c5 of mold 41.Equally
Ground, the other end of metal column 20 also stretches out from the end face of mold 41.
Then, the mold 41 fitting together and lower mold 42 (including metal and ceramic green sheet) are placed in sintering furnace and enter
Row sintering (step S4).In sintering process, to the mold 41 fitting together and lower mold 42 (hereafter referred to collectively as " mould
40 " two end faces) apply pressure.That is, during sintering, such as along the long side direction of metal column 20 to ceramic green sheet
Apply pressure.
In addition, during sintering, it is possible to use mould 40 also can utilize other instruments such as fixture etc. to keep gold
Belong to the relative position of post 20 and ceramic green sheet.Thereby, it is possible to make metal column 20 more step up during sintering with ceramic green sheet
Close combination.
In the present embodiment, sintering temperature for example, 1450～1650 DEG C, more preferably 1500～1650 DEG C.At pottery
During sintering (hot pressed sintering), the such as aluminum oxide in glass phase starts to shrink at towards the direction of metal column 20, makes aluminum oxide
Fit tightly with metal column 20, form the ceramic substrate (seeing Fig. 6 (D) and Fig. 6 (E)) with metal column 20.
As the sintering furnace used in sintering circuit, for example, can illustrate lifting type batch-type atmosphere sintering furnace, push rod
Formula stove, band oven etc..
As sintering condition, preferably can under vacuum, pressure is about 0.5MPa～10MPa to be carried out.Programming rate,
Retention time is not particularly limited, for example the programming rate with 500 DEG C/more than h and 1500 DEG C/below h, and the retention time is 10 points
More than clock and less than 2 hours.
Finally, the unnecessary metal column prominent from ceramic substrate surface is removed, and ceramic substrate is cut into multi-disc institute
Need the ceramic bases 11 (step S5) of thickness.Alternatively, it is also possible to as required ceramic bases 11 is polished.Thus, obtain
Ceramic bases 11 (seeing Fig. 6 (F)) involved by present embodiment.
In addition, in step s 5, the method that ceramic substrate cuts into monolithic is not particularly limited, for example, it is possible to enumerate
Inner circle patterning method, cylindrical patterning method, the crush-cutting process of chopping or the scribing skill in using a kitchen knife in cookery, laser cutting method etc..
In the manufacture process of above-mentioned ceramic bases, before sintering, unsticking knot agent operation can first be carried out.De-binding agent
Condition in operation can at ambient pressure, keep temperature be to carry out under conditions of more than 500 DEG C and less than 900 DEG C.In addition, heat up
Speed, retention time are not particularly limited.
Further optionally, cylinder grinding, sandblasting etc. such as will can for example be passed through with the ceramic bases 11 obtained by upper type
Implement end surface grinding, the metal lotion of burn-back metal pattern, thus at the upper surface 11a of ceramic bases 11 or lower surface
11b forms connecting lead wire.
Additionally, after ceramic bases 11 makes and finishes, electronic unit 30 is for example passed through welded and installed to ceramic bases 11
On, and becket 12 is for example soldered to ceramic bases 11, then with silica gel etc. fill electronic unit 30 and ceramic bases 11 it
Between gap or other positions, and crown cap 13 is welded (laser welding) arrive ceramic bases 11, thus, obtain air-tightness and be able to
The sealing structure 10 improved.
(the second embodiment)
Hereinafter, with reference to Fig. 8, the sealing structure 101 of built-in type device involved by second embodiment of the present invention is described.
In the following description, in order to make it easy to understand, the sealing structure of Fig. 8 to Figure 11 all only illustrates ceramic bases part, gold is eliminated
Belong to the description of ring and metal lid portions.
Fig. 8 shows the structural representation of the ceramic bases 111 of the sealing structure 101 of built-in type device.For the ease of saying
Bright, sealing structure 101 here illustrate only different from the sealing structure 10 of the built-in type device involved by the first embodiment
Part.As shown in Figure 8, the ceramic base of the sealing structure 101 of the built-in type device involved by second embodiment of the present invention
The difference of the ceramic bases 11 of the sealing structure 10 with the built-in type device involved by the first embodiment of the present invention for the end 111
Being, metal column 201 is the column structure being made up of post body 201a and post projection 201b.
Specifically, in the sealing structure 101 of the built-in type device involved by present embodiment, metal column 201 be by
The column structure that post body 201a and post projection 201b are constituted.As shown in Figure 8, the length direction along post body 201a is (i.e. vertical
The direction on the straight surface in ceramic bases 11), the part at post body 201a is formed with the post arranging around post body 201a
Projection 201b.Wherein, the radius of post body 201a is less than the radius of post projection 201b.In addition, post body 201a and post projection
201b can be one-body molded.
Additionally, post projection 201b is not particularly limited from the height of post body 201a projection, it is however generally that, relative to metal
The post body 201a of post 201 has the height of significantly outside (away from post body 201a) projection.Preferably, post projection 201b from
Metal column 201 towards the post body 201a that the height of outside (away from post body 201a) projection is metal column 201 radius three
More than/mono-and less than 1/2nd.In this case, post projection 201b in metal column 201 can be with ceramic bases
The ceramic structure of 111 more fully contacts, and it is possible to improve the effect that metal column 201 fits tightly with ceramic bases 111.
In the present embodiment, the radius more than post body 201a for the radius of post projection 201b, i.e. at metal column 201
It with the contact interface of ceramic bases 111, is formed with concaveconvex structure, thus, the contact area of metal column 201 and ceramic bases 111
It is greatly increased.Therefore, for the through hole being not changed in compared to radius, can more efficiently suppress moisture, gas or other
It is outside that composition leaks into sealing structure 101 along the contact interface of metal column 201 and ceramic bases 111, it is possible to improve
Seal the biological safety of structure 101 and be chronically implanted reliability.
In the present embodiment, although showing metal column 201 by the post body 201a of generally cylindrical body and generally a cylindrical
Post projection 201b of body is constituted, but metal column 201 also can be other shapes, and such as metal column 201 can be by substantially rectangular
The post projection of the post body of body and generally rectangular bodies constitutes (not shown).Additionally, metal column 201 also can be by generally cylindrical body
The post projection of post body and tool cylinder jaggy (such as fan-shaped cylinder (sector including continuously and separating)) is constituted.
Additionally, the ceramic bases 111 of the sealing structure 101 of built-in type device involved by second embodiment of the present invention
The ceramic bases 11 of sealing structure 10 of the built-in type device involved by the first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 201.
(the 3rd embodiment)
Hereinafter, with reference to Fig. 9, the sealing structure 102 of built-in type device involved by third embodiment of the present invention is described.
Fig. 9 shows the pottery of the sealing structure 102 of the built-in type device involved by third embodiment of the present invention
The schematic section of substrate 112.For convenience of description, sealing structure 102 here illustrate only with involved by the first embodiment
And the different part of the sealing structure 10 of built-in type device.As it is shown in figure 9, planting involved by third embodiment of the present invention
Enter ceramic bases 112 and the built-in type device involved by the first embodiment of the present invention of the sealing structure 102 of formula device
The difference of ceramic bases 11 sealing structure 10 is, the metal column 202 in ceramic bases 112 is by post body 202a and two
Post projection 202b1,202b2 are constituted.
Specifically, in the sealing structure 102 of the built-in type device involved by present embodiment, metal column 202 be by
The column structure that post body 202a and two post projections 202b1,202b2 are constituted.As it is shown in figure 9, along the length of post body 202a
Degree direction, is formed with two the post projections arranging around post body 202a at a part of different twos of post body 202a
202b1、202b2.Wherein, the radius of post body 202a is less than two post projections 202b1, the radiuses of 202b2.In addition, post body
202a and two post projections 202b1,202b2 can be one-body molded.
In the present embodiment, two post projections 202b1, radiuses more than post body 202a for the radius of 202b2, i.e.
The contact interface with ceramic bases 112 of metal column 202, is formed with concaveconvex structure, thus, and metal column 202 and ceramic bases 112
Contact area increase further.Therefore, for the through hole being not changed in compared to radius, water can more efficiently be suppressed
Point, that gas or other compositions leak into sealing structure 102 along metal column 202 and the contact interface of ceramic bases 112 is outside,
Thus also can improve and seal the biological safety of structure 102 and be chronically implanted reliability.
Although in addition, the ceramic base of the sealing structure 102 of built-in type device involved by third embodiment of the present invention
The metal column 202 at the end 112 illustrates only two post projections 202b1, the situations of 202b2, but, those skilled in the art should manage
Solving, the post projection of the metal column 202 of present embodiment also can be the situation of three or more than three.
Although in addition, show in the present embodiment two post projections 202b1,202b2 radius equal, but two
Post projection 202b1, the radius of 202b2 also can be different.
Additionally, the ceramic bases 112 of the sealing structure 102 of built-in type device involved by third embodiment of the present invention
The ceramic bases 11 of sealing structure 10 of the built-in type device involved by the first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 202.
(the 4th embodiment)
Hereinafter, with reference to Figure 10, the sealing structure of the built-in type device involved by the 4th embodiment of the present invention is described
103。
Figure 10 shows the pottery of the sealing structure 103 of the built-in type device involved by the 4th embodiment of the present invention
The schematic section of substrate 113.For convenience of description, sealing structure 103 here illustrate only with involved by the first embodiment
And the different part of the sealing structure 10 of built-in type device.As shown in Figure 10, involved by the 4th embodiment of the present invention
The ceramic bases 113 of the sealing structure 103 of built-in type device and the built-in type device involved by the first embodiment of the present invention
The difference of ceramic bases 11 of sealing structure 10 be, the metal column 203 in ceramic bases 113 is by post body 203a and spiral shell
Line projection 203b is constituted.
Specifically, in the sealing structure 103 of the built-in type device involved by present embodiment, metal column 203 be by
The column structure that post body 203a and threaded bosses 203b are constituted.As shown in Figure 10, the length direction along post body 203a,
A part of post body 203a, is formed with threaded bosses 203b arranging around post body 203a.Wherein, the half of post body 203a
Footpath is less than the radius of threaded bosses 203b.In addition, post body 203a and threaded bosses 203b can be one-body molded.
In the present embodiment, the radius more than post body 203a for the external diameter of threaded bosses 203b, i.e. at metal column 203
The contact interface with ceramic bases 113, be formed with concaveconvex structure, thus, the contact surface of metal column 203 and ceramic bases 113
Amassing increases further, and threaded bosses 203b is easier to chimeric with the ceramic structure of ceramic bases 113.Therefore, compared to half
For the through hole that footpath is not changed in, can more efficiently suppress moisture, gas or other compositions along metal column 203 and pottery
The contact interface of substrate 113 and to leak into sealing structure 103 outside, thus also can improve the bio-safety sealing structure 103
Property and be chronically implanted reliability.
Additionally, the ceramic bases 113 of the sealing structure 103 of the built-in type device involved by the 4th embodiment of the present invention
The ceramic bases 11 of sealing structure 10 of the built-in type device involved by the first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 203.
(the 5th embodiment)
Hereinafter, with reference to Figure 11, the sealing structure of the built-in type device involved by the 5th embodiment of the present invention is described
104。
Figure 11 shows the ceramic base of the sealing structure 104 of the built-in type device involved by the 5th embodiment of the present invention
The schematic section at the end 114.For convenience of description, sealing structure 104 here illustrate only with involved by the first embodiment
The different part of the sealing structure 10 of built-in type device.As shown in figure 11, planting involved by the 5th embodiment of the present invention
Enter ceramic bases 114 and the built-in type device involved by the first embodiment of the present invention of the sealing structure 104 of formula device
The difference of the ceramic bases 11 sealing structure 10 is, the metal column 204 in ceramic bases 114 is recessed by post body 204a and post
Fall into 204b to constitute.
Specifically, in the sealing structure 104 of the built-in type device involved by present embodiment, metal column 204 be by
The column structure that post body 204a and post depression 204b is constituted.As shown in figure 11, the length direction along post body 204a, at post
A part of body 204a, is formed with the post depression 204b arranging around post body 204a.Wherein, the radius of post body 204a is big
Radius in post depression 204b.In addition, post body 204a can be one-body molded with post depression 204b.
In the present embodiment, the contact interface with ceramic bases 114 at metal column 204, be formed concaveconvex structure (
In present embodiment, the radius less than post body 204a for the radius of post depression 204b), thus, metal column 204 and ceramic bases
The contact area of 114 increases further, in addition, the ceramic structure of ceramic bases 114 also can embed metal column 204.Therefore, compare
For the through hole that radius is not changed in, can more efficiently suppress moisture, gas or other compositions along metal column 204 with
The contact interface of ceramic bases 114 and to leak into sealing structure 104 outside, thus also can improve the biology sealing structure 104
Security and be chronically implanted reliability.
Although in addition, the ceramic base of the sealing structure 104 of built-in type device involved by the 5th embodiment of the present invention
The metal column 204 at the end 114 illustrates the situation of only one post depression 204b, it will be understood, however, to one skilled in the art, that this enforcement
The post depression of the metal column 204 of mode also can be two or more situation.
Additionally, the ceramic bases 114 of the sealing structure 104 of the built-in type device involved by the 5th embodiment of the present invention
The ceramic bases 11 of sealing structure 10 of the built-in type device involved by the first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 204.
Although being illustrated the present invention above in association with drawings and embodiments, but it is not intended to limit
The present invention, it will be appreciated that to those skilled in the art, without departing from the spirit and scope of the present invention, can
To carry out deforming and changing to the present invention, these deformation and change each fall within the scope of the claimed protection of the present invention.
For example, in above-mentioned first to the 5th embodiment, employ one set of die 40 and (include mold 41 and lower mold
42) make ceramic bases, but many molds also can be used to carry out.For example, when press ceramic blank, it is possible to use
One set of die 40, and another set of identical or different mould can be used when sintering ceramic green sheet.
Claims (9)
1. one kind has the artificial retina sealing structure, it is characterised in that:
In described sealing structure, accommodate electronic unit,
Described electronic unit electrically connects with the stimulating electrode of described sealing structural outer via the metal column as feed through pole,
Wherein, the manufacture method of described sealing structure includes:
Prepare the mould with multiple through hole for making ceramic green sheet；
Many metal columns are passed through the plurality of through hole；
Prepare ceramic powder, and described ceramic powder is filled into described mould；
Utilize described mould by compressing for described ceramic powder, form described ceramic green sheet, and make described metal column pass through institute
State the upper and lower surface of ceramic green sheet；And
Described metal column is sintered together with described ceramic green sheet, is consequently formed the ceramic bases with described metal column,
Described sintering during, along described metal column long side direction to described ceramic green sheet apply pressure.
2. artificial retina as claimed in claim 1, it is characterised in that:
Described mould by can constitute along the mold of the described long side direction relative movement of described metal column and lower mold,
Described mold is formed with the cavity of the shape determining described ceramic bases with described lower mold after assembling.
3. artificial retina as claimed in claim 1, it is characterised in that:
In described sintering process, keep the relative position of described metal column and described ceramic green sheet.
4. the artificial retina as described in any one in claims 1 to 3, it is characterised in that:
Described ceramic bases is made up of the aluminum oxide of more than 99%.
5. the artificial retina as described in any one in claims 1 to 3, it is characterised in that:
Described metal column is made up of at least one in platinum, iridium, niobium, tantalum or gold.
6. the artificial retina as described in any one in claims 1 to 3, it is characterised in that:
The minimum diameter of described metal column is 50 μm to 500 μm.
7. the artificial retina as described in any one in claims 1 to 3, it is characterised in that:
The particle diameter of described ceramic powder is 50 μm to 200 μm.
8. the artificial retina as described in any one in claims 1 to 3, it is characterised in that:
Described metal column is made up of the platinum of more than 99%.
9. the artificial retina as described in any one in claims 1 to 3, it is characterised in that:
It is added with dispersant and binding agent in described ceramic powder.
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| CN201610520882.3A CN106145963B (en) | 2015-12-31 | 2015-12-31 | Artificial retina with sealing structure |
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| CN201610520882.3A CN106145963B (en) | 2015-12-31 | 2015-12-31 | Artificial retina with sealing structure |
| CN201511033067.6A CN105503205B (en) | 2015-12-31 | 2015-12-31 | The manufacture method of the sealing structure of built-in type device |
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| CN109574637A (en) * | 2017-12-29 | 2019-04-05 | 深圳硅基仿生科技有限公司 | Ceramic substrate and its manufacturing method with feed through pole |
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| CN110039640A (en) * | 2019-04-04 | 2019-07-23 | 河北躬责科技有限公司 | A kind of ceramics feedthrough mold, green body and production method |
| CN111588983A (en) * | 2020-05-19 | 2020-08-28 | 微智医疗器械有限公司 | Method for manufacturing electrode array forming die, shaping method, clamping tool and medium |
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| CN111769049B (en) * | 2019-03-30 | 2022-08-05 | 深圳硅基仿生科技有限公司 | Sealing method of implantable device |
| CN109970463A (en) * | 2019-04-04 | 2019-07-05 | 河北躬责科技有限公司 | A kind of ceramic structures with holes and production method |
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| CN109574637A (en) * | 2017-12-29 | 2019-04-05 | 深圳硅基仿生科技有限公司 | Ceramic substrate and its manufacturing method with feed through pole |
| CN113068298A (en) * | 2017-12-29 | 2021-07-02 | 深圳硅基仿生科技有限公司 | Ceramic substrate for connecting electronic component and method for manufacturing the same |
| CN113099603A (en) * | 2017-12-29 | 2021-07-09 | 深圳硅基仿生科技有限公司 | Ceramic substrate for implantable medical device and method for manufacturing same |
| CN113099603B (en) * | 2017-12-29 | 2022-06-21 | 深圳硅基仿生科技有限公司 | Ceramic substrate for implantable medical device and method for manufacturing same |
| CN113068298B (en) * | 2017-12-29 | 2022-06-21 | 深圳硅基仿生科技有限公司 | Ceramic substrate for connecting electronic parts and method for manufacturing the same |
| CN110015890A (en) * | 2019-04-04 | 2019-07-16 | 河北躬责科技有限公司 | A kind of high density ceramic feedthrough production method |
| CN110039640A (en) * | 2019-04-04 | 2019-07-23 | 河北躬责科技有限公司 | A kind of ceramics feedthrough mold, green body and production method |
| CN114709073A (en) * | 2019-08-31 | 2022-07-05 | 深圳硅基仿生科技有限公司 | Winding method of planar coil |
| CN114709072A (en) * | 2019-08-31 | 2022-07-05 | 深圳硅基仿生科技有限公司 | Winding device for planar coil |
| CN114709072B (en) * | 2019-08-31 | 2024-04-02 | 深圳硅基仿生科技股份有限公司 | Winding device for planar coil |
| CN114709073B (en) * | 2019-08-31 | 2024-05-17 | 深圳硅基仿生科技股份有限公司 | Winding method of planar coil |
| CN111588983A (en) * | 2020-05-19 | 2020-08-28 | 微智医疗器械有限公司 | Method for manufacturing electrode array forming die, shaping method, clamping tool and medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105503205B (en) | 2016-08-24 |
| CN106145963B (en) | 2018-10-30 |
| CN105503205A (en) | 2016-04-20 |
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Address after: 518000 A, 4 building, 3 Ting Wei Industrial Park, 6 Baoan District Road, Xin'an, Shenzhen, Guangdong. Patentee after: Shenzhen Silicon Bionics Technology Co.,Ltd. Address before: 518000 A, 4 building, 3 Ting Wei Industrial Park, 6 Baoan District Road, Xin'an, Shenzhen, Guangdong. Patentee before: SHENZHEN SIBIONICS TECHNOLOGY Co.,Ltd. |