TW201803266A - Processes for surface mount quartz crystal resonator whole up panel apparatus and method - Google Patents

Abstract

This invention relates to the field of electronic components, particularly to processes for surface mount quartz crystal resonator whole up panel apparatus and method. The whole up panel apparatus includes a fixed device, an adsorption device inside the fixed device, a moving device which is detached and connected to the fixing device, and an integral plate wafer for mounting on the entire panel of the base panel is placed on the moving device. The said monolithic wafer being formed from a plurality of wafers, said adsorbing device being in contact with the monolithic wafer on the moving device. In the invention, the whole panel is formed by moving a plurality of wafers as a whole to form a whole wafer, so that a single base is correspondingly below each wafer in the whole wafer. The invention utilizes the coating fixture as a whole to absorb the wafer, and is placed on the whole panel of the base after dispensing, which can save the time of placing the wafer and the speed of the chip placing is quickly. The production efficiency can improve by more than tens to hundreds of times and increase the production simultaneously.

Description

Device and method for whole-board chip in production of surface-mounted quartz crystal resonator

The invention belongs to the field of electronic components, and in particular relates to a device and method for a whole plate in the production of surface-mounted quartz crystal resonators.

Quartz crystal resonators are also called quartz crystals, commonly known as crystal oscillators. They are resonators made using the piezoelectric effect of quartz crystals. They can be used together with semiconductor devices and RC elements to form quartz crystal oscillators.

Quartz wafer, hereinafter referred to as wafer, it can be square, rectangular or circular, etc., silver electrodes are coated on its two corresponding faces, and the quartz crystal resonator on the surface is the electrode on the quartz wafer and The base is electrically connected, and a primer is coated on the base to form a conductive adhesive below the quartz wafer. The quartz wafer is above the primer, and the secondary electrode on the quartz wafer is coated to form a conductive adhesive above the quartz wafer.

CCD as an image sensor, also called an image controller, is a semiconductor device that can convert optical images into digital signals. The more pixels a CCD contains, the higher the resolution it provides. CCD works like film, but it converts light signals into charge signals. There are many neatly arranged photodiodes on the CCD, which can sense light and convert the light signal into an electrical signal, which is converted into a digital image signal by external sampling amplification and analog-to-digital conversion circuits.

For the fixing of the quartz wafer on the base, the production method of sucking the wafers from the coating fixture one by one and then placing them in the base has been adopted. The main process is: directly pick up the wafers one by one from the coating fixture, move them to the CCD for detection and rotate the angle. After the CCD recognizes the wafers as qualified, mount them one by one in the base of the primed adhesive.

However, the current process of sucking wafers one by one has the following problems:

1. Individual wafers are sucked one by one, and the time is about 0.6s. The wafer time for transferring the whole board fixture (taking 400pcs as an example) is 240s, and the production efficiency is low.

2. Due to the low production efficiency and slow flow, the coating fixture needs a large amount.

In view of the shortcomings of the prior art, the present invention provides a whole-plate device and method for the production of surface-mounted quartz crystal resonators, which are used for the entire processing of the base of the surface-mounted quartz crystal resonators, so that the coated wafers can be directly from the coating fixture The whole plate is moved into the whole plate of the base.

In order to solve the above technical problems, the entire on-board device in the production of the surface-mounted quartz crystal resonator provided by the present invention is special in that it includes a fixing device, an adsorption device located inside the fixing device, and a movement detachably connected to the fixing device. The device is provided on the mobile device with a whole plate wafer for mounting on the base plate 1. The whole plate wafer is formed of a plurality of wafers 4, and the adsorption device is in contact with the whole plate wafer on the mobile device.

Further, the fixing device is a suction box 12, which includes a metal rod 7 penetrating the upper surface of the suction box 12, a suction nozzle 13 located at the top of the metal rod 7, and a spring 9 sleeved on the metal rod 7, The bottom end of the metal rod 7 is connected to the vacuum system, and the top end of the suction nozzle 13 corresponds to the entire plate wafer in the mobile device one-to-one.

Further, the moving device is a coating jig 10, and a row-to-column spacing of each wafer 4 on the coating jig 10 is an integer multiple of a row-to-column spacing of a single base 1-1 in the entire pedestal 1.

Further, the suction box 12 is further provided with a positioning device. The positioning device is a plurality of positioning pins 8 provided on the suction box, and the positioning pins 8 correspond to the corresponding tray positioning holes 1-2 on the base plate. .

Further, the coating fixture 10 is provided with a coating fixture positioning hole 11 that is consistent with the base whole plate positioning holes 1-3 on the base whole plate 1.

The present invention provides a method for manufacturing a whole plate on a surface-mounted quartz crystal resonator, which is special in that a plurality of wafers form a whole plate wafer and the whole plate wafer is moved as a whole so that there is a single sheet directly below each wafer in the whole plate wafer The body base corresponds to it.

Further, moving the entire plate wafer to the entire substrate plate includes the following steps:

Step 1. Move the entire wafer as a whole in a fixing device with an adsorption device, and suck the entire wafer through the adsorption device;

Step 2. Press down the adsorption device so that each wafer contacts the primer on the left and right platforms of the corresponding single base;

Step 3: The adsorption device is separated from the entire plate wafer, and the entire plate wafer is transferred on each unit base in the entire plate of the base.

Further, in step 1, the entire wafer is moved over the adsorption device in the fixed device by the mobile device as a whole.

Further, in step 1, the mobile device is installed in the fixed device by an electric device or a manual operation.

Further, the moving device is a coating fixture, and the manufacturing meets the following conditions:

The size of the coating fixture is the same as that of the base plate;

The row and column spacing of each wafer on the coating fixture is an integer multiple of the row and column spacing of the individual pedestals in the entire pedestal;

The positioning holes on the coating fixture are consistent with the positioning holes on the entire base plate.

Further, in step 2, before the adsorption device is pressed down, the adsorption device in the fixing device is positioned above the entire wafer, and the lower part of each wafer in the entire wafer corresponds to the position of the corresponding single substrate in the entire substrate. .

Further, the fixing device manufactured in step 1 is a suction box, the suction device is a suction nozzle located in the suction box, the lower end of the suction box is connected to a vacuum system, and the suction nozzle inside the suction box is connected to the entire board wafer in the moving device one by one. Correspondingly, the positioning device on the suction box is consistent with the positioning hole of the whole plate on the base plate.

Further, in step 2, the suction box is moved by an electric device or a manual operation, so that the entire plate wafer is located above the entire plate of the base.

Compared with the prior art, the present invention is beneficial in that the present invention adopts a process of transferring a plurality of wafers on a whole plate, forming a plurality of wafers on a coating fixture, and placing the entire plate on a suction box through the coating fixture. Internally fixed, each nozzle corresponds to a wafer, and by turning, the entire wafer is placed on the base plate with the primer. This can shorten the time for placing a large number of wafers, increase the placement speed, and increase production efficiency. Ten to hundreds of times, while expanding the production of SMD.

The following describes specific embodiments of the present invention with reference to FIGS. 1 to 6 to further explain the present invention.

The wafer in the present invention is a quartz crystal resonator. Regarding the entire base plate for a surface-mounted quartz crystal resonator, the specific form of the base plate in the present invention is: processed on a large ceramic plate into a matrix array. The structural units connected by cloth, each structural unit serves as an independent single base, and the ceramic large plate formed thereby serves as the entire base plate of the present invention.

The specific form of the whole board wafer of the present invention is: forming a whole board wafer from a plurality of wafers arranged in a matrix on a coating fixture, and each structural unit is regarded as an independent each wafer, thereby forming the whole board wafer of the present invention. .

The present embodiment provides a method for manufacturing the entire plate on the surface-mounted quartz crystal resonator, which is an improvement on the loading stage in the production of surface-mounted quartz crystal resonators. For other steps in production, such as the process of applying primer It will not be described in detail any more, and is only used to supplement the description of the process of the present invention.

In the present invention, the entire pedestal is a single pedestal connected in an M * N matrix arrangement. The initial values of M and N are both 1, M and N are non-zero natural numbers, M is the number of rows, and M The maximum value is the number of rows in the matrix, N is the number of columns, and the maximum value of N is the number of columns in the matrix, that is, 1 ≤ M ≤ number of rows, 1 ≤ N ≤ number of columns. The pedestal is expressed as a single pedestal located in the Mth row and Nth column of the entire pedestal.

In the present invention, the coating fixture used by the mobile device and the suction device with a suction nozzle are used for the fixing device. In order to facilitate the movement of the entire wafer into the fixing device, other types of devices can also be used, or they can be moved manually. The fixing device is not limited to the suction box, as long as multiple suction nozzles are provided inside the fixing device. The vacuum system is not shown in the figure and is located inside the suction box. The specific installation position is not limited, as long as the nozzle and the Adsorption between wafers is sufficient. The vacuum system can be located inside the suction box as part of the suction box or outside the suction box as a separate structure.

The entire wafer on the coating fixture is a P * Q matrix, P is the number of rows and the maximum value of P is the number of rows in the matrix, Q is the number of columns and the maximum value of Q is the number of columns in the matrix, that is, 1≤P≤number of rows , 1 ≤ Q ≤ the number of columns. For each wafer on the entire wafer, the expression is used. Each wafer is located in the P-th row and Q-th column of the coating fixture.

The coating fixture in the present invention must meet the following conditions:

1. It is required that the size of the coating fixture and the base plate are the same;

2. The row and column spacing of the coating fixture is an integer multiple of the row and column spacing of the entire base plate, that is, P is an integer multiple of M and Q is an integer multiple of N. The coating fixture is a multilayer structure. One layer above the wafer layer of the coating fixture is provided with a row of magnetic sheets between each two rows. The number of magnetic sheets is the same as the number of each wafer in the row. Each magnetic sheet corresponds to each wafer. Each wafer can be fixed on a coating jig to form a whole board wafer;

3. The positioning hole of the coating fixture is the same as the positioning hole of the base plate.

The suction box of the fixed fixture in the present invention must meet the following conditions

1. The lower end of the suction box is connected to the vacuum system, and can be turned 180 ° through electrical devices;

2. The suction nozzle with elastic down inside the suction box corresponds to the wafer in the coating fixture one-to-one;

3. The positioning device on the suction box is consistent with the positioning hole of the whole plate on the base.

In the present invention, four corners of the upper surface of the suction box are provided with positioning devices, and metal rods are evenly arranged in the area between the positioning devices. The metal rods penetrate the upper surface of the suction box, and above the upper surface of the suction box, each A suction nozzle is provided on the top of each metal rod. Below the upper surface of the suction box, a spring is sleeved on each metal rod and fixed in the suction box. A vacuum system is provided at the bottom end of the metal rod. In the present invention, the positioning device is a plurality of positioning pins provided on the suction box, and the positioning pins respectively correspond to the corresponding tray positioning holes of the entire plate of the base, so that when the suction nozzle of the suction box is located above the wafer, the positioning pins and the carrier The disk positioning holes are fastened, and the suction box can be fixed on the whole plate of the base.

In the present invention, there are 4 tray positioning holes on both sides of the tray of the base plate, specifically, tray positioning holes P1, tray positioning holes P2, tray positioning holes P3, and tray positioning holes P4, which are symmetrically distributed. On both sides of the carrier, it is used to engage with the four positioning pins of the suction box.

The coating fixture is provided with a positioning hole for the coating fixture which is consistent with the positioning hole of the base plate on the base plate. When the suction box is fixed on the base plate, the positioning hole of the base plate and the positioning hole of the coating plate Together, it can ensure the stability of the coating fixture, which is conducive to each wafer corresponding to its corresponding single base.

The embodiments of the present invention will be described according to the specifications of the entire base plate, the coating jig, and the suction box.

Before using the coating fixture to move the entire plate of wafer, follow the steps below to apply primer to the entire plate of the pedestal:

Step 1. Place the prepared whole base plate into the base cage and wait for the primer to be applied;

Step 2. Adjust the glue spraying time and position according to the size of the glue dot;

Step 3. Apply primer to the left and right platforms of each single base in the whole base plate.

Example 1

In this embodiment, the rows and columns of the entire wafer on the coating fixture are the same as the rows and columns of the entire pedestal. That is, after the primer coating process is completed for all the individual pedestals on the entire pedestal of the pedestal, all the individual pedestals are coated. At the same time, the wafer loading process is performed. In this embodiment, the entire wafer on the coating fixture is a P * Q matrix, and the entire base plate is an M * N matrix, P = M, Q = N. After the primer is coated on the left and right platforms of each monomer base, the entire wafer is moved and placed according to the following steps. The specific loading process is as follows:

Step 1. Place the entire plate of wafers placed in the coating fixture into the wafer cage, the number of each wafer on the whole plate of wafers, the number of nozzles in the suction box, and the number of individual pedestals on the whole plate base be consistent;

Step 2: Install the coating fixture with the entire plate of wafer in the suction box by a robotic hand, turn on the vacuum system, and suck the wafer through the suction nozzle in the suction box. The suction nozzle at the top of each metal rod in the suction box corresponds to the coating fixture. On each wafer, remove the upper electrode cover of the upper coating fixture;

Step 3: The suction box is turned over by a robotic arm, and the suction box is overlapped with the whole plate carrier plate by the positioning pin, and the coating fixture is overlapped with the whole plate of the base plate; One correspondence

Step 4. Press down the suction nozzle so that each wafer contacts the primer on the left and right platforms of the corresponding single base;

Step 5. After breaking the vacuum of the suction box, each suction nozzle loses suction to each wafer, the suction box and the coating fixture leave the carrier plate of the entire plate of the base, and the entire wafer is transferred to each unit of the whole plate of the base. Body base.

In this embodiment, the coating fixture is installed in the suction box, and the suction box is turned over by an electrical device, which is specifically operated using a robot hand.

Example 2

In this embodiment, the process of moving the entire plate wafer on the coating fixture to the entire base plate is similar to that in Embodiment 1, except that in this embodiment, the entire plate wafer on the coating fixture is the same as the entire plate on the base plate. The distance between rows and columns is twice. For the whole plate wafer on the coating fixture, it is a P * Q matrix, and the whole pedestal plate is a M * N matrix, P = 2M, Q = 2N. After the primer coating process of the base, the monolithic base on the odd-numbered rows and even-numbered columns or even-numbered rows and even-numbered columns on the whole board of the base is simultaneously subjected to the loading process. In this embodiment, the monolithic base with odd rows and odd columns on the entire base plate is selected to be loaded, and then the monolithic base with even rows and even columns is placed on the entire base plate.

After the primer is coated on the left and right platforms of each single base on the whole pedestal of the pedestal, the whole plate is moved and placed according to the following steps. The specific loading process is as follows:

Step 1. Place the entire wafer placed in the coating fixture into the wafer cage. The number of each wafer on the entire wafer and the number of suction nozzles in the suction box are the same, and each wafer is on the whole board base. The number of single-element bases in odd rows and odd columns remains the same;

Step 2: Install the coating fixture with the entire plate of wafer in the suction box by the robot, and suck the wafer through the suction nozzle in the suction box. The suction nozzle on the top of each metal rod in the suction box corresponds to each of the coating fixtures. Wafer, peel off the upper electrode of the upper coating fixture;

Step 3: The suction box is turned over by a robotic arm, and the suction box is overlapped with the whole plate carrier plate by the positioning pin, and the coating fixture is overlapped with the whole plate of the base plate; One correspondence

Step 4. Press down the suction nozzle so that each wafer contacts the primer on the left and right platforms of the corresponding single base;

Step 5. After breaking the vacuum of the suction box, each suction nozzle loses the suction power for each wafer, the suction box and the coating fixture leave the carrier plate of the entire plate of the base, and the entire wafer is transferred in the whole plate of the base in odd rows and odd rows. A series of individual cell bases;

Step 6. Return to step 1 and place the entire plate of wafers on the coating fixture again. Repeat steps 1 to 5. In this step, after the suction box is turned over, each wafer on the coating fixture is even-numbered on the whole plate base. Corresponds to the unit base of even-numbered columns.

Follow the above steps to complete the work of loading all the single bases on the entire base plate.

Example 3

In this embodiment, the process of moving the entire plate wafer on the coating fixture to the entire plate of the base is similar to that in Embodiment 1, except that in this embodiment, the coating fixture is installed in the suction box, and the suction box is turned over. This is done manually.

In addition, in this embodiment, the rows and columns of the entire wafer on the coating fixture are 3 times the row and column spacing of the entire plate of the pedestal. For the entire wafer on the coating fixture, it is a P * Q matrix, and the entire substrate on the base is an M * N matrix. P = 3M, Q = 3N, that is, after completing the primer coating process for all the monomer bases on the entire base plate, the single bases located on the base plate are separated by two rows and two columns at the same time. Craft. Taking the base plate of 12 * 12 as an example, in this embodiment, the entire base of the base plate on the first, fourth, seventh, and tenth rows, and on the first, fourth, seventh, and tenth columns of the whole base is selected. Load the film, and then load the entire base plate on rows 2, 5, 8, 11 and 2, 5, 8, and 11 as a whole. Finally, load the base plate on rows 3, 6, and Rows 9, 12 and 3, 6, 9, 12 are monolithic bases on the whole.

After the primer is coated on the left and right platforms of each single base on the whole pedestal of the pedestal, the whole plate is moved and placed according to the following steps. The specific loading process is as follows:

Step 1. Place the entire wafer placed in the coating fixture into the wafer cage. The number of each wafer on the entire wafer and the number of suction nozzles in the suction box are the same, and each wafer is on the whole board base. The first, fourth, seventh, and tenth rows, the first, fourth, seventh, and tenth columns of the single base remain the same;

Step 2. Manually install the coating fixture with the whole plate of wafer in the suction box, and suck the wafer through the suction nozzle in the suction box. The suction nozzle at the top of each metal rod in the suction box corresponds to each wafer on the coating fixture. Remove the upper electrode of the upper coating fixture;

Step 3: Manually flip the suction box, make the suction box coincide with the entire plate carrier plate by the positioning pin, and the coating fixture coincide with the entire plate of the base plate; therefore, each wafer is in the first, fourth, seventh, and tenth of the entire plate of the base plate. Rows, one-to-one correspondence with the individual bases of columns 1, 4, 7, 10;

Step 4. Press down the suction nozzle so that each wafer contacts the primer on the left and right platforms of the corresponding single base;

Step 5. After breaking the vacuum of the suction box, each suction nozzle loses the suction force for each wafer, the suction box and the coating fixture leave the carrier plate of the whole plate, and the whole wafer is transferred to the first plate of the base plate. , 7, 10 rows, on each base of columns 1, 4, 7, 10;

Step 6. Return to step 1 and place the entire plate wafer on the coating fixture again. Repeat steps 1 to 5. In this step, after the suction box is turned over, each wafer on the coating fixture and the whole plate base Rows 2, 5, 8, and 11 correspond to the individual bases in columns 2, 5, 8, and 11.

Step 7. Return to step 1 and place the entire wafer on the coating fixture again. Repeat steps 1 to 5. In this step, after the suction box is turned over, each wafer on the coating fixture and the whole plate base Rows 3, 6, 9, and 12 correspond to the individual bases in rows 3, 6, 9, and 12.

Follow the above steps to complete the work of loading all the single bases on the entire base plate.

The above embodiments only list several orders of the overall film loading of the present invention. The present invention mainly implements the whole plate moving process for the upper film of the whole plate base. As for the row and column spacing of the coating fixture, it is the row and column spacing of the whole board of the base. Integer multiples are different loading sequences, and more loading sequences can be transformed according to the row and column spacing.

It is obvious to a person skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, the embodiments are to be regarded as exemplary and non-limiting in every respect, and the scope of the present invention is defined by the appended claims rather than the above description, and therefore is intended to fall within the claims. All changes that are within the meaning and scope of equivalent elements are encompassed by the invention.

In addition, it should be understood that although this description is described in terms of embodiments, not every embodiment includes an independent technical solution. This description of the description is for clarity only, and those skilled in the art should take the description as a whole. The technical solutions in the embodiments can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

1‧‧‧ base plate
1-1‧‧‧Single base
1-2‧‧‧Carrier plate positioning hole
1-3‧‧‧ base plate positioning holes
2‧‧‧left platform
3‧‧‧right platform
4‧‧‧Chip
5‧‧‧ secondary electrode
6‧‧‧ primer
7‧‧‧ metal rod
8‧‧‧ positioning pin
9‧‧‧ spring
10‧‧‧Coated Fixture
11‧‧‧ Coated fixture positioning holes
12‧‧‧ Suction Box
13‧‧‧Nozzle

FIG. 1 is a schematic diagram of a whole plate of a base of the present invention;

2 is a schematic diagram of a single base of the present invention;

FIG. 3 is a schematic view of a state after spraying the monomer base of the present invention; FIG.

4 is a schematic structural diagram of a suction box for sucking a wafer according to the present invention;

5 is a schematic structural view of a part of a suction box according to the present invention;

FIG. 6 is a schematic structural diagram of a coating fixture of the present invention.

7‧‧‧ metal rod

8‧‧‧ positioning pin

12‧‧‧ Suction Box

13‧‧‧Nozzle

Claims (10)

A whole-board device in the production of a surface-mounted quartz crystal resonator includes a fixing device, an adsorption device located inside the fixing device, and a moving device detachably connected to the fixing device. The moving device is provided with a device for mounting on a substrate. The whole plate wafer on the whole plate is formed of a plurality of wafers, and the adsorption device is in contact with the whole plate wafer on the moving device. The entire on-board device in the production of a surface-mounted quartz crystal resonator according to item 1 of the scope of the patent application, wherein the fixing device is a suction box, and the suction device inside the fixing device includes a metal rod penetrating the upper surface of the suction box. A suction nozzle located at the top of the metal rod and a spring sleeved on the metal rod. The bottom end of the metal rod is connected to the vacuum system, and the top of the nozzle corresponds to the entire plate wafer in the mobile device. The mobile device is a coating fixture. The row and column spacing of each wafer on the coating fixture is an integer multiple of the row and column spacing of the single pedestal in the pedestal entire board. The entire on-board device in the production of a surface-mounted quartz crystal resonator according to item 2 of the scope of the patent application, wherein the suction box is further provided with a positioning device, and the positioning device is a plurality of positioning pins provided on the suction box. The positioning pins respectively correspond to corresponding disk positioning holes on the entire base plate; the coating fixture is provided with a coating fixture positioning hole that is consistent with the entire base plate positioning hole on the base plate. A wafer-on-board method in the production of a surface-mounted quartz crystal resonator, comprising: forming multiple wafers from a plurality of wafers, and moving the entire wafers as a whole so that there is a single base directly below each wafer in the wafers; correspond. According to the method of applying a surface-mount quartz crystal resonator as described in item 4 of the patent application, the entire plate method is as follows: moving the whole plate wafer to the base plate as a whole, including the following steps: Step 1, the whole plate wafer The whole is moved in a fixed device with an adsorption device, and the entire wafer is sucked by the adsorption device; Step 2. Press down the adsorption device so that each wafer contacts the primer on the left and right platforms of the corresponding single base; Separate the adsorption device from the whole plate wafer, and the whole plate wafer is transferred on each single base in the whole plate of the base. According to the method of claim 5 of the scope of patent application for the whole-board chip-making method in the production of surface-mounted quartz crystal resonators, wherein: In step 1, the whole-plate wafer is moved by an electric device or a manual operation to integrate the whole plate wafer Move over the adsorption device in the fixed device. According to the method of claim 5 in the scope of patent application for the whole-plate-on-chip method in the production of surface-mounted quartz crystal resonators, in which: In step 2, before pressing the adsorption device, the adsorption device in the fixing device is located on the wafer of the entire plate. Above, the bottom of each wafer in the entire wafer corresponds to the position of the corresponding single substrate in the entire substrate. As described in the patent application No. 6, the whole-board method for the production of surface-mounted quartz crystal resonators, wherein the moving device is a coating fixture, and the spacing between the rows and columns of each wafer on the coating fixture is the single board The space between the rows and columns of the body base is an integer multiple; the positioning holes on the coating fixture are consistent with the positioning holes on the entire base plate. As described in the patent application scope item 7 or item 8, the whole-board method in the production of a surface-mounted quartz crystal resonator, wherein: The fixing device produced in step 1 is a suction box, and the suction device is located in the suction box The lower end of the suction box is connected to the vacuum system. The suction nozzle inside the suction box corresponds to the entire plate wafer in the mobile device one by one. The positioning device on the suction box is consistent with the positioning hole of the whole plate carrier disk. The method for chip-on-board in the production of surface-mounted quartz crystal resonators according to item 9 of the scope of patent application, wherein: In step 2, the suction box is moved by an electrical device or a manual operation so that the whole-board wafer is located on the base-board. Up.