CN107913131B - Implant packaging structure and sealing cover thereof - Google Patents
Implant packaging structure and sealing cover thereof Download PDFInfo
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- CN107913131B CN107913131B CN201711364497.5A CN201711364497A CN107913131B CN 107913131 B CN107913131 B CN 107913131B CN 201711364497 A CN201711364497 A CN 201711364497A CN 107913131 B CN107913131 B CN 107913131B
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- implant
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- packaging structure
- sealing
- sealing cover
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
- A61F9/0008—Introducing ophthalmic products into the ocular cavity or retaining products therein
- A61F9/0017—Introducing ophthalmic products into the ocular cavity or retaining products therein implantable in, or in contact with, the eye, e.g. ocular inserts
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/02—Prostheses implantable into the body
- A61F2/14—Eye parts, e.g. lenses, corneal implants; Implanting instruments specially adapted therefor; Artificial eyes
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- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Vascular Medicine (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Cardiology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Transplantation (AREA)
- Prostheses (AREA)
Abstract
The invention provides an implant packaging structure and a sealing cover thereof, wherein the sealing cover comprises a cover body and a welding part arranged at the outer edge of the cover body, the top of the cover body is provided with a protruding part which can be contacted with body fluid, and the top surface of a silica gel layer and the top surface of the protruding part are positioned in the same plane under the state that the silica gel layer is injection-molded on the outer surface of the cover body. According to the implant packaging structure and the sealing cover thereof, the grounding problem in the output process of the nerve electrode stimulation signal of the implant can be solved through the protruding part at the top of the sealing cover, and the nerve electrode stimulation effect and safety are improved.
Description
Technical Field
The invention relates to the technical field of medical instruments, in particular to an implant packaging structure and a sealing cover thereof.
Background
Most active implantation instruments adopt silicon-based electronic devices to perform sensing or treatment functions, because the silicon substrate is biocompatible, a higher-density feed-through is needed to be communicated with a peripheral circuit for achieving a better stimulation effect, and long-term implantable ultra-high-density, airtight and biocompatible electronic packaging becomes a necessary choice.
In the prior art, the ceramic with biocompatibility is adopted to perform the function, but the ceramic direct packaging mode cannot ensure that the electronic device is in an anhydrous environment for a long time, and a closed cavity with mechanical supporting performance and biocompatibility is needed, so that a closed cavity structure of the titanium cover and the titanium ring in the embodiment is needed.
Disclosure of Invention
The invention aims to provide an implant packaging structure and a sealing cover thereof, which can solve the problem of grounding in the process of outputting a nerve electrode stimulation signal of an implant through a protruding part at the top of the sealing cover, and improve the stimulation effect and safety of the nerve electrode.
The above object of the present invention can be achieved by the following technical solutions:
the invention provides a sealing cover of an implant packaging structure, which comprises a cover body and a welding part arranged at the outer edge of the cover body, wherein a protruding part capable of contacting with body fluid is arranged at the top of the cover body, and the top surface of a silica gel layer and the top surface of the protruding part are positioned in the same plane under the state that the silica gel layer is injection-molded on the outer surface of the cover body.
In an embodiment of the invention, a concave part is arranged at the top of the cover body, and the silica gel layer can be injection-molded in the concave part.
In an embodiment of the present invention, the recess is a ring groove, and the ring groove is surrounded on the outer periphery of the protrusion.
In an embodiment of the present invention, the concave portion is formed by a plurality of grooves arranged at intervals, and the plurality of grooves are surrounded on the periphery of the convex portion.
In an embodiment of the present invention, the protrusion is cylindrical, elliptic cylindrical or polygonal prism.
In an embodiment of the invention, the sealing cover is made of titanium material.
In an embodiment of the invention, the top surface roughness of the protrusions is less than 0.8 μm.
In an embodiment of the invention, the cross-sectional area of the protrusion is greater than or equal to one third of the cross-sectional area of the cover.
In an embodiment of the invention, the welding part is a welding shoulder arranged at the outer edge of the cover body, and the outer diameter of the welding shoulder is smaller than that of the cover body.
In an embodiment of the present invention, the height of the welded portion is 0.25mm to 0.35mm.
In an embodiment of the present invention, the outer diameter of the cover is 4mm to 4.5mm.
In an embodiment of the present invention, the width of the cross section of the recess is 0.15mm to 0.25mm.
The invention also provides an implant packaging structure which comprises the sealing cover, and the implant packaging structure is further provided with a ceramic substrate, and a sealing ring is welded between the ceramic substrate and the sealing cover.
In an embodiment of the invention, a sealing cavity is formed among the ceramic substrate, the sealing cover and the sealing ring, and helium is filled in the sealing cavity.
In an embodiment of the invention, the sealing ring is made of a titanium material.
In an embodiment of the invention, the sealing ring is provided radially inwards with a step ring, against which the welding part of the sealing cover abuts.
The implant packaging structure and the sealing cover thereof have the characteristics and advantages that: according to the invention, through the design of the protruding part on the sealing cover, good contact between the implant packaging structure and body fluid can be achieved, friction between the implant packaging structure and eyeballs is reduced to a great extent, secondary damage to eye tissues is prevented, the grounding problem in the output process of the implant nerve electrode stimulation signal is solved, and the nerve electrode stimulation effect and safety are improved. In addition, through the design of the welding part on the sealing cover, the effect of welding and sealing with the sealing ring can be achieved well, the sealing performance of the implant packaging structure is solved, and the sealing performance of the implant packaging structure after the subsequent encapsulation by silica gel is better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a front cross-sectional view of a seal cap of the present invention.
Fig. 2 is a front cross-sectional view of the seal cap of the present invention with a silicone layer injection molded thereon.
FIG. 3 is a top view of one embodiment of the seal cap of the present invention.
FIG. 4 is a top view of another embodiment of the seal cap of the present invention.
Fig. 5 is a perspective view of the sealing cap of the embodiment shown in fig. 3.
Fig. 6 is a front cross-sectional view of an implant package structure of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one
As shown in fig. 1 to 5, the present invention provides a sealing cover 1 of an implant packaging structure, where the sealing cover 1 includes a cover body 11 and a welding portion 12 disposed at an outer edge of the cover body 11, a protruding portion 13 capable of contacting with body fluid is disposed at a top of the cover body 11, and in a state that a silica gel layer 3 is injection molded on an outer surface of the cover body 11, a top surface 31 of the silica gel layer 3 and a top surface 131 of the protruding portion 13 are located in a same plane.
The sealing cover 1 is made of titanium material, has certain hardness, is not easy to deform, can well protect internal circuits and chips placed in the implant packaging structure, and has the roughness of 0.6-0.8 mu m on the outer surface of the sealing cover 1. The sealing cover 1 is made of pure titanium material, and is a material which is widely accepted by the United states Food and Drug Administration (FDA) and Chinese Food and Drug Administration (CFDA) and can be implanted into human body for more than 10 years. The seal cap 1 may be suitable for packaging of one or more of biomedical sensors, biochip plates, cardiac pacemakers, artificial retina, cochlear implant, defibrillator and stimulator, and the seal cap 1 is particularly suitable for packaging of a variety of retinal products (e.g., 128, 512 and 1000+ channel retinal products).
Specifically, the cover 11 in the present embodiment is substantially cylindrical, however, in other embodiments, the cover 11 may be designed into a rectangular parallelepiped or polygonal prism structure according to actual needs, and the present invention is not limited thereto. The top of the cover 11 is provided with a protruding portion 13, in this embodiment, the top surface roughness of the protruding portion 13 is less than 0.8 μm, which is cylindrical and is located at the middle position of the top of the cover 11, however, in other embodiments, the protruding portion 13 may be an elliptic cylinder or a polygonal cylinder, etc., which is not limited herein. The outer edge of the cover 11 is provided with a welding part 12, in this embodiment, the welding part 12 is a welding shoulder arranged on the outer edge of the cover 11, the outer diameter D1 of the welding shoulder is smaller than the outer diameter D2 of the cover 11, and the design of the welding shoulder can ensure the air tightness of the closed cavity of the implant packaging structure. In the present embodiment, the cross-sectional area of the projection 13 is greater than or equal to one third of the cross-sectional area of the cover 11.
As shown in fig. 2, when the outer surface of the cover 11 is injection-molded with the silica gel layer 3, the top surface 31 of the silica gel layer 3 and the top surface 131 of the protrusion 13 are located in the same plane. In this embodiment, the outer edge of the protruding portion 13 may be designed into a rounded corner structure or a right angle structure, so that the protruding portion 13 can achieve the effect of being easily wrapped by silica gel, the silica gel is wrapped by the cover body 11 and then cured to form the silica gel layer 3, the surface of the cover body 11 wrapped by the silica gel layer 3 is flat, the protruding portion 13 is exposed, the purpose of contacting with body fluid well can be achieved, meanwhile, friction between the encapsulation structure of the implant and the eyeball is greatly reduced, and secondary damage to eye tissues is prevented.
In one embodiment of the present invention, the top surface of the cover 11 is provided with a recess 14, and the silica gel layer 3 can be injection molded in the recess 14. In the process of silica gel injection molding, the whole concave part 14 can be filled with silica gel, so that water vapor and oxygen entering the implant packaging structure from the gap between the convex part 13 and the silica gel layer 3 can be well blocked, and a barrier effect for preventing body fluid invasion is well achieved, so that the requirement of implanting the implant into a human body for more than 10 years is met.
In a possible embodiment, as shown in fig. 3, the recess 14 is a ring groove 141, the ring groove 141 is disposed around the periphery of the protrusion 13, the ring groove 141 may be disposed concentrically with the protrusion 13, or the ring groove 141 may be disposed non-concentrically with the protrusion 13. In another possible embodiment, as shown in fig. 4, the recess 14 is formed by a plurality of grooves 142 disposed at intervals, the plurality of grooves 142 are disposed around the periphery of the protrusion 13, and the grooves 142 form an annular structure, which may be disposed concentrically with the protrusion 13, or may be disposed non-concentrically with the protrusion 13.
In an embodiment of the present invention, as shown in fig. 1, the cover 11 and the protruding portion 13 are both cylindrical, and the recessed portion 14 is a ring groove 141. Wherein, the outer diameter D2 of the cover 11 is 8 mm-10 mm, preferably 10mm; the height h2 of the cover 11 is 1.5mm to 2.5mm, preferably 1.9mm. The outer diameter D3 of the projection 13 is 4mm to 6mm, preferably 5mm; the height h3 of the projection 13 is 0.2mm to 0.3mm, preferably 0.25mm. The height h of the welded portion 12 is 0.25mm to 0.35mm, preferably 0.3mm; the outer diameter D1 of the welded portion 12 is 8.5mm to 9.5mm, preferably 9.1mm; the inner diameter D6 of the welded portion 12 is 7mm to 9mm, preferably 8mm. The width b of the cross section of the recess 14 is 0.15mm to 0.25mm, preferably 0.2mm; the distance D4 between the concave portion 14 and the convex portion 13 is 0.95mm to 1.05mm, preferably 1mm; the inner diameter D5 of the recess 14 is 6mm to 8mm, preferably 7mm; the depth h1 of the recess 14 is 0.15mm to 0.25mm, preferably 0.2mm.
Second embodiment
As shown in fig. 1 to 6, the present invention further provides an implant packaging structure, which includes a sealing cover 1, the implant packaging structure further includes a ceramic substrate 4, and a sealing ring 5 is welded between the ceramic substrate 4 and the sealing cover 1. The sealing cover 1 is the sealing cover in the first embodiment, and the specific structure, working principle and beneficial effects are the same as those in the first embodiment, and are not described herein.
Specifically, the ceramic substrate 4 is made of a biocompatible ceramic material, and is substantially in a plate shape, and a plurality of through holes 41 (for example, through holes on 128, 512 and 1000+ channel retina products are respectively applicable to 128, 512 and 1000+ channel retina products) are formed on the ceramic substrate 4, and the through holes 41 can be filled with biocompatible metal fillers 42, and the metal fillers 42 are used for electrically connecting with chips encapsulated in the implant encapsulation structure. The sealing ring 5 is used for sealing and connecting the ceramic substrate 4 and the sealing cover 1, so that a sealing cavity 6 is formed among the ceramic substrate 4, the sealing cover 1 and the sealing ring 5, helium is filled in the sealing cavity 6 to protect a chip placed in an implant packaging structure, and long-term effective operation of the chip is ensured.
In this embodiment, the sealing ring 5 is made of titanium material, the inner annular wall of the sealing ring is radially and inwardly provided with a step ring 51, one end of the sealing ring 5 is welded with the ceramic substrate 4, the other end of the sealing ring is abutted with the sealing cover 1, and the welding part 12 is a welding shoulder which is abutted on the step ring 51, so that the sealing ring 5 and the sealing cover 1 just form a snap fit connection, and the two are firmly connected in a welding connection mode, thereby ensuring the sealing performance of the sealing cavity 6.
According to the implant packaging structure, through the design of the protruding part 13 on the sealing cover 1, good contact between the implant packaging structure and body fluid can be achieved, friction between the implant packaging structure and eyeballs is reduced to a great extent, secondary damage to eye tissues is prevented, the grounding problem in the output process of the implant nerve electrode stimulation signal is solved, and the nerve electrode stimulation effect and safety are improved. In addition, through the design of the welding part 12 on the sealing cover 1, the effect of welding and sealing with the sealing ring 5 can be achieved well, the sealing performance of the implant packaging structure is solved, and the sealing performance of the implant packaging structure after the subsequent encapsulation by silica gel is better.
The foregoing is merely a few embodiments of the present invention and those skilled in the art may make various modifications or alterations to the embodiments of the present invention in light of the disclosure herein without departing from the spirit and scope of the invention.
Claims (14)
1. The sealing cover of the implant nerve stimulating electrode packaging structure is characterized by comprising a cover body and a welding part arranged at the outer edge of the cover body, wherein the top of the cover body is provided with a protruding part which can be contacted with body fluid, the protruding part realizes the grounding in the output process of an implant nerve stimulating electrode stimulating signal, the outer surface of the cover body is injection-molded with a silica gel layer, and the top surface of the silica gel layer and the top surface of the protruding part are positioned in the same plane; the top of the cover body is provided with a concave part, and the silica gel layer can be injection-molded in the concave part; the protruding part is in a cylindrical shape, an elliptic cylindrical shape or a polygonal prism shape.
2. The seal cap of claim 1, wherein the recess is a ring groove, the ring groove surrounding the periphery of the protrusion.
3. The seal cover of the implant nerve stimulating electrode packaging structure of claim 1, wherein the recess portion is composed of a plurality of grooves arranged at intervals, and a plurality of the grooves are surrounded on the periphery of the protruding portion.
4. The seal cap of an implant neurostimulation electrode package structure of claim 1, wherein said seal cap is made of an iron material.
5. The seal cap of an implant neurostimulation electrode package structure of claim 1, wherein the top surface roughness of the projection is less than 0.8 μm.
6. The seal cap of claim 1, wherein the cross-sectional area of the protrusion is greater than or equal to one third of the cross-sectional area of the cap body.
7. The seal cap of claim 1, wherein the weld is a weld shoulder disposed on an outer edge of the cap, the weld shoulder having an outer diameter that is less than an outer diameter of the cap.
8. The seal cap of the implant nerve stimulating electrode packaging structure of claim 1, wherein the height of the welded portion is 0.25mm to 0.35mm.
9. The seal cap of the implant neurostimulation electrode package structure of claim 1, wherein the outer diameter of the cap body is 4 mm-4.5 mm.
10. The seal cap of the implant neurostimulation electrode package structure of claim 1, wherein the width of the cross section of the recess is 0.15mm to 0.25mm.
11. An implant nerve stimulating electrode packaging structure, characterized in that the implant nerve stimulating electrode packaging structure comprises the sealing cover according to any one of claims 1 to 10, and further comprises a ceramic substrate, and a sealing ring is welded between the ceramic substrate and the sealing cover.
12. The implant nerve stimulation electrode package structure of claim 11, wherein a sealed cavity is formed between the ceramic substrate, the sealing cover and the sealing ring, and the sealed cavity is filled with nitrogen.
13. The implant neurostimulation electrode package of claim 11, wherein said sealing ring is made of an iron material.
14. The implant nerve stimulation electrode package of claim 11, wherein the sealing ring is provided radially inward with a step ring, and the welded portion of the sealing cover abuts against the step ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364497.5A CN107913131B (en) | 2017-12-18 | 2017-12-18 | Implant packaging structure and sealing cover thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364497.5A CN107913131B (en) | 2017-12-18 | 2017-12-18 | Implant packaging structure and sealing cover thereof |
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| Publication Number | Publication Date |
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| CN107913131A CN107913131A (en) | 2018-04-17 |
| CN107913131B true CN107913131B (en) | 2023-08-08 |
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| CN201711364497.5A Active CN107913131B (en) | 2017-12-18 | 2017-12-18 | Implant packaging structure and sealing cover thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019119217A1 (en) * | 2017-12-18 | 2019-06-27 | 深圳先进技术研究院 | Implant encapsulation structure, and sealing cover thereof |
| CN109675189A (en) * | 2018-12-12 | 2019-04-26 | 深圳先进技术研究院 | Neural stimulation electrodes, implant, silica gel packaging method and silica gel packaging equipment |
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| CN107913131A (en) | 2018-04-17 |
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