CN106067775A - Surface patch quartz-crystal resonator produce in sheet devices and method on imposite - Google Patents
Surface patch quartz-crystal resonator produce in sheet devices and method on imposite Download PDFInfo
- Publication number
- CN106067775A CN106067775A CN201610528937.5A CN201610528937A CN106067775A CN 106067775 A CN106067775 A CN 106067775A CN 201610528937 A CN201610528937 A CN 201610528937A CN 106067775 A CN106067775 A CN 106067775A
- Authority
- CN
- China
- Prior art keywords
- imposite
- wafer
- pedestal
- box
- crystal resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000013078 crystal Substances 0.000 title claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims abstract description 151
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 100
- 239000011248 coating agent Substances 0.000 claims abstract description 81
- 238000000576 coating method Methods 0.000 claims abstract description 81
- 239000003463 adsorbent Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000003292 glue Substances 0.000 abstract description 7
- 239000011159 matrix material Substances 0.000 description 14
- 239000010453 quartz Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to electronic devices and components field, particularly relate to sheet devices and method on the imposite during surface patch quartz-crystal resonator produces.In the present invention, on imposite, sheet devices includes fixing device, is positioned at the mobile device that the adsorbent equipment within fixing device removably connects with fixing device, it is provided with the imposite wafer for being mounted on pedestal imposite on the mobile device, described imposite wafer is formed by multiple wafers, and described adsorbent equipment contacts with the imposite wafer in mobile device.In the present invention, imposite upper slice method is, moves integrally multiple wafer and forms imposite wafer so that has an individual base the most corresponding in imposite wafer immediately below each wafer.The present invention utilizes coating clamp entirety to draw wafer, is integrally placed on the pedestal imposite after a glue, so can shorten the time placing wafer, and paster speed is fast, improves production efficiency dozens to one hundred times, simultaneously expanding production amount.
Description
Technical field
The invention belongs to electronic devices and components field, particularly relate to during surface patch quartz-crystal resonator produces on chip on imposite
Put and method.
Background technology
Quartz-crystal resonator is also called quartz crystal, is commonly called as crystal oscillator, is to utilize the piezoelectric effect of quartz crystal to make
Resonant element, be used together with semiconductor device and Resistor-Capacitor Unit, just may make up quartz oscillator.
Quartz wafer, hereinafter referred to as wafer, it can be square, rectangle or circle etc., at its two corresponding surfaces
Upper coating silver layer is as electrode, and surface patch quartz-crystal resonator is the electrode on quartz wafer and pedestal to be entered by conducting resinl
Row electrical connection, is coated with primer on pedestal, forms quartz wafer underlying conductive glue, by quartz wafer side above primer, and stone
Auxiliary electrode on English wafer is coated with gluing, forms quartz wafer upper conductive glue.
CCD, as imageing sensor, is also image controller, is a kind of semiconductor device, it is possible to optical image is converted
For digital signal.The pixel count comprised on one piece of CCD is the most, and its screen resolution provided is the highest.CCD acts like
Film is the same, but it is that optical signal is converted into charge signal.There is the photodiode of many marshallings on CCD, can sense
Light, and convert optical signals into the signal of telecommunication, it is converted into data image signal through external sampling amplification and analog to digital conversion circuit.
For quartz wafer is fixed on pedestal, has been used up from coating clamp, draw wafer one by one at present and place again
Production method in pedestal.Main technique is: directly draws wafer from coating clamp one by one, moves to CCD and detect and rotate
Angle, after CCD identifies that wafer is qualified, is mounted in the pedestal of a little good primer one by one.
But, the most this wafer technique of drawing one by one there is problems in that
1, single wafer draw one by one, about 0.6s standing time, transfer imposite fixture (as a example by 400pcs) the wafer time
For 240s, production efficiency is low.
2, slow due to the low circulation of production efficiency, coating clamp requirement is big.
Summary of the invention
For the deficiencies in the prior art, the present invention provides sheet devices on the imposite in the patch quartz-crystal resonator production of surface
And method, for the pedestal imposite processing of surface patch quartz-crystal resonator, it is achieved after plated film, wafer is directly in coating clamp
Imposite is displaced in pedestal imposite.
For solving above-mentioned technical problem, on chip on imposite in the surface patch quartz-crystal resonator production that the present invention provides
Putting, it is characterized in that and includes fixing device, is positioned at the adsorbent equipment within fixing device and detachably connects with fixing device
The mobile device connect, is provided with the imposite wafer for being mounted on pedestal imposite 1 on the mobile device, described imposite wafer by
Multiple wafers 4 are formed, and described adsorbent equipment contacts with the imposite wafer in mobile device.
Further, described fixing device is for inhaling box 12, and described adsorbent equipment includes being positioned at running through inhales box 12 upper surface
Metal bar 7, the suction nozzle 13 being positioned at metal bar 7 top, the spring 9 that is set on metal bar 7, metal bar 7 bottom and vacuum system
Connect, suction nozzle 13 top and the imposite wafer one_to_one corresponding in mobile device.
Further, described mobile device is coating clamp 10, and on coating clamp 10, the ranks spacing of each wafer 4 is base
The ranks spacing integral multiple of individual base 1-1 in seat imposite 1.
Further, inhaling on box 12 and be additionally provided with positioner, described positioner is to be arranged on inhale on box multiple fixed
Position pin 8, positioning needle 8 is corresponding with corresponding load plate location hole 1-2 on pedestal imposite respectively.
Further, described coating clamp 10 is provided with on pedestal imposite 1 pedestal imposite position hole 1-3 consistent
Hole 11, coating clamp location.
The present invention provides imposite upper slice method in the patch quartz-crystal resonator production of surface, and it is characterized in that multiple
Wafer forms imposite wafer, moves integrally imposite wafer and makes to have immediately below each wafer in imposite wafer an individual base
Corresponding therewith.
Further, move integrally imposite wafer to pedestal imposite, comprise the following steps:
Step 1, imposite wafer is moved integrally in the fixing device with adsorbent equipment, held by adsorbent equipment whole
Lath sheet；
Step 2, press adsorbent equipment down, make the primer on the individual base left and right platform of each its correspondence of contact wafers；
Step 3, separation absorption device and imposite wafer, the imposite wafer transfer each individual base in pedestal imposite
On.
Further, imposite wafer is that the absorption moving integrally in fixing device by mobile device fills in step 1
Put top.
Further, by electric device or manual operation, mobile device is arranged in fixing device in step 1.
Further, described mobile device is coating clamp, and it makes and meets following condition:
Coating clamp and pedestal imposite consistent size；
On coating clamp, the ranks spacing of each wafer is the ranks spacing integral multiple of individual base in pedestal imposite；
Hole, location on coating clamp is consistent with the hole, location on pedestal imposite.
Further, in step 2, before lower pressure adsorbent equipment, the adsorbent equipment in fixing device is positioned at imposite wafer
Top, the position of corresponding individual base in the lower section correspondence pedestal imposite of each wafer in imposite wafer.
Further, the fixing device made in step 1 is for inhaling box, and adsorbent equipment is the suction nozzle being positioned at and inhaling box, inhales
Box lower end is connected with vacuum system, inhales the suction nozzle within box and the imposite wafer one_to_one corresponding in mobile device, inhales determining on box
Position device is consistent with the hole, location of pedestal imposite load plate.
Further, suction box is moved by electric device or manual operation in step 2 so that imposite wafer is positioned at pedestal
Above imposite.
Compared with prior art, it has the beneficial effect that the present invention uses the multiple wafer technique of imposite transfer to the present invention, will
Multiple wafers form imposite wafer on coating clamp, fixing in imposite wafer being placed on suction box by coating clamp, each
Imposite wafer, to there being a wafer, by upset, is placed on the pedestal imposite with primer, so can shorten by suction nozzle
Placing the time of a large amount of wafer, improve paster speed, production efficiency improves dozens to one hundred times, expands paster volume of production simultaneously.
Accompanying drawing explanation
Fig. 1 is pedestal imposite schematic diagram of the present invention；
Fig. 2 is individual base schematic diagram of the present invention；
Fig. 3 is view after individual base glue spraying of the present invention；
Fig. 4 is the suction box structural representation that the present invention draws wafer；
Fig. 5 is that the present invention inhales box part-structure schematic diagram；
Fig. 6 is coating clamp structural representation of the present invention.
Description of symbols: 1, pedestal imposite, 1-1, individual base, hole, 1-2, load plate location, hole, 1-3, pedestal imposite location, 2,
Left platform, 3, right platform, 4, wafer, 5, auxiliary electrode, 6, primer, 7, metal bar, 8, positioning needle, 9, spring, 10, coating clamp,
11, hole, coating clamp location, 12, inhale box, 13, suction nozzle.
Detailed description of the invention
1 to accompanying drawing 6 referring to the drawings, provide the detailed description of the invention of the present invention, are used for being the present invention furtherly
Bright.
Wafer in the present invention is exactly quartz-crystal resonator, whole about the pedestal for surface patch quartz-crystal resonator
Plate, the concrete form of pedestal imposite is in the present invention: by being processed into the structure connected by matrix arrangement on the big plate of pottery
Unit, each construction unit is as an independent individual base, and the big plate of pottery being consequently formed is whole as the pedestal of the present invention
Plate.
Concrete form at the imposite wafer of the present invention is: formed according to multiple wafers of matrix arrangement on coating clamp
Imposite wafer, each construction unit, as independent each wafer, is consequently formed the imposite wafer of the present invention.
In providing surface patch quartz-crystal resonator to produce in the present embodiment, blade technolgy method on imposite, is to paste surface
Quartz-crystal resonator produce in the improvement in upper slice stage, for other steps in producing, as being coated with the technique of primer, no longer
It is developed in details in describing, is only used for the technique of the present invention is aided in illustrating.
Being the individual base connected by the arrangement of M*N matrix in the present invention on pedestal imposite, the initial value of M, N is 1, M,
N is non-zero natural number, and M is the line number that maximum is matrix of line number and M, N be the maximum of columns and N be matrix column
Number, i.e. 1≤M≤line number, 1≤N≤columns, a is used for each individual base on pedestal impositeMNExpress, aMNIt is in base
The individual base of seat imposite M row Nth column.
The coating clamp that mobile device uses in the present invention, fixing device uses the suction box with suction nozzle, for ease of moving
Dynamic imposite wafer is in fixing device, it is possible to uses other type of device, or manually moves.Fixing device is not limited to inhale
Box, as long as the most permissible as long as being furnished with multiple suction nozzle in fixing device inside, vacuum system is the most not shown, is positioned at suction box
Portion, concrete installation site is unrestricted, if the absorption that can control between suction nozzle and wafer.Vacuum system both can conduct
The part inhaling box is positioned at inside suction box, it is also possible to be positioned at outside suction box as independent structure.
Imposite wafer on coating clamp is P*Q matrix, and P is the line number that maximum is matrix of line number and P, and Q is columns
And the maximum of Q is matrix column number, i.e. 1≤P≤line number, 1≤Q≤columns, each wafer on imposite wafer is used
aPQExpress, aPQIt is in each wafer of coating clamp P row Q row.
Coating clamp in the present invention to meet following condition:
1, coating clamp and pedestal imposite consistent size are required；
2, the ranks spacing of coating clamp is the ranks spacing integral multiple of pedestal imposite, i.e. P is the integral multiple of M, and Q is N's
Integral multiple.Coating clamp is multiple structure, a layer above coating clamp wafer layer, is provided with a line magnetic between every two row
Sheet, the number of the number of magnetic sheet wafer each with this row is consistent, and each magnetic sheet, can be solid by each wafer to there being each wafer
It is scheduled on coating clamp formation imposite wafer；
3, hole, coating clamp location is consistent with hole, pedestal imposite location.
In the present invention, the suction box of stationary fixture to meet following condition
1, inhale box lower end to be connected with vacuum system, 180 ° of upsets can be done by electric device；
2, the internal flexible suction nozzle pressed down of box and wafer one_to_one corresponding in coating clamp are inhaled；
3, the positioner on box is inhaled consistent with the hole, location of pedestal imposite load plate.
Four corners inhaling box upper surface in the present invention are provided with positioner, and the region between positioner is equal
The even metal bar that is placed with, metal bar runs through suction box upper surface, is inhaling above box upper surface, and the top of each metal bar is provided with
Suction nozzle, in the lower section inhaling box upper surface, each metal bar is socketed with spring and is fixed in suction box, and metal bar bottom is provided with
Vacuum system.Positioner is to be arranged on the multiple positioning needles inhaled on box in the present invention, positioning needle respectively with pedestal imposite phase
The hole, load plate location answered is corresponding, and so when the suction nozzle inhaling box is positioned at above wafer, positioning needle fastens with hole, load plate location, permissible
Suction box is fixed on pedestal imposite.
The load plate dual-side of pedestal imposite has hole, 4 load plate location, specially load plate location hole P1, load in the present invention
Dish location hole P2, load plate location hole P3, load plate location hole P4, be symmetrically distributed in load plate dual-side, and it is fixed with inhale box four to be used for
Position pin is interlocked.
It is provided with on coating clamp and positions the hole, coating clamp location that hole is consistent with the pedestal imposite on pedestal imposite, work as suction
When box is fixed on pedestal imposite, hole, pedestal imposite location and coating clamp position the fastening in hole, it can be ensured that coating clamp
Stable, that the most each wafer is corresponding individual base correspondence.
According to top base imposite, coating clamp, the specification of suction box, the embodiment in the present invention is illustrated.
Before utilizing coating clamp to move imposite wafer, according to following steps to pedestal imposite coating primer:
Step 1, ready pedestal imposite is placed into pedestal the primer to be coated such as carries in cage；
Step 2, according to glue point size position adjustment glue spraying time and glue spraying position；
Primer it is coated with on the left and right platform of each individual base in step 3, pedestal imposite.
Embodiment 1
Imposite wafer ranks on coating clamp are identical with the ranks spacing of pedestal imposite in the present embodiment, i.e. complete base
After the coating primer technique of the whole individual base on seat imposite, whole individual base is carried out simultaneously upper blade technolgy, at this
In embodiment, the imposite wafer on coating clamp is P*Q matrix, pedestal imposite is M*N matrix, and P=M, Q=N, when pedestal is whole
After the left and right platform of each individual base on plate is coated with primer, follows the steps below the movement of imposite wafer and put
Putting, particularly sheet process is as follows:
Step 1, the imposite wafer being placed in coating clamp is placed into wafer carries in cage, each wafer on imposite wafer
Number, the number inhaling suction nozzle in box and imposite pedestal on the number of individual base keep consistent；
Step 2, by mechanical hand the coating clamp with imposite wafer is arranged in suction box, opens vacuum system, logical
Cross the suction nozzle inhaled in box and hold wafer, inhale each wafer on the suction nozzle correspondence coating clamp on box each metal bar top interior,
Throw off the upper electric lids of coating clamp；
Step 3, by mechanical hand upset inhale box, make suction box overlap with pedestal imposite load plate by positioning needle, coating clamp
Overlap with pedestal imposite；Thus each wafer and the individual base one_to_one corresponding in pedestal imposite；
Step 4, press suction nozzle down, make the primer of the individual base left and right platform that each contact wafers is corresponding；
Step 5, to inhaling after box vacuum breaker, each suction nozzle loses suction to each wafer, inhales box and leaves base with coating clamp
The load plate of seat imposite, on the imposite wafer transfer each individual base in pedestal imposite.
In the present embodiment coating clamp is arranged in suction box, and upset is inhaled box and all realized by electric device, tool
Body uses mechanical hand to operate.
Embodiment 2
The process that imposite wafer on the present embodiment, coating clamp moves to pedestal imposite is similar to embodiment 1, no
Being with part, in the present embodiment, the imposite wafer row on coating clamp is classified as the ranks spacing twice of pedestal imposite, for plating
Imposite wafer on film fixture is P*Q matrix, pedestal imposite is M*N matrix, and P=2M, Q=2N i.e. complete on pedestal imposite
Whole individual base coating primer technique after, be pointed to odd-numbered line odd column or the list of even number line even column on pedestal imposite
Susceptor body carries out upper blade technolgy simultaneously.Select in the present embodiment first to the individual base of odd-numbered line odd column on pedestal imposite
Upper slice, the most again to the individual base upper slice of even number line even column on pedestal imposite
After the left and right platform of each individual base on pedestal imposite is coated with primer, follow the steps below imposite
The movement of wafer and placement, particularly sheet process is as follows:
Step 1, the imposite wafer being placed in coating clamp is placed into wafer carries in cage, each wafer on imposite wafer
Number, to inhale the number of suction nozzle in box consistent, and each wafer and the number of odd-numbered line odd column individual base on imposite pedestal
Mesh keeps consistent；
Step 2, by mechanical hand the coating clamp with imposite wafer is arranged in suction box, by inhaling the suction nozzle in box
Hold wafer, inhale each wafer on the suction nozzle correspondence coating clamp on box each metal bar top interior, throw off coating clamp
Upper electrode；
Step 3, by mechanical hand upset inhale box, make suction box overlap with pedestal imposite load plate by positioning needle, coating clamp
Overlap with pedestal imposite；Thus each wafer and the individual base one_to_one corresponding in pedestal imposite；
Step 4, press suction nozzle down, make the primer of the individual base left and right platform that each contact wafers is corresponding；
Step 5, to inhaling after box vacuum breaker, each suction nozzle loses suction to each wafer, inhales box and leaves base with coating clamp
The load plate of seat imposite, imposite wafer transfer is positioned on each individual base of odd-numbered line odd column in pedestal imposite；
Step 6, return step 1, again placement imposite wafer on coating clamp, palikinesia step 1 to step 5,
In this step, after inhaling box upset, each wafer being positioned on coating clamp and the monomer base of even number line even column on imposite pedestal
Seat is corresponding.
Upper slice work of whole individual base on pedestal imposite is completed according to above step.
Embodiment 3
The process that imposite wafer on the present embodiment, coating clamp moves to pedestal imposite is similar to embodiment 1, no
It is with part, in the present embodiment coating clamp is arranged in suction box, and upset is inhaled box and the most manually realized.
Additionally, the imposite wafer row on coating clamp is classified as the ranks spacing 3 times of pedestal imposite in the present embodiment, for plating
Imposite wafer on film fixture is P*Q matrix, pedestal imposite is M*N matrix, and P=3M, Q=3N i.e. complete on pedestal imposite
Whole individual base coating primer technique after, be pointed on pedestal imposite to be separated by two row and be separated by the individual base of two row simultaneously
Carry out upper blade technolgy.As a example by the pedestal imposite of 12*12, select in the present embodiment first to pedestal imposite the 1st, 4,7,10 row,
Individual base sheets on the whole on 1st, 4,7,10 row, the most again to pedestal imposite the 2nd, 5,8,11 row, on the 2nd, 5,8,11 row
Individual base sheet on the whole, finally to pedestal imposite the 3rd, 6,9,12 row, the individual base on the 3rd, 6,9,12 row are on the whole
Sheet.
After the left and right platform of each individual base on pedestal imposite is coated with primer, follow the steps below imposite
The movement of wafer and placement, particularly sheet process is as follows:
Step 1, the imposite wafer being placed in coating clamp is placed into wafer carries in cage, each wafer on imposite wafer
Number, to inhale the number of suction nozzle in box consistent, and on each wafer and imposite pedestal the 1st, 4,7,10 row, the 1st, 4,7,10 row
The number of individual base keeps consistent；
Step 2, artificial being arranged on by the coating clamp with imposite wafer are inhaled in box, hold crystalline substance by inhaling the suction nozzle in box
Sheet, inhales each wafer on the suction nozzle correspondence coating clamp on box each metal bar top interior, throws off powering on of coating clamp
Pole；
Box is inhaled in step 3, artificial upset, makes suction box overlap with pedestal imposite load plate by positioning needle, coating clamp and pedestal
Imposite overlaps；Thus in each wafer and pedestal imposite the 1st, 4,7,10 row, the individual base one_to_one corresponding of the 1st, 4,7,10 row；
Step 4, press suction nozzle down, make the primer of the individual base left and right platform that each contact wafers is corresponding；
Step 5, to inhaling after box vacuum breaker, each suction nozzle loses suction to each wafer, inhales box and leaves base with coating clamp
The load plate of seat imposite, imposite wafer transfer in pedestal imposite the 1st, 4,7,10 row, each individual base of the 1st, 4,7,10 row
On；
Step 6, return step 1, again placement imposite wafer on coating clamp, palikinesia step 1 to step 5,
In this step, after inhaling box upset, on each wafer being positioned on coating clamp and imposite pedestal the 2nd, 5,8,11 row, the 2nd, 5,8,
The individual base of 11 row is corresponding.
Step 7, return step 1, again placement imposite wafer on coating clamp, palikinesia step 1 to step 5,
In this step, after inhaling box upset, on each wafer being positioned on coating clamp and imposite pedestal the 3rd, 6,9,12 row, the 3rd, 6,9,
The individual base of 12 row is corresponding.
Upper slice work of whole individual base on pedestal imposite is completed according to above step.
Above example only lists the order of several sheets on the whole of the present invention, and the present invention mainly realizes imposite pedestal
Upper slice use imposite moving process, be the ranks spacing integral multiple of pedestal imposite as the ranks spacing of coating clamp, be not
With upper slice order, can convert out according to ranks spacing and more go up an order.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of the spirit or essential attributes of the present invention, it is possible to realize the present invention in other specific forms.Therefore, no matter
From the point of view of which point, all should regard embodiment as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all by fall in the implication of equivalency and scope of claim
Change is included in the present invention.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment comprises
One independent technical scheme, this narrating mode of description is only the most for clarity sake, and those skilled in the art should be by
Description is as an entirety, and the technical scheme in each embodiment can also be through appropriately combined, and forming those skilled in the art can
With other embodiments understood.
Claims (10)
1. sheet devices on the imposite during patch quartz-crystal resonator in surface produces, it is characterised in that: include fixing device, be positioned at admittedly
Determine the mobile device that the adsorbent equipment within device removably connects with fixing device, be provided with on the mobile device for pasting
Being contained in the imposite wafer on pedestal imposite (1), described imposite wafer is formed by multiple wafers (4), described adsorbent equipment and movement
Imposite wafer on device contacts.
2. sheet devices on the imposite during surface as claimed in claim 1 patch quartz-crystal resonator produces, it is characterised in that:
Described fixing device for inhaling box (12), described adsorbent equipment include being positioned at run through inhale box (12) upper surface metal bar (7),
The suction nozzle (13) being positioned at metal bar (7) top, the spring (9) being set on metal bar (7), metal bar (7) bottom and vacuum system
System connects, suction nozzle (13) top and the imposite wafer one_to_one corresponding in mobile device；
Described mobile device is coating clamp (10), and the ranks spacing of the upper each wafer (4) of coating clamp (10) is pedestal imposite
(1) the ranks spacing integral multiple of individual base (1-1) in.
3. sheet devices on the imposite during surface as claimed in claim 2 patch quartz-crystal resonator produces, it is characterised in that:
Inhaling and be additionally provided with positioner on box (12), described positioner is to be arranged on the multiple positioning needles (8) inhaled on box, location
Pin (8) is corresponding with corresponding load plate hole, location (1-2) on pedestal imposite respectively；
It is provided with on described coating clamp (10) and positions, with the pedestal imposite on pedestal imposite (1), the coating film sandwich that hole (1-3) is consistent
Tool hole, location (11).
4. the imposite upper slice method during patch quartz-crystal resonator in surface produces, it is characterised in that: it is brilliant that multiple wafers form imposite
Sheet, moves integrally imposite wafer and makes have an individual base the most corresponding in imposite wafer immediately below each wafer.
5. the imposite upper slice method during surface as claimed in claim 4 patch quartz-crystal resonator produces, it is characterised in that: whole
Body moves imposite wafer to pedestal imposite, comprises the following steps:
Step 1, imposite wafer is moved integrally in the fixing device with adsorbent equipment, hold imposite by adsorbent equipment brilliant
Sheet；
Step 2, press adsorbent equipment down, make the primer on the individual base left and right platform of each its correspondence of contact wafers；
Step 3, separation absorption device and imposite wafer, on the imposite wafer transfer each individual base in pedestal imposite.
6. the imposite upper slice method during surface as claimed in claim 5 patch quartz-crystal resonator produces, it is characterised in that:
Imposite wafer is under electric device or manual operation in step 1, is moved integrally by imposite wafer by mobile device
Above adsorbent equipment in fixing device.
7. the imposite upper slice method during surface as claimed in claim 5 patch quartz-crystal resonator produces, it is characterised in that:
In step 2, before lower pressure adsorbent equipment, the adsorbent equipment in fixing device being positioned at the top of imposite wafer, imposite is brilliant
The position of corresponding individual base in the lower section correspondence pedestal imposite of each wafer in sheet.
8. the imposite upper slice method during surface as claimed in claim 6 patch quartz-crystal resonator produces, it is characterised in that: institute
Stating mobile device is coating clamp, and on coating clamp, the ranks spacing of each wafer is in pedestal imposite between the ranks of individual base
Away from integral multiple；Hole, location on coating clamp is consistent with the hole, location on pedestal imposite.
9. the imposite upper slice method during patch quartz-crystal resonator in surface produces as claimed in claim 7 or 8, its feature exists
In:
The fixing device made in step 1 is for inhaling box, and adsorbent equipment is the suction nozzle being positioned at and inhaling box, inhales box lower end and vacuum system
System connects, and inhales the suction nozzle within box and the imposite wafer one_to_one corresponding in mobile device, inhales the positioner on box whole with pedestal
The hole, location of onboard dish is consistent.
10. the imposite upper slice method during surface as claimed in claim 9 patch quartz-crystal resonator produces, it is characterised in that:
Suction box is moved in step 2 so that imposite wafer is positioned at above pedestal imposite by electric device or manual operation.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528937.5A CN106067775B (en) | 2016-07-06 | 2016-07-06 | Paste in quartz-crystal resonator production sheet devices and method in whole plate in surface |
| PCT/CN2017/091032 WO2018006755A1 (en) | 2016-07-06 | 2017-06-30 | Full-array die attachment device and method utilized in producing surface-mount quartz crystal oscillator |
| TW106122609A TWI674750B (en) | 2016-07-06 | 2017-07-05 | Processes for surface mount quartz crystal resonator whole up panel apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528937.5A CN106067775B (en) | 2016-07-06 | 2016-07-06 | Paste in quartz-crystal resonator production sheet devices and method in whole plate in surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106067775A true CN106067775A (en) | 2016-11-02 |
| CN106067775B CN106067775B (en) | 2019-04-26 |
Family
ID=57206605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610528937.5A Active CN106067775B (en) | 2016-07-06 | 2016-07-06 | Paste in quartz-crystal resonator production sheet devices and method in whole plate in surface |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106067775B (en) |
| TW (1) | TWI674750B (en) |
| WO (1) | WO2018006755A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107517044A (en) * | 2017-08-10 | 2017-12-26 | 烟台明德亨电子科技有限公司 | A kind of whole plate SMD quartz crystal resonator board structure and its processing method |
| WO2018006755A1 (en) * | 2016-07-06 | 2018-01-11 | 烟台明德亨电子科技有限公司 | Full-array die attachment device and method utilized in producing surface-mount quartz crystal oscillator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1738012A (en) * | 2004-08-20 | 2006-02-22 | 威宇科技测试封装有限公司 | Chip radiator fin-fitting method |
| CN101515553A (en) * | 2009-04-08 | 2009-08-26 | 扬州扬杰电子科技有限公司 | Method for processing chip diode |
| CN101594120A (en) * | 2008-05-28 | 2009-12-02 | 上海晶赛电子有限公司 | The sheet type quartz crystal frequency device of ceramic packaging and manufacture method thereof |
| CN101867005A (en) * | 2010-06-13 | 2010-10-20 | 天津市卓辉电子有限公司 | Method for bonding a plurality of LED chips on thermal conducting substrate |
| CN105305995A (en) * | 2015-11-05 | 2016-02-03 | 烟台大明电子科技有限公司 | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof |
| CN205754235U (en) * | 2016-07-06 | 2016-11-30 | 烟台明德亨电子科技有限公司 | Sheet devices on imposite in the patch quartz-crystal resonator production of surface |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163658B (en) * | 2011-02-01 | 2012-07-04 | 哈尔滨工业大学 | LED (light-emitting diode) device with multiple chip suction nozzles |
| CN106067775B (en) * | 2016-07-06 | 2019-04-26 | 四川明德亨电子科技有限公司 | Paste in quartz-crystal resonator production sheet devices and method in whole plate in surface |
-
2016
- 2016-07-06 CN CN201610528937.5A patent/CN106067775B/en active Active
-
2017
- 2017-06-30 WO PCT/CN2017/091032 patent/WO2018006755A1/en active Application Filing
- 2017-07-05 TW TW106122609A patent/TWI674750B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1738012A (en) * | 2004-08-20 | 2006-02-22 | 威宇科技测试封装有限公司 | Chip radiator fin-fitting method |
| CN101594120A (en) * | 2008-05-28 | 2009-12-02 | 上海晶赛电子有限公司 | The sheet type quartz crystal frequency device of ceramic packaging and manufacture method thereof |
| CN101515553A (en) * | 2009-04-08 | 2009-08-26 | 扬州扬杰电子科技有限公司 | Method for processing chip diode |
| CN101867005A (en) * | 2010-06-13 | 2010-10-20 | 天津市卓辉电子有限公司 | Method for bonding a plurality of LED chips on thermal conducting substrate |
| CN105305995A (en) * | 2015-11-05 | 2016-02-03 | 烟台大明电子科技有限公司 | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof |
| CN205754235U (en) * | 2016-07-06 | 2016-11-30 | 烟台明德亨电子科技有限公司 | Sheet devices on imposite in the patch quartz-crystal resonator production of surface |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018006755A1 (en) * | 2016-07-06 | 2018-01-11 | 烟台明德亨电子科技有限公司 | Full-array die attachment device and method utilized in producing surface-mount quartz crystal oscillator |
| CN107517044A (en) * | 2017-08-10 | 2017-12-26 | 烟台明德亨电子科技有限公司 | A kind of whole plate SMD quartz crystal resonator board structure and its processing method |
| CN107517044B (en) * | 2017-08-10 | 2024-04-09 | 四川明德亨电子科技有限公司 | Substrate structure of whole-board SMD quartz crystal resonator and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106067775B (en) | 2019-04-26 |
| TWI674750B (en) | 2019-10-11 |
| TW201803266A (en) | 2018-01-16 |
| WO2018006755A1 (en) | 2018-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI710103B (en) | Luminous panel and method of manufacturing such a luminous panel | |
| CN109661163B (en) | A kind of temperature control adhesive Micro-LED flood tide transfer method | |
| US8970516B2 (en) | Integrated passives and power amplifier | |
| EP1798778A3 (en) | Integrated thin-film solar cell and method of manufacturing the same | |
| CN107275058B (en) | charging coil and manufacturing method thereof | |
| EP1291920A3 (en) | Solar cell, method for manufacturing the same, and apparatus for manufacturing the same | |
| EP2423948A3 (en) | Lateral connection for a via-less thin film resistor and method of forming the same | |
| EP2006908A3 (en) | Electronic device and method of manufacturing the same | |
| CN104349609A (en) | Printed circuit board and manufacturing method thereof | |
| US10290785B2 (en) | Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device | |
| CN109920814A (en) | Display base plate and manufacturing method, display device | |
| CN205754235U (en) | Sheet devices on imposite in the patch quartz-crystal resonator production of surface | |
| CN110010490A (en) | A kind of manufacture craft of the radio frequency cube structure longitudinally interconnected | |
| CN109712928B (en) | High-precision transfer printing equipment and system suitable for micro device | |
| CN106067775A (en) | Surface patch quartz-crystal resonator produce in sheet devices and method on imposite | |
| CN104052329A (en) | Flexible electricity generation power supply and flexible display screen | |
| CN103985647A (en) | Method for preparing copper cylinder salient points | |
| Yu et al. | A biaxially stretchable and washable LED display enabled by a wavy-structured metal grid | |
| CN101699930A (en) | Glue filling and laminating method of circuit board | |
| CN206798616U (en) | Unloader is used in electronic components production | |
| FR2965659B1 (en) | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT | |
| CN104037094B (en) | The preparation method of salient point on base plate for packaging | |
| US11296298B2 (en) | Method for manufacturing flexible organic light-emitting diode display panel | |
| CN203675430U (en) | Flexible printed circuit board | |
| CN207603482U (en) | Sextuple piezoelectric type energy collector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190408 Address after: 646300 No. 3, Lan'an Road, Naxi District, Luzhou City, Sichuan Province Applicant after: Sichuan Mingdeheng Electronic Technology Co., Ltd. Address before: 264006 No. 6 Heilongjiang Road, Yantai Economic and Technological Development Zone, Shandong Province Applicant before: YANTAI DYNAMIC ELECTRONICS CO., LTD. |