CN106361464B - The sealing structure of built-in type device - Google Patents
The sealing structure of built-in type device Download PDFInfo
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- CN106361464B CN106361464B CN201610986403.7A CN201610986403A CN106361464B CN 106361464 B CN106361464 B CN 106361464B CN 201610986403 A CN201610986403 A CN 201610986403A CN 106361464 B CN106361464 B CN 106361464B
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/02—Prostheses implantable into the body
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/36046—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation of the eye
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3758—Packaging of the components within the casing
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- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Neurosurgery (AREA)
- Neurology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Vascular Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Ophthalmology & Optometry (AREA)
- Cardiology (AREA)
- Transplantation (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Prostheses (AREA)
Abstract
The present invention provides a kind of sealing structure and its manufacturing method of built-in type device, which includes：Ceramic bases with upper and lower surface, and are formed with one or more through-hole of perforation upper surface and lower surface；Metal column, filling through-hole are formed with concaveconvex structure in the contact interface with ceramic bases of metal column.In the sealing structure of built-in type device according to the present invention, it is formed with concaveconvex structure in the contact interface of metal column and ceramic bases, thus, it is possible to improve the contact area of metal column and ceramic bases.Therefore, for the constant through-hole of radius compared with the prior art, it can more efficiently inhibit moisture, gas or other compositions to be leaked into outside sealing structure along metal column and the contact interface of ceramic bases, thus, it is possible to improve the air-tightness of sealing structure.
Description
The application isOn November 03rd, 2015, application No. is201510737633.5, it is entitledImplantation The sealing structure and its manufacturing method of formula deviceDivisional application.
Technical field
The present invention relates to the sealing structure of built-in type device and its manufacturing methods.
Background technology
Currently, built-in type device has been widely used for restoring body function, improving quality of life or save life etc.
Various aspects.Such built-in type device is for example including being implanted into internal pacemaker, deep brain stimulator, artitificial ear
Snail, artificial retina etc..
It is implanted to internal implanted device in vivo since built-in type device needs implant and retain for a long time
Part needs to face internal complex physiologic environment, and this physiological environment condition is often harsh, and built-in type device has after being chronically implanted
It may interact with surrounding tissue and organ, such as the material of built-in type device can occur aging, degradation, cracking, be crosslinked again
Deng physically or chemically reacting, to adversely affect the bad biological respinse such as causing inflammation to implantation object.Therefore, right
For built-in type device, biological safety, the requirement for being chronically implanted reliability etc. are all very high.In general, in order to ensure implantation
The biological safety of formula device is chronically implanted reliability etc., on the one hand needs with biological safety and to be chronically implanted reliability good
Good seal casinghousing by the abiotic security component in built-in type device such as silicon base chip, printed circuit board (PCB) with
It is implanted position (such as blood, tissue or bone) isolation；On the other hand, it is also necessary to from the seal casinghousing draw for example with stimulation
Component carries out the function conducting wire of signal interaction.
In view of the biological safety of built-in type device, seal casinghousing is usually with the good glass of biological safety, ceramics
Deng being used as substrate (substrate), and formed bys covering good metal cap body of biological safety etc. in substrate close
Seal structure.In such sealing structure, substrate usually has multiple through-holes (via), logical filled with metal in these through-holes
Road (feedthrough).In addition, the electronic unit being encapsulated in inside the seal casinghousing via these metal passages and with outside
Carry out signal interaction.
Invention content
In the sealing structure of existing built-in type device, usually opened (drill) in brills such as ceramic green sheets as substrate
Then multiple cylindrical holes are inserted into the metal column (such as platinum column) substantially adapted to through-hole diameter in these through-holes,
Then it is sintered in the case where the through-hole of metal column and ceramic green sheet contacts, makes the cylinder of metal column and ceramic green sheet
Shape through-hole fits closely and forms the ceramic bases with metal column.Then, ceramic bases and metal-back are welded, to make pottery
Porcelain substrate fits together with metal-back and forms sealing structure.
However, in the sealing structure of existing built-in type device, the contraction or expansion that metal and ceramics is utilized carrys out shape
At fitting closely for metal column and the through-hole of ceramic bases.In this case, due to the sintering in metal column and ceramic bases
During (cofiring) processing, ceramic green sheet as ceramic bases often uneven heating and cause metal column in each through-hole
Contraction or expansion degree is different, as a result, the stickiness of the through-hole of metal column and ceramic green sheet is bad, leads to existing sealing structure
Air-tightness it is bad.
The inventors of the present invention think after long-term practical experience, the bad master of air-tightness of above-mentioned existing sealing structure
It is, the coefficient of thermal expansion (CTE of ceramic green sheet and the metal column in the through-hole being filled in the ceramic green sheet：
Coefficient of thermal expansion) it is not fully identical, it is not easy to find the ceramic green sheet that CTE is exactly matched
And metal column, therefore, in this case, after ceramic green sheet is sintered together with metal column using above-mentioned existing technique, gold
Belong to column is bonded untight problem with how much the through-hole of ceramic green sheet will appear, causes the air-tightness of sealing structure bad.
The present invention completes in view of the situation of the above-mentioned prior art, and its purpose is to provide one kind capable of improving air-tightness
The sealing structure and its manufacturing method of the built-in type device of energy.
An aspect of of the present present invention is related to the sealing structure of built-in type device comprising：Ceramic bases, with upper surface and
Lower surface, and it is formed with the more than one through-hole of perforation upper surface and lower surface；Metal column fills through-hole, in metal
The contact interface with ceramic bases of column, is formed with concaveconvex structure.
In the sealing structure of built-in type device according to the present invention, in the contact interface of metal column and ceramic bases,
It is formed with concaveconvex structure, thus, it is possible to improve the contact area of metal column and ceramic bases.Therefore, half compared with the prior art
For the constant through-hole of diameter, it can more efficiently inhibit moisture, gas or other compositions along metal column and ceramic bases
Contact interface and leak into outside sealing structure, thus, it is possible to improve the biological safety of sealing structure and be chronically implanted reliable
Property.
In addition, in the sealing structure of built-in type device according to the present invention, optionally, ceramic bases are by 99% or more
Aluminium oxide constitute.In this case, the biological safety of ceramic bases and it is formed by the air-tightness of sealing structure more preferably.
In addition, in the sealing structure of built-in type device according to the present invention, optionally, the thickness of ceramic bases is
0.25mm or more and 0.75mm or less.
In addition, in the sealing structure of built-in type device according to the present invention, optionally, metal column by be selected from platinum, iridium,
At least one of niobium, tantalum or gold are constituted.
In addition, in the sealing structure of built-in type device according to the present invention, optionally, through-hole in the straight of upper surface
Diameter is 0.1mm or more and 0.5mm or less.
Another aspect of the present invention relates to built-in type device sealing structure manufacturing method comprising following steps：
Prepare metal column, and in a part for metal column, concaveconvex structure is formed with along the length direction of metal column；Metal column is inserted
There is a part for concaveconvex structure into the formation of ceramic paste, and ceramic paste covering metal column；By ceramic paste compression moulding,
Form ceramic green sheet；And metal column is sintered together with ceramic green sheet, the ceramic bases with metal column are consequently formed.
In the manufacturing method of the sealing structure of built-in type device according to the present invention, due in metal column and ceramic base
The contact interface at bottom forms concaveconvex structure, therefore, can be more for the through-hole that radius compared with the prior art does not change
Moisture, gas or other compositions are effectively inhibited to leak into outside sealing structure along metal column and the contact interface of ceramic bases
Portion, thus, it is possible to improve the biological safety of sealing structure and be chronically implanted reliability.
In addition, in the manufacturing method of the sealing structure of built-in type device according to the present invention, optionally, ceramic bases
It is made of 99% or more aluminium oxide.In this case, the biological safety of made ceramic bases and be formed by it is close
The air-tightness of seal structure is more preferably.
In addition, in the manufacturing method of the sealing structure of built-in type device according to the present invention, optionally, ceramic bases
Thickness be 0.25mm or more and 0.75mm or less.
In addition, in the manufacturing method of the sealing structure of built-in type device according to the present invention, optionally, metal column by
It is constituted selected from least one of platinum, iridium, niobium, tantalum or gold.Thereby, it is possible to obtain air-tightness better seal structure.
In addition, in the manufacturing method of the sealing structure of built-in type device according to the present invention, optionally, through-hole
The a diameter of 0.1mm or more and 0.5mm or less of the upper surface of ceramic bases.
According to the sealing structure and its manufacturing method of built-in type device according to the present invention, it is capable of providing air-tightness and obtains
To the sealing structure of improved built-in type device.
Description of the drawings
Fig. 1 shows the stereochemical structure of the sealing structure of the built-in type device involved by the first embodiment of the present invention
Figure.
Fig. 2 shows the schematic internal views of the sealing structure of built-in type device shown in FIG. 1.
Fig. 3 shows the plan view of the ceramic bases of the sealing structure of built-in type device shown in FIG. 1.
Fig. 4 shows sealing structure the cutting along the straight line I-I ' ceramic bases intercepted of built-in type device shown in Fig. 3
Face figure.
Fig. 5 shows the structural schematic diagram of the metal column of the sealing structure of built-in type device.
Fig. 6 shows the ceramic bases of the sealing structure of the built-in type device involved by the first embodiment of the present invention
The flow chart of making step.
Fig. 7 (Fig. 7 (A) to Fig. 7 (E)) shows the sealing of the built-in type device involved by the first embodiment of the present invention
The schematic diagram of the making step of the ceramic bases of structure.
Fig. 8 shows the ceramic bases of the sealing structure of the built-in type device involved by second embodiment of the present invention
Schematic section.
Fig. 9 shows the ceramic bases of the sealing structure of the built-in type device involved by third embodiment of the present invention
Schematic section.
Figure 10 shows the ceramic bases of the sealing structure of the built-in type device involved by the 4th embodiment of the present invention
Schematic section.
Symbol description：
10,101,102,103 ... sealing structure, 11,111,112,113 ... ceramic bases, 11c ... through-holes, 12 ... metals
Ring, 13 ... metal covers, the upper surfaces 11a ..., the lower surfaces 11b ..., 20,201,202,203 ... metal columns, 20a ... column ontologies,
20b ... column protrusions, 30 ... electronic units, 40 (40a, 40b) ... molds.
Specific implementation mode
Hereinafter, the preferred embodiment of the present invention is described in detail with reference made to the accompanying drawings.In the following description, for identical
Component assigns identical symbol, and the repetitive description thereof will be omitted.Scheme in addition, attached drawing is only schematical, the mutual size of component
Ratio or the shape etc. of component can be with actual difference.
Sealing structure 10 according to the present invention can be adapted for built-in type device for example including being implanted into the internal heart
Dirty pacemaker, deep brain stimulator, artificial cochlea, artificial retina etc..In addition, the sealing structure 10 involved by present embodiment
It is also especially suitable for high density ceramic encapsulation.
Further, since the sealing structure 10 involved by present embodiment needs to be placed in the internal of implantation object, therefore, for
For those skilled in the art, it is readily understood that arrive, the sealing structure according to the present invention with blood, tissue or bone-contact
10 exterior material (including be described later on ceramic bases 11, becket 12, metal cover 13 and be filled in ceramic bases 11
The constituent material etc. of the metal column 20 of through-hole) all need to meet required standard (such as ISO 10993 (international standard), GB/T
16886 (Chinese Industrial Standards (CIS)s)) biological safety and be chronically implanted reliability.
(first embodiment)
Fig. 1 shows the stereochemical structure of the sealing structure 10 of the built-in type device involved by the first embodiment of the present invention
Figure.Fig. 2 shows the schematic internal views of the sealing structure 10 of built-in type device shown in FIG. 1.
As depicted in figs. 1 and 2, the sealing structure 10 of the built-in type device involved by first embodiment of the invention includes
Ceramic bases 11, becket 12 and metal cover 13.Specifically, sealing structure 10 by ceramic bases 11 be arranged (such as
Welding) there are becket 12 and metal cover 13 and is formed to have the seal of the accommodation space for accommodating electronic unit 30.
In addition, as shown in Figure 1, sealing structure 10 is in the shape of approximately cuboid.In the present embodiment, typical implantation
The size of the sealing structure 10 of formula device is, for example, length 10mm × width 10mm × thickness 5mm.
In the present embodiment, ceramic bases 11 can be by aluminium oxide (chemical formula Al2O3Comprising the sapphire of monocrystalline and
Ruby or polycrystalline α-Al2O3), zirconium oxide (chemical formula ZrO2Comprising magnesia partial stabilized zirconia (Mg-PSZ)),
The structures such as the tetragonal zirconia polycrystal (Y-TZP) of stabilized with yttrium oxide or the tetragonal zirconia polycrystal (Ce-TZP) of ceria stabilized
At.
In the present embodiment, ceramic bases 11 are preferably by the aluminium oxide (Al of 96% or more (mass fraction, similarly hereinafter)2O3)
It constitutes.In addition, ceramic bases 11 are more preferably made of 99% or more aluminium oxide.In addition, ceramic bases 11 most preferably by
99.99% or more aluminium oxide is constituted.In general, in ceramic bases 11, with aluminium oxide (Al2O3) mass fraction increasing
Add, principal crystalline phase increases, and the physical property of ceramic bases 11 is also gradually increased, such as compression strength (MPa), bending strength (MPa),
Elasticity modulus (GPa) also correspondingly improves, it is possible thereby to think to will present better biological safety and long-term reliability.
In the present embodiment, the thickness of ceramic bases 11 is not particularly limited, such as can be 0.1mm or more and 2mm
Below.In the present embodiment, the thickness of ceramic bases 11 is preferably 0.25mm or more and 0.75mm or less.
In the present embodiment, becket 12 is shaped generally as the banded structure of annular.Becket 12 is along ceramic bases
11 edge (being rectangular four side here, referring to Fig. 3) is arranged and welds (such as soldering) in ceramic bases 11.Becket
12 thickness (i.e. the thickness of ring wall) is not particularly limited, such as the ring wall thickness of becket 12 is in the present embodiment
0.5mm just can reach good support strength.In addition, the height of becket 12 is (i.e. along the upper surface with ceramic bases 11
Or the height of the ring wall on the orthogonal direction in lower surface) can be according to the big of the accommodation space of above-mentioned mentioned sealing structure 10
It is small and determine, it is however generally that, as long as can ensure the electronic unit 30 in accommodation space.
In addition, metal cover 13 is arranged on becket 12, such as can be by laser welding by metal cover 13 and becket
12 weld together.Ceramic bases 11, becket 12 and the metal cover 13 fitted together as a result, constitutes the close of present embodiment
Seal structure 10.
Here, ceramics and the welding (such as soldering) of metal and welding (such as laser welding) skill of metal and metal
Art belongs to that well known to a person skilled in the art technologies, therefore, in the present specification, about ceramics and metal and metal with
The welding technique of metal will not be described in great detail.
In the present embodiment, becket 12 and metal cover 13 can by titanium and its alloy, noble metal (including gold, silver and
Platinum group metal (ruthenium, rhodium, palladium, osmium, iridium, platinum)) and its alloy, medical grade (biograde) stainless steel, tantalum, niobium, Nitinol
(Nitinol) or the compositions such as nickel cobalt chrome molybdenum (MP35N).In addition, in the present embodiment, becket 12 and metal cover 13
It can be made of, can also be made of different metal materials identical metal material.In addition, becket 12 preferably by titanium or
Titanium alloy material is constituted.Metal cover 13 titanium or titanium alloy material it is also preferred that be made of.
Furthermore in order to simplify manufacturing process, in the sealing structure 10 involved by present embodiment, becket 12 and metal
Lid 13 can also be integrally formed.
In the present embodiment, it is in approximately cuboid shape notwithstanding sealing structure 10, but sealing structure 10
Shape is not particularly limited, and can be other regular shapes such as cylindric, elliptic cylindrical shape, triangle column, can also be
Irregular shape (including regular shape and irregular shape be combined into shape).
As shown in Fig. 2, in sealing structure 10 (being specifically the accommodation space of sealing structure 10), electronic unit is accommodated
30.In the present embodiment, electronic unit 30 can include such as resistor, electricity by being made on printed circuit board (PCB)
The discrete components such as container or inductor or IC chip (IC) such as application-specific integrated circuit (ASIC), electric erasable are only
It reads memory (EEPROM) etc. and constitutes.
In addition, electronic unit 30 is via the metal column 20 being described later on and (not with the functional component outside sealing structure 10
Diagram) electrical connection.In the present embodiment, electronic unit 30 can for example be played to input signal, stimulus signal or detection letter
Number etc. various signals carry out the effects of signal processings.
As shown in Fig. 2, ceramic bases 11 have upper surface 11a and lower surface 11b.In addition, the upper surface of ceramic bases 11
11a and lower surface 11b can be substantially parallel to each other each other.13 groups of ceramic bases 11, becket 12 and metal cover are being filled with structure
When at sealing structure 10, first metal pattern can be carried out in the upper surface 11a of ceramic bases 11 and lower surface 11b respectively and carry out shape
At specific connection line.Then, the ceramic bases 11 (such as upper surface 11a with connection line) after patterning can example
(bonding) is such as engaged with electronic unit 30 by welding.Wherein, the step of metal pattern may include metal deposit, light
The Conventional process steps such as quarter, etching, since these Conventional process steps belong to known technology, which is not described herein again.
Fig. 3 shows the plan view of the ceramic bases 11 of the sealing structure 10 of built-in type device.Fig. 4 is shown shown in Fig. 3
Built-in type device sealing structure 10 along the straight line I-I ' ceramic bases 11 intercepted sectional view.
As shown in Figure 3 and Figure 4, ceramic bases 11 have multiple through-hole 11c.In the present embodiment, ceramic bases 11 have
There is the through-hole 11c for being arranged in 5 × 4 arrays.In addition, each through-hole 11c penetrates through ceramic bases 11 and reaches the upper of ceramic bases 11
Surface 11a and lower surface 11b.In other words, ceramic bases 11 are formed with the through-hole 11c of perforation upper surface 11a and lower surface 11b.
Here, the central axis direction of through-hole 11c can be substantially vertical with the upper surface 11a of ceramic bases 11 and lower surface 11b.In addition,
The central axis direction of through-hole 11c can also be formed with inclined angle with the upper surface 11a and lower surface 11b of ceramic bases 11.
In the present embodiment, although showing that the quantity of through-hole 11c is 20 (5 × 4), the number of through-hole 11c
Amount is not particularly limited, and the quantity of through-hole 11c can determine according to specific needs, such as the quantity of through-hole 11c can be 1
It is a, or 2 or more.
Although the diameter in upper surface of through-hole 11c is not particularly limited, for high density ceramic encapsulation viewpoint,
Diameters of the through-hole 11c in upper surface can be 0.1mm or more and 0.5mm or less.
As shown in Figure 3 and Figure 4, metal column 20 is filled in through-hole 11c.That is, metal column 20 can be solid construction.But
It is that in the present embodiment, metal column 20 can also be hollow column structure (not shown), as long as ensureing in through-hole 11c
The upper surface 11a of ceramic bases 11 can be electrically connected by metal column 20 with lower surface 11b.
In addition, in the present embodiment, in the contact interface with ceramic bases 11 of metal column 20, being formed with concave-convex knot
Structure.Hereinafter, with reference to figure 5, it is described more fully the cylinder 20 and metal column of the sealing structure 10 involved by present embodiment
20 with the contact interfaces of ceramic bases 11.
Fig. 5 shows the structural schematic diagram of the metal column 20 of the sealing structure 10 of built-in type device.As shown in figure 5, at this
In embodiment, metal column 20 is the column structure being made of column ontology 20a and column protrusion 20b.Specifically, as shown in figure 5,
Along column ontology 20a (radius r1) length direction, a part of column ontology 20a be formed with around column ontology 20a be arranged
Column protrusion 20b (radius r2).Wherein, the radius r of column ontology 20a1Less than the radius r of column protrusion 20b2.In addition, column ontology
20a can be integrally formed with column protrusion 20b.
In the present embodiment, concaveconvex structure is formed with (at this in the contact interface of metal column 20 and ceramic bases 11
In embodiment, the radius r of column protrusion 20b2More than the radius r of column ontology 20a1), metal column 20 and ceramic bases 11 as a result,
Contact area greatly increases.Therefore, for the through-hole that radius compared with the prior art does not change, can more efficiently press down
Moisture, gas or other compositions processed are leaked into along metal column 20 and the contact interface of ceramic bases 11 outside sealing structure 10
Portion, thus, it is possible to improve the biological safety of sealing structure 10 and be chronically implanted reliability.
As the exemplary of high density ceramic encapsulation, the spacing between the central shaft and central shaft of adjacent metal column 20
Such as can be 0.1mm or more and 1mm hereinafter, preferably 0.25mm or more and 0.5mm or less.
In addition, metal column 20 can be constituted by being selected from least one of platinum, iridium, niobium, tantalum or gold.For biological safety
With the viewpoint for being chronically implanted reliability, metal column 20 is preferably made of platinum, is more preferably made of 99% or more platinum.
In addition, height (i.e. radius rs of the column protrusion 20b from column ontology 20a protrusions2With radius r1Difference) be not particularly limited,
But there is the height of apparent (separate column ontology 20a) outward protrusion relative to the column ontology 20a of metal column 20.Preferably,
Column protrusion 20b is from metal column 20 towards the half of the column ontology 20a that the height of outside (far from column ontology 20a) protrusion is metal column 20
Diameter r1One third more than and half below.In this case, the column protrusion 20b in metal column 20 can be with ceramics
The ceramic structure of substrate 11 more fully contacts, the effect fitted closely thus, it is possible to improve metal column 20 and ceramic bases 11
Fruit.
The output end (not shown) of electronic unit 30 can be electrically connected via solder or lead with metal column 20, then, then
It is electrically connected with the functional component outside sealing structure 10 via metal column 20, electronic unit 30 can be realized and be sealed as a result,
The signal interaction of functional component outside structure 10.
In addition, in the assembling process of sealing structure 10, such as installed in electronic unit 30 and be welded on ceramic bases 11
After upper, ceramic bases 11 are arrived into the welding of becket 12 (such as soldering), then the resins such as silica gel, epoxy resin are used to fill electronics
Gap between component 30 and ceramic bases 11 or other positions, and metal cover 13 is welded (e.g., laser welded) to ceramic base
Bottom 11 obtains the sealing structure 10 involved by present embodiment as a result,.
Here, the quantity of metal column 20 is corresponding with the quantity of through-hole 11c.In addition, in the present embodiment, although showing
Metal column 20 is made of the column protrusion 20b of the column ontology 20a of generally cylindrical body and generally cylindrical body, but metal column 20 also may be used
To be other shapes, such as metal column 20 can be made of (not the column protrusion of the column ontology of generally rectangular bodies and generally rectangular bodies
Diagram).In addition, metal column 20 can also by generally cylindrical body column ontology and have cylinder jaggy (such as fan-shaped cylinder
(including continuous and separation sector)) column protrusion 20b constitute.
Hereinafter, with reference to figure 6 and Fig. 7 (Fig. 7 (A) to Fig. 7 (E)), the sealing knot involved by present embodiment is explained in detail
The production method of the ceramic bases 11 of structure 10.Fig. 6 shows the sealing structure 10 involved by the first embodiment of the present invention
The flow chart of the making step of ceramic bases 11.Fig. 7 (A) to Fig. 7 (E) is shown involved by the first embodiment of the present invention
The schematic diagram of the making step of the ceramic bases 11 of sealing structure 10.
When the ceramic bases 11 of the sealing structure 10 of the built-in type device as manufacture, by the making of metal column 20,
The known method of the making of ceramic paste (paste), the making of ceramic green sheet etc. makes the sealing structure for including metal column 20
10 ceramic bases 11.Then, in order to make fitting closely for metal column 20 and ceramic green sheet, by de- binder process, sintering
The processes such as process complete the making of the ceramic bases 11 of sealing structure 10.
In general, the particle of ceramic powder is thinner, activation degree is higher, then powder is easy for being sintered, and sintering temperature is got over
It is low.Therefore, the ceramic paste for ceramic bases 11 in the present invention is, for example, 10nm to 100nm's it is preferable to use average grain diameter
Ceramic powders.By making the average grain diameter of ceramic paste fall in the range, so as to make the good ceramic blank of compactness
Piece.
Ceramic paste by with homogeneous mixer by after the mixing such as ceramic powders, binder, organic carrier, in three-roller
Or is disperseed in ball mill, rod mill, is kneaded to make.
Above-mentioned organic carrier is that binder resin is made to be dissolved in organic carrier obtained from solvent.Made as organic carrier
Binder resin is not particularly limited, and may be exemplified the common various binder trees such as ethyl cellulose, acrylic resin
Fat.In addition, solvent used in organic carrier is it is not also specifically limited, using common solvent such as water, ethyl alcohol.
Hereinafter, on one side referring to figure 6 and figure 7, illustrating the ceramic bases of the sealing structure 10 involved by present embodiment on one side
11 manufacturing method.In addition, in Fig. 7 (A) to Fig. 7 (E), understands for convenience, illustrate only the ceramics for including 4 metal columns
The schematic diagram of the manufacturing process of substrate 11, but in actual fabrication, can make as needed respective numbers (such as one or
Two or more) metal column.
First, prepare metal column 20 to be formed with along the length direction of metal column 20 recessed in a part for the metal column 20
Male structure (that is, radius is more than the structure of the column protrusion 20b of the radius of the column ontology 20a of metal column 20) (referring to Fig. 7 (A)).Separately
Outside, prepare the ceramic paste (ceramic for constituting Fig. 3 and ceramic bases shown in Fig. 4 11 (including metal column 20) after being burnt into
Paste) (step S1).Here, the length of the metal column 20 prepared is more than the thickness h of the ceramic bases 11 after firing.For
Viewpoint easy to operation, the length of the metal column 20 prepared are about the three times of the thickness h of the ceramic bases 11 after being burnt into or more.
In addition, the metal column 20 prepared can be for example made of 99% or more platinum.The ceramic paste allocated is for example with quality point
Aluminium oxide (the Al that number is 96% or more2O3) it is principal component, there is mobility appropriate.In addition, ceramic paste can add suitably
Dispersant, binder of ratio etc..
Then, ready ceramic paste is loaded into the 40 (mould of mold of the sealing structure 10 involved by present embodiment
Tool 40 includes lower mold 40a and upper mold 40b, is specifically lower mold 40a here, referring to Fig. 7 (B)), wait for that ceramic paste has loaded
After lower mold 40a, metal column 20 is inserted into the above-mentioned ceramic paste in lower mold 40a, and by lower mold 40a and upper mold
40b is fitted together.
Then, the mold 40 lower mold 40a and upper mold 40b assembled stands the stipulated time (such as 60 minutes),
Ceramic paste is set to be come into full contact with metal column 20.In the present embodiment, upper mold 40b can be along the inner wall of lower mold 40a
(i.e. with the bottom surface generally perpendicular direction of lower mold 40a) is mobile in above-below direction.
Here, the shape for the inner space that upper mold 40b and lower mold 40a are composed corresponds roughly to present embodiment
The shape of made sealing structure 10.Therefore, the shape for the inner space that upper mold 40b and lower mold 40a are composed can
Changed with the variation according to the shape of made sealing structure 10, such as when sealing structure 10 is generally cylindrical structure
When, the shape for the inner space that upper mold 40b and lower mold 40a are composed also is generally cylindrical structure.
In addition, the position of metal column 20 can be positioned by the corresponding aperture on the mold 40 of sealing structure 10 (referring to Fig. 7
(C)).In addition, in mold 40, metal column 20 is inserted into ceramic paste, and metal column 20 is completely covered in ceramic paste
Formation have the part (step S2) of concaveconvex structure.Before sintering, the height of ceramic paste e.g., about 1mm~2.5mm.This
In, the degree of the concaveconvex structure of ceramic paste covering metal column 20 is that ceramic body remains able to cover the part after ensureing sintering,
That is the height h of sintered metal column 201Less than the thickness h of ceramic bases 11, it is preferable that the height h of metal column 201About make pottery
The half of the thickness h of porcelain substrate 11.
Then, in order to form ceramic bases 11 shown in Fig. 4 mould is utilized under such as 150~350 DEG C of temperature condition
Tool 40 is by ceramic paste compression moulding (that is, upper mold 40b to be placed in the ceramic paste of lower mold 40a along upper and lower directions compacting
Body), form the ceramic green sheet (step S3) needed for ceramic bases 11.In above-mentioned pressing process, such as in ceramic paste
Excessive gas and moisture can from setting lower mold 40a escape orifices it is (not shown) discharge.Here, the molding side of ceramic green sheet
Method can also use the methods of currently known gel forming, injection moulding or injection forming.Material can used in mold 40
To be selected according to different forming methods.
In the forming process of ceramic green sheet, ceramic paste is further contacted with metal column 20, to be conducive to metal column
Tight structure is formed between 20 and ceramic structure.
Then, the ceramic green sheet with metal column 20 is sintered.In the present embodiment, sintering temperature is, for example,
1300~1650 DEG C, more preferably 1450~1650 DEG C.During ceramic post sintering, in the aluminium oxide of glass phase towards metal column
20 direction starts to shrink at, and aluminium oxide is made to be fitted closely with metal column 20, formed with metal column 20 ceramic bases 11 (referring to
Fig. 7 (D)) (step S4).
Finally, it will be removed from 11 surface of ceramic bases extra metal column 20 outstanding.Alternatively, it is also possible to right as needed
Ceramic bases 11 are polished.The ceramic bases 11 (referring to Fig. 7 (E)) (step S5) involved by present embodiment are obtained as a result,.
Furthermore it is possible to which obtained ceramic bases 11 are cut into monolithic.The method of singualtion is not particularly limited, can be with
Enumerate inner circle cutting method, outer circle patterning method, the crush-cutting process of chopping or the scribing skill in using a kitchen knife in cookery, laser cutting method etc..
In the manufacturing process of above-mentioned sealing structure, the condition in binder process that takes off can be 10 in partial pressure of oxygen~
21atm or more and 10~16atm are hereinafter, and hydrogen concentration is highest in 0.1% or more and 4.0% nitrogen hydrogen mixeding gas below
Holding temperature carries out under the conditions of being 650 DEG C or more and 850 DEG C below.Heating rate, retention time are not particularly limited, such as
It is 0.1wt% or less to make residual carbon amounts.
As the sintering furnace used in sintering circuit, such as it may be exemplified lifting type batch-type atmosphere sintering furnace, push rod
Formula stove, band oven etc..
Preferably as sintering condition, such as with 300 DEG C/h or more and 1500 DEG C/h heating rates below, when holding
Between be 10 minutes or more and 2 hours hereinafter, atmosphere be nitrogen, hydrogen and vapor coexist under atmosphere and hydrogen concentration is more than 0.1%
And 4.0% or less carries out.
Further optionally, roller grinding, sandblasting such as can will for example be passed through with the obtained ceramic bases of upper type 11
Implement end surface grinding, the lotion of burn-back metal pattern, in the upper surface 11a or lower surface 11b shapes of ceramic bases 11
At connecting lead wire.
In addition, after ceramic bases 11 make, electronic unit 30 is for example installed to by welding in ceramic bases 11,
Becket 12 is soldered to ceramic bases 11, then with silica gel etc. fill gap between electronic unit 30 and ceramic bases 11 or
Other positions, and metal cover 13 is welded into (laser welding) and arrives ceramic bases 11, the sealing that air-tightness is improved is obtained as a result,
Structure 10.
More than, it explains the embodiment of the present invention, but the present invention is at all not limited to the above embodiment,
Various changes can be carried out to be applicable in the range of without departing from spirit of the invention.
(second embodiment)
Hereinafter, with reference to figure 8, illustrate the sealing structure 101 of the built-in type device involved by second embodiment of the present invention.
Fig. 8 shows the ceramic base of the sealing structure 101 of the built-in type device involved by second embodiment of the present invention
The schematic section at bottom 111.For convenience of description, sealing structure 101 here illustrate only with involved by first embodiment
Built-in type device the different part of sealing structure 10.As shown in figure 8, the implantation involved by second embodiment of the present invention
The ceramic bases 111 of the sealing structure 101 of formula device are close with the built-in type device involved by first embodiment of the invention
The ceramic bases 11 of seal structure 10 the difference lies in that the metal column 201 in ceramic bases 111 by column ontology 201a and two columns
Protrusion 201b is constituted.
Specifically, in the sealing structure 101 of built-in type device involved by present embodiment, in present embodiment
In, metal column 201 is the column structure being made of column ontology 201a and two column protrusion 201b.As shown in figure 8, along column ontology
201a (radius r11) length direction, be formed at different two of a part of column ontology 201a around column ontology 201a
(radius is r to two column protrusion 201b being arranged21).Wherein, the radius r of column ontology 201a11Less than two column protrusion 201b's
Radius r21.In addition, column ontology 2011a can be integrally formed with two column protrusion 20b.
In the present embodiment, in the contact interface with ceramic bases 111 of metal column 201, be formed with concaveconvex structure (
In present embodiment, the radius r of two column protrusion 201b21More than the radius r of column ontology 201a11), as a result, metal column 201 with
The contact area of ceramic bases 111 further increases.Therefore, for the through-hole that radius compared with the prior art does not change,
Moisture, gas or other compositions can be more efficiently inhibited to be let out along the contact interface of metal column 201 and ceramic bases 111
It drains to outside sealing structure 101, thus can also improve the biological safety of sealing structure 101 and is chronically implanted reliability.
In addition, although the ceramic base of the sealing structure 101 of built-in type device involved by second embodiment of the present invention
The metal column 201 at bottom 111 shows the situation of only two column protrusion 201b, it will be understood, however, to one skilled in the art, that this implementation
The column protrusion 201b of the ceramic bases 111 of mode can also be three or three or more situations.
In addition, although showing the radius r of two column protrusion 201b in the present embodiment21It is equal, but two columns are prominent
Playing the radius of 201b can also be different.
In addition, the ceramic bases 111 of the sealing structure 101 of built-in type device involved by second embodiment of the present invention
First embodiment of the manufacturing method with the present invention involved by built-in type device sealing structure 10 ceramic bases 11
Manufacturing method is essentially identical, the difference is that only the above structure of prepared metal column 201.
(third embodiment)
Hereinafter, with reference to figure 9, illustrate the sealing structure 102 of the built-in type device involved by third embodiment of the present invention.
Fig. 9 shows the ceramic base of the sealing structure 102 of the built-in type device involved by third embodiment of the present invention
The schematic section at bottom 112.For convenience of description, sealing structure 102 here illustrate only with involved by first embodiment
Built-in type device the different part of sealing structure 10.As shown in figure 9, the implantation involved by third embodiment of the present invention
The ceramic bases 112 of the sealing structure 102 of formula device are close with the built-in type device involved by first embodiment of the invention
The ceramic bases 11 of seal structure 10 the difference lies in that the metal column 202 in ceramic bases 112 is dashed forward by column ontology 202a and screw thread
202b is played to constitute.
Specifically, in the sealing structure 102 of built-in type device involved by present embodiment, in present embodiment
In, metal column 202 is the column structure being made of column ontology 202a and threaded bosses 202b.As shown in figure 9, along column ontology
202a (radius r12) length direction be formed with the screw thread around column ontology 202a setting in a part of column ontology 202a
Protrusion 202b (radius r22).Wherein, the radius r of column ontology 202a12Radius r less than threaded bosses 202b22.In addition, column sheet
Body 202a can be integrally formed with threaded bosses 202b.
In the present embodiment, in the contact interface with ceramic bases 112 of metal column 202, be formed with concaveconvex structure (
In present embodiment, the outer diameter r of threaded bosses 202b22More than the radius r of column ontology 202a12), as a result, metal column 202 with pottery
The contact area of porcelain substrate 112 further increases, and threaded bosses 202b is more easily embedding with the ceramic structure of ceramic bases 112
It closes.Therefore, for the through-hole that radius compared with the prior art does not change, can more efficiently inhibit moisture, gas or
Other compositions are leaked into along metal column 202 and the contact interface of ceramic bases 112 outside sealing structure 102, thus also can
It enough improves the biological safety of sealing structure 102 and is chronically implanted reliability.
In addition, the ceramic bases 112 of the sealing structure 102 of built-in type device involved by third embodiment of the present invention
First embodiment of the manufacturing method with the present invention involved by built-in type device sealing structure 10 ceramic bases 11
Manufacturing method is essentially identical, the difference is that only the above structure of prepared metal column 202.
(the 4th embodiment)
Hereinafter, with reference to figure 10, illustrate the sealing structure of the built-in type device involved by the 4th embodiment of the present invention
103。
Figure 10 shows the ceramic base of the sealing structure 103 of the built-in type device involved by third embodiment of the present invention
The schematic section at bottom 113.For convenience of description, sealing structure 103 here illustrate only with involved by first embodiment
Built-in type device the different part of sealing structure 10.As shown in Figure 10, the plant involved by the 4th embodiment of the invention
Enter the built-in type device involved by first embodiment of the ceramic bases 113 of the sealing structure 103 of formula device with the present invention
The ceramic bases 11 of sealing structure 10 the difference lies in that the metal column 203 in ceramic bases 113 is recessed by column ontology 203a and column
203b is fallen into constitute.
Specifically, in the sealing structure 10 of built-in type device involved by present embodiment, in the present embodiment,
Metal column 203 is the column structure being made of column ontology 203a and column recess 203b.As shown in Figure 10, along column ontology 203a
(radius r13) length direction be formed with the column recess around column ontology 203a setting in a part of column ontology 203a
203b (radius r23).Wherein, the radius r of column ontology 203a13More than the radius r of column recess 203b23.In addition, column ontology 203a
It can be integrally formed with column recess 203b.
In the present embodiment, in the contact interface with ceramic bases 113 of metal column 203, be formed with concaveconvex structure (
In present embodiment, the radius r of column recess 203b23Less than the radius r of column ontology 203a13), as a result, metal column 203 with ceramics
The contact area of substrate 113 further increases, in addition, the ceramic structure of ceramic bases 113 can also be embedded in metal column 203.Therefore,
For the through-hole that radius compared with the prior art does not change, it can more efficiently inhibit moisture, gas or other compositions
It leaks into outside sealing structure 103, thus can also improve close along metal column 203 and the contact interface of ceramic bases 113
The biological safety of seal structure 103 and it is chronically implanted reliability.
In addition, although the present invention the 4th embodiment involved by built-in type device sealing structure 103 ceramic base
The metal column 203 at bottom 113 shows the situation of only one column recess 203b, it will be understood, however, to one skilled in the art, that this implementation
The column recess 203b of the ceramic bases 113 of mode can also be two or more situations.
In addition, the present invention the 4th embodiment involved by built-in type device sealing structure 103 ceramic bases 113
First embodiment of the manufacturing method with the present invention involved by built-in type device sealing structure 10 ceramic bases 11
Manufacturing method is essentially identical, the difference is that only the above structure of prepared metal column 203.
Although being illustrated to the present invention above in association with drawings and embodiments, above description is not configured to
Limit the present invention in any form, it should be understood that those skilled in the art, without departing from the present invention essence and
In the case of range, can the present invention be deformed and be changed as needed, it is evident that these deformations and change each fall within this
In the scope of the claimed protection of invention.
Claims (9)
1. a kind of sealing structure of built-in type device, it is characterised in that：
Including：
Ceramic bases with upper and lower surface, and are formed with one of the perforation upper surface and the lower surface
Above through-hole；And
Metal column is filled up completely the through-hole,
In the contact interface with the ceramic bases of the metal column, it is formed with concaveconvex structure, the ceramic bases cover institute
The formation for stating metal column has the part of the concaveconvex structure, and
The ceramic bases are sintered together with the metal cartridge and make the ceramic structure of the ceramic bases and the metal column
It fits closely.
2. the sealing structure of built-in type device as described in claim 1, it is characterised in that：
The ceramic bases are made of 99% or more aluminium oxide.
3. the sealing structure of built-in type device as claimed in claim 1 or 2, it is characterised in that：
The thickness of the ceramic bases is 0.25mm or more and 0.75mm or less.
4. the sealing structure of built-in type device as claimed in claim 1 or 2, it is characterised in that：
The metal column is constituted by being selected from least one of platinum, iridium, niobium, tantalum or gold.
5. the sealing structure of built-in type device as claimed in claim 1 or 2, it is characterised in that：
The a diameter of 0.1mm or more and 0.5mm or less in the upper surface of the through-hole.
6. a kind of manufacturing method of the sealing structure of built-in type device, it is characterised in that：
Including：
Prepare metal column, and in a part for the metal column, concave-convex knot is formed with along the length direction of the metal column
Structure；
The metal column is injected into ceramic paste, and the formation that the ceramic paste covers the metal column has the concave-convex knot
The part of structure；
By the ceramic paste compression moulding, form ceramic green sheet makes the ceramics in the forming process of the ceramic green sheet
Lotion is further contacted with the metal column, tight to be formed between the metal column and the ceramic structure of the ceramic green sheet
Close structure；And
The metal column is sintered together with the ceramic green sheet, the ceramic bases with the metal column are consequently formed.
7. the manufacturing method of the sealing structure of built-in type device as claimed in claim 6, it is characterised in that：
The ceramic bases are made of 99% or more aluminium oxide.
8. the manufacturing method of the sealing structure of built-in type device as claimed in claims 6 or 7, it is characterised in that：
The thickness of the ceramic bases is 0.25mm or more and 0.75mm or less.
9. the manufacturing method of the sealing structure of built-in type device as claimed in claims 6 or 7, it is characterised in that：
The metal column is constituted by being selected from least one of platinum, iridium, niobium, tantalum or gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610986403.7A CN106361464B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610986403.7A CN106361464B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device |
| CN201510737633.5A CN105287047B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device and its manufacture method |
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| CN201510737633.5A Division CN105287047B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device and its manufacture method |
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| CN105771089B (en) * | 2016-02-04 | 2018-12-28 | 深圳市中科先见医疗科技有限公司 | The manufacturing method of the artificial retina ceramic packaging body of implantable |
| CN105749421B (en) * | 2016-02-04 | 2018-10-19 | 深圳先进技术研究院 | The manufacturing method of the artificial retina silicon packaging body of implantable |
| CN106362279B (en) * | 2016-08-01 | 2018-11-02 | 深圳硅基仿生科技有限公司 | The implanted device of stimulating electrode structure and artificial retina |
| CN107913131B (en) * | 2017-12-18 | 2023-08-08 | 深圳先进技术研究院 | Implant packaging structure and sealing cover thereof |
| CN108211118B (en) * | 2017-12-23 | 2021-11-26 | 深圳先进技术研究院 | Implantable package, method of manufacturing the same, and implantable medical device |
| CN109999343B (en) * | 2019-03-30 | 2020-08-25 | 深圳硅基仿生科技有限公司 | Electronic packaging body of implantable device and retina stimulator |
| CN110015890A (en) * | 2019-04-04 | 2019-07-16 | 河北躬责科技有限公司 | A kind of high density ceramic feedthrough production method |
| CN110039640A (en) * | 2019-04-04 | 2019-07-23 | 河北躬责科技有限公司 | A kind of ceramics feedthrough mold, green body and production method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5105811A (en) * | 1982-07-27 | 1992-04-21 | Commonwealth Of Australia | Cochlear prosthetic package |
| US5738270A (en) * | 1994-10-07 | 1998-04-14 | Advanced Bionics Corporation | Brazeless ceramic-to-metal bonding for use in implantable devices |
| US5870272A (en) * | 1997-05-06 | 1999-02-09 | Medtronic Inc. | Capacitive filter feedthrough for implantable medical device |
| US7599743B2 (en) * | 2004-06-24 | 2009-10-06 | Ethicon Endo-Surgery, Inc. | Low frequency transcutaneous energy transfer to implanted medical device |
| US20110048770A1 (en) * | 2009-08-31 | 2011-03-03 | Medtronic Inc. | Injection molded ferrule for cofired feedthroughs |
| JP5501745B2 (en) * | 2009-12-01 | 2014-05-28 | 株式会社ニデック | Visual reproduction assist device |
| DE102011009861B4 (en) * | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Process for the preparation of a cermet-containing feedthrough |
| DE102011009865B4 (en) * | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Headboard for a medically implantable device |
| US8670829B2 (en) * | 2011-08-02 | 2014-03-11 | Medtronic, Inc. | Insulator for a feedthrough |
| DE102011080299B4 (en) * | 2011-08-02 | 2016-02-11 | Infineon Technologies Ag | Method of manufacturing a circuit carrier, and method of manufacturing a semiconductor device |
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| CN105287047A (en) | 2016-02-03 |
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Address after: 518000 A, 4 building, 3 Ting Wei Industrial Park, 6 Baoan District Road, Xin'an, Shenzhen, Guangdong. Patentee after: Shenzhen Silicon Bionics Technology Co.,Ltd. Address before: 518000 A, 4 building, 3 Ting Wei Industrial Park, 6 Baoan District Road, Xin'an, Shenzhen, Guangdong. Patentee before: SHENZHEN SIBIONICS TECHNOLOGY Co.,Ltd. |
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