CN106051478B - High-power LED lamp radiator, fixed device and processing method - Google Patents
High-power LED lamp radiator, fixed device and processing method Download PDFInfo
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- CN106051478B CN106051478B CN201610361357.1A CN201610361357A CN106051478B CN 106051478 B CN106051478 B CN 106051478B CN 201610361357 A CN201610361357 A CN 201610361357A CN 106051478 B CN106051478 B CN 106051478B
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- plate
- heat dissipation
- wing plate
- dissipation wing
- radiating
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
Abstract
The present invention relates to high-power LED lamp radiators, fixed device and processing method, wherein, high-power LED lamp radiator, including temperature-uniforming plate, radiating bottom plate and heat dissipation wing plate, the lower surface of temperature-uniforming plate and radiating bottom plate is fixed together by friction welding, multiple inserting grooves disposed in parallel are uniformly opened up on the upper surface of radiating bottom plate, inserting groove extends along radiating bottom plate transverse direction, heat dissipation wing plate is plugged in inserting groove, heat dissipation wing plate, which is corresponded to, is equipped with heat conductive silica gel between clamping and heat dissipation wing plate and corresponding inserting groove at the top of the cell wall of inserting groove, half potting is located at the upper surface of radiating bottom plate and is longitudinally threaded through the bottom of each heat dissipation wing plate the lower arm of U-shaped samming pipe along the longitudinal direction, the upper arm of U-shaped samming pipe is threaded through the top of each heat dissipation wing plate.High-power LED lamp radiator of the invention, the radiating efficiency of radiator greatly enhance, and the lamp bead temperature of high-power LED lamp significantly reduces, and light decay greatly reduces, and the service life increases significantly, and effect is very good.
Description
Technical field
The present invention relates to the high-power LED lamp radiator in lighting area, fixed device and processing method are further related to.
Background technique
LED lamp is with the excellent characteristics of their own, nowadays more more and more universal.It is well known that fever more is
One major issue of LED lamp, therefore each LED lamp needs to be equipped with suitable radiator, the quality of radiator performance
The performance and used life of a LED lamp, especially high-power LED lamp are directly influenced, since calorific value is big, to big function
The performance and used life of rate LED lamp influences even more serious.Existing high-power LED lamp mostly uses greatly substrate directly fixed
On a heat sink, radiator includes the radiating bottom plate being wholely set and heat dissipation wing plate, the high-power LED lamp heat dissipation of this structure
Ability is worst, and high-powered LED lamp light decay is big, and the service life is short, and reliability is low, and the radiator of high-power LED lamp also includes dissipating
Hot bottom plate, heat dissipation wing plate and the temperature-uniforming plate on radiating bottom plate, radiator heat-dissipation effect and the former phase of this structure
It is promoted than, but temperature-uniforming plate connects after generally using soldering and welding to connect or smear heat conductive silica gel with base plate of radiator,
Heat dissipation effect is still very unsatisfactory.
Summary of the invention
Technical staff is by a large amount of research and test, the undesirable reason of discovery heat dissipation effect: first, temperature-uniforming plate
Heat dissipation effect is largely effected on base plate of radiator connection type, the mode of temperature-uniforming plate and base plate of radiator welding leads to temperature-uniforming plate
It is not close with many location contacts of base plate of radiator, the poor ability of heat is passed to, there is that there are in solder etc. for welding position
Between heat carrier, affect heat transference efficiency, for smear heat conductive silica gel connection type, however it remains led due to increasing centre
Hot body and the problem of influence heat transference efficiency；In addition, when radiating fin due to being wholely set with radiating bottom plate, leads to processing
Radiating fin can not be made thin, be easy deposition in the root heat of radiating fin, affect heat from radiating bottom plate to heat dissipation
The efficiency of fin transmitting, and heat is also required to a phase from the root of radiating fin to the speed that radiating fin other parts extend
To longer process.Technical staff contemplates first to be made into separate structure for radiating fin and radiating bottom plate and processes respectively, then
Slot is opened up on radiating fin and radiating fin is plugged in the mode in slot, and such radiating fin can be made
It is thin, it prevents heat deposition from improving heat conduction efficiency, still, in actual use, finds since radiating fin is than relatively thin, it is this to plug
Mode is there is facing a difficult choice, i.e., radiating fin grafting is not easy and is easily deformed if slot is relatively narrow, if the wider radiating fin of slot
Plate is not fixed firmly on radiating bottom plate and radiating bottom plate can be greatly lowered to the effect of radiating fin transmitting heat.
The purpose of the invention is to provide a kind of high-power LED lamp radiators, to solve to exist in the prior art
The problem of, the invention further relates to fixed device and processing methods.
To achieve the goals above, the technical scheme adopted by the invention is that:
High-power LED lamp radiator, including temperature-uniforming plate, radiating bottom plate and heat dissipation wing plate, the temperature-uniforming plate and institute
The lower surface for stating radiating bottom plate is fixed together by friction welding, is uniformly opened up on the upper surface of the radiating bottom plate multiple flat
The inserting groove of row setting, the inserting groove extend along the radiating bottom plate transverse direction, and the heat dissipation wing plate is plugged in described insert
In access slot and inserting mode is the inserting groove grafting one heat dissipation wing plate described in one or at least three, the radiating fin
Plate is corresponded to clamping at the top of the cell wall of the inserting groove and is equipped with heat conductive silica gel, U between the heat dissipation wing plate and corresponding inserting groove
Half potting is located at the upper surface of the radiating bottom plate to the lower arm of type samming pipe along the longitudinal direction and longitudinal direction is threaded through each heat dissipation
The bottom of wing plate, the upper arm of the U-shaped samming pipe are threaded through the top of each heat dissipation wing plate.
Preferably, the two sides of the heat dissipation wing plate are equipped with the otic placode of convex shape, and the otic placode includes protrusion and bottom, described
The bottom of otic placode is equipped with the bayonet for blocking the protrusion for setting the adjacent otic placode, and the protrusion is U-shaped board.
For fixing the fixation device of the heat dissipation wing plate and the radiating bottom plate, including upper die and lower die, the lower die
Including for fixing radiating bottom plate fixed plate, for clamp radiating bottom plate and be located at the fixed plate left side clamping plate and
For by otic placode bending and be located at the fixed plate right side two push plates disposed in parallel, the left side of the clamping plate, which is arranged, to be used
In the first power source for driving the clamping plate to move back and forth in the horizontal direction, the right side of the push plate is equipped with described for driving
The second power source that push plate moves back and forth in the horizontal direction, the upper mold include multiple stripper plates and driving stripper plate perpendicular
The bottom setting longitudinal section of the third power source that histogram moves back and forth upwards, the stripper plate is trapezoidal extrusion head, adjacent institute
It states stripper plate and forms the crack for being used for sandwiched heat dissipation wing plate upper end.
The processing method of the processing high-power LED lamp radiator:
Radiating bottom plate is arranged in fixed plate step 1, and the first power source drive clamping plate clamps radiating bottom plate, the bottom of by
The heat dissipation wing plate that heat conductive silica gel is smeared in portion is plugged in the inserting groove of fixed plate and the upper end for the wing plate that radiates is plugged on face this is slotting
In the crack of access slot, then third power source drive stripper plate is moved downward, and extrusion head squeezes the cell wall of the inserting groove to centre
Pressure, until clamping heat dissipation wing plate, then two push plates of the second power source drive successively roll over two otic placodes of preceding each heat dissipation wing plate
It is curved and be overlapped in the latter adjacent heat radiation wing plate, so that the protrusion of the otic placode of previous radiating fin is caught in the latter radiating fin
In the bayonet of the otic placode of piece, then the second power source drive push plate resets, and third power source drive squeezes sheet reset, the first power
Source drives clamping plate to reset, and is inserted into U-shaped samming pipe, obtains radiator semi-finished product；
Step 2, by temperature-uniforming plate and step 1 process after the radiator semi-finished product friction welding on friction-welding machine together,
Radiator is made.
The lower surface of high-power LED lamp radiator of the invention, temperature-uniforming plate and radiating bottom plate is solid by friction welding
It is scheduled on together, since the impurity such as the oxidation film on contact surface surface can be discharged from contact surface for friction welding, contact surface passes through molecule
The mode of diffusion and recrystallization realizes welding, the close gapless in welding position and bubble, during the heat of such temperature-uniforming plate does not pass through
Between medium but be directly delivered on radiating bottom plate, compared with prior art, heat conduction efficiency greatly increases, meanwhile, welding
Shi Wendu is lower than the melting temperature of material, and material resistance of deformation is reduced, is firmly combined, and heat dissipation wing plate is plugged in inserting groove, dissipates
Hot wing plate, which is corresponded to, is equipped with heat conductive silica gel between clamping and heat dissipation wing plate and corresponding inserting groove at the top of the cell wall of inserting groove, insert in this way
The width of access slot can reduce as far as possible width under the premise of guaranteeing that grafting is convenient and not have to worry that mounting stability is asked
Topic, inserting mode is to be every the reason of one heat dissipation wing plate of one or at least three inserting groove grafting, if two, interval is inserted
Access slot is arranged an extrusion head and is unable to complete work, be arranged two extrusion heads can push when among one frid of sandwiched, generate
Horizontal force and make extrusion head that can not be expressed to grafting trench bottom, heat dissipation wing plate is fixed on heat dissipation bottom using inserting mode
On plate, heat dissipation wing plate is allowed to be made thin, the frid of inserting groove is also made thin, this sample car heat deposition phenomenon can be delayed significantly
Solution enhances the capacity of heat transmission of the radiating bottom plate to heat dissipation wing plate；The lower arm of U-shaped samming pipe along the longitudinal direction half potting be located at it is described
The upper surface and longitudinal direction of radiating bottom plate are threaded through the bottom of each heat dissipation wing plate, and the upper arm of U-shaped samming pipe is threaded through each heat dissipation
The heat of radiating bottom plate is quickly diffused to the top of heat dissipation wing plate by the top of wing plate, U-shaped another path samming Guan Nengcong, greatly
Heat diffusion speed is enhanced greatly, semi-buried mounting means can increase the heat conduction rate of U-shaped samming pipe, pass through above-mentioned side
The radiating efficiency of case, radiator greatly enhances, and the lamp bead temperature of high-power LED lamp significantly reduces, and light decay greatly reduces, the service life
Increase significantly, effect is very good.
Further, otic placode is set in the wing plate that radiates, each wing plate that radiates is fixed into an entirety by otic placode, increases greatly
Stability is added, the ability that radiating fin resists transforming by external force greatly enhances.
Fixation device for fixed heat dissipation wing plate and radiating bottom plate of the invention, dexterously fixes heat dissipation wing plate very much
On radiating bottom plate, the especially design of stripper plate can be by the extruding to inserting groove so that cell wall clamps radiating fin reality
It now fixes, the crack that adjacent stripper plate is formed can also be used to the upper end of fixed heat dissipation wing plate, so that each radiating fin of push plate bending
Otic placode when can prevent radiating fin wide-angle bending deformation.
The processing method of high-power LED lamp radiator, is skillfully constructed described in processing of the invention, so that processing is big
Power LED lamps become simple and easy.
Detailed description of the invention
Fig. 1 is high-power LED lamp heat spreader structures schematic diagram of the present invention；
Fig. 2 is the structural schematic diagram of present invention heat dissipation wing plate；
Fig. 3 is the right view of Fig. 2；
Fig. 4 is the structural schematic diagram of the fixed device of the present invention；
Fig. 5 is the use state diagram of the fixed device of the present invention.
Specific embodiment
The embodiment of high-power LED lamp radiator, as shown in Figures 1 to 3, including temperature-uniforming plate 7, radiating bottom plate 5 and
Radiate wing plate 2, and temperature-uniforming plate 7 and the lower surface of radiating bottom plate 5 are fixed together by friction welding, the upper surface of radiating bottom plate 5
On uniformly open up multiple inserting grooves disposed in parallel 4, inserting groove 4 extends along 5 transverse direction of radiating bottom plate, and heat dissipation wing plate 2 plugs
In inserting groove 4 and inserting mode is every being in one heat dissipation wing plate of one or at least three inserting groove grafting, the present embodiment
Every three 4 grafting of inserting groove, one heat dissipation wing plate 2, the wing plate 2 that radiates is by clamping and radiating fin at the top of the cell wall of corresponding inserting groove 4
Heat conductive silica gel is equipped between plate 2 and corresponding inserting groove 4, half potting is located at radiating bottom plate to the lower arm of U-shaped samming pipe 1 along the longitudinal direction
5 upper surface and the bottom for being longitudinally threaded through each heat dissipation wing plate 2, the upper arm of U-shaped samming pipe 1 are threaded through the upper of each heat dissipation wing plate 2
Portion, the two sides for the wing plate that radiates are equipped with the otic placode 3 of convex shape, and otic placode 3 includes protrusion 302 and bottom 301, and the bottom 301 of otic placode is set
There is the bayonet 304 for the protrusion that adjacent otic placode is set for card, protrusion 302 is U-shaped board, and otic placode 3 is arranged in the wing plate 2 that radiates, each to radiate
Wing plate 2 is fixed into an entirety by otic placode 3, considerably increases stability, and radiating fin 2 resists the energy of transforming by external force
Power greatly enhances.
The lower surface of the high-power LED lamp radiator of the present embodiment, temperature-uniforming plate and radiating bottom plate passes through friction welding
It is fixed together, since the impurity such as the oxidation film on contact surface surface can be discharged from contact surface for friction welding, contact surface is by dividing
The mode of son diffusion and recrystallization realizes welding, and the close gapless in welding position and bubble, the heat of such temperature-uniforming plate directly pass
It is delivered on radiating bottom plate, compared with prior art, heat conduction efficiency greatly increases, meanwhile, temperature is lower than material when welding
Melting temperature, material resistance of deformation are reduced, are firmly combined, and heat dissipation wing plate is plugged in inserting groove, and heat dissipation wing plate is corresponded to grafting
Heat conductive silica gel, the width of such inserting groove are equipped at the top of the cell wall of slot between clamping and heat dissipation wing plate and corresponding inserting groove
Guarantee grafting it is convenient under the premise of reduce as far as possible width and do not have to worry mounting stability problem, inserting mode be every
The reason of one heat dissipation wing plate of one or at least three inserting groove grafting, is, if two inserting grooves in interval, are arranged an extruding
Head be unable to complete work, be arranged two extrusion heads can push when among one frid 6 of sandwiched, the horizontal force of generation and make
Grafting trench bottom can not be expressed to by obtaining extrusion head, and heat dissipation wing plate is fixed on radiating bottom plate using inserting mode, so that radiating fin
Plate can be made thin, and the frid of inserting groove is also made thin, this sample car heat deposition phenomenon can be alleviated significantly, enhance heat dissipation bottom
The capacity of heat transmission of the plate to heat dissipation wing plate；Half potting is located at the upper table of the radiating bottom plate to the lower arm of U-shaped samming pipe along the longitudinal direction
Face and longitudinal bottom for being threaded through each heat dissipation wing plate, the upper arm of U-shaped samming pipe is threaded through the top of each heat dissipation wing plate, U-shaped
The heat of radiating bottom plate is quickly diffused to the top of heat dissipation wing plate by another path samming Guan Nengcong, greatly strengthens heat expansion
Speed is dissipated, semi-buried mounting means can increase the heat conduction rate of U-shaped samming pipe, pass through the scheme of this implementation power, radiator
Radiating efficiency greatly enhance, the lamp bead temperature of high-power LED lamp significantly reduces, and light decay greatly reduces, and the service life increases significantly,
Effect is very good.
The radiator heat-dissipation Contrast on effect of different structure is tested:
A radiator: temperature-uniforming plate is connect with base plate of radiator soldering and welding and the wing plate that radiates is wholely set with base plate of radiator；
B radiator: heat conductive silica gel, heat dissipation wing plate and base plate of radiator one are fixed by screw and smeared to temperature-uniforming plate and base plate of radiator
Setting；C radiator: temperature-uniforming plate and base plate of radiator friction welding and wing plate is radiated and base plate of radiator is wholely set；D heat dissipation
Device: the radiator in the present embodiment.Use thermometric thermal imaging camera (model DM60M, no extension camera lens, operation range-
20.0/180.0), target component: emissivity 0.90, with high-power LED lamp distance 2.00m, environment temperature is 29.5 DEG C,
Humidity is 60%.Each radiator is respectively charged into identical high-power LED lamp, by the bottom of radiator and there is lamp bead
Substrate be bolted, and by sandwiched heat conductive silica gel it is thermally conductive, respectively to substrate and heat dissipation wing plate test, to temperature
Collection result when degree tends towards stability.
After testing, it is as follows to measure result: using the high-power LED lamp of A radiator, 60 DEG C of substrate temperature, radiating fin
Plate temperature is 50.1 DEG C, and it is relatively low to the efficiency of radiating fin to illustrate that heat is conducted from substrate；Using the high-power of B radiator
LED lamp, 59.5 DEG C of substrate temperature, radiating fin plate temperature is 51.0 DEG C, illustrates that heat is conducted from substrate to the effect of radiating fin
Rate is relatively low；Using the high-power LED lamp of C radiator, 55 DEG C of substrate temperature, radiating fin plate temperature is 50.7 DEG C, illustrates heat
It measures the efficiency conducted from substrate to radiating fin to greatly improve, heat dissipation effect is preferable；Using the high-power LED lamp of D radiator,
53 DEG C of substrate temperature, radiating fin plate temperature is 50.1 DEG C, illustrates that heat is conducted from substrate to the efficiency of radiating fin and greatly improves,
Good heat dissipation effect causes the temperature of substrate to be greatly reduced, since the temperature of substrate and the temperature of lamp bead are close, so the present embodiment
Scheme greatly reduce the temperature of lamp bead chip, to prolong the service life to reduce light decay and provide guarantee.
For the embodiment of fixed heat dissipation wing plate and the fixation device of radiating bottom plate, as shown in Figure 4, Figure 5, including upper mold and
Lower die, lower die include for fixing the fixed plate 16 of radiating bottom plate 5, for clamping radiating bottom plate 5 and positioned at a left side for fixed plate 16
The clamping plate 17 of side and for by otic placode bending and be located at fixed plate 16 right side two push plates 14 disposed in parallel, clamping plate 17
Left side the first power source 18 for driving clamping plate to move back and forth in the horizontal direction is set, fixed station is set in fixed plate 16
Rank 19, the right side of push plate 14 are equipped with the second power source 15 for driving push plate 14 to move back and forth in the horizontal direction, upper mold packet
The third power source 9 for including multiple stripper plates 12 and stripper plate 12 being driven to move back and forth in the vertical direction, third power source are set
On the crossbeam 10 of rack 11, the bottom setting longitudinal section of stripper plate 12 is trapezoidal extrusion head 20, the adjacent formation of stripper plate 12
Crack 13 for sandwiched heat dissipation wing plate upper end.
The fixation device for fixed heat dissipation wing plate and radiating bottom plate of the present embodiment, dexterously consolidates heat dissipation wing plate very much
It is scheduled on radiating bottom plate, especially the design of stripper plate, it can be by the extruding to inserting groove so that cell wall clamps radiating fin
It realizes and fixes, the crack that adjacent stripper plate is formed can also be used to the upper end of fixed heat dissipation wing plate, so that each radiating fin of push plate bending
Radiating fin wide-angle bending deformation can be prevented when the otic placode of piece.
The processing method of the processing high-power LED lamp radiator:
Radiating bottom plate is arranged in fixed plate step 1, and the first power source drive clamping plate clamps radiating bottom plate, the bottom of by
The heat dissipation wing plate that heat conductive silica gel is smeared in portion is plugged in the inserting groove of fixed plate and the upper end for the wing plate that radiates is plugged on face this is slotting
In the crack of access slot, then third power source drive stripper plate is moved downward, and extrusion head squeezes the cell wall of the inserting groove to centre
Pressure, until clamping heat dissipation wing plate, then two push plates of the second power source drive successively roll over two otic placodes of preceding each heat dissipation wing plate
It is curved and be overlapped in the latter adjacent heat radiation wing plate, so that the protrusion of the otic placode of previous radiating fin is caught in the latter radiating fin
In the bayonet of the otic placode of piece, then the second power source drive push plate resets, and third power source drive squeezes sheet reset, the first power
Source drives clamping plate to reset, and is inserted into U-shaped samming pipe, obtains radiator semi-finished product；
Step 2, by temperature-uniforming plate and step 1 process after the radiator semi-finished product friction welding on friction-welding machine together,
Radiator is made.
Claims (2)
1. the fixation device of heat dissipation wing plate and radiating bottom plate for fixing high-power LED lamp radiator, wherein high-power
LED lamp radiator includes temperature-uniforming plate, radiating bottom plate and heat dissipation wing plate, the following table of the temperature-uniforming plate and the radiating bottom plate
Face is fixed together by friction welding, and multiple inserting grooves disposed in parallel are uniformly opened up on the upper surface of the radiating bottom plate,
The inserting groove extends along the radiating bottom plate transverse direction, and the heat dissipation wing plate is plugged in the inserting groove and inserting mode
For the inserting groove grafting one heat dissipation wing plate described in one or at least three, the heat dissipation wing plate is corresponded to the grafting
It is clamped at the top of the cell wall of slot and is equipped with heat conductive silica gel, the lower arm edge of U-shaped samming pipe between the heat dissipation wing plate and corresponding inserting groove
Half potting of longitudinal direction is located at the upper surface of the radiating bottom plate and longitudinal bottom for being threaded through each heat dissipation wing plate, the U
The upper arm of type samming pipe is threaded through the top of each heat dissipation wing plate, and the two sides of the heat dissipation wing plate are equipped with the otic placode of convex shape,
The otic placode includes protrusion and bottom, and the bottom of the otic placode is equipped with the bayonet for blocking the protrusion for setting the adjacent otic placode, institute
State protrusion be U-shaped board, it is characterised in that: including upper die and lower die, the lower die include for fix the fixed plate of radiating bottom plate,
For clamping radiating bottom plate and positioned at the clamping plate in the left side of the fixed plate and for by otic placode bending and positioned at the fixation
The left side of two push plates disposed in parallel on the right side of plate, the clamping plate is arranged for driving the clamping plate past in the horizontal direction
The first power source moved again, the right side of the push plate are equipped with for driving that the push plate moves back and forth in the horizontal direction
Two power sources, the upper mold include the third power that multiple stripper plates and driving stripper plate move back and forth in the vertical direction
The bottom setting longitudinal section in source, the stripper plate is trapezoidal extrusion head, and the adjacent stripper plate, which is formed, is used for sandwiched radiating fin
The crack of plate upper end.
2. the processing method for processing the high-power LED lamp radiator using fixation device described in claim 1:
Radiating bottom plate is arranged in fixed plate step 1, and the first power source drive clamping plate clamps radiating bottom plate, and bottom is applied
The heat dissipation wing plate for smearing heat conductive silica gel is plugged in the inserting groove of fixed plate and the upper end for the wing plate that radiates is plugged on the face inserting groove
Crack in, then third power source drive stripper plate moves downward, extrusion head by the cell wall of the inserting groove to centre squeeze, directly
To the wing plate that radiates is clamped, then two push plates of the second power source drive successively by two otic placode bendings of preceding each heat dissipation wing plate and are taken
It connects in the latter adjacent heat radiation wing plate, so that the protrusion of the otic placode of previous radiating fin is caught in the ear of the latter radiating fin
In the bayonet of plate, then the second power source drive push plate resets, and third power source drive squeezes sheet reset, the first power source drive
Clamping plate resets, and is inserted into U-shaped samming pipe, obtains radiator semi-finished product；
Step 2, by temperature-uniforming plate and step 1 process after the radiator semi-finished product friction welding on friction-welding machine together, be made
Radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610361357.1A CN106051478B (en) | 2016-05-27 | 2016-05-27 | High-power LED lamp radiator, fixed device and processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610361357.1A CN106051478B (en) | 2016-05-27 | 2016-05-27 | High-power LED lamp radiator, fixed device and processing method |
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| CN106051478A CN106051478A (en) | 2016-10-26 |
| CN106051478B true CN106051478B (en) | 2019-02-22 |
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| CN102679180A (en) * | 2011-03-07 | 2012-09-19 | 浙江迈勒斯照明有限公司 | Illumination lamp module of LED (light emitting diode) light source |
| CN204652845U (en) * | 2015-04-01 | 2015-09-16 | 太仓陶氏电气有限公司 | A kind of high-efficiency frequency conversion device heat-pipe radiator |
| CN105387435A (en) * | 2015-11-23 | 2016-03-09 | 广东昭信照明科技有限公司 | Radiator with LED light source module and LED lighting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201652263U (en) * | 2009-11-23 | 2010-11-24 | 四川新力光源有限公司 | Heat radiating device of light-emitting diode (LED) illuminating lamp |
| CN102679180A (en) * | 2011-03-07 | 2012-09-19 | 浙江迈勒斯照明有限公司 | Illumination lamp module of LED (light emitting diode) light source |
| CN204652845U (en) * | 2015-04-01 | 2015-09-16 | 太仓陶氏电气有限公司 | A kind of high-efficiency frequency conversion device heat-pipe radiator |
| CN105387435A (en) * | 2015-11-23 | 2016-03-09 | 广东昭信照明科技有限公司 | Radiator with LED light source module and LED lighting equipment |
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|---|---|
| CN106051478A (en) | 2016-10-26 |
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Address after: Nanzhao County of Nanyang City, the 474650 industrial agglomeration in Henan Province District Yingbin Avenue Applicant after: HENAN ZHONGYUNCHUANG OPTOELECTRONIC TECHNOLOGY CO., LTD. Address before: Industry in Biyang County of Zhumadian City, Henan province 463700 area Henan zhongyun a photoelectric Polytron Technologies Inc Applicant before: HENAN ZHONGYUNCHUANG OPTOELECTRONIC TECHNOLOGY CO., LTD. |
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Effective date of registration: 20190116 Address after: 510550 No. 6 Zhengliang Road 101, Zhongluotan Town, Baiyun District, Guangzhou City, Guangdong Province Applicant after: Guangzhou meteor shower Photoelectric Technology Co. Ltd. Address before: 474650 Yingbin Avenue, Nanzhao County Industrial Agglomeration Area, Nanyang City, Henan Province Applicant before: HENAN ZHONGYUNCHUANG OPTOELECTRONIC TECHNOLOGY CO., LTD. |
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