CN109999343B

CN109999343B - Electronic packaging body of implantable device and retina stimulator

Info

Publication number: CN109999343B
Application number: CN201910252654.6A
Authority: CN
Inventors: 王追; 陈大伟; 王蕾; 方骏飞; 韩明松
Original assignee: Shenzhen Sibionics Technology Co Ltd
Current assignee: Shenzhen Silicon Bionics Technology Co ltd
Priority date: 2019-03-30
Filing date: 2019-03-30
Publication date: 2020-08-25
Anticipated expiration: 2039-03-30
Also published as: CN111821567A; CN109999343A; CN111821568A

Abstract

The invention provides an electronic package of an implantable device, comprising: a hermetic case including a base and an outer case fitted with the base, the base having a plurality of feedthrough holes and a plurality of feedthrough electrodes filling the plurality of feedthrough holes; and an electronic component which is accommodated in the sealed case, includes a substrate having an upper surface and a lower surface which are opposed to each other, and on the upper surface of which at least the electronic element is arranged, and on the lower surface of which an integrated circuit chip and a plurality of pads distributed around the integrated circuit chip are arranged, the plurality of pads of the substrate being connected with the plurality of feed-through electrodes of the sealed case via a solder body. Thus, the number of layers of the substrate can be effectively reduced, and the increase of the thickness of the electronic package can be suppressed.

Description

Electronic packaging body of implantable device and retina stimulator

Technical Field

The invention relates to the field of implantable medical devices, in particular to an electronic packaging body of an implantable device and a retina stimulator.

Background

Currently, implantable devices have been widely used in various aspects such as restoring body function, improving quality of life, or saving life. Such implantable devices include, for example, cardiac pacemakers, deep brain stimulators, cochlear implants, retinal prostheses, and the like, which are implantable in vivo.

Since the implantable device needs to be implanted into the body and remain in the body for a long time, the implantable device implanted into the body needs to be exposed to a complex physiological environment in the body, which is often harsh. For example, after long-term implantation of an implantable device, the implantable device may interact with tissues and organs surrounding the implantation site after long-term implantation, such as physical or chemical reactions that may occur during the aging, degradation, cleavage, re-crosslinking, etc., of the implantable device material. Therefore, in order to improve the safety and reliability of the implantable device, there are very high requirements for the material, sealing property, and structural size (whether it can be adapted to the body structure of the implantation site) of the implantable device.

In implantable devices, the electronic package generally bears the functional components of the implantable device, and often includes a Printed Circuit Board (PCB) and core components of a circuit structure such as an electronic component, an integrated circuit chip, and the like disposed on the PCB. The electronic package is primarily used for processing external signals received from outside the body, thereby generating stimulation signals that can be used for neural stimulation, for example. Whether the core components in the electronic package can be effectively isolated from the harsh physiological environment in the body greatly affects the safety and reliability of the implanted device. Therefore, in order to be implanted in the human body for a long period of time, electronic packages often need to employ a material having good biocompatibility such as ceramics or the like as a sealing material, and the airtightness thereof is to be of an extremely high level.

Disclosure of Invention

In the conventional electronic package, a printed circuit board, an integrated circuit chip and an electronic component, etc. are generally included on the printed circuit board. With higher and higher densities of stimulation channels, such as for neurostimulation, multiple layers of such printed circuit boards (e.g., two-layer printed circuit boards) are often required to perform the functions of the electronic package. However, the use of the multi-layer printed circuit board in the electronic package greatly increases the thickness of the electronic package, thereby being disadvantageous to the implantation of the electronic package in the human body, and generally speaking, the greater the thickness of the electronic package, the greater the difficulty and complexity of the implantation in the human body.

In view of the above conventional circumstances, it is an object of the present invention to provide an electronic package of an implantable device and a retinal stimulator, which can suppress an increase in thickness of the electronic package.

To this end, one aspect of the invention relates to an electronic package for an implantable device, comprising: a hermetically sealed housing comprising a base and an outer housing mated to the base, the base having a plurality of feedthrough apertures and a plurality of feedthrough electrodes filling the plurality of feedthrough apertures; and an electronic component accommodated in the sealed case, the electronic component including a substrate having an upper surface and a lower surface opposed to each other, at least an electronic element being arranged on the upper surface of the substrate, an integrated circuit chip and a plurality of pads distributed around the integrated circuit chip being arranged on the lower surface of the substrate, the plurality of pads of the substrate being connected with the plurality of feed-through electrodes of the base via a solder body.

In the present invention, by arranging the electronic component and the integrated circuit chip respectively on the upper surface and the lower surface of the substrate in the sealed case and adjusting the arrangement of the pads connected to the feed-through electrodes of the sealed case, the space of the upper surface and the lower surface of the substrate can be sufficiently utilized, the number of layers of the substrate can be effectively reduced, and thus an increase in the thickness of the electronic package can be suppressed.

In addition, in the electronic package according to the present invention, a gap may optionally exist between the integrated circuit chip and the substrate. This can suppress the influence of the substrate of the sealing case on the integrated circuit chip.

In the electronic package according to the present invention, the height of the solder body may be larger than the height of the integrated circuit chip protruding from the lower surface of the substrate. In this case, the integrated circuit chip provided on the lower surface of the substrate and the base of the sealing case are left with a gap by the support of the solder body, whereby the influence of the base of the sealing case on the integrated circuit chip can be suppressed, and the reliability of the contact of the pad and the feedthrough electrode can be improved.

In the electronic package according to the present invention, the solder body may include a core portion and a solder layer covering the core portion. In this case, by employing the core portion, the solder body can be prevented from collapsing after soldering, thereby improving the reliability of the pad contact with the feedthrough electrode.

In the electronic package according to the present invention, the solder body may have a spherical shape, an ellipsoidal spherical shape, or a cylindrical shape. In this case, sufficient contact of the pad with the feed-through electrode can be ensured.

In addition, in the electronic package according to the present invention, optionally, the pads are arranged in at least two rows and/or at least two columns around the integrated circuit chip, and the pads of two adjacent rows and/or two adjacent columns are distributed in a staggered manner. In this case, by distributing the pads on the substrate in a staggered manner, it is possible to sufficiently utilize the substrate space and suppress adverse effects between the pads.

In the electronic package according to the present invention, the core may have a hollow structure. Thereby, the weight of the solder body can be reduced.

In the electronic package according to the present invention, the core may be made of at least one selected from the group consisting of copper, gold, titanium, platinum, aluminum, and silver. This can ensure a supporting function of the solder body on the substrate and improve the conductivity of the solder body.

In the electronic package according to the present invention, the core may be made of plastic. This can further reduce the weight of the solder body.

In the electronic package according to the present invention, the solder layer may be formed by covering an outer surface of the core with copper, nickel, or tin.

Furthermore, another aspect of the invention relates to a retinal stimulator comprising: an implant device having the electronic package described above; a camera device for capturing a video image and converting the video image into a visual signal; and a video processing device connected to the image pickup device, processing the visual signal and transmitting the processed visual signal to the implanting device via a transmitting antenna, the implanting device converting the received visual signal into an electrical stimulation signal to stimulate ganglion cells or bipolar cells of the retina through the stimulation end of the stimulation electrode structure to generate a light sensation.

According to the present invention, by arranging the integrated circuit chip and the plurality of pads distributed around the integrated circuit chip in the lower surface of the substrate within the sealed case, and connecting the plurality of pads of the substrate with the plurality of feed-through electrodes of the sealed case via the solder body, it is possible to effectively suppress an increase in the thickness of the substrate and improve the reliability of the electrical connection between the pads of the substrate and the feed-through electrodes.

Drawings

Fig. 1 is a perspective view showing an electronic package of an implantable device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram showing an internal configuration of an electronic package according to an embodiment of the present invention.

Fig. 3 shows a detail of fig. 2, which essentially comprises a solder body.

Fig. 4 shows a schematic view of a substrate according to the present embodiment.

Fig. 5 is a schematic diagram showing an electronic component according to the present embodiment.

Fig. 6 shows a cross-sectional view of a solder body according to the present embodiment.

Fig. 7 is a schematic diagram of the composition of a retinal stimulator according to an embodiment of the present invention.

Description of the symbols:

1 electronic package, 9 retinal stimulator, 10 sealed housing, 11 substrate, 12 metal ring, 13 metal lid, 11a upper surface, 11b lower surface, 111 feedthrough, 111a feedthrough, 111b feedthrough, 111c feedthrough, 111d feedthrough, 112a feedthrough, 112b feedthrough, 112c feedthrough, 112d feedthrough, 20 electronic components, 21 substrate, 21a lower surface, 21b lower surface, 22 electronic components, 23 integrated circuit chip, 24 pad, 30 solder body, 31 core, 32 solder layer, 91 implant, 911 receiving antenna, 912 stimulating electrode array, 92 extracorporeal device, 921 camera device, 922 video processing device, 923 transmitting antenna.

Detailed Description

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same components are denoted by the same reference numerals, and redundant description thereof is omitted. The drawings are schematic and the ratio of the dimensions of the components and the shapes of the components may be different from the actual ones.

The electronic package 1 of the implantable device according to the present invention may be applied to implantable devices including, for example, a cardiac pacemaker implantable in vivo, a deep brain stimulator, a cochlear implant, a retinal stimulator (sometimes also referred to as "artificial retina", "artificial retina"), and the like. The electronic package 1 according to the present invention is also particularly suitable for high-density ceramic packages.

In the electronic package 1 according to the present embodiment, the electronic component, the integrated circuit chip, and the plurality of pads distributed around the integrated circuit chip are arranged on the upper surface and the lower surface of the substrate provided in the sealed case, respectively, and the plurality of pads of the substrate are connected to the plurality of feed-through electrodes of the sealed case via the solder body, whereby it is possible to effectively suppress an increase in the thickness of the sealed case and to improve the reliability of the electrical connection between the pads of the substrate and the feed-through electrodes.

Further, since the electronic package 1 according to the present invention needs to be placed in the body of the implantation subject, it is easily understood by those skilled in the art that the external material of the sealed case 10 of the electronic package 1 according to the present invention, which is in contact with blood, tissue, bone, or the like, including the constituent materials of the substrate 11, the metal ring 12, the metal lid 13, and the feedthrough electrode 112 filled in the feedthrough hole 111 of the substrate 11, which will be described later, need to satisfy the biosafety and the long-term implantation reliability of prescribed standards (e.g., ISO 10993 (international standard), GB/T16886 (chinese standard)).

Fig. 1 is a perspective view showing an electronic package 1 of an implanted device according to the present embodiment. Fig. 2 shows a schematic view of the internal structure of the electronic package shown in fig. 1. In fig. 2, for convenience of explanation, a bonding wire or the like of an electronic component is omitted. Fig. 3 shows a detail of fig. 2, which essentially comprises a solder body.

As shown in fig. 1 and 2, the electronic package 1 according to the present embodiment includes a sealed case 10 and an electronic component 20 accommodated in the sealed case 10. In some cases, the electronic package 1 may also include other components besides the electronic component 20, as necessary.

In the present embodiment, the hermetic case 10 may include a base 11 and an outer case fitted to the base 11. The outer housing may include a metal ring 12 and a metal cap 13 (see fig. 1). In the sealed case 10 according to the present embodiment, a metal ring 12 and a metal cover 13 are provided (for example, welded) on a base 11 to form a sealed body having a housing space for housing an electronic component 20. Such a sealing body (the sealed case 10) can effectively isolate the electronic component 20 from the external environment outside the sealed case 10, and reduce the influence of the electronic component 20 from the external environment.

In the present embodiment, the shape of the sealed housing 10 is not particularly limited as long as an accommodation space for accommodating the electronic component 20 is secured in the sealed housing 10. In some examples, the seal housing 10 may be cylindrical. In other examples, the sealed housing 10 may have a rectangular or square shape. In other examples, the sealed housing 10 may have an irregular shape.

Fig. 4 shows a schematic view of a substrate according to the present embodiment. Fig. 4 shows a top view of the substrate.

In the hermetic case 10, the substrate 11 may be an insulating substrate, and in some examples, as the insulating substrate, a ceramic substrate composed of alumina (chemical formula Al2O3 including single-crystal sapphire and ruby, or polycrystal α -Al2O3), zirconia (chemical formula ZrO2 including magnesia partially-stabilized zirconia (Mg-PSZ)), yttria-stabilized tetragonal zirconia polycrystal (Y-TZP), or ceria-stabilized tetragonal zirconia polycrystal (Ce-TZP), or the like may be used₂O₃) More preferably 99% or more, and most preferably 99.99% or more, of alumina. In general, in a ceramic substrate, alumina (Al) is attached to₂O₃) The increase in mass fraction increases the main crystal phase, and the physical properties of the ceramic substrate are gradually improved, for example, compressive strength (MPa), bending strength (MPa), and elastic modulus (GPa) are also improved accordingly, whereby it is considered that better biosafety and long-term reliability are exhibited. In addition, in some examples, the substrate 11 of the sealing case 10 may be another insulating substrate.

In the present embodiment, the substrate 11 may have a plurality of feedthrough holes 111 and a plurality of feedthrough electrodes 112 filling the plurality of feedthrough holes 111. Fig. 2 illustrates that the feedthrough holes 111 include

feedthrough holes

111a, 111b, 111c, and 111d, and the feedthrough electrodes 112 include

feedthrough electrodes

112a, 112b, and 112c, 112 d. The feedthrough electrode 112 fills the feedthrough hole 111. The number of feedthrough holes 111 and feedthrough electrodes 112 is not limited to this, and the number of feedthrough electrodes 112 may be adjusted according to the actual application, for example, the number of feedthrough electrodes 112 may be 4 or more than 4. The electronic component 20 housed in the sealed case 10 can be electrically connected to an external actuator (e.g., a stimulation electrode) via the feed-through electrode 112.

In the present embodiment, the outer shape of the substrate 11 may be substantially a disk shape. In some examples, the substrate 11 may also have a rectangular shape or other shape as long as the shape of the substrate 11 corresponds to the overall outer shape of the hermetic case 10. The thickness of the base 11 is not particularly limited, and may be, for example, 0.1mm to 4 mm. In the present embodiment, the thickness of the base 11 is preferably 0.25mm or more and 2mm or less.

As shown in fig. 4, the substrate 11 has a plurality of feedthrough holes 111. In the present embodiment, each feedthrough hole may be made the same, and thus, for convenience of description, the "feedthrough hole 111" is used to refer to any one of all feedthrough holes. In some examples, the feedthrough apertures 111 may be arranged in at least two rows and/or at least two columns, and as an example, the substrate 11 may have the feedthrough apertures 111 arranged in a 4 × 2 × 4 array, i.e., in 4 groups of 2 rows with 4 feedthrough apertures in each row. In other examples, the feedthrough holes 111 may be arranged in at least two rows and/or at least two columns, and the pads of two adjacent rows and/or two adjacent columns are staggered. Thereby, the distribution density of the feedthrough holes 111 can be increased.

In addition, each feedthrough hole 111 penetrates the substrate 11 and reaches the upper surface 11a and the lower surface 11b of the substrate 11. In other words, the substrate 11 is formed with a feedthrough hole 111 penetrating the upper surface 11a and the lower surface 11b (see fig. 3). Here, the center axis direction of the feedthrough hole 111 may be substantially perpendicular to the upper surface 11a and the lower surface 11b of the substrate 11. In addition, the center axis direction of the feedthrough hole 111 may be inclined at an angle to the upper surface 11a and the lower surface 11b of the substrate 11.

In the present embodiment, although the number of the feedthrough holes 111 is shown to be 64, the number of the feedthrough holes 111 is not particularly limited, and the number of the feedthrough holes 111 may be determined according to specific needs, for example, in some examples, the number of the feedthrough holes 111 may also be 1, and in other examples, the number of the feedthrough holes 111 may also be more than 2.

Although the aperture (diameter) of the feedthrough hole 111 is not particularly limited, the diameter of the feedthrough hole 111 at the upper surface 11a may be 0.1mm or more and 0.5mm or less from the viewpoint of high-density ceramic packaging.

In the present embodiment, the feedthrough hole 111 may be filled with a metal pillar as the feedthrough electrode 112. In some examples, the metal posts may be solid structures. In other examples, the metal pillar may be a hollow pillar structure (not shown), as long as the metal pillar in the feedthrough hole 111 can electrically connect the upper surface 11a and the lower surface 11b of the substrate 11.

In addition, the substrate 11 of the sealed case 10 has a plurality of feedthrough holes 111 and a plurality of feedthrough electrodes 112 filling the plurality of feedthrough holes 111. The number of feedthrough apertures 111 corresponds to the number of feedthrough electrodes 112.

In addition, each feedthrough hole 111 penetrates the upper surface 11a and the lower surface 11b of the substrate 11. In some examples, the feedthrough 111 may be a cylindrical shaped via. In addition, a concave-convex structure may be formed in the through hole of the feedthrough hole 111. In the present embodiment, the feedthrough hole 111 is a cylindrical through hole.

In addition, the feed-through electrode 112 may be a metal pillar having electrical conductivity. The shape of the feedthrough electrode 112 corresponds to the shape of the feedthrough aperture 111. In some examples, feedthrough electrode 112 may be composed of at least one selected from platinum, iridium, niobium, tantalum, or gold. From the viewpoint of biosafety and long-term implantation reliability, the feedthrough electrode 112 may be preferably composed of platinum, more preferably composed of 99% or more of platinum. Each feedthrough hole 111 is filled with a feedthrough electrode 112, in which case the feedthrough electrode 112 can serve as a seal and the electronic component 20 inside the electronic package 1 can be electrically connected to an external component (e.g., a coil) via the feedthrough electrode 112.

As shown in fig. 2, the metal ring 12 may be formed in a substantially annular band-like structure. The metal ring 12 may be disposed along an edge of the substrate 11 and welded (e.g., brazed) to the substrate 11. The thickness of the metal ring 12 (i.e., the thickness of the annular wall) is not particularly limited, and for example, in the present embodiment, the annular wall of the metal ring 12 has a thickness of 0.1mm to 1mm, which can achieve a good supporting strength.

The height of the metal ring 12 (i.e., the height of the ring wall in the direction perpendicular to the upper surface or the lower surface of the substrate 11) may be determined according to the size of the housing space of the hermetic case 10 mentioned above, and generally, the height may be determined as long as the electronic component 20 in the housing space can be secured.

The metal lid 13 may be provided on the metal ring 12, and the metal lid 13 and the metal ring 12 may be welded together by laser welding, for example, to constitute the outer case described above. Thus, the base 11, the metal ring 12, and the metal cover 13 are assembled together to form the hermetic case 10.

In the present embodiment, the metal ring 12 and the metal cover 13 may be made of titanium and its alloy, noble metals (including gold, silver, and platinum group metals (ruthenium, rhodium, palladium, osmium, iridium, platinum)) and its alloy, medical grade (biograde) stainless steel, tantalum, niobium, Nitinol (Nitinol), or nickel-cobalt-chromium-molybdenum alloy (MP35N), or the like.

In the present embodiment, the metal ring 12 and the metal cover 13 may be made of the same metal material or different metal materials. In addition, the metal ring 12 may preferably be composed of a titanium or titanium alloy material. In this case, the metal cover 13 may also be preferably made of a titanium or titanium alloy material. In the seal housing 10 according to the present embodiment, the metal ring 12 and the metal lid 13 may be integrally formed, for example, an integrally formed outer housing, in order to simplify the manufacturing process.

As shown again in fig. 2, the substrate 11 may have an upper surface 11a and a lower surface 11b opposite to each other. Additionally, in some examples, the upper surface 11a and the lower surface 11b of the substrate 11 may be substantially parallel to each other. Before the substrate 11, the metal ring 12 and the metal cover 13 are assembled to constitute the hermetic case 10, specific connection lines may be formed by metal patterning on the upper surface 11a and the lower surface 11b of the substrate 11, respectively. Then, the patterned substrate 11 (e.g., the upper surface 11a having the connection lines) may be bonded (bonding) with the electronic component 20, for example, by soldering. The step of patterning the metal may include conventional process steps such as metal deposition, photolithography, and etching, which are well known in the art and thus will not be described herein again.

In the present embodiment, although the hermetic case 10 has been described as having a substantially cylindrical shape, the shape of the hermetic case 10 is not particularly limited, and may be other regular shapes such as a rectangular parallelepiped shape, an elliptical cylinder shape, a triangular cylinder shape, and the like, or may be an irregular shape (including a shape in which a regular shape and an irregular shape are combined).

Fig. 6 shows a schematic diagram of an electronic component according to the present embodiment.

In the present embodiment, the electronic component 20 is housed in the hermetic case 10 (see fig. 2). That is, the inside of the hermetic case 10 may have a hermetic cavity that accommodates the electronic component 20. In addition, the electronic components 20 may be disposed on the substrate 11 of the hermetic case 10. In the present embodiment, the electronic component 20 may include a substrate 21 having an upper surface 21a and a lower surface 21b opposed to each other. The electronic component 20 can be configured by forming an electronic element 22 and an integrated circuit chip 23 on a substrate 21. Here, the electronic component 22 may include discrete components such as a resistor, a capacitor, or an inductor. An integrated circuit chip (IC) may include, for example, an Application Specific Integrated Circuit (ASIC), an electrically erasable read-only memory (EEPROM), a digital processor (DSP), and the like.

In addition, in the present embodiment, the substrate 21 may be preferably formed of a Printed Circuit Board (PCB). In some examples, the substrate 21 may be formed of a single-layer double-sided printed circuit board.

In addition, the electronic component 20 is electrically connected to a functional component outside the sealed case 10, for example, a stimulation electrode array (not shown) of a retinal stimulator described later, via the feedthrough electrode 112. In the present embodiment, the electronic component 20 can function to perform signal processing on various signals such as an input signal, a stimulus signal, and a detection signal.

In the present embodiment, at least the electronic component 22 may be arranged on the upper surface 21a of the substrate 21. In addition, on the lower surface 21b of the substrate 21, an Integrated Circuit (IC) chip 23 and a plurality of pads 24 distributed around the IC chip 23 may be disposed (see fig. 3). In some examples, the arrangement of the plurality of pads 24 may correspond to the arrangement of the feedthrough electrodes 111, whereby each feedthrough electrode 111 can be connected to each pad 24 by the solder body 30 described later to be conductive correspondingly.

In the present embodiment, the integrated circuit chip (IC)23 may be located at substantially the center of the lower surface 21b of the electronic component 20. Thereby enabling a plurality of pads 24 to be arranged around the integrated circuit chip 23. In addition, it is understood that in some examples, the integrated circuit chip 23 may also be disposed at other locations on the lower surface 21b of the electronic component 20, such as other locations offset from the center of the lower surface 21b of the electronic component 20.

In the present embodiment, since the integrated circuit chip 23 is disposed on the lower surface 21b of the electronic component 20, the upper surface 21a of the electronic component 20 has a sufficient space for disposing the electronic element 22, so that the accommodation space within the hermetic case 10 can be effectively utilized.

In addition, in some examples, the integrated circuit chip 23 disposed on the lower surface 21b of the substrate 21 may be an Application Specific Integrated Circuit (ASIC). The integrated circuit chip 23 may be used for signal processing of input signals, stimulation signals, detection signals, or the like. In the present embodiment, since the integrated circuit chip 23 is disposed on the lower surface of the electronic component 20, the components of the electronic component 20 can be efficiently disposed in a limited space within the hermetic case 10, and thus more input/output ports can be provided to meet the functional requirements of the electronic component 20.

In addition, as described above, the plurality of pads 24 of the electronic component 20 may be connected with the plurality of feed-through electrodes 112 of the hermetic case 10 via the solder body 30. The respective pads 24 on the substrate 21 may be soldered in one-to-one correspondence with the solder bodies 30. Correspondingly, the pads 24 are distributed in the same manner as the solder bodies 30. The respective solder bodies 30 are soldered to the feedthrough electrodes 112 in a one-to-one correspondence. That is, the solder bodies 30 are distributed in the same manner as the feedthrough electrodes 112. Thereby, it is ensured that each solder body 30 has a feed-through electrode 112 corresponding thereto. It will be appreciated that the feedthrough electrodes 112 may be distributed in the same manner and in a one-to-one correspondence with the pads 24 (see fig. 4).

In addition, the lower surface 21b of the electronic component 20 is disposed toward the upper surface 11a of the substrate 11 so that the integrated circuit chip 23 is located between the electronic component 20 and the substrate 11.

In the present embodiment, the height of the solder body 30 is larger than the height of the integrated circuit chip 23 protruding from the lower surface 21b of the electronic component 20. That is, the integrated circuit chip 23 can be spaced from the substrate 11 with the support of the solder body 30. The solder body 30 supports the electronic component 20 around the integrated circuit chip 23. It is thus possible to ensure that the integrated circuit chip 23 does not contact the substrate 11.

In addition, similar to the feedthrough holes 111, the plurality of pads 24 are arranged in at least two rows and/or at least two columns around the integrated circuit chip 23, and the pads 24 of two adjacent rows and/or two adjacent columns are staggered.

In some examples, the integrated circuit chip 23 may be rectangular in shape. It is understood that in some examples, the integrated circuit chip 23 may also be circular, oval, or other shapes. In this embodiment, two rows (two rows or two columns) of pads 24 may be disposed around the integrated circuit chip 23. In other words, each side of the integrated circuit chip 23 is provided with two rows of pads 24 on a corresponding side of the electronic component 20.

In addition, in some examples, two rows or columns of pads 24 corresponding to respective sides of the integrated circuit chip 23 may be parallel to each other with respect to the sides of the integrated circuit chip 23. The individual pads 24 may be arranged symmetrically about the integrated circuit chip 23. Such a pad 24 arrangement may provide balanced support for the electronic component 20.

In other examples, two rows or two columns of pads 24 corresponding to the corresponding side of each side of the integrated circuit chip 23 on the electronic component 20 may also be arranged asymmetrically with respect to the side.

In addition, in other examples, two rows or columns of pads 24 on the same side of each side of the integrated circuit chip 23 may be distributed in a staggered fashion (see fig. 4). In addition, preferably, the pads 24 in the same row or column are arranged at equal intervals, and two adjacent rows or columns of pads 24 are parallel to each other and are staggered by a certain distance along the extending direction of the two rows or columns. In some examples, two columns or rows of pads 24 are staggered by a distance equal to half the distance between two adjacent pads 24 on the same row or column. Thereby, the density of arrangement of the pads 24 can be increased.

In some examples, the solder body 30 may be ellipsoidal or cylindrical. In the present embodiment, the solder body 30 may have a spherical shape (see fig. 3). In this case, the solder body 30 can be easily brought into sufficient contact with the pad 24, the soldering effect is good, and the supporting function of the solder body 30 on the electronic component 20 is improved. It will be appreciated that the solder body 30 may take other shapes as is customary by those skilled in the art, such as a mesa or the like.

In the present embodiment, the solder body 30 may include a core 31, and a solder layer 32 covering the core 31. In some examples, the core 31 may be a solid structure (see fig. 6). In other examples, the core 31 may also be a hollow structure.

In some examples, the core 31 may be constructed of a hard material. In addition, in some examples, the core 31 may be composed of at least one selected from among copper, gold, titanium, platinum, aluminum, and silver. In some examples, the core 31 may also be constructed of plastic. The plastic may be hard plastic such as acrylonitrile-butadiene-styrene copolymer (ABS), polyethylene terephthalate (PET), etc.

In addition, by using the hard material as the core portion, it is possible to provide sufficient support for the electronic component 20, ensure effective support of the electronic component 20 by the solder body 30, and reduce avoidance of cold solder.

In addition, in some examples, the solder layer 32 may be formed by covering the outer surface of the core 31 with copper, nickel, or tin. In this case, by covering the outer surface of the core portion 31 with the solder layer 32, the soldering property of the solder body 30 can be improved, and the bonding strength with the pad 24 can be enhanced.

(retina stimulator)

Fig. 7 is a schematic configuration diagram of the retinal stimulator according to the present embodiment.

As shown in fig. 7, the retinal stimulator 9 includes an implant device 91 and an extracorporeal apparatus 92. The extracorporeal device 92 may include a camera 921, a video processing device 922, and a transmitting antenna 923. The implant device 91 may include the electronics package 1, stimulation electrode array 912, and receiving antenna 911 described above. The transmitting antenna 923 and the receiving antenna 912 are communicatively connected to each other.

In the extracorporeal device 92 according to the present embodiment, the image pickup device 921 may be configured to capture a video image of the outside world and convert the video image into a visual signal. In some examples, the camera 921 may be a device having a camera function, such as a video camera or the like. For convenience of use, the camera with smaller design volume can be arranged on the glasses, and the patient can capture video images by wearing the portable glasses.

In addition, the video processing device 922 may be connected to the camera device 921, and process and transmit the visual signal to the implant device 91 of the retinal stimulator 9 via the transmitting antenna 923. In some examples, the video processing device 922 is a collection of signal processing module circuits, and the video processing device 922 may be mounted on glasses for patient convenience.

In the implant device 91, the feed-through electrode 112 has a portion exposed from the electronic package 1. The stimulation electrode array 912 may be connected with a plurality of feedthrough electrodes 112 of the electronic package 1 (see fig. 4). The stimulation electrode array 912 may include a plurality of stimulation electrodes, for example, array electrodes arranged as a 4 x 4 array. The plurality of stimulation electrodes may be electrically connected to the feedthrough electrode 112 directly or through a lead. In some examples, each stimulation electrode of stimulation electrode array 912 has a corresponding feedthrough electrode 112.

In addition, in clinical applications, the stimulation electrode array 912 may be placed at the implantation site of the retina (e.g., on the retina) within the eyeball via the incision of the eyeball. The integrated circuit chip 23 of the electronic package 1 may be used to generate a particular waveform and apply it to a plurality of stimulation electrodes. The plurality of stimulation electrodes are capable of electrically stimulating ganglion cells or bipolar cells adjacent to the ganglion cells by providing electrical stimulation of a particular waveform.

In addition, the receiving antenna 911 may be a metal coil (e.g., gold). The receiving antenna 911 and the electronic package 1 may be packaged together in a base (not shown). The substrate may be an insulating flexible material with good biocompatibility. The matrix may be made of PDMS, poly (chlorinated p-xylene) (Parylene C), or Polyimide (Polyimide).

In addition, the receiving antenna 911 may be electrically connected to the feedthrough electrode 112 of the electronic package 1 by a wire. Thereby electrically connecting the receiving antenna 911 to the integrated circuit chip 23 and the electronic component 22 inside the electronic package 1. It is understood that the portion of the feed-through electrode 112 exposed to the outside of the hermetic case 10 is connected to the receiving antenna 911 (here, the connection is achieved by physical and electrical connection by soldering). In this case, the receiving antenna 911 can receive the signal from the transmitting antenna 923 through wireless coupling and transmit the signal to the internal electronic components of the electronic package 1, and at the same time, the receiving antenna 911 can also be used to supply power to the internal circuitry of the electronic package 1 and the stimulating electrode array 912 through electromagnetic induction.

In addition, in some examples, the receiving antenna 911 and the electronic package 1 may be implanted at the outer surface of the eyeball and attached to the surface of the eyeball.

In the retina stimulator 9, the implanted device 91 receives the visual signal from the transmitting antenna 923 through the receiving antenna 911, and converts the visual signal received by the receiving antenna 911 into an electrical stimulation signal through the electronic package 1, thereby stimulating cells of the retina, such as ganglion cells or bipolar cells, to generate light sensation through the stimulating electrode array 912. Therefore, the blind person eyesight recovery device can help the low-vision or blind person to recover partial eyesight and improve the life quality of the low-vision or blind person patients.

While the invention has been specifically described above in connection with the drawings and examples, it will be understood that the above description is not intended to limit the invention in any way. Those skilled in the art can make modifications and variations to the present invention as needed without departing from the true spirit and scope of the invention, and such modifications and variations are within the scope of the invention.

Claims

1. An electronic package for an implantable device, comprising: a hermetically sealed housing comprising a base and an outer housing mated to the base, the base having a plurality of feedthrough apertures and a plurality of feedthrough electrodes filling the plurality of feedthrough apertures; and an electronic component accommodated in the hermetic case and including a substrate having an upper surface and a lower surface opposed to each other, at least an electronic element being arranged on the upper surface of the substrate, an integrated circuit chip and a plurality of pads distributed around the integrated circuit chip being arranged on the lower surface of the substrate, the lower surface of the electronic component being disposed toward the upper surface of the base so that the integrated circuit chip is located between the electronic component and the base, the plurality of pads of the substrate being connected with the plurality of feed-through electrodes of the base via a solder body supporting the electronic component around the integrated circuit chip, the solder body having a height greater than a height at which the integrated circuit chip protrudes from the lower surface of the electronic component with a gap therebetween, the welding body comprises a core part and a welding layer, wherein the core part is made of hard materials, the welding layer covers the core part, the welding body is in a spherical shape, and the radius of the core part is larger than the thickness of the welding layer.

2. The electronic package of an implantable device of claim 1,

the plurality of bonding pads are arranged on the periphery of the integrated circuit chip in at least two rows and/or at least two columns, and the bonding pads of two adjacent rows and/or two adjacent columns are distributed in a staggered mode.

3. The electronic package of an implantable device of claim 1,

the core is a hollow structure.

4. The electronic package of an implantable device of claim 1,

the core is composed of at least one selected from among copper, gold, titanium, platinum, aluminum, or silver.

5. The electronic package of an implantable device of claim 1,

the core is constructed of plastic.

6. The electronic package of an implantable device of claim 4 or 5,

the solder layer is formed by covering the outer surface of the core with copper, nickel or tin.

7. A retinal stimulator, characterized in that,

the method comprises the following steps:

an implant device having an electronics package of the implantable device of any one of claims 1-6, and a stimulation electrode array and a receive antenna connected with the plurality of feedthrough electrodes of the electronics package;

a camera device for capturing a video image and converting the video image into a visual signal; and

a video processing device connected to the camera device and processing the visual signal and transmitting it to the implant device via a transmitting antenna,

the implant device converts the received visual signals into electrical stimulation signals to stimulate ganglion cells or bipolar cells of the retina through the stimulation electrode array to generate light sensation.