CN106128987A - Substrate rotates loader - Google Patents
Substrate rotates loader Download PDFInfo
- Publication number
- CN106128987A CN106128987A CN201610286548.6A CN201610286548A CN106128987A CN 106128987 A CN106128987 A CN 106128987A CN 201610286548 A CN201610286548 A CN 201610286548A CN 106128987 A CN106128987 A CN 106128987A
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- Prior art keywords
- arm
- substrate
- actuator
- clamper
- loading module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
Abstract
There is disclosed herein a kind of for loading substrate method and apparatus in inspection post.In one embodiment, there is disclosed herein a kind of loading module for inspecting substrate station.Described loading module includes two arms, multiple substrate holder, two rotatable supporting members, conveyer device and at least one actuator.Each arm has first end and the second end, and wherein said the second end is relative with described first end.Each substrate holder is arranged on the respective end of each arm.The corresponding arm that each rotatable supporting member is coupled in described arm.Described conveyer device is arranged between described rotatable supporting member.At least one actuator described is configured to make described upper-arm circumference rotate around described rotatable supporting member, so that described clamper to be selectively positioned at above described conveyer device the position making the substrate kept by described clamper be released on described conveyer device.
Description
Technical field
The embodiment of present disclosure relates in general to substrate charging appliance.More specifically, it is disclosed herein
Embodiment relates to a kind of system and method for being loaded in semiconductor inspection apparatus by substrate.
Background technology
In processing procedure, the substrate of such as semiconductor substrate etc routine at single inspection post is tested
Look into, to ensure compliance with predetermined quality control standard.Different Examined effect provide combining about product and technique
Close data.But, due to the quantity in required inspection post and between inspection post moving substrate caused
Delivery time, Integrated Checkout is probably time-consuming, thus makes volume of production reduce.Therefore, equipment manufacturers
Often face and spend heavy (burdensome) inspection/delivery time through all of inspection post in selection
Give a thorough inspection or select previous some to check between technique to make a policy.
But, along with checking that technique has the most constantly decreased the required time quantum checking that step needs, also
Need to improve loading attachment and enable to catch up with the volume of production of increase.
Accordingly, it would be desirable to the substrate loading device of a kind of improvement being used together with inspection system.
Summary of the invention
In one embodiment, there is disclosed herein a kind of loading module for base plate inspection system.Institute
State loading module and include two arms, multiple clamper, two rotatable supporting members, conveyer device and at least
One actuator.Each arm has first end and the second end, wherein said the second end and described first
End is relative.Each substrate holder is arranged at the respective end of each arm.Each rotatable supporting member
The corresponding arm being couple in described arm.Described conveyer device be arranged on described rotatable supporting member it
Between.At least one actuator described is configured to make described upper-arm circumference rotate around described rotatable supporting member, with
Described clamper is selectively positioned at the substrate making to be kept by described clamper above described conveyer device
It is released to the position on described conveyer device.
In another embodiment, there is disclosed herein a kind of loading module for base plate inspection system.Institute
State loading module include conveyer device, be arranged on two box keepers of the opposite side of described conveyer device, two
Individual arm, two rotatable supporting members and two actuators.Each arm includes first end and described first
The second end, the first clamper being arranged on the described first end of the first arm that end is relative and be arranged on
The second clamper on the described the second end of the second arm.Each rotatable supporting member is couple in described arm
An arm.Each actuator is couple to corresponding rotatable supporting member.Described actuator is configured to make institute
State upper-arm circumference to rotate around described rotatable supporting member so that described arm with indexing (index) mode making
State clamper and transmitted rotation between substrate position between described box keeper and described conveyer device.
In another embodiment, there is disclosed herein a kind of method for loading substrate.Described method bag
Include: make the first arm rotate scheduled volume in a first direction, in order to pickup first substrate；Described first arm is made to exist
Described first party rotates up and makes the second arm to rotate scheduled volume, wherein said second party in a second direction
To relative with described first direction；And continue in a stepwise manner to make described first arm in said first direction
Rotate and make described second arm rotate in this second direction, in order to alternately pick up and load substrate.
Accompanying drawing is sketched
Therefore, in the way of the features described above of present disclosure can be understood in detail, summarized above
The more specifically description of present disclosure is referred to embodiment and obtains, some in these embodiments
Embodiment illustrates in the accompanying drawings.It should be noted, however, that the typical case that accompanying drawing only illustrates present disclosure is real
Execute mode, and be therefore not construed as limiting the scope of the disclosure, because present disclosure can allow it
His equivalent implementations.
Fig. 1 is the schematic top view of the inspection system of an embodiment with loading module.
Fig. 2 is the side view of the arm of the loading module according to an embodiment with multiple clamper.
Fig. 3 is to have Bernoulli vacuum nozzle (Bernoulli vacuum nozzle) according to an embodiment
The end perspective view of clamper.
Fig. 4 is the flow chart of an embodiment of the method for loading substrate in loading module.
Fig. 5 A to Fig. 5 E illustrates at according to the different phase of the method being in Fig. 4 of an embodiment
Loading module.
For the sake of clarity, same reference numerals is used to indicate the identical unit that each figure is common the most as far as possible
Part.It addition, the element in an embodiment can be advantageously applied to other embodiments described herein.
Detailed description of the invention
Fig. 1 illustrates the top plan view of the base plate inspection system 100 according to an embodiment.Inspection system
100 include loading module 102, modular unit 104 and sorting (sorting) unit 106.An enforcement
In mode, modular unit 104 can include one or more measuring station (metrology station).This metering
Stand any one that can include in (the most for example) the following: fine fisssure (micro-crack) checks
Unit, thickness measuring unit, resistivity (resistivity) measuring unit, luminescence generated by light
(photoluminescence) unit, geometry inspection unit, sawing marker (saw mark) detection
Unit, flaw (stain) detector unit, chip detection unit and/or crystallization point rate (crystal fraction)
Detector unit.Fine fisssure inspection unit can be configured to (the most for example) check substrate whether exist crack and
(optionally) determines the crystallization point rate of this substrate alternatively.Geometry inspection unit (only can be configured to
For example) analytic substrate surface nature.Sawing marker detector unit can be configured to (the most for example) and knows
Do not include groove, ladder and the sawing marker of double stepped mark on (identify) substrate.Except listed that
Outside Xie, measuring station may also include other examples.
Loading module 102, modular unit 104 and sorting unit 106 are connected to substrate with linear arrangement
Can be easy to quickly single in loading module 102, modular unit 104 and sorting by induction system 108
Transmit between unit 106, and without departing from checking system 100.Loading module 102 is configured to load substrate,
For by induction system 108, substrate transported through modular unit 104 and sorting unit 106.
Loading module 102 receives one or more box 110,111 of the substrate 112 accommodating stack arrangement.Often
Individual box 110,111 includes multiple slit.Each slit is configured to keep substrate 112.Box 110,111
Can be positioned such that substrate 112 stacking positions (positioned one over the other).At another example
In, substrate 112 can be positioned in keeper so that very close to each other between each substrate 112.Substrate 112
It is transferred into induction system 108 from box 110,111.Box 110 is positioned in box keeper 190.Box 111
It is positioned in box keeper 192.In one embodiment, induction system 108 can be to run through inspection
Look into the continuous conveyor of system 100.In another embodiment, induction system 108 can comprise more than one
The conveyer belt of individual runthrough system 100.One or more conveyer belt can be sequentially arranged linear cloth
Put, so that the substrate received in loading module 102 is sent to modular unit 104.
Loading module 102 includes multiple arm (being shown as such as arm 114,115), multiple rotatable support
Component 125,126 and at least one actuator 116 for turning arm 114,115.Arm 114 includes
First end 118 and the second end 120 relative with first end 118.Arm 114 is being positioned at arm 114
End 118,120 between centre position (midway) near point at be couple to rotatable support structure
Part 125.Rotatable supporting member 125 is configured so that arm 114 passes around the axle 128 of this point and rotates.
Arm 114 can illustrate in greater detail in Fig. 2.
Arm 115 includes first end 122 and the second end 124 relative with first end 122.Arm 115
It is couple to rotatable support at point near the centre position between the end 122,124 of arm 115
Component 126.Rotatable supporting member 126 is configured so that arm 115 passes around the axle 129 of this point and revolves
Turn.
Rotatable supporting member 125,126 is positioned at the opposite side of induction system 108.Rotatable support structure
Part 125 is positioned between induction system 108 and box 110.Rotatable supporting member 126 is positioned at delivery system
Between system 108 and box 111.Rotatable supporting member 125 is positioned to make the end 118 of arm 114 to be selected
Selecting property it is positioned at above box 110, and makes the end 120 of arm 114 be selectively positioned at conveying
Above system 108, in order to facilitate transmission substrates between both.Equally, rotatable supporting member 126
The end 122 being oriented to make arm 115 is selectively positioned at above box 111, and makes arm 115
End 124 be selectively positioned at above induction system 108, in order to facilitate between both pass
Send substrate.
Substrate holder 123 is arranged on each end 118,120,122,124 of arm 114,115.
Clamper 123 may be provided on bottom side or the end of each arm in arm 114,115, so that clamper 123
Substrate 112 to be transmitted can be fixed.Clamper 123 can be any suitable substrate holder, all in this way
Sucking type clamper (suction gripper), clamp-type clamper (claw gripper), magnetic clutch holder,
Bernoulli vacuum nozzle and similar clamper.Each box 110,111 can include elevator (not shown),
This elevator is configured to make substrate rise to the substrate so that top and can be captured by substrate holder 123
The position arrived.
Fig. 3 is the isometric bottom view of the clamper 123 with Bernoulli vacuum nozzle 200.Bernoulli vacuum
Nozzle 200 makes it possible to clamp substrate in the case of reducing contact, right during the most advantageously reducing carrying
The potential damage of substrate.Bernoulli vacuum nozzle 200 is operable to by with in the center of substrate 112 and week
Between limit, the mode of formation vacuum and lifting force applies air-flow provides substrate 112 below substrate 112
Contactless (non-contact) transmit.Due to vacuum power and the reason of continuous flow, substrate 112 is not
It is attached to Bernoulli vacuum nozzle 200, and is to maintain this substrate 112 against one or more stop part (stop)
290.Stop part 290 can be configured to post or other appropriate geometry.Stop part 290 can prolong from arm 114
Stretch the distance more longer than Bernoulli vacuum nozzle 200, to guarantee that substrate 112 does not the most contact uncle and exerts
Profit vacuum nozzle 200.The end of the contact substrate 112 of stop part 290 can be by being chosen to offer substrate 112
And the enough frictional force between stop part 290 does not offsets when arm 114 rotates or sliding guaranteeing substrate 112
Dynamic material is made.Therefore, the clamper 123 with Bernoulli vacuum nozzle 200 makes it possible to loading
Safe carrying substrate 112 in module 102.
Referring back to Fig. 1, rotatable supporting member 125,126 can be couple at least one actuator 116.
In one embodiment, supporting member 125,126 is couple to same actuator 116.Real at another
Executing in mode, each supporting member 125,126 is couple to single actuator 116.As it has been described above, cause
Dynamic device 116 is configured to make arm 114,115 rotate around supporting member 125,126.An embodiment party
In formula, actuator 116 is motor, servomotor, revolving actuator, pneumatic motor (air motor)
Or suitable equipment.Actuator 116 can rotate rotatable supporting member 125,126 in indexing mode,
Make to utilize each motion of arm 114,115, when the opposed end of arm 114,115 is by substrate transmission
During same position in induction system 108, by an end of arm 114,115 from box 110,111
In box receive new substrate.
Inspection system 100 can farther include controller 130.Inspection system 100 is by communication cable
(communication cable) 132 is couple to controller 130.Controller 130 is operable, to control
Substrate is processed in inspection system 100.Controller 130 includes programmable CPU (CPU) 134,
CPU can with memorizer 136 and the mass-memory unit of the various parts being couple to inspection system 100,
Input control unit and display unit (not shown) (such as power supply, clock, cache, input/defeated
Go out (I/O) circuit and the like person) operate together, in order to facilitate carrying and the work of inspection substrate
The control of skill.Controller 130 may also include hardware for by the sensor in inspection system 100 (not
Illustrate) carry out monitoring substrate process.
In order to facilitate the control carrying out inspection system 100 and processing substrate, CPU 134 can be to be used for controlling
One in any type of general-purpose computer processor of substrate process.Memorizer 136 is couple to CPU
134, and memorizer 136 is non-transient state (non-transitory), and can be readily available all
As random access memory (RAM), read only memory (ROM), floppy disk, hard disk or appoint
What one or more in the memorizer of digital memeory device (Local or Remote) of his form etc.Support
Circuit 138 is coupled to CPU 134, for supporting CPU 134 in a conventional manner.For by dress
The operation of load module 102 loads the technique of substrate and can be stored in memorizer 136.For loading substrate
This technique also can store by the 2nd CPU (not shown) of the hardware controlled away from CPU 134
And/or perform.
Memorizer 136 is in the form of the computer-readable recording medium comprising instruction, and described instruction is by CPU
134 operations facilitating inspection system 100 when performing.The instruction in memorizer 136 form in program product,
(method 400 of such as Fig. 4, including such as in the operation of this program product all enforcement in this way inspection system 100
The operation of loading module 102) program.It is any that program code may conform in many different programming languages
A kind of.In an example, present disclosure can be embodied as the calculating for being used together with computer system
The program product of storage in machine readable storage medium storing program for executing.The program of this program product limits the function of embodiment.
Exemplary storage computer-readable medium includes but not limited to: (i) permanently stores the storage that can not write of information and be situated between
Matter (the read only memory equipment in such as computer, the CD-ROM that such as CD-ROM drive can read
Dish, flash memories, rom chip or any kind of solid state non-volatile semiconductor memory)；With
And (ii) storage can change the writable storage medium (writing storage media) of information, and (such as disk drives
Floppy disk in dynamic device or hard disk drive or any kind of solid-state random-access semiconductor memory).This type of
Computer-readable recording medium is in the calculating of the function performing instruction (direct) method described herein
It it is the embodiment of present disclosure during machine instructions.
Fig. 4 illustrates and in loading module 102, substrate 112 is loaded into induction system according to an embodiment
The flow chart of the method 400 on 108.Method 400 carrys out turning arm 114,115 in indexing mode so that arm
114,115 from box 110,111, pick up a substrate simultaneously and another substrate is loaded into induction system 108
On.It is in the loading module 102 at the different phase of method 400 to be illustrated in Fig. 5 A to Fig. 5 E.Figure
5A illustrates that arm 114,115 is in their initial position.
Method 400 starts at square frame 402.At square frame 402, the arm of loading module is in a first direction
Rotate scheduled volume so that the end of arm is positioned on the first substrate in the box being arranged in these boxes
Side.The clamper being positioned at the end above box being arranged on the first arm picks up first substrate.Such as, figure
5B illustrates the first arm 114 deasil 90-degree rotation so that the first end 118 of the first arm 114 positions
Above box 110.It is arranged on the clamper 123 at the first end 118 of the first arm 114 and picks up the first base
Plate 112A.
At square frame 404, the first arm 114 rotates scheduled volume in a first direction so that the end of arm is no longer
It is positioned at above box and induction system.Second arm 115 rotates scheduled volume in a second direction so that the end of arm
Portion is positioned at above the second substrate being arranged in box 111.The second direction that second arm moves is moved with the first arm
Dynamic first direction is relative.By transfer arm 114,115 in the opposite direction, the substrate being maintained on arm
Between the probability that comes in contact reduce.It is arranged on the clamper being positioned on the end above box of the second arm
Pickup second substrate.In one embodiment, arm 114,115 is connected to same actuator.Work as arm
When being connected to same actuator, the probability of arm collision minimizes, this is because the motion of arm is guaranteed to
Synchronization is carried out.In another embodiment, each arm is connected to single actuator.Controller controls to activate
Device so that the rotation of arm is timed (time) and collides with preventing arm or the substrate that is maintained on arm.Example
As, Fig. 5 C illustrates the first arm 114 deasil half-twist, and the second arm 115 rotates in the counterclockwise
90°.First arm 114 present position is substantially perpendicular to position shown in Fig. 5 B, so that the second arm 115
Clamper 123 rotated and picked up second substrate 112B from box 111.First end of the second arm 115
Portion 122 is positioned at above box 111.The second end 124 of the second arm 115 is positioned at induction system 108
Top.
At square frame 406, the second arm rotates scheduled volume in a second direction so that the end of arm does not relocates
Above box and induction system.First arm rotates scheduled volume in a first direction so that do not keep first substrate
End be positioned at above box.The end keeping first substrate of the first arm is positioned at above induction system.If
Substrate is discharged in induction system by the clamper put on the end keeping first substrate of the first arm.Arrange
Clamper pickup the 3rd substrate on the end being positioned above box.Such as, Fig. 5 D illustrates the first arm 114
Deasil half-twist, and the second arm 115 rotates in the counterclockwise 90 °.Position residing for first arm 114
Put and be substantially perpendicular to position shown in Fig. 5 C so that the first end 118 of the first arm 114 is positioned at defeated
Send above system 108, and the second end 120 of the first arm 114 is positioned at above box 110.It is arranged on
Clamper 123 on the first end 118 of the first arm 114 is just keeping the first substrate of pickup in Fig. 5 B
112A.The clamper 123 release substrate 112A being arranged on the first end 118 of the first arm 114, makes
Obtain substrate 112A to be loaded onto in induction system 108.It is arranged on the second end 120 of the first arm 114
Clamper 123 pick up the 3rd substrate 112C from box 110.Second arm 115 present position perpendicular
In the position of the second arm 115 shown in Fig. 5 C, so that the first arm 114 rotates and any touching does not occurs
Hit.
At square frame 408, the first arm rotates scheduled volume in a first direction so that the end of arm does not relocates
Above box and induction system.Second arm rotates scheduled volume in a second direction so that do not keep second substrate
End be positioned at above box.The end keeping second substrate of the second arm is positioned at above induction system.If
Substrate is discharged in induction system by the clamper 123 put on the end keeping second substrate of the second arm.
The clamper 123 being arranged on the end being positioned above box picks up tetrabasal.Such as, Fig. 5 E illustrates
First arm 114 deasil half-twist, and the second arm 115 rotates in the counterclockwise 90 °.Second arm
115 present positions are substantially perpendicular to position shown in Fig. 5 D so that the first end 122 of the second arm 115
It is positioned at above induction system 108, and the second end 124 of the second arm 115 is positioned at above box 111.
The clamper 123 being arranged on the first end 122 of the second arm 115 is just keeping second picked up in Fig. 5 C
Substrate 112B.The clamper 123 release substrate 112B being arranged on the first end 122 of the second arm 115,
Substrate 112B is loaded onto in induction system 108.Be arranged on the second arm 115 is positioned at box 111
Clamper 123 on the second end 124 of top picks up tetrabasal 112D.Position residing for first arm 114
Put the position being substantially perpendicular to the first arm 114 shown in Fig. 5 D so that the second arm 115 rotate and
There is not any collision.
Method 400 can so continue, until all substrates from box 110,111 are all loaded onto
In induction system 108.Method 400 is easy to (allow for) and is favorably loaded more than 5000 for each hour
Substrate, this is to be markedly improved compared with conventional inspection system.
It will be understood by those skilled in the art that previous examples is illustrative, and not restrictive.Expection
After reading this specification and studying accompanying drawing, all displacements obvious to those skilled in the art, increasing
Benefit, equivalent and improvement thereof are included in true spirit and the scope of present disclosure.It is therefore contemplated that
, appended claims include falling into these type of amendments all in true spirits of these teachings and scope,
Displacement and equivalent.
Reference
Flag member title
100 check system
102 loading modules
104 modular units
106 sorting units
108 induction systems
110 boxes
111 boxes
112 load substrate
112A first substrate
112B second substrate
112C the 3rd substrate
112D tetrabasal
114 arms
115 arms
116 actuators
118 ends
120 ends
122 ends
123 clampers
124 ends
125 rotatable supporting members
126 rotatable supporting members
128 axles
129 axis
130 controllers
132 communication cables
134 CPU
136 memorizeies
138 support circuit
190 box keepers
192 box keepers
200 Bernoulli vacuum nozzles
290 stop parts
400 methods
402 square frames
404 square frames
406 square frames
408 square frames
Claims (20)
1., for a loading module for base plate inspection system, described loading module includes:
Two arms, each arm has first end and the second end, wherein said the second end and described first
End is relative；
Multiple substrate holder, each substrate holder is arranged on the respective end of each arm；
Two rotatable supporting members, be couple in described arm corresponding one of each rotatable supporting member
Arm；
Induction system, described induction system is arranged between described rotatable supporting member；And
At least one actuator, at least one actuator described is couple to described rotatable supporting member, described
At least one actuator is configured to make described upper-arm circumference rotate around described rotatable supporting member, with by described folder
Holder be selectively positioned at above described induction system make the substrate kept by described clamper be able to by
It is discharged into the position in described induction system.
Loading module the most according to claim 1, wherein said clamper includes:
Bernoulli vacuum nozzle.
Loading module the most according to claim 2, wherein said clamper farther includes:
Multiple stop parts, the plurality of stop part extends farther than described Bernoulli vacuum nozzle from described arm.
Loading module the most according to claim 1, at least one actuator wherein said wraps further
Include:
Single actuator, described single actuator is configured to move two arms simultaneously.
Loading module the most according to claim 1, at least one actuator wherein said wraps further
Include:
First actuator, described first actuator is operable with mobile first arm；And
Second actuator, described second actuator is operable with mobile second arm.
Loading module the most according to claim 1, at least one actuator wherein said farther includes
At least one in motor, servomotor, revolving actuator or pneumatic motor.
Loading module the most according to claim 1, at least one actuator wherein said is configured to make
At least one arm in described arm rotates in indexing mode.
Loading module the most according to claim 1, the described clamper being wherein couple to each arm can be determined
Above the same position in described induction system of the position.
Loading module the most according to claim 1, farther includes:
One or more measuring station, one or more measuring station described is suitable to receive substrate from described induction system.
10., for a loading module for base plate inspection system, described loading module includes:
Induction system；
Two box keepers, described box keeper is arranged on the opposite side of described induction system；
Two arms, each arm includes:
First end；
The second end, described the second end is relative with described first end；
First clamper, described first clamper is arranged on the described first end of the first arm；And
Second clamper, described second clamper is arranged on the described the second end of the second arm；
Two rotatable supporting members, the arm that each rotatable supporting member is coupled in described arm；
And
Two actuators, each actuator is couple to corresponding rotatable supporting member, and described actuator is configured
Become to make described upper-arm circumference rotate around described rotatable supporting member so that described arm makes described folder in indexing mode
Holder is transmitted to be rotated between substrate position between described box keeper and described induction system.
11. loading modules according to claim 10, wherein said clamper includes:
Bernoulli vacuum nozzle.
12. loading modules according to claim 11, wherein said clamper farther includes:
Multiple stop parts, the plurality of stop part extends farther than described Bernoulli vacuum nozzle from described arm.
13. loading modules according to claim 10, wherein said two actuators are configured to same
Two arms of Shi Yidong.
14. loading modules according to claim 10, wherein said two actuators wrap further
Include:
First actuator, described first actuator is operable with mobile described first arm；And
Second actuator, described second actuator is operable with mobile described second arm.
15. loading modules according to claim 10, wherein said two actuators be configured to
Indexing mode rotates described arm.
16. loading modules according to claim 10, farther include:
One or more measuring station, one or more measuring station described is suitable to receive substrate from described induction system.
17. 1 kinds are used for the method loading substrate, and described method includes:
The first arm is made to rotate scheduled volume in a first direction, in order to pickup first substrate；
Make described first arm rotate in said first direction and to make the second arm rotate in a second direction pre-
Quantitatively, wherein said second direction is relative with described first direction；And
Continue to make described first arm rotate in said first direction and make described second arm described second
Side rotates up, in order to alternately picks up and loads substrate.
18. methods according to claim 17, wherein make described first arm in said first direction
The described step rotated includes:
Described arm is moved in indexing mode.
19. methods according to claim 17, farther include:
The substrate being arranged in described induction system is performed metering.
20. methods according to claim 17, farther include:
Utilize Bernoulli vacuum nozzle that described substrate is fixed to described first arm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/703,851 | 2015-05-04 | ||
| US14/703,851 US10403533B2 (en) | 2015-05-04 | 2015-05-04 | Substrate rotary loader |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106128987A true CN106128987A (en) | 2016-11-16 |
| CN106128987B CN106128987B (en) | 2022-02-08 |
Family
ID=56068662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610286548.6A Active CN106128987B (en) | 2015-05-04 | 2016-05-03 | Substrate rotary loader |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10403533B2 (en) |
| EP (1) | EP3091566A1 (en) |
| CN (1) | CN106128987B (en) |
| TW (1) | TWI675428B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109285796A (en) * | 2017-07-21 | 2019-01-29 | 应用材料公司 | The automation of rotary type sorting machine |
| CN114649193A (en) * | 2020-12-18 | 2022-06-21 | 株式会社斯库林集团 | Substrate cleaning method and substrate cleaning apparatus |
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| US10069030B2 (en) * | 2015-12-14 | 2018-09-04 | Solarcity Corporation | Load lock solar cell transfer system |
| NL2018555A (en) | 2016-04-20 | 2017-10-31 | Asml Netherlands Bv | Substrate support, lithographic apparatus and loading method |
| WO2018025146A1 (en) * | 2016-08-05 | 2018-02-08 | Dematic Corp. | Diverter for sorter and method of diverting |
| US10507991B2 (en) | 2018-05-08 | 2019-12-17 | Applied Materials, Inc. | Vacuum conveyor substrate loading module |
| US11688618B2 (en) | 2020-12-10 | 2023-06-27 | Applied Materials, Inc. | Method and apparatus for continuous substrate cassette loading |
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| CN114649193A (en) * | 2020-12-18 | 2022-06-21 | 株式会社斯库林集团 | Substrate cleaning method and substrate cleaning apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201642377A (en) | 2016-12-01 |
| US10403533B2 (en) | 2019-09-03 |
| US20160325946A1 (en) | 2016-11-10 |
| CN106128987B (en) | 2022-02-08 |
| EP3091566A1 (en) | 2016-11-09 |
| TWI675428B (en) | 2019-10-21 |
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