CN106085647A - A kind of electronic chip scavenger specially - Google Patents
A kind of electronic chip scavenger specially Download PDFInfo
- Publication number
- CN106085647A CN106085647A CN201610402398.0A CN201610402398A CN106085647A CN 106085647 A CN106085647 A CN 106085647A CN 201610402398 A CN201610402398 A CN 201610402398A CN 106085647 A CN106085647 A CN 106085647A
- Authority
- CN
- China
- Prior art keywords
- chip
- electronic chip
- scavenger specially
- methyl
- abluent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002516 radical scavenger Substances 0.000 title claims abstract description 32
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 150000001335 aliphatic alkanes Chemical class 0.000 claims abstract description 15
- 239000005977 Ethylene Substances 0.000 claims abstract description 13
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 10
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 20
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 17
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- -1 carbon alkane Chemical class 0.000 claims description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- HOWGUJZVBDQJKV-UHFFFAOYSA-N docosane Chemical compound CCCCCCCCCCCCCCCCCCCCCC HOWGUJZVBDQJKV-UHFFFAOYSA-N 0.000 claims description 4
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 claims description 4
- 239000012188 paraffin wax Substances 0.000 claims description 4
- NLAGNNORBYGNAV-UHFFFAOYSA-N isotriacontane Natural products CCCCCCCCCCCCCCCCCCCCCCCCCCCC(C)C NLAGNNORBYGNAV-UHFFFAOYSA-N 0.000 claims description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 abstract description 11
- 238000004140 cleaning Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000006378 damage Effects 0.000 abstract description 3
- 230000009972 noncorrosive effect Effects 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 125000004806 1-methylethylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 1
- ILLHQJIJCRNRCJ-UHFFFAOYSA-N dec-1-yne Chemical compound CCCCCCCCC#C ILLHQJIJCRNRCJ-UHFFFAOYSA-N 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 7
- 239000002689 soil Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 239000012459 cleaning agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000006210 lotion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000002769 thiazolinyl group Chemical group 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/247—Hydrocarbons aromatic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a kind of electronic chip scavenger specially, it is prepared from by the raw material of following mass percent: ethylene glycol monoethyl ether 10 16%, ethanolamine 3 7%, 4,7 dihydroxy 2,4,7,9 tetramethyl 5 decine 10 16%, abluent 20 30%, alkane solvent 20 28%, surplus is 1 methyl 4 (1 methyl ethylene) cyclic ethylene.The abluent of the present invention is exclusively used in chip and cleans, and just can thoroughly clean the oil stain on chip and spot, noresidue, hinder chip without any damage, non-corrosive after chip cleaning, have certain protective role after production and application；All kinds of high-end chip of electronic chip scavenger specially professional cleaning of the present invention, is also applied for common each electric appliances chip cleaning.
Description
Technical field
The present invention relates to chemical technical field, particularly relate to a kind of electronic chip scavenger specially.
Background technology
Chip (chip) refers to include the silicon chip of integrated circuit, and volume is the least, may often be such that computer or other electronic equipments
A part, also known as integrated circuit (English: integrated circuit, IC), microcircuit (microcircuit), microchip
(microchip) it is a kind of circuit (mainly including semiconductor equipment, also include passive component etc.) miniaturization in electronics
Mode, and be normally manufactured on semiconductor wafer surface.
In the production process of the electronic component of electronics industry manufacture, cleaning agent is used to be carried out parts being must
Few technical process, and the abluent that the abluent major part used is including freon, and freon is that destruction air is smelly
The material of oxygen layer, according to the Montreal Agreement book signed in the world, each state that signs should be phased out the Chlorofluorocarbons (CFCs) such as freon
Class material.This is the task and challenge sent to electronics industry, it is therefore desirable to select suitably substitute cleaning agent and use corresponding
Production technology.
In electronics industry manufactures, the production of electronic component and be assembled with composition of multiple stage, and each stage has
The technical process cleaned, to ensure high reliability and the high finished product rate of product.Due to pollute granule contamination and inappropriate clearly
Wash caused electronic component problem to include high electric leakage, short circuit open circuit, corrosion corrosion, detection inefficacy, bad welding, seal loosely
A large amount of degradation product and substandard products are caused with metal migration etc..It is thus desirable to further exploitation one not only environmental protection but also clean efficiently
Agent.
Domestic currently used chip abluent, it is main for being mainly from external import.Along with reducing production cost, improve and produce
The overall situation change of product competitiveness, exploitation substitutes import high price chemical products and has become the R&D direction of chemical industry.
One of principal item as surface cleaning agent, chip abluent starts supporting appearance from high-end electronic product, with
The development of science and technology, the requirement effect of chip abluent is constantly improving, same chip abluent function with
Raw material composition aspect has had new progress, essentially becomes the principal item of alternative chip inlet abluent.
Compared with chip inlet abluent, the abluent usability of present invention research and development is safer, and cleaning effect performance is good
Etc. advantage.
Chip abluent is generally divided into the different abluent required such as digital electronic goods, electronic circuit board, electrical terminal.
Chip abluent of the present invention is compared with general abluent, and its cleaning dynamics is strong, and corrosivity is weak, and volatility is fast, clean range is wide
Good characteristics.
Summary of the invention
For above-mentioned deficiency present in prior art, the technical problem to be solved is to provide a kind of electronics core
Sheet scavenger specially.
The present invention seeks to be achieved through the following technical solutions:
A kind of electronic chip scavenger specially, is prepared from by the raw material of following mass percent: ethylene glycol monoethyl ether 10-16%,
Ethanolamine 3-7%, 4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine 10-16%, abluent 20-30%, alkane solvent 20-
28%, surplus is 1-methyl-4-(1-methyl ethylene) cyclic ethylene.
Preferably, described abluent is a kind of in METHYLPYRROLIDONE, dimethyl carbonate or its mixture.
It is highly preferred that described abluent is 1:(2-6 in mass ratio by METHYLPYRROLIDONE, dimethyl carbonate)
Mix.
Preferably, described alkane solvent is the linear paraffin of the alkane of C5-C20, preferably C5-C20, can be selected from different
In hexane, positive structure 12 carbon alkane, hexadecane, n-docosane, positive melissane, normal octane, solvent naphtha D35 one or more
Mixture.
It is highly preferred that described alkane solvent is 1:(2-6 by isohexane, positive structure 12 carbon alkane in mass ratio) mixing and
Become.
Present invention also offers the preparation method of above-mentioned electronic chip scavenger specially, by proportioning by ethylene glycol list second
Ether, 1-methyl-4-(1-methyl ethylene) cyclic ethylene, detergent additive, alkane solvent, dimethyl carbonate mix homogeneously are i.e.
?.
Concrete, in the present invention:
Ethylene glycol monoethyl ether, No. CAS: 110-80-5.
Ethanolamine, No. CAS: 141-43-5.
METHYLPYRROLIDONE, No. CAS: 2687-44-7.
4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine, No. CAS: 126-86-3.
Solvent naphtha D35, for C5-20 normal paraffin paraffin, No. CAS: 64771-72-8.
1-methyl-4-(1-methyl ethylene) cyclic ethylene, also known as dipentene, No. CAS: 138-86-3.
Dimethyl carbonate, No. CAS: 616-38-6.
Isohexane, also known as 2-methylpentane, No. CAS: 107-83-5.
Positive structure 12 carbon alkane, No. CAS: 93685-81-5.
The abluent of the present invention is exclusively used in chip and cleans, and just can thoroughly clean the oil stain on chip and dirt after production and application
Stain, noresidue, to chip without any damage hinder, chip clean after non-corrosive, have certain protective role.The electronic chip of the present invention is special clearly
All kinds of high-end chip of lotion professional cleaning, is also applied for common each electric appliances chip cleaning.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described further, the following stated, is only the preferable enforcement to the present invention
Example, not does the restriction of other forms to the present invention, and any those skilled in the art are possibly also with the disclosure above
Technology contents be changed to the Equivalent embodiments that changes on an equal basis.Every without departing from the present invention program content, according to the present invention
Technical spirit any simple modification that following example are done or equivalent variations, all fall within protection scope of the present invention.
Embodiment 1
Electronic chip scavenger specially raw material: ethylene glycol monoethyl ether 13kg, ethanolamine 5kg, METHYLPYRROLIDONE 5kg, 4,
7-dihydroxy-2,4,7,9-tetramethyl-5-decine 13kg, solvent naphtha D35 9kg, 1-methyl-4-(1-methyl ethylene) ring second
Alkene 20kg, dimethyl carbonate 20kg, isohexane 3kg, positive structure 12 carbon alkane 12kg.
Prepared by electronic chip scavenger specially: stir adding ethanolamine mixing after solvent naphtha D35, dimethyl carbonate stirring
Mix after uniformly, add ethylene glycol monoethyl ether, METHYLPYRROLIDONE, 4,7-dihydroxy-2,4,7,9-tetramethyl-5-last of the ten Heavenly stems
Alkynes, 1-methyl-4-(1-methyl ethylene) cyclic ethylene, isohexane, positive structure 12 carbon alkane mix homogeneously, can be prepared by embodiment
The electronic chip scavenger specially of 1.
Embodiment 2
Electronic chip scavenger specially raw material: ethylene glycol monoethyl ether 13kg, ethanolamine 5kg, 4,7-dihydroxy-2,4,7,9-tetramethyl
Base-5-decine 13kg, abluent 25kg, alkane solvent 24kg, 1-methyl-4-(1-methyl ethylene) cyclic ethylene 20kg.
Described abluent is obtained for 1:4 mix homogeneously in mass ratio by METHYLPYRROLIDONE, dimethyl carbonate.
Described alkane solvent is obtained for 1:4 mix homogeneously in mass ratio by isohexane, positive structure 12 carbon alkane.
Prepared by electronic chip scavenger specially: added by ethanolamine in alkane solvent and stir 6 minutes with 400 revs/min, then add
Enter ethylene glycol monoethyl ether, 4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine stir 6 minutes with 400 revs/min, are eventually adding clear
Lotion, 1-methyl-4-(1-methyl ethylene) cyclic ethylene are with 10 minutes mix homogeneously of 400 revs/min of stirrings.Can be prepared by embodiment
The electronic chip scavenger specially of 2.
Embodiment 3
Substantially the same manner as Example 2, differ only in: described abluent is only METHYLPYRROLIDONE.Can be prepared by
The electronic chip scavenger specially of embodiment 3.
Embodiment 4
Substantially the same manner as Example 2, differ only in: described abluent is only dimethyl carbonate.Can be prepared by embodiment 4
Electronic chip scavenger specially.
Embodiment 5
Substantially the same manner as Example 2, differ only in: described alkane solvent is only isohexane.Can be prepared by embodiment 5
Electronic chip scavenger specially.
Embodiment 6
Substantially the same manner as Example 2, differ only in: described alkane solvent is only positive structure 12 carbon alkane.Can be prepared by
The electronic chip scavenger specially of embodiment 6.
Comparative example 1
Electronic chip scavenger specially raw material: ethylene glycol monoethyl ether 13kg, ethanolamine 5kg, METHYLPYRROLIDONE 13kg,
4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine 18kg, solvent naphtha D35 15kg, 1-methyl-4-(1-methyl ethylene) ring
Ethylene 20kg, isohexane 4kg, positive structure 12 carbon alkane 12kg.
Prepared by electronic chip scavenger specially: after solvent naphtha and ethanolamine mixing and stirring, add ethylene glycol list
Ether, METHYLPYRROLIDONE, 4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine, 1-methyl-4-(1-ethylene methacrylic
Base) cyclic ethylene, positive structure 12 carbon alkane, isohexane mix homogeneously, can be prepared by the electronic chip scavenger specially of comparative example 1.
Comparative example 2
Electronic chip scavenger specially raw material: ethylene glycol monoethyl ether 10kg, ethanolamine 5kg, 4,7-dihydroxy-2,4,7,9-tetramethyls
Base-5-decine 18kg, solvent naphtha D35 14kg, 1-methyl-4-(1-methyl ethylene) cyclic ethylene 20kg, isohexane 3kg, positive structure
12 carbon alkane 12kg, dimethyl carbonate 18kg.
Prepared by electronic chip scavenger specially: add ethanolamine mix and blend after solvent naphtha, dimethyl carbonate stirring
After Jun Yun, add ethylene glycol monoethyl ether, 4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine, 1-methyl-4-(1-methyl second
Thiazolinyl) cyclic ethylene, isohexane mix homogeneously, can be prepared by the electronic chip scavenger specially of comparative example 2.
Test case 1
The electronic chip scavenger specially of embodiment 1-6 and comparative example 1-2 is carried out detergency ability test.
Experiment chip: totally 8 groups, often organize and take 0.5 × 0.5 chip for cell phone 10 respectively, respectively check weighing W1, chip is coated with
Cover the dirt of a layer 30 grams, dry one hour at 80 DEG C, respectively check weighing W2.
Cleaning method: the 1000 grams of electronic chip scavenger speciallies weighing embodiment 1-6 and comparative example 1-2 respectively are poured into little
In type ultrasonic drilling machine, being carried out 8 groups of chips for cell phone respectively, ultrasonic temperature is 50 DEG C, and the ultrasonic cleaning time is 5 minutes, so
After rinse 5 minutes under the flowing of 50 DEG C of water, oven for drying, respectively check weighing W3.Soil removal efficiency is drawn by gravimetric method.
By Colophonium 15 grams, scaling powder 15 grams, (scaling powder uses Yongtai, Shenzhen Xi Ye company limited to provide to above-mentioned dirt
Model is the colophony type scaling powder of YT004) mix homogeneously forms.
Soil removal efficiency=[(W2-W3)/(W2-W1)] × 100.Concrete outcome is shown in Table 1.
Table 1: soil removal efficiency test result table
| Soil removal efficiency | |
| Embodiment 1 | 99 |
| Embodiment 2 | 99 |
| Embodiment 3 | 86 |
| Embodiment 4 | 92 |
| Embodiment 5 | 90 |
| Embodiment 6 | 89 |
| Comparative example 1 | 75 |
| Comparative example 2 | 88 |
In the present invention, use dimethyl carbonate and the combination of METHYLPYRROLIDONE both efficient cleaners, dimethyl carbonate
Being environment-friendly and green industrial chemicals, be the green solvent integrating spatter property with safety, its cleaning dynamics is significantly improved,
Comparing embodiment 2 and embodiment 3-4, embodiment 2(dimethyl carbonate, METHYLPYRROLIDONE are compounding) soil removal efficiency is the highest
Single raw material in embodiment 3-4(dimethyl carbonate, METHYLPYRROLIDONE).
Particularly, comparing embodiment 2 and embodiment 5-6, embodiment 2(isohexane, positive structure 12 carbon alkane are compounding) decontamination
Rate is apparently higher than single raw material in embodiment 5-6(isohexane, positive structure 12 carbon alkane).
The electronic chip scavenger specially of the present invention, easy to use, chip abluent is poured into ultrasonic echography and cleans again
Add water rinsing post-drying, can reach clean the effect of chip and form the work of one layer of antirust lasting protecting film on surface
With, product of the present invention uses safely, is the cleaning product of greening and environmental protection.
Claims (5)
1. an electronic chip scavenger specially, it is characterised in that: it is prepared from by the raw material of following mass percent: ethylene glycol
Single ether 10-16%, ethanolamine 3-7%, 4,7-dihydroxy-2,4,7,9-tetramethyl-5-decine 10-16%, abluent 20-30%,
Alkane solvent 20-28%, surplus is 1-methyl-4-(1-methyl ethylene) cyclic ethylene.
2. electronic chip scavenger specially as claimed in claim 1, it is characterised in that: described abluent is N-methyl-2-
A kind of or its mixture in ketopyrrolidine, dimethyl carbonate.
3. electronic chip scavenger specially as claimed in claim 2, it is characterised in that: described abluent is by N-methyl-2-
Ketopyrrolidine, dimethyl carbonate are in mass ratio for 1:(2-6) mix.
4. the electronic chip scavenger specially as according to any one of claim 1-3, it is characterised in that: described alkane solvent
For the linear paraffin of the alkane of C5-C20, preferably C5-C20, can be selected from isohexane, positive structure 12 carbon alkane, hexadecane,
The mixture of one or more in n-docosane, positive melissane, normal octane, solvent naphtha D35.
5. electronic chip scavenger specially as claimed in claim 4, it is characterised in that: described alkane solvent by isohexane,
Positive structure 12 carbon alkane is in mass ratio for 1:(2-6) mix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610402398.0A CN106085647B (en) | 2016-06-07 | 2016-06-07 | A kind of electronic chip scavenger specially |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610402398.0A CN106085647B (en) | 2016-06-07 | 2016-06-07 | A kind of electronic chip scavenger specially |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106085647A true CN106085647A (en) | 2016-11-09 |
| CN106085647B CN106085647B (en) | 2018-08-17 |
Family
ID=57227492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610402398.0A Active CN106085647B (en) | 2016-06-07 | 2016-06-07 | A kind of electronic chip scavenger specially |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106085647B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114196405A (en) * | 2021-12-30 | 2022-03-18 | 广东长兴半导体科技有限公司 | Liquid medicine for taking wafer from waste IC and preparation process and application thereof |
| CN115821276A (en) * | 2022-07-07 | 2023-03-21 | 中山市浩科化工科技有限公司 | Strong cleaning agent for new energy metal and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030004075A1 (en) * | 2000-09-01 | 2003-01-02 | Mizuki Suto | Cleaning solution for removing residue |
| CN102660393A (en) * | 2012-05-02 | 2012-09-12 | 常熟奥首光电材料有限公司 | Cleaning solution for light-emitting diode (LED) chip |
| CN102851151A (en) * | 2012-09-25 | 2013-01-02 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly cleaning agent for electronic industry |
| KR20130068903A (en) * | 2011-12-16 | 2013-06-26 | 동우 화인켐 주식회사 | Cleaning composition using electronic material |
| CN104450332A (en) * | 2014-11-21 | 2015-03-25 | 苏州东辰林达检测技术有限公司 | Integrated circuit chip cleaning fluid and preparation method thereof |
-
2016
- 2016-06-07 CN CN201610402398.0A patent/CN106085647B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030004075A1 (en) * | 2000-09-01 | 2003-01-02 | Mizuki Suto | Cleaning solution for removing residue |
| KR20130068903A (en) * | 2011-12-16 | 2013-06-26 | 동우 화인켐 주식회사 | Cleaning composition using electronic material |
| CN102660393A (en) * | 2012-05-02 | 2012-09-12 | 常熟奥首光电材料有限公司 | Cleaning solution for light-emitting diode (LED) chip |
| CN102851151A (en) * | 2012-09-25 | 2013-01-02 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly cleaning agent for electronic industry |
| CN104450332A (en) * | 2014-11-21 | 2015-03-25 | 苏州东辰林达检测技术有限公司 | Integrated circuit chip cleaning fluid and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114196405A (en) * | 2021-12-30 | 2022-03-18 | 广东长兴半导体科技有限公司 | Liquid medicine for taking wafer from waste IC and preparation process and application thereof |
| CN115821276A (en) * | 2022-07-07 | 2023-03-21 | 中山市浩科化工科技有限公司 | Strong cleaning agent for new energy metal and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106085647B (en) | 2018-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20180064365A (en) | Etchant solutions and method of use thereof | |
| CN101614971B (en) | Photoresist cleaning agent | |
| CN102047184A (en) | Cleaning solution of plasma etching residues | |
| CN101907835B (en) | Detergent composition for photoresists | |
| US7799750B2 (en) | Solvent composition for cleaning | |
| CN106085647A (en) | A kind of electronic chip scavenger specially | |
| CN101412948A (en) | Cleaning agent for plasma etching residue | |
| CN101163776A (en) | Selective removal chemistries for semiconductor applications, methods of production and uses thereof | |
| CN101412949A (en) | Cleaning liquid for plasma etching residue | |
| CN113186044A (en) | Preparation method of fluorine-containing cleaning liquid composition | |
| CN104194971B (en) | A kind of welding fixture microemulsion cleaning agent | |
| CN108465977A (en) | A kind of non-halide cleaning-free welding flux and preparation method thereof | |
| CN106459850A (en) | TIN pull-back and cleaning composition | |
| Zheng et al. | Electrochemical examination of surface films formed during chemical mechanical planarization of copper in acetic acid and dodecyl sulfate solutions | |
| CN112698554A (en) | Photoresist cleaning agent for semiconductor process | |
| CN101827927A (en) | A plasma etching residues cleaning composition | |
| CN101270324A (en) | Semiconductor etch residue remover and cleansing compositions | |
| US20140272113A1 (en) | Gum rosin protective coating and methods of use | |
| CN113249175B (en) | Application of post-chemical mechanical polishing cleaning solution | |
| CN101750915A (en) | Semiconductor wafer metal protection liquid and use method thereof | |
| CN105462707A (en) | Water-based cleaning agent and preparation method and application thereof | |
| CN102051283B (en) | Hydroxylamine-containing cleaning solution and use thereof | |
| CN107868729B (en) | A kind of degumming composition and its preparation method and application | |
| CN104031522A (en) | Three-proofing lacquer rapidly solidified at room temperature and used for printed circuit boards | |
| CN107828549A (en) | A kind of hard surface cleaner and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 528400, No. 6 Xinzhan Road, Shazai Administrative Village, Minmin Street, Zhongshan City, Guangdong Province, Class A workshops A and B, Class C workshops D, R&D workshops on the first and second floors, with one card on the third floor, one card on the fourth floor, one card on the fifth floor, Class A warehouses A and B, and Class C warehouses Patentee after: ZHONGSHAN HOK CHEMICAL TECHNOLOGY CO.,LTD. Country or region after: China Address before: No. 6, Xinzhan Road, Shazi Village, Minmin Town, Zhongshan, Guangdong 528441 Patentee before: ZHONGSHAN HOK CHEMICAL TECHNOLOGY CO.,LTD. Country or region before: China |